CN207766386U - A kind of thermal imaging device and video camera - Google Patents
A kind of thermal imaging device and video camera Download PDFInfo
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- CN207766386U CN207766386U CN201721672036.XU CN201721672036U CN207766386U CN 207766386 U CN207766386 U CN 207766386U CN 201721672036 U CN201721672036 U CN 201721672036U CN 207766386 U CN207766386 U CN 207766386U
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- thermal imaging
- imaging device
- circuit board
- metal frame
- infrared detector
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- 238000001931 thermography Methods 0.000 title claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 59
- 238000007781 pre-processing Methods 0.000 claims abstract description 50
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 14
- 206010020843 Hyperthermia Diseases 0.000 abstract 1
- 230000036031 hyperthermia Effects 0.000 abstract 1
- 230000006641 stabilisation Effects 0.000 abstract 1
- 238000011105 stabilization Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Abstract
The utility model is related to photographic device technical field, it includes the metal framework and infrared detector being installed on metal framework, signal pre-processing circuit plate and mainboard to disclose a kind of thermal imaging device and video camera, thermal imaging device；Wherein, the infrared detector is located at the side of the metal framework；The signal pre-processing circuit plate is located at the side that the metal framework deviates from the infrared detector, and the mainboard is located at the side of the signal pre-processing circuit backboard from the metal framework.Above-mentioned thermal imaging device can be effectively improved the heat dissipation effect of infrared detector, while one can be provided for infrared detector with respect to samming, the environment of stabilization, and then can reduce localized hyperthermia or temperature change in device and be had an impact to infrared detector；Therefore, the image quality of the thermal imaging device is higher, and image effect is higher.
Description
Technical Field
The utility model relates to a camera technical field, in particular to thermal imaging device and camera.
Background
The principle of thermal imaging is to convert the invisible infrared energy emitted by an object into a visible thermal image; infrared detectors are a major functional component of thermal imaging devices. The infrared detector for the movement of the thermal imaging camera is often low in temperature specification and is particularly sensitive to temperature uniformity and stability, and the image effect can be seriously influenced by local high temperature and temperature change.
As shown in fig. 1 and 2, a thermal imaging camera in the prior art generally comprises five parts, namely a metal frame 10, an infrared detector 20, a circuit board 30, a main board 40 and a rear cover 50, wherein the infrared detector 20 is mounted on an upper end face of the metal frame 10, the circuit board 30 is mounted in a cavity of the metal frame 10, the main board 40 is mounted on a lower end face of the metal frame 10, and the rear cover 50 is located on a rear face of the main board 40. When the movement works, the power consumption of the main board 40 is large (about 1.6W), the temperature of devices such as FPGA, DDR and the like on the main board 40 can be rapidly increased, so that the local high temperature of the main board 40 can be caused, one part of the local high temperature can be dissipated to the rear cover 50, and the other part of the local high temperature can be directly conducted to the metal frame 10, so that the metal frame 10 generates the local high temperature; however, since the infrared detector 20 is directly contacted with the metal frame 10 to dissipate heat, the heat dissipation of the infrared detector 20 is seriously affected by the temperature rise of the metal frame 10, and it is likely that the infrared detector 20 generates local high temperature and peripheral temperature variation, which seriously affect the imaging effect.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a thermal imaging device and camera for improve thermal imaging device's image effect.
In order to achieve the above purpose, the utility model provides the following technical scheme:
a thermal imaging device comprises a metal frame, an infrared detector, a signal preprocessing circuit board and a main board, wherein the infrared detector, the signal preprocessing circuit board and the main board are arranged on the metal frame; wherein,
the infrared detector is positioned on one side of the metal frame; the signal preprocessing circuit board is located on one side, away from the infrared detector, of the metal frame, and the main board is located on one side, away from the metal frame, of the signal preprocessing circuit board.
In the thermal imaging device, the signal preprocessing circuit board is positioned on one side of the metal frame, which is far away from the infrared detector, and the mainboard is positioned on one side of the signal preprocessing circuit board, which is far away from the metal frame, namely the signal preprocessing circuit board is isolated between the metal frame and the mainboard, because the material of the circuit board has low thermal conductivity and the signal preprocessing circuit board is a low-power-consumption heat dissipation plate (the power consumption is about 0.3W), the signal preprocessing circuit board has a certain heat insulation effect between the metal frame and the mainboard, the heat transfer of the mainboard can be well isolated from the metal frame, and the influence of high-temperature devices on the mainboard on the metal frame is effectively reduced, therefore, the heat dissipation effect of the infrared detector in contact with the metal frame can; in addition, the infrared detector is positioned on one side of the metal frame, which is far away from the main board, namely the signal preprocessing circuit board is arranged between the infrared detector and the main board to play a heat insulation role, and the infrared detector and the main board are spaced by the space distance of the metal frame, so that the surrounding environment of the infrared detector is relatively uniform and stable, and the influence of the high temperature of the main board is small; in conclusion, the thermal imaging device can effectively improve the heat dissipation effect of the infrared detector, and can provide a relatively uniform temperature and stable environment for the infrared detector, so that the thermal imaging device is high in image quality and high in image effect.
