Utility model content
Based on this, it is necessary to provide a kind of camera module can effectively improve lens assembling flatness.
A kind of camera module, including:
Wiring board;
Sensitive chip, be located at one surface of the wiring board on, and with the circuit board electrical connection;
Packaging body, is the hollow structure of both ends open, and the packaging body is packaged on the wiring board and around the sense
Optical chip, end face of the packaging body far from the wiring board are equipped with card slot;
Optical filter is installed in the packaging body;And
Camera lens, including light incidence end and the connecting pin opposite with the light incidence end, the end face of the connecting pin are set
There are boss, the camera lens to be set on the end face of the one end of the packaging body far from the wiring board, the boss is far from the company
The end face for connecing the one end at end is abutted with the slot bottom of the card slot, and the boss is located at the card slot close to one end of the connecting pin
Outside.
In above-mentioned camera module, boss is located at outside card slot close to the end face of one end of connecting pin namely camera lens is supported in
On boss, since the area of boss is less than the area of the end face of connecting pin, the flatness of the flatness of boss relative to connecting pin
More easily management and control.Similarly, the area of the slot bottom of card slot is less than the end face of the end face of packaging body, and the flatness of the slot bottom of card slot is opposite
Flatness in the end face of packaging body is easier management and control.Therefore above-mentioned camera module can effectively change relative to traditional camera module
The assembling flatness of kind camera lens avoids the occurrence of asking because of camera lens and the image quality for influencing camera module due to packaging body run-off the straight
Topic.Boss one end is located in card slot, can increase the thrust between packaging body and camera lens so that the company between packaging body and camera lens
It connects more securely.
The height of the boss and the depth difference of the card slot are 15 μm~35 μm in one of the embodiments,.It is taking the photograph
As module assembling process in, it is also necessary in the end face of connecting pin and packaging body far from wiring board, adhesive layer is set.The height of boss
The depth difference of degree and card slot is 15 μm~35 μm, it can be ensured that adhesive layer has suitable thickness, to provide suitable bond
Power.
The depth of the card slot is 150 μm~250 μm in one of the embodiments,.The depth of card slot and boss
Height and the depth difference of card slot coordinate, and ensure that camera lens is securely connect with packaging body.
The number of the card slot is multiple in one of the embodiments, and the number of the boss is multiple, the boss
It is corresponded with the card slot.Multiple card slots coordinate with multiple boss, so that camera lens is securely connect with packaging body.
The shape of the card slot inner wall is identical as the shape of the outer wall of boss in one of the embodiments,.In card slot
The shape of wall is identical as the shape of outer wall of boss, and convenient for making molding, can also increase can increase between packaging body and camera lens
Thrust ensures the secured connection of camera lens and packaging body.
Specific implementation mode
Below in conjunction with the accompanying drawings and camera module is further described in specific embodiment.
As shown in Figures 2 and 3, the camera module 20 of an embodiment includes wiring board 100, sensitive chip 200, packaging body
300, optical filter 400, camera lens 500, conductor wire 600 and electronic component 700.
Sensitive chip 200 is located on 100 1 surface of wiring board, and is electrically connected with wiring board 100.Packaging body 300 is both ends
The hollow structure of opening, packaging body 300 are packaged on wiring board 100 and around sensitive chips 200.Packaging body 300 is far from circuit
The end face of plate 100 is equipped with card slot 310.Optical filter 400 is installed in packaging body 300.Camera lens 500 includes light incidence end 510
And the connecting pin 520 opposite with light incidence end 510.The end face of connecting pin 520 is equipped with boss 522.Camera lens 500 is set to packaging body
On the end face of 300 one end far from wiring board 100, the slot of the end face and card slot 310 of the one end of boss 522 far from connecting pin 520
Bottom abuts, and boss 522 is located at close to one end of connecting pin 520 outside card slot 310.
As shown in Figures 4 to 7, in above-mentioned camera module 20, boss 522 is located at card slot close to one end of connecting pin 520
Outside 310 namely camera lens 500 is supported on boss 522, since the area of boss 522 is less than the area of the end face of connecting pin 520,
The flatness of boss 522 is easier management and control relative to the flatness of connecting pin 520.Similarly, the area of the slot bottom of card slot 310 is less than
The flatness of the area of the end face of packaging body 300, the slot bottom of card slot 310 is more held relative to the flatness of the end face of packaging body 300
Easy management and control.Therefore above-mentioned camera module 20 can effectively improve the assembling flatness of camera lens relative to traditional camera module, avoid
Occur because camera lens 500 and packaging body 300 run-off the straight due to influence the image quality of camera module 20 the problem of.522 one end of boss
In card slot 310, the thrust between packaging body 300 and camera lens 500 can be increased so that between packaging body 300 and camera lens 500
Connection it is more secured.
