CN207766666U - A kind of ceramic circuit-board with plated-through hole - Google Patents
A kind of ceramic circuit-board with plated-through hole Download PDFInfo
- Publication number
- CN207766666U CN207766666U CN201820126064.XU CN201820126064U CN207766666U CN 207766666 U CN207766666 U CN 207766666U CN 201820126064 U CN201820126064 U CN 201820126064U CN 207766666 U CN207766666 U CN 207766666U
- Authority
- CN
- China
- Prior art keywords
- hole
- metal
- metal layer
- board
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model belongs to pcb board manufacturing technology field, it is intended to provide a kind of ceramic circuit-board with plated-through hole, the ceramic circuit-board includes ceramic substrate, at least one connection through-hole is opened up on ceramic substrate by laser, metal paste is then clogged in each connection through-hole, metal paste after hot setting is shaped to metal column immediately, it is achieved in the metallization of each connection through-hole, and liquid medicine will not be kept in hole, the reliability for ensuring ceramic circuit-board evades the defect that filling perforation in tradition plating process for filling hole has cavity；In addition, mechanical grinding protrudes the both ends of each metal column on two surfaces of ceramic substrate or more, then the magnetron vacuum splash-proofing sputtering metal layer group at least one surface of ceramic substrate, because metal layer group can be with ceramic substrate firm connection, and magnetron vacuum sputtering technology can control its thickness well, therefore, which is suitable for being fabricated to fine ceramic circuit-board, obviously, which can take into account delicate execution and high reliability.
Description
Technical field
The utility model belongs to pcb board manufacturing technology field, is to be related to a kind of pottery with plated-through hole more specifically
Porcelain wiring board.
Background technology
With the development of LED core chip technology, the encapsulating structure of LED product is from pinned encapsulating structure to surface-adhered type
(abbreviation SMD) encapsulating structure arrives power-type encapsulating structure again.It is well known that efficiency of the heat dissipation performance of LED to LED chip, longevity
Life, reliability etc. have significant impact, and this requires LED encapsulation to have good heat sinking function.Because ceramic substrate have high heat dissipation,
The performances such as low resistance, long lifespan, proof voltage, thus, LED package substrate is from traditional glass epoxy resin to based on aluminium or copper
The substrate of material is wanted, is gradually transferred to using the ceramic material of high heat conduction as on the New LED ceramic substrate of main material.With DPC
For ceramic substrate (also known as direct copper plating ceramic wafer), because higher cost performance has in numerous electronic package substrates
Stronger competitiveness becomes the development trend of the following power type LED encapsulation.
No matter which kind of substrate need to usually open up through-hole, and to through-hole to realize the signal conduction of each layer of substrate on substrate
It metallizes.However, traditional main two kinds of double-surface ceramics substrate covers copper mode and is respectively present following defect：(1) sintered copper
Mode, in general, this mode needs the copper thickness of plank generally in 10oz or more, and the typically no plated through-hole of such plank, if any
Through-hole, then generally use metal packing filling perforation sintering is with plated-through hole, it is clear that this mode is unfavorable for making fine circuit
Plate；(2) electro-coppering mode, in general, which using plating process for filling hole come plated-through hole, however, which is be easy to cause
There is cavity in through-hole, and easily keep electroplating liquid medicine in cavity, in this way, during use, the electroplating liquid medicine in cavity can be to through-hole
It carries out stinging erosion, causes resistance exception in through-hole, finally cause product there are larger risk, reliability reduces.
Utility model content
The purpose of this utility model is to provide a kind of ceramic circuit-boards with plated-through hole, to solve the prior art
Present in traditional ceramics substrate be unsuitable for making fine wiring board, or suitable for being fabricated to fine-line plate but because being easy
The technical problem that cavity causes reliability relatively low.
In order to solve the above technical problems, the technical solution adopted in the utility model is：It provides a kind of with plated-through hole
Ceramic circuit-board, the ceramic circuit-board with plated-through hole include the ceramics that at least one connection through-hole is offered by laser
Substrate, each described connect are packed in through-hole successively by the metal column of metal grouting and curing process formation, after polishing
The both ends of each metal column respectively with the two surface flush up and down of the ceramic substrate；The ceramic substrate it is at least one
On surface magnetron vacuum sputtering have can coat each metal column, can with the metal layer group of ceramic substrate firm connection, and
It is etched with outer-layer circuit figure in the metal layer group after thickening.