Optionally, an edge of the motherboard is aligned with an edge of the signal pre-processing circuit board.
Optionally, the thermal imaging device further comprises a heat sink disposed between the signal preprocessing circuit board and the motherboard.
Optionally, the heat sink is a metal plate.
Optionally, an edge of the heat sink is aligned with an edge of the main board.
Optionally, a mounting hole is formed in one side, facing the signal preprocessing circuit board, of the frame of the metal frame, and through holes correspondingly matched with the mounting hole are formed in the edges of the signal preprocessing circuit board and the edge of the heat dissipation member respectively; the signal preprocessing circuit board and the heat radiating piece are installed on the metal frame through connecting pieces matched with the through holes and the installation holes.
Optionally, the thermal imaging device further includes a rear cover disposed on a side of the main board away from the signal preprocessing circuit board.
Optionally, an edge of the rear cover is aligned with an edge of the main panel.
Optionally, through holes correspondingly matched with the mounting holes are respectively formed in the edges of the rear cover and the main board; the rear cover and the main board are mounted on the metal frame through the connecting piece.
A camera comprising a thermal imaging device as described in any of the above claims.
Drawings
Fig. 1 is an exploded view of a prior art thermal imaging camera cartridge;
fig. 2 is a schematic structural view of a side of the metal frame of the thermal imaging camera movement of fig. 1 facing away from the infrared detector;
fig. 3 is an exploded schematic view of a thermal imaging apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 3.
As shown in fig. 3, an embodiment of the present invention provides a thermal imaging apparatus, which includes a metal frame 1, and an infrared detector 2, a signal preprocessing circuit board 3 and a main board 4 mounted on the metal frame 1; wherein:
the infrared detector 2 is positioned on one side of the metal frame 1; the signal preprocessing circuit board 3 is located on one side of the metal frame 1, which is far away from the infrared detector 2, and the main board 4 is located on one side of the signal preprocessing circuit board 3, which is far away from the metal frame 1.
In the thermal imaging device, the signal preprocessing circuit board 3 is located on one side of the metal frame 1 away from the infrared detector 2, the main board 4 is located on one side of the signal preprocessing circuit board 3 away from the metal frame 1, namely the signal preprocessing circuit board 3 is isolated between the metal frame 1 and the main board 4, because the circuit board material has low thermal conductivity, and the signal preprocessing circuit board 3 is a low-power-consumption heat dissipation plate (power consumption is about 0.3W), therefore, the signal preprocessing circuit board 3 has a certain heat insulation effect between the metal frame 1 and the main board 4, can well prevent heat of the main board 4 from being transferred to the metal frame 1, and effectively reduces the influence of high-temperature devices on the main board 4 on the metal frame 1, so that the heat dissipation effect of the infrared detector 2 in contact with the metal frame 1 can be effectively improved; in addition, the infrared detector 2 is positioned on one side of the metal frame 1, which is far away from the main board 4, namely the signal preprocessing circuit board 3 is arranged between the infrared detector 2 and the main board 4 to play a heat insulation role, and the space distance of the metal frame 1 is also formed, so that the surrounding environment of the infrared detector 2 is relatively uniform and stable, and the influence of the high temperature of the main board 4 is small; in conclusion, the thermal imaging device can effectively improve the heat dissipation effect of the infrared detector 2, and can provide a relatively uniform temperature and stable environment for the infrared detector 2, so that the thermal imaging device has high image quality and high image effect.
As shown in fig. 3, in a specific embodiment, the front surface of the signal preprocessing circuit board 3 is disposed toward the metal frame 1, and the signal preprocessing circuit board 3 is in signal connection with the infrared detector 2, and is configured to perform preprocessing, such as analog-to-digital conversion processing, on a detection signal of the infrared detector 2; further, the main board 4 is in signal connection with the signal preprocessing circuit board 3, and is used for further processing the output signal of the signal preprocessing circuit board 3.
As shown in fig. 3, on the basis of the above-described embodiment, in a preferred embodiment, the edge of the main board 4 may be aligned with the edge of the signal preprocessing circuit board 3.
As shown in fig. 3, on the basis of the above two embodiments, in a preferred embodiment, the thermal imaging apparatus provided by the embodiment of the present invention may further include a heat sink 5 disposed between the signal preprocessing circuit board 3 and the main board 4.
In a preferred embodiment, the heat sink 5 is a metal plate, as shown in fig. 3.
Further, the edge of the heat sink 5 may be aligned with the edge of the main board 4.
Set up heat dissipation spare 5 through the one side at mainboard 4 towards signal preprocessing circuit board 3, can help mainboard 4 to dispel the heat on the one hand, on the other hand can play certain isolated effect between infrared detector 2 and mainboard 4 to can further reduce the local high temperature that mainboard 4 produced and to infrared detector 2's image influence.
As shown in fig. 3, on the basis of the above embodiments, in a specific embodiment, the thermal imaging apparatus provided by the embodiment of the present invention may further include a rear cover 6 disposed on a side of the main board 4 away from the signal preprocessing circuit board 3; specifically, the rear cover 6 is made of a metal material, and the main board 4 can dissipate heat by contacting with the rear cover 6.
