CN207801878U - A kind of Plastic Package quartz-crystal resonator shell and its quartz-crystal resonator - Google Patents
A kind of Plastic Package quartz-crystal resonator shell and its quartz-crystal resonator Download PDFInfo
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- CN207801878U CN207801878U CN201820362473.XU CN201820362473U CN207801878U CN 207801878 U CN207801878 U CN 207801878U CN 201820362473 U CN201820362473 U CN 201820362473U CN 207801878 U CN207801878 U CN 207801878U
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Abstract
The utility model is related to a kind of quartz-crystal resonators, including cover board, quartz wafer, conducting resinl and pedestal, the cover board is plastic cover plate, the quartz wafer is the quartz wafer of plated electrode, the pedestal includes plastic body and conductive pin, the conductive pin is combined together with plastic body by nanometer injection molding process, and the quartz wafer of the plated electrode is cured in the accommodation room by conducting resinl, and is connected with conductive pin；The cover board is light-permeable plastic cover plate, it is provided in the surrounding of the cover board and accommodates groove raised on pedestal, the plastic body is opaque-plastic main body, the accommodating chamber for accommodating quartz wafer and protrusion corresponding with groove are provided in the opaque-plastic main body, the cover board and pedestal is fixed together by laser welding, and quartz wafer is sealed.The utility model product has broken the limitation of metal and ceramics envelope in crystal industry, and more selectivity are brought to the product that client uses.
Description
Technical field
The utility model is related to a kind of Plastic Package quartz-crystal resonator shell and its quartz-crystal resonators, belong to stone
English crystal resonator field.
Background technology
Quartz-crystal resonator is widely used in the various systems such as global positioning system (GPS) and mobile communication.Quartz
Crystal resonator is Metal Packaging and ceramic package, is met light, thin, short, small by the portable product of representative of mobile phone
It is required that transformation of the encapsulation of quartz-crystal resonator from traditional bare metal shell to plastic covering metal and ceramic package.It passes
The crystal resonator ceramic package of system includes at least 2 layers of ceramic substrate, and with the fixed capping of ceramic substrate, inside ceramics are equipped with
The lower section of interior electrode, outside ceramic substrate is equipped with external electrode, the inner and outer electrodes mutual conduction.The interior electrode it is upper
A quartz crystal is fixed by adhesive layer by side, and the quartz crystal setting is being formed by enclosure space by ceramic substrate and capping
It is interior.In order to increase enclosure space, metal layer, solder and becket are fixedly provided on the ceramic substrate of the prior art.Capping with
The encapsulation of becket uses parallel seam welding or noble metal gold-tin alloy melting welding.Due to traditional surface mounting quartz crystal resonator
The ceramic wafer of ceramic package shell is formed by potsherd superposition cofiring, and the production cost of ceramic substrate remains high always, system
Somewhat expensive is made, while being superimposed cofiring, technology requires high when making, and yield is limited by technology, equipment various aspects, production effect
Rate and product yield reduce, and far can not be satisfied with ever-increasing market demand.And ceramet packaged type is producing
It needs to use one converted products of automation equipment, low production efficiency in the process.
Metal is known as nanometer injection molding technology (NMT) with plastics with the technique that nanotechnology is combined.First to metal surface
Nanosizing processing is carried out, then plastic injection can be combined the metals such as magnesium, stainless steel, titanium with hard resin in metal surface,
Realize integrated molding.Nanometer forming technique was invented in 2002 by Japanese great achievement plastics (Taiseiplas) Co., Ltd.
(NMT).Great achievement first letter is T, so name T processing.China researcher changes nano-pore generation type, derivative
Different processing method, wherein the processing method carried out in the case of energization is referred to as E processing, and letter e is the abbreviation of electricity.
Two kinds of technological processes are as follows：T processing：(1) alkali cleaning metal base is washed after removing surface grease.2. acid-washed metal base material is carved
It is washed after losing larger-size nano-pore.3.T processing：Base material is handled using weakly acidic T liquid, etches the smaller bee of size
Nest shape nano-pore, final substrate surface form the coral reef structure of Nano grade.4. being dried after washing base material.(wherein, T processing
Step needs to be repeated several times, and specific number of repetition is depending on selected materials).E processing：E processing combines electrochemical principle and chemistry
Corrosion principle --- aluminium alloy anode oxide+chemical enlargement technology.Principle is first to use in weakly alkaline solution and in nano-pore
Acid solution, then be immersed in couplant, make couplant full of nano-pore (couplant needs to react with PPS/PBT).Technique stream
Journey：Upper extension → oil removing → washing → alkaline etching → washing → oxidation → washing → E processing → washing → baking.Pre- oxygen is needed before E processing,
Four liquid medicine coprocessing 3min or so, per pass liquid medicine handle 40s or so.E processing rear substrates surface forms cellular irregular
Hole, nano aperture direct injection molding after drying.The advantages of nanometer moulding process：1. effectively reduce process working hour at
This；2. mitigate product dead weight while taking into account appearance tactile impression；3. cohesive force is superpower；4. safe and recyclable, effect on environment is very
It is small.And there are no be applied to quartz crystal oscillator device field for nanometer forming technique (NMT).