Further, the metal layer group includes the first metal layer and magnetic that magnetron vacuum is sputtered on the ceramic substrate
Vacuum sputtering is controlled in the second metal layer on the first metal layer, and the first metal layer and the second metal layer is total
Thickness is less than or equal to 1um.
Further, the first metal layer is layer of titanium metal, and the second metal layer is layers of copper.
Further, each metal column after silver paste sintering curing by forming.
Further, the thickness of the ceramic substrate is less than or equal to 0.5mm.
Further, the pore size of each connection through-hole is 0.05mm~0.2mm.
Compared with prior art, the advantageous effect of the ceramic circuit-board provided by the utility model with plated-through hole exists
In：
The ceramic circuit-board with plated-through hole includes ceramic substrate, opens up at least one on ceramic substrate by laser
A connection through-hole, and be in the milk into row metal to each connection through-hole and respectively connect through-hole after hot setting to clog each connection through-hole
Interior metal paste is shaped to metal column, in this way, the metallization of each connection through-hole can be realized, and liquid medicine will not be kept in hole,
The electric property of ceramic circuit-board is not interfered with, reliability is high, it is clear that it is free that filling perforation in tradition plating process for filling hole can be evaded
The defect in hole；By mechanical grinding ensure the both ends of each metal column respectively with the two surface flush up and down of ceramic substrate, then
The magnetron vacuum splash-proofing sputtering metal layer group at least one surface of ceramic substrate etches outer layer line on it after adding set of thick metal layers
Road figure, because metal layer group can be strong bonded with ceramic substrate, and magnetron vacuum sputtering technology can control its thickness well, because
And the ceramic substrate is further adapted for being fabricated to fine ceramic circuit-board, can also take into account delicate execution and high reliability.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new
Some embodiments of type for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the cross-sectional view of the ceramic substrate prepared in the utility model embodiment step S10；
Fig. 2 is the cross-sectional view of the ceramic substrate after step S20 laser drill in Fig. 1；
Fig. 3 is to connect through-hole in Fig. 2 to pour the cross section with the ceramic substrate after sintering curing through step S30 metal pastes
Schematic diagram；
Fig. 4 is the cross-sectional view of ceramic substrate of the metal column after step S40 mechanical grindings in Fig. 3；
Fig. 5 is cross-sectional view of the ceramic substrate after the sputtering of step S50 magnetron vacuums in Fig. 4；
Fig. 6 is cross-sectional view of the ceramic substrate after step S60 thickeies in Fig. 5；
Fig. 7 is through the ceramics with plated-through hole in the finally formed the utility model embodiment of step S70 Etchings
Wiring board；
Fig. 8 is the manufacturing flow chart of the ceramic circuit-board with plated-through hole in the utility model embodiment.
Wherein, the label in attached drawing is as follows：
100- ceramic substrates, 110- connections through-hole, 111- metal columns, the convex material of 1111-；
200- metal layers group, 300- outer-layer circuit figures.
Specific implementation mode
In order to make the technical problem to be solved, technical solution and advantage of the utility model be more clearly understood, below
In conjunction with accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific implementation described herein
Example is only used to explain the utility model, is not used to limit the utility model.
It should be noted that when component is referred to as " being fixed on " or " being set to " another component, it can be directly another
On a component or it is connected on another component.When a component is known as " being connected to " another component, it can be with
It is directly to another component or is indirectly connected on another component.
It should be noted that in the attached drawing of the utility model embodiment same or analogous label correspond to it is same or analogous
Component；If in the description of the present invention, it should be understood that there is the side of the instructions such as term "upper", "lower", "left", "right"
Position or position relationship are to be based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description the utility model and simplification is retouched
It states, does not indicate or imply the indicated device or element must have a particular orientation, with specific azimuth configuration and operation,
Therefore, the terms describing the positional relationship in the drawings are only for illustration, should not be understood as the limitation to this patent, for this
For the those of ordinary skill in field, the concrete meaning of above-mentioned term can be understood as the case may be.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or two with
On, unless otherwise specifically defined.
Below in conjunction with attached drawing 1 to Fig. 7 to a kind of reality of the ceramic circuit-board with plated-through hole provided by the utility model
Now it is described in detail.