As shown in fig. 3, in a preferred embodiment based on the above embodiment, the edge of the rear cover 6 may be aligned with the edge of the main board 4.
As shown in fig. 3, on the basis of the above embodiments, in a specific embodiment, a mounting hole is formed on one side of the frame of the metal frame 1 facing the signal preprocessing circuit board 3; further, the edges of the signal preprocessing circuit board 3, the heat sink 5, the main board 4 and the rear cover 6 are respectively provided with through holes 7 correspondingly matched with the mounting holes; thus, the signal preprocessing circuit board 3, the heat sink 5, the main board 4, and the rear cover 6 may be fixed to the metal frame 1 by a connector, which may be a bolt, in particular, matching the through hole 7 and the mounting hole.
The embodiment of the utility model provides a still provide a camera, this camera includes the thermal imaging device in any embodiment of the aforesaid.
It will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A thermal imaging device is characterized by comprising a metal frame, an infrared detector, a signal preprocessing circuit board and a main board, wherein the infrared detector, the signal preprocessing circuit board and the main board are arranged on the metal frame; wherein,
the infrared detector is positioned on one side of the metal frame; the signal preprocessing circuit board is located on one side, away from the infrared detector, of the metal frame, and the main board is located on one side, away from the metal frame, of the signal preprocessing circuit board.
2. The thermal imaging device of claim 1, wherein an edge of the motherboard is aligned with an edge of the signal pre-processing circuit board.
3. The thermal imaging device according to claim 2, further comprising a heat sink disposed between the signal pre-processing circuit board and the motherboard.
4. A thermal imaging device according to claim 3, wherein said heat dissipation element is a metal plate.
5. The thermal imaging device according to claim 4, wherein an edge of said heat spreading member is aligned with an edge of said main board.
6. The thermal imaging device according to claim 4 or 5, wherein a side of the frame of the metal frame facing the signal preprocessing circuit board is provided with a mounting hole, and edges of the signal preprocessing circuit board and the heat dissipation member are respectively provided with through holes correspondingly matched with the mounting holes; the signal preprocessing circuit board and the heat radiating piece are installed on the metal frame through connecting pieces matched with the through holes and the installation holes.
7. The thermal imaging device of claim 6, further comprising a back cover disposed on a side of said motherboard facing away from said signal pre-processing circuit board.
8. The thermal imaging device of claim 7, wherein edges of the back cover are aligned with edges of the main plate.
9. The thermal imaging device according to claim 7 or 8, wherein the edges of the rear cover and the main board are respectively provided with through holes correspondingly matched with the mounting holes; the rear cover and the main board are mounted on the metal frame through the connecting piece.
10. A camera comprising the thermal imaging device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721672036.XU CN207766386U (en) | 2017-12-05 | 2017-12-05 | A kind of thermal imaging device and video camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721672036.XU CN207766386U (en) | 2017-12-05 | 2017-12-05 | A kind of thermal imaging device and video camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207766386U true CN207766386U (en) | 2018-08-24 |
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| CN201721672036.XU Active CN207766386U (en) | 2017-12-05 | 2017-12-05 | A kind of thermal imaging device and video camera |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040621A (en) * | 2018-09-20 | 2018-12-18 | 武汉高德智感科技有限公司 | A kind of infrared mould group with reinforcement heat sinking function |
| WO2021047351A1 (en) * | 2019-09-10 | 2021-03-18 | 深圳市大疆创新科技有限公司 | Infrared imaging unit, imaging device, and unmanned aerial vehicle |
| CN113423231A (en) * | 2021-06-09 | 2021-09-21 | 浙江大华技术股份有限公司 | Thermal imaging equipment |
-
2017
- 2017-12-05 CN CN201721672036.XU patent/CN207766386U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109040621A (en) * | 2018-09-20 | 2018-12-18 | 武汉高德智感科技有限公司 | A kind of infrared mould group with reinforcement heat sinking function |
| CN109040621B (en) * | 2018-09-20 | 2024-08-13 | 武汉高德智感科技有限公司 | Infrared module with reinforcement heat dissipation function |
| WO2021047351A1 (en) * | 2019-09-10 | 2021-03-18 | 深圳市大疆创新科技有限公司 | Infrared imaging unit, imaging device, and unmanned aerial vehicle |
| CN113423231A (en) * | 2021-06-09 | 2021-09-21 | 浙江大华技术股份有限公司 | Thermal imaging equipment |
| CN113423231B (en) * | 2021-06-09 | 2022-08-30 | 浙江大华技术股份有限公司 | Thermal imaging equipment |
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Effective date of registration: 20230906 Address after: Room 201, Building A, Integrated Circuit Design Industrial Park, No. 858, Jianshe 2nd Road, Economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province, 311215 Patentee after: Zhejiang Huagan Technology Co.,Ltd. Address before: Hangzhou City, Zhejiang province Binjiang District 310053 shore road 1187 Patentee before: ZHEJIANG DAHUA TECHNOLOGY Co.,Ltd. |