Further, in the present embodiment, the height of boss 522 and the depth difference of card slot 310 are 15 μm~35 μm.It is taking the photograph
As module 20 assembling process in, it is also necessary to be arranged in the end face of connecting pin 520 and packaging body 300 far from wiring board 100 and bond
Layer (not shown).The height of boss 522 is 15 μm~35 μm with the depth difference of card slot 310, it can be ensured that adhesive layer has suitable
Thickness, to provide suitable cohesive force.Further, in the present embodiment, the depth of card slot 310 is 150 μm~250
μm.The depth of card slot 310 and the height of boss 522 and the depth difference of card slot 310 coordinate, and can increase packaging body 300 and camera lens
Thrust between 500 ensures that camera lens is securely connect with packaging body.The adhesive layer being arranged between connecting pin 520 and packaging body 300
Packaging body 300 can be made securely to be connect with camera lens 500.
Further, in the present embodiment, the number of card slot 310 is multiple, and the number of boss 522 is multiple, boss 522
It is corresponded with card slot 310.Multiple card slots 310 coordinate with multiple boss 522, so that camera lens 500 and packaging body 300
Securely connection.
Further, in the present embodiment, the shape of 310 inner wall of card slot is identical as the shape of 522 outer wall of boss.Specifically
, in the present embodiment, 310 inner wall of card slot is square, and 522 outer wall of boss is also square.The shape of 310 inner wall of card slot with it is convex
The shape of 522 outer wall of platform is identical, and convenient for making molding, can also increase can increase pushing away between packaging body 300 and camera lens 500
Power ensures the secured connection of camera lens and packaging body.In other embodiments, the shape of 310 inner wall of card slot and 522 outer wall of boss
Shape can not also be identical, as long as 522 end of boss can be abutted with the slot bottom of card slot 310.
Further, in the present embodiment, packaging body 300 (mode of generally use mold injection forms packaging body 300)
It takes shape on wiring board 100, and sensitive chip 200 is fixed on wiring board 100.In traditional camera module, usually first
By the way of gluing wiring board is fixedly connected with sensitive chip, then holder is set in the circuit board by the way of gluing
(being equivalent to packaging body 300).And in above-mentioned camera module 20, when forming packaging body 300, that is, complete sensitive chip 200
With being fixedly connected for wiring board 100 and being fixedly connected for packaging body 300 and wiring board 100, it is highly convenient for assembling.Using envelope
Dress body 300 substitutes traditional holder, can also form card slot 310 while forming packaging body 300, be highly convenient for making above-mentioned
Camera module 20.
In the present embodiment, as shown in figure 3, the one end of packaging body 300 far from wiring board 100 is equipped with first step portion
320, optical filter 400 is set in first step portion 320.Optical filter 400 is set on packaging body 300 and is set to relative to optical filter 400
On camera lens 500, the distance between optical filter 400 and sensitive chip 200 can be reduced, reduce light through optical filter 400 with it is photosensitive
The number that chip 200 reflects avoids multiple reflections from generating hot spot phenomenon.First step portion 320 can increase luminous flux, reduce envelope
It fills the material cost of body 300 and reduces the weight of packaging body 300.It is appreciated that in other embodiments, first step portion
320 can be omitted, and directly optical filter 400 is set in packaging body 300.
Further, in the present embodiment, first step portion 320 includes that the first connected load plane 322 and first is oblique
The central axes 20a of wall 324, the first load plane 322 and packaging body 300 is vertically arranged, and the first skew wall 324 is relative to packaging body
The slanted angle of 300 central axes 20a is 15~45 °.First load plane 322 can make 400 smooth installation of optical filter, the
One skew wall 324 can increase luminous flux, (need to form packaging body 300 using mold, after forming packaging body 300, need convenient for demoulding
Demould) and convenient for cleaning solution centrifugation throw away (formed packaging body 300 after, need using cleaning solution clean packaging body 300, keep away
The impurity pollution sensitive chip 200 for exempting from packaging body 300 needs the pasting protective film on sensitive chip 200 in advance in cleaning), also
The material cost of packaging body 300 can be reduced and reduce the weight of packaging body 300.Specifically, sensitive chip 200 is held with first
Glue-line namely sensitive chip 200 is arranged between load plane 322 to connect by the way of gluing with the first load plane 322.
Further, in the present embodiment, the one end of packaging body 300 far from wiring board 100 is additionally provided with second step portion 330
Second step portion 330 is between first step portion 320 and sensitive chip 200.Second step portion 330 can increase luminous flux,
It reduces the material cost of