It should be noted that the ceramic circuit-board with plated-through hole, is mainly used in LED technology field, it to be used for LED
Power-type encapsulating structure, as LED chip encapsulation DPC ceramic circuit-boards in.Certainly, in practical application, it may also be used for other
In the other products of suitable technical field.
As shown in Figure 1 and Figure 7, which includes a ceramic substrate 100.It should be noted
It is that specifically in the present embodiment, the thickness of the ceramic substrate 100 is less than or equal to 0.5mm, and ultra-thin circuit is made in this way, facilitating
Plate.Certainly, in fact, the thickness for making the ceramic substrate 100 that the ceramic circuit-board with plated-through hole can be selected not only limits
Within 0.5mm, thicker ceramic substrate 100 also can be selected.
To realize the conducting of signal, as shown in Fig. 2, it is often necessary to being opened up at least on the laminating direction of ceramic substrate 100
One connection through-hole 110.Because traditional ceramic substrate 100 is more crisp, to overcome common mechanical tapping mode to be easy to cause to make pottery
The deficiency that porcelain substrate 100 cracks, in the present embodiment, each through-hole 110 that connects is opened up by way of laser drill, in this way, phase
Than traditional mechanical tapping mode, it is additionally favorable for opening up out the smaller connection through-hole 110 in aperture.Specifically in the present embodiment, preferably
Ground, each pore size for connecting through-hole 110 are 0.05mm~0.2mm.
As shown in figure 3, being respectively packed with metal column 111 in connection through-hole 110.Not because of traditional layers of copper and the binding force of ceramics
Good, in the present embodiment, each metal column 111 is to first pass through to be in the milk into row metal in corresponding connection through-hole 110, then high temperature
Solidification just ultimately forms, in this way, ceramic substrate 100 can be overcome to lead to metal using traditional hole metallization mode such as chemistry displacement
Layer is easy to fall off, and then influences the defect of wiring board reliability.Moreover, the mode of " metal grouting+hot setting " may be used also
To ensure that each connection through-hole 110 avoids generating cavity in metallization processes, thus liquid medicine is not easy to ensconce each connection through-hole 110
It is interior, and then can ensure that final ceramic circuit-board has higher reliability.
As shown in figure 3, in general, in metal filling process, to make to fill metal paste in each connection through-hole 110, often
There is part metals slurry to overflow connection through-hole 110, in this way, after solidification convex material 1111 can be formed at the both ends of metal column 111.Consider
To the structure for simplifying wiring board and ensure the factors such as its reliability, in the present embodiment, as shown in figure 4, need to be by metal column 111
The convex material 1111 at both ends polishes off, so that it is guaranteed that the both ends of each metal column 111 respectively with the two surface phase up and down of ceramic substrate 100
Concordantly.It should be noted that in this embodiment, it is preferred that, each metal column 111 after silver paste sintering curing by forming, in other words,
Metal paste is silver paste.Certainly in fact, metal paste can also be other suitable metal pastes, such as copper is starched.
As shown in figure 5, to enable the ceramic circuit-board to install various electronic components, the letter between each electronic component is realized
Number conducting, and ensure ceramic circuit-board on line pattern it is not easily to fall off, formed at least one surface of ceramic substrate 100
Have can coat each metal column 111, metal layer group 200 that can be strong bonded with ceramic substrate 100.In the present embodiment, to make this
Ceramic circuit-board can be adapted to make ultra-thin, fine wiring board, and metal layer group 200 is sputtered at by way of magnetron vacuum sputtering
On the surface of ceramic substrate 100, in other words, it is different from the metal layer of traditional ceramics substrate, which is ultra-thin gold
Belong to layer group, and its thickness can be effectively controlled, in this way, can guarantee the overall thickness of the ceramic circuit-board that final molding goes out compared with
It is small.It should be noted that in the present embodiment, sputtering has metal layer group 200 on two surfaces up and down of ceramic substrate 100, namely
It is to say, ceramic substrate 100 realizes two-sided metallization.
In addition, as shown in fig. 6, in general, also need using the modes such as common plating or electroless copper plating to metal layer group 200 into
Row thickeies, to be further ensured that the reliability and signal conduction of ceramic circuit-board.As shown in fig. 7, the metal layer group 200 after thickening
On be etched with outer-layer circuit figure 300, each electronic component be installed on ceramic circuit-board realize signal conduction to facilitate.