Utility model content
The utility model provides a kind of Plastic Package quartz-crystal resonator shell and its quartz-crystal resonator, solves
Existing ceramic-packaged quartz crystal resonator manufacturing expense is expensive, production efficiency and product yield reduce, and far can not meet
In the ever-increasing market demand the problems such as.
In order to solve the above technical problems, the technical solution adopted in the utility model is：
A kind of Plastic Package quartz-crystal resonator shell, including cover board and pedestal, the cover board are plastic cover plate, institute
The pedestal stated includes plastic body and conductive pin, and the accommodating chamber for accommodating quartz wafer, institute are provided on the plastic body
The conductive pin stated is combined together with plastic body by nanometer injection molding process, and the cover board and pedestal pass through fixation
Quartz wafer is sealed together.
Further, a kind of preferred embodiment of the utility model is：The cover board is light-permeable plastic cover plate, the lid
It is provided on plate and accommodates groove raised on pedestal, the plastic body is the opaque modeling described in opaque-plastic main body
The accommodating chamber for accommodating quartz wafer and protrusion corresponding with groove, the conductive pin and opaque modeling are provided in material main body
Material main body is combined together by nanometer injection molding process, and the cover board and pedestal are fixed together by laser welding,
Quartz wafer is sealed.
The utility model also provides a kind of Plastic Package quartz-crystal resonator, including cover board, quartz wafer, conducting resinl
And pedestal, the cover board are plastic cover plate, the quartz wafer is the quartz wafer of plated electrode, and the pedestal includes
Plastic body and conductive pin are provided with the accommodating chamber for accommodating quartz wafer, the conductive pin on the plastic body
It is combined together by nanometer injection molding process with plastic body, the quartz wafer of the plated electrode is solid by conducting resinl
Change in the accommodation room, and be connected with conductive pin, the cover board and pedestal are fixed together and seal quartz wafer.
Further, a kind of preferred embodiment of the utility model is：The cover board is light-permeable plastic cover plate, the lid
It is provided on plate and accommodates groove raised on pedestal, the plastic body is opaque-plastic main body, and described is opaque
Be provided on plastic body accommodate quartz wafer accommodating chamber and protrusion corresponding with groove, the conductive pin with it is opaque
Plastic body is combined together by nanometer injection molding process, and the cover board and pedestal are fixed on one by laser welding
It rises, quartz wafer is sealed.
Further, a kind of preferred embodiment of the utility model is：The crystal resonator is that two pins quartz crystal is humorous
Shake device, and the conductive pin is in quartz-crystal resonator both ends.
Further, a kind of preferred embodiment of the utility model is：The crystal resonator is that tri-pin quartz crystalline is humorous
Shake device, and the tri-pin quartz crystalline resonator further includes grounding pin, and grounding pin setting is in three pins quartz
The centre of crystal resonator.
Further, a kind of preferred embodiment of the utility model is：The conductive pin is Z-shaped pin.
Further, a kind of preferred embodiment of the utility model is：Z-shaped pin is corresponded in the opaque-plastic main body
Position be provided with injecting hole.
Further, a kind of preferred embodiment of the utility model is：The injecting hole is bellmouth.
Further, a kind of preferred embodiment of the utility model is：The crystal resonator is that four pin quartz crystallines are humorous
Shake device, and four pin quartz crystalline resonators connect electric pin and two grounding pins including two, and described connects electric pin
It is staggered at four angles of four pin quartz crystalline resonators with grounding pin.The beneficial effects of the utility model：
The utility model product is handled using metal nano and plastic raw materials nanometered disposal technique, makes its two kinds by injection molding
The entirely different material of property is physical to be fitted closely, and there are two types of properties for this product plastic cement material in addition, with metal binding molecule
For opaqueness plastics, product upper cover can be then laser welding with light transmission, welding manner, when laser irradiation lid because of lid
Material is translucency, thus laser bottom can be radiated at across lid can not be on the plastics of light transmission, in the position of two kinds of plastics fitting
It sets and will produce moment heat and to lid apply pressure so two kinds of plastics can weld together and reach leakproofness and not leak plus external
Gas.
The plastic crystal of the utility model has following advantage：
1, welding manner is contact pin type to apparent size original metal product smaller than original metal envelope product on circuit boards, existing
Patch (SMD) welding can be realized in the product using the utility model on circuit boards；
2, the utility model product is in cost of manufacture less than current metal and ceramics envelope product；
3, the utility model product significantly larger than current product on the market in the efficiency of production；
4, the utility model product is electroplated area and reduces percent 50% or more, more environmentally-friendly；The utility model product exists
Crystal industry has broken the limitation of metal and ceramics envelope, and more selectivity are brought to the product that client uses；
5, the utility model product has greater flexibility, a size that can do more multifrequency in performance than ceramet envelope
The product that rate differs brings greater flexibility for board design.
Description of the drawings
It briefly introduces below in conjunction with the accompanying drawings.It is clear that some specific implementations that figure below, which is only the application, to be recorded
Mode.The utility model includes but not limited to these attached drawings.
Fig. 1 is the quartz-crystal resonator structural schematic diagram of embodiment 1；
Fig. 2 is the A of Fig. 1 to structural schematic diagram；
Fig. 3 is 2 quartz-crystal resonator structural schematic diagram of embodiment；
Fig. 4 is the A of Fig. 3 to structural schematic diagram；
Fig. 5 is 3 quartz-crystal resonator main view schematic diagram of embodiment；
Fig. 6 is the A of Fig. 5 to structural schematic diagram；
Fig. 7 is the quartz-crystal resonator main view schematic diagram of embodiment 4；
In figure, 1 is cover board, and 2 be pedestal, and 3 be groove, and 4 be protrusion, and 5 be Z-shaped pin, and 6 be bellmouth, and 7 be quartz-crystal
Piece, 8 be accommodating chamber, and 9 be conducting resinl, and 10 be square hole, and 11 be grounding pin, and 12 be square pin.
Specific implementation mode
Below in conjunction with the utility model attached drawing, the technical solution of the utility model is clearly and completely described, is shown
So, described content is only the utility model one embodiment, instead of all the embodiments.Based in the utility model
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained without creative efforts,
It shall fall within the protection scope of the present invention.
Embodiment 1
As illustrated in fig. 1 and 2, a kind of Plastic Package quartz-crystal resonator, including cover board 1, quartz wafer 7,9 and of conducting resinl
Pedestal 2, the cover board 1 are the light-permeable plastic cover plate that injection molding is formed, and are provided with and are accommodated on pedestal 2 on the cover board 1
The groove 3 of protrusion 4, the quartz wafer 7 are the quartz wafer 7 of plated electrode, and the pedestal 2 includes opaque-plastic
Main body and conductive pin are provided with the accommodating chamber 8 for accommodating quartz wafer 7 and right with groove 3 in the opaque-plastic main body
The protrusion 4 answered, the conductive pin is combined together with opaque-plastic main body by nanometer injection molding process, described
The quartz wafer 7 of plated electrode is solidificated in by conducting resinl 9 in accommodating chamber 8, and is connected with conductive pin, the cover board 1
It is fixed together with pedestal 2 and seals quartz wafer 7.
Cover board 1 and pedestal 2 are fixed together by laser welding.
It is Z-shaped pin 5 to connect electric pin, and the position that Z-shaped pin 5 is corresponded in opaque-plastic main body is provided with injection molding
Hole.Setting injecting hole may insure that metal is not deformed in injection molding by plastic cement impact force, effectively improve product quality and yield rate.
Injecting hole can be arranged as required to as different shape, and the present embodiment uses bellmouth 6.
Embodiment 2
As shown in Figures 3 and 4, substantially the same manner as Example 1, the difference lies in that crystal resonator is tri-pin quartz crystalline
Resonator, tri-pin quartz crystalline resonator further include grounding pin 11, and the grounding pin 11 setting is in three pins quartz
The centre of crystal resonator.It is Z-shaped pin 5 to connect electric pin, and the position that Z-shaped pin 5 is corresponded in opaque-plastic main body is set
It is equipped with injecting hole.Setting injecting hole may insure that metal is not deformed in injection molding by plastic cement impact force, effectively improve product quality
And yield rate.Injecting hole can be arranged as required to as different shape, and the present embodiment uses square hole 10.
Embodiment 3
As it can be seen in figures 5 and 6, substantially the same manner as Example 1, difference is：The crystal resonator is four pin stones
English crystal resonator, four pin quartz crystalline resonators connect electric pin and two grounding pins 11 including two, described
Connect electric pin and grounding pin 11 is staggered at four angles of four pin quartz crystalline resonators, the electric pin that connects is
Can be any shape, the present embodiment is square pin 12.
Embodiment 4
As shown in fig. 7, a kind of Plastic Package quartz-crystal resonator, including cover board and pedestal, the cover board are plastics
Cover board, the pedestal include plastic body and conductive pin, and the appearance for accommodating quartz wafer is provided on the plastic body
Receive room, the conductive pin is combined together with plastic body by nanometer injection molding process, the cover board and pedestal
It is fixed together and seals quartz wafer.Quartz-crystal resonator in the present embodiment is two pins, and the electric pin that connects is Z
Font pin.The position that Z-shaped pin is corresponded on plastic body is provided with injecting hole.Injecting hole is bellmouth.In the present embodiment
Cover board and pedestal be fixed together by gluing, ultrasonic welding process can also be selected to be fixed together.
A kind of preparation method of the Plastic Package quartz-crystal resonator of the utility model, includes the following steps：
(1) cover board 1 manufactures：According to the shape and size of cover board 1, is manufactured and covered by injection molding process using light-passing plastic
Plate 1；
(2) pedestal 2 manufactures：Sheet metal strip strikes out pin by punch forming process, and the terminal after punching press carries out nanometer
Change is handled, and so that metal terminal surface is formed nanometer cavernous structure, the terminal after nanometered disposal is put into injection mold, and use is received
Rice plastics molding process, shape and size as requested manufacture pedestal 2；
(3) quartz wafer 7 pre-processes：Quartz wafer 7 plates top electrode, and the quartz wafer of plated electrode 7 is passed through conduction
Glue 9 is fixed on conductive pin, and quartz wafer 7 is put into after pedestal and carries out frequency modulation by vernier device；
(4) laser welding：By upper cover and pedestal by the raised 4 engaging portion laser weldings of groove 3, make two kinds of upper cover and pedestal
Plastically welding seals quartz wafer 7.
Light-passing plastic used in the utility model and opaque-plastic can select PPS, PBT, PA6, PAA6, PPA
Deng.As long as light-passing plastic ensures that laser can penetrate, opaque-plastic will ensure that laser cannot penetrate.It is adopted in the present embodiment
Plastics are PPS.
Another preparation method of the Plastic Package quartz-crystal resonator of the utility model, includes the following steps：
A kind of preparation method of Plastic Package quartz-crystal resonator shell, includes the following steps：
(1) cover board manufactures：According to the shape and size of cover board, plastic cover plate is manufactured by injection molding process；
(2) pedestal manufactures：Sheet metal strip strikes out pin by punch forming process, then according to the shape of pedestal and ruler
It is very little, by nanometer injection molding process, manufacture pedestal；
(3) fixing seal：Upper cover and pedestal are fixed together by gluing, quartz wafer is sealed.Upper cover and pedestal
Fixed form can also be carried out by the way of ultrasonic bonding.
Two pins Plastic Package quartz-crystal resonator one is prepared using the method for embodiment 6, using the side of embodiment 5
Method prepares two pins Plastic Package quartz-crystal resonator two, measures its quartz-crystal resonator relevant parameter, determination condition is such as
Under：Frequency：16000000, the level of drive:10.00uW Into RR, load capacitance:9.00pF.Each model random selection ten
A measurement, design parameter are as follows：
The relevant parameter of two pins Plastic Package quartz-crystal resonator one
The relevant parameter of two pins Plastic Package quartz-crystal resonator two
By above data it is found that Plastic Package quartz-crystal resonator and the ceramic package of the present invention and Metal Packaging
Quartz-crystal resonator does not have gap in performance.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (10)
1. a kind of Plastic Package quartz-crystal resonator shell, it is characterised in that：Including cover board and pedestal, the cover board is modeling
Expect cover board, the pedestal includes plastic body and conductive pin, is provided on the plastic body and accommodates quartz wafer
Accommodating chamber, the conductive pin are combined together with plastic body by nanometer injection molding process, the cover board and bottom
Seat is sealed quartz wafer by being fixed together.
2. a kind of Plastic Package quartz-crystal resonator shell according to claim 1, it is characterised in that：The cover board
It for light-permeable plastic cover plate, is provided on the cover board and accommodates groove raised on pedestal, the plastic body is not
It is provided in opaque-plastic main body described in light-passing plastic main body and accommodates the accommodating chamber of quartz wafer and corresponding with groove convex
Rise, the conductive pin is combined together with opaque-plastic main body by nanometer injection molding process, the cover board with
Pedestal is fixed together by laser welding, and quartz wafer is sealed.
3. a kind of Plastic Package quartz-crystal resonator, it is characterised in that：Including cover board, quartz wafer, conducting resinl and pedestal, institute
The cover board stated is plastic cover plate, and the quartz wafer is the quartz wafer of plated electrode, and the pedestal includes plastic body
And conductive pin, the accommodating chamber for accommodating quartz wafer, the conductive pin and plastics master are provided on the plastic body
Body is combined together by nanometer injection molding process, and the quartz wafer of the plated electrode is solidificated in receiving by conducting resinl
Interior, and be connected with conductive pin, the cover board and pedestal are fixed together and seal quartz wafer.
4. a kind of Plastic Package quartz-crystal resonator according to claim 3, it is characterised in that：The cover board is can
Light-passing plastic cover board is provided on the cover board and accommodates groove raised on pedestal, and the plastic body is opaque
Plastic body is provided with the accommodating chamber for accommodating quartz wafer and protrusion corresponding with groove in the opaque-plastic main body,
The conductive pin is combined together with opaque-plastic main body by nanometer injection molding process, the cover board and pedestal
It is fixed together by laser welding, quartz wafer is sealed.
5. a kind of Plastic Package quartz-crystal resonator according to claim 4, it is characterised in that：The crystal resonant
Device is two pins quartz-crystal resonator, and the conductive pin is in quartz-crystal resonator both ends.
6. a kind of Plastic Package quartz-crystal resonator according to claim 4, it is characterised in that：The crystal resonant
Device is tri-pin quartz crystalline resonator, and the tri-pin quartz crystalline resonator further includes grounding pin, the ground connection
Pin is arranged in the centre of tri-pin quartz crystalline resonator.
7. a kind of Plastic Package quartz-crystal resonator according to claim 5 or 6, it is characterised in that：The conduction
Pin is Z-shaped pin.
8. a kind of Plastic Package quartz-crystal resonator according to claim 7, it is characterised in that：The opaque modeling
The position that Z-shaped pin is corresponded in material main body is provided with injecting hole.
9. a kind of Plastic Package quartz-crystal resonator according to claim 8, it is characterised in that：The injecting hole is
Bellmouth.
10. a kind of Plastic Package quartz-crystal resonator according to claim 3, it is characterised in that：The crystal is humorous
The device that shakes is four pin quartz crystalline resonators, and four pin quartz crystalline resonators connect electric pin including two and two connect
Ground pin, it is described to connect electric pin and grounding pin is staggered at four angles of four pin quartz crystalline resonators.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820362473.XU CN207801878U (en) | 2018-03-16 | 2018-03-16 | A kind of Plastic Package quartz-crystal resonator shell and its quartz-crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820362473.XU CN207801878U (en) | 2018-03-16 | 2018-03-16 | A kind of Plastic Package quartz-crystal resonator shell and its quartz-crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207801878U true CN207801878U (en) | 2018-08-31 |
Family
ID=63275540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820362473.XU Active CN207801878U (en) | 2018-03-16 | 2018-03-16 | A kind of Plastic Package quartz-crystal resonator shell and its quartz-crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207801878U (en) |
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2018
- 2018-03-16 CN CN201820362473.XU patent/CN207801878U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201021 Address after: Floor 1-3, No.3, Mudun Road, No.1 Industrial Zone, Loucun community, Xinhu street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Hogg Technology Co., Ltd Address before: 200135 Shanghai city Pudong New Area mud Town Road No. 979 Building 2 Hon Patentee before: SHANGHAI CIJIN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 floor 1-3, No.3, Mudun Road, No.1 Industrial Zone, Loucun community, Xinhu street, Guangming District, Shenzhen City, Guangdong Province Patentee after: Cijin Technology (Guangdong) Co.,Ltd. Address before: 518000 floor 1-3, No.3, Mudun Road, No.1 Industrial Zone, Loucun community, Xinhu street, Guangming District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Hogg Technology Co., Ltd |