It is to be appreciated that comparing traditional ceramic circuit-board, the ceramic circuit-board with plated-through hole is by using different
Copper mode is covered in traditional, specifically, first passing through laser drill, simultaneously high temperature is solid for the rear filling metal paste in each connection through-hole 110
It is melted into metal column 111, after polishing each metal column 111, the advance magnetron vacuum splash-proofing sputtering metal layer group 200 on ceramic substrate 100,
To ensure the overall thickness of the reliability and control ceramic circuit-board of ceramic circuit-board, finally in the metal layer group 200 after thickening
Outer-layer circuit figure 300 is etched, the metallization of micropore is not only realized, ensures its own with higher reliability, moreover it is possible to is suitable
In being fabricated to fine wiring board, meet the ultra-thin and high-power growth requirement of wiring board.
Further, a kind of specific embodiment party as the ceramic circuit-board provided by the utility model with plated-through hole
Formula, metal layer group 200 include the first metal layer (not shown) and second metal layer (not shown).To ensure that metal layer can be with ceramics
The surface of substrate 100 is securely joined with, it is preferable that the first metal layer is layer of titanium metal.Certainly, in fact, the first metal layer also
It can be other metal layers, need to only ensure that it can have preferable associativity with ceramic substrate 100.In addition, for that can make
Ultra-thin ceramic circuit-board, general thickness energy real-time control, the first metal layer are laid on pottery by way of magnetron vacuum sputtering
On the surface of porcelain substrate 100.
Accordingly, second metal layer (not shown) is laid on the first metal layer by way of magnetron vacuum sputtering and (schemes not
Show) on.In general, the second metal layer is layers of copper.Certainly, in fact, can also be other metal layers.For the pottery for producing ultra-thin
Porcelain wiring board, in the present embodiment, the overall thickness of the first metal layer and second metal layer are less than or equal to 1um.Certainly, it actually answers
In, the overall thickness of the first metal layer and second metal layer is simultaneously unlimited within 1um.
From the foregoing, it will be observed that a kind of the step of manufacturing method of ceramic circuit-board with plated-through hole provided by the utility model
Including：
S10：Prepare ceramic substrate 100.Specifically in the present embodiment, as shown in Figure 1, ceramic substrate spare in the step
100 thickness is less than or equal to 0.5mm, in this way, conducive to ultra-thin ceramic circuit-board is produced.Certainly, in fact, spare pottery
The thickness of porcelain substrate 100 is simultaneously unlimited within 0.5mm.
S20：Laser drill is carried out to process each connection through-hole 110 to ceramic substrate 100.Specifically in the present embodiment,
As shown in Fig. 2, the pore size of each connection through-hole 110 drilled out by laser drill in the step is 0.05mm~0.2mm, this
Sample is conducive to make micropore, final to be conducive to make ultra-thin ceramic circuit-board.Certainly, in fact, respectively connecting the aperture of through-hole 110
Size can also be other suitably sized.
S30：The capping metal slurry in each connection through-hole 110, and sintering curing metal paste is to form metal column 111.
Specifically in the present embodiment, as shown in figure 3, being filled in each connection through-hole 110 by the way of steel mesh+vacuum taphole in the step
Expire silver paste, then high temperature sintering cures silver paste.Wherein, in solidification process, the organic solvent being mixed in silver paste can vapor away, most
End form at conducting metal column 111.Obviously, pass through the step, you can realize the metallization of micropore, and ensure metallization processes
In, each connect in through-hole 110 cavity will not occur, thereby it is ensured that respectively connecting through-hole as traditional hole metallization technique
Liquid medicine will not be kept in 110, and then ensures the reliability of the ceramic circuit-board.
S40：Each metal column 111 of mechanical grinding, so that the both ends of each metal column 111 are upper and lower with ceramic substrate 100 respectively
Two surface flushes.Specifically in the present embodiment, as shown in figure 4, the step gets rid of each metal mainly by mechanical lapping
The convex material 1111 in both ends 110 aperture of protrusion connection through-hole of column 111.
S50：One layer of magnetron vacuum sputtering can be secured with ceramic substrate 100 on toward at least one surface of ceramic substrate 100
In conjunction with metal layer group 200, to realize the surface metalation of ceramic substrate 100.It should be noted that in embodiment, such as Fig. 5 institutes
Show, sputtering has metal layer group 200 on two surfaces up and down of ceramic substrate 100, that is, ceramic substrate 100 realizes two-sided gold
Categoryization.In addition, specifically, which includes the following steps：
S51：One layer of magnetron vacuum sputtering can be secured with ceramic substrate 100 on toward at least one surface of ceramic substrate 100
In conjunction with the first metal layer (not shown).Specifically in this embodiment, it is preferred that, which is titanium layer, that is, passing through
The mode of magnetron vacuum sputtering, a thin layer of Titanium is sputtered on the surface of ceramic substrate 100, enhances metal layer group with this
200 with the binding force of ceramic substrate 100.
S52：Magnetron vacuum sputters one layer of second metal layer (not shown) on toward the first metal layer.Specifically in the present embodiment
In, which is layers of copper, that is, one layer of copper that can have stronger binding force with titanium layer is sputtered on the surface of titanium layer again,
To facilitate the technique that can subsequently continue to use and cover copper in traditional surface, simplify cost of manufacture.Generally, the metal sputtered in step S50
The thickness of layer group 200 can be controlled in time, and specifically in the present embodiment, the overall thickness of the first metal layer and second metal layer is less than
Or it is equal to 1um.
It is to be appreciated that the metal layer group 200 in step S50 includes the first metal layer and is sputtered on the first metal layer
Second metal layer, because all having stronger knot between the first metal layer and ceramic substrate 100, the first metal layer and second metal layer
With joint efforts, thus, by sputtering one layer of thin titanium in advance, then on titanium layer sputter one layer of thin copper, you can ensure 200 energy of metal layer group
It is firmly bonded on ceramic substrate 100, and conducive to control metal layer group 200 or even entire ceramic circuit-board ultrathin.
S60：Add set of thick metal layers 200.Specifically in embodiment, because second metal layer (not shown) is layers of copper, thus, it should
Step can continue to use the modes such as traditional plating or chemical deposition to thicken second metal layer namely layers of copper.
S70：Outer-layer circuit figure 300 is etched in metal layer group 200 after thickening, to realize the ceramic circuit-board
Electric property connection.
From the foregoing, it will be observed that the utility model is by using " laser drill+silver paste consent+hot setting+mechanical lapping+priority
The close fit of each steps such as magnetron vacuum sputtered titanium and the heavy copper+circuit etching figure of copper+tradition ", realization can ultra-thin ceramic
The making of wiring board, meanwhile, there is cavity to cause to keep liquid medicine in hole when solving traditional plating filling perforation, finally influences ceramic thread
The problem of road plate reliability.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model.For this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the right of the utility model.
Claims (6)
1. a kind of ceramic circuit-board with plated-through hole, which is characterized in that the ceramic circuit-board includes being opened up by laser
There is the ceramic substrate of at least one connection through-hole, is packed in each connection through-hole successively through metal grouting and curing process
The both ends of the metal column of formation, each metal column after polishing are equal with two surfaces up and down of the ceramic substrate respectively
Together；Each metal column can be coated by there is magnetron vacuum sputtering at least one surface of the ceramic substrate, can be with the ceramics
The metal layer group of substrate firm connection, and it is etched with outer-layer circuit figure in the metal layer group after thickening.
2. the ceramic circuit-board according to claim 1 with plated-through hole, which is characterized in that the metal layer group includes
The first metal layer and magnetron vacuum that magnetron vacuum is sputtered on the ceramic substrate are sputtered on the first metal layer
Two metal layers, and the overall thickness of the first metal layer and the second metal layer is less than or equal to 1um.
3. the ceramic circuit-board according to claim 2 with plated-through hole, which is characterized in that the first metal layer is
Layer of titanium metal, second metal layer are layers of copper.
4. the ceramic circuit-board according to claim 2 with plated-through hole, which is characterized in that each metal column is by silver
It is formed after slurry sintering curing.
5. the ceramic circuit-board according to any one of claims 1 to 4 with plated-through hole, which is characterized in that the pottery
The thickness of porcelain substrate is less than or equal to 0.5mm.
6. the ceramic circuit-board according to claim 5 with plated-through hole, which is characterized in that each connection is logical
The pore size in hole is 0.05mm~0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820126064.XU CN207766666U (en) | 2018-01-24 | 2018-01-24 | A kind of ceramic circuit-board with plated-through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820126064.XU CN207766666U (en) | 2018-01-24 | 2018-01-24 | A kind of ceramic circuit-board with plated-through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207766666U true CN207766666U (en) | 2018-08-24 |
Family
ID=63181915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820126064.XU Active CN207766666U (en) | 2018-01-24 | 2018-01-24 | A kind of ceramic circuit-board with plated-through hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207766666U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323003A (en) * | 2018-01-24 | 2018-07-24 | 深圳市牧泰莱电路技术有限公司 | A kind of ceramic circuit-board and its manufacturing method with plated-through hole |
| CN110132453A (en) * | 2019-05-28 | 2019-08-16 | 无锡莱顿电子有限公司 | A kind of pressure sensor bonding method |
| CN110828961A (en) * | 2019-11-26 | 2020-02-21 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of LTCC embedded hollow rectangular waveguide structure |
| CN111681965A (en) * | 2020-06-19 | 2020-09-18 | 西安微电子技术研究所 | Manufacturing method of double-sided photoelectric substrate with high-density through hole interconnection |
| CN111741604A (en) * | 2020-07-04 | 2020-10-02 | 吉安满坤科技股份有限公司 | Manufacturing method of automobile printed circuit board |
-
2018
- 2018-01-24 CN CN201820126064.XU patent/CN207766666U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323003A (en) * | 2018-01-24 | 2018-07-24 | 深圳市牧泰莱电路技术有限公司 | A kind of ceramic circuit-board and its manufacturing method with plated-through hole |
| CN110132453A (en) * | 2019-05-28 | 2019-08-16 | 无锡莱顿电子有限公司 | A kind of pressure sensor bonding method |
| CN110828961A (en) * | 2019-11-26 | 2020-02-21 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of LTCC embedded hollow rectangular waveguide structure |
| CN110828961B (en) * | 2019-11-26 | 2021-06-08 | 中国电子科技集团公司第五十四研究所 | Manufacturing method of LTCC embedded hollow rectangular waveguide structure |
| CN111681965A (en) * | 2020-06-19 | 2020-09-18 | 西安微电子技术研究所 | Manufacturing method of double-sided photoelectric substrate with high-density through hole interconnection |
| CN111741604A (en) * | 2020-07-04 | 2020-10-02 | 吉安满坤科技股份有限公司 | Manufacturing method of automobile printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207766666U (en) | A kind of ceramic circuit-board with plated-through hole | |
| CN108323003A (en) | A kind of ceramic circuit-board and its manufacturing method with plated-through hole | |
| CN103956265B (en) | Thin film capacitor embedded in polymer dielectric | |
| CN102709439B (en) | LED (Light emitting diode) ceramic support and manufacturing method thereof | |
| US20060234021A1 (en) | Multi-layer ceramic substrate, method for manufacturing the same and electronic device using the same | |
| CN106463470A (en) | Wiring board, electronic device, and electronic module | |
| EP1830414A1 (en) | Element mounting substrate and method for manufacturing same | |
| CN102683220A (en) | Method for making multi-layer organic liquid crystal polymer (LCP) substrate structure | |
| CN105870026A (en) | Carrier and manufacturing method therefor, and method for manufacturing core-less packaging substrate from carrier | |
| CN101834178A (en) | Integration-type passive element and manufacturing method thereof | |
| CN202662663U (en) | Led ceramic bracket | |
| CN205595327U (en) | Centreless package substrate | |
| CN207678068U (en) | A kind of ultra-high conducting heat type ceramic substrate | |
| KR100764386B1 (en) | Insulation structure for high thermal condition and its manufacturing method | |
| CN103081574B (en) | Circuit board and electronic installation | |
| CN208402213U (en) | A kind of high-density printed circuit board | |
| CN110536565A (en) | A kind of filling perforation method of wiring board through-hole | |
| CN107871673B (en) | A kind of thickness dielectric layer thin-film multilayer package substrate production method | |
| TWI581697B (en) | Method for manufacturing heat dissipation structure of ceramic substrate | |
| JPH09293968A (en) | Method of manufacturing multilayer wiring substrate | |
| CN105420679A (en) | Device and method for preparing copper-clad ceramic substrate based on twin-target magnetron sputtering | |
| JPH1027959A (en) | Manufacturing method of multilayer wiring board | |
| CN107785470A (en) | UV LED auxiliary frames ceramic substrates and its manufacture method | |
| TW202101686A (en) | A ceramic circuit board with thick copper structure and manufacturing method thereof | |
| CN203535979U (en) | Short circuit chip for surface gold-coated microwave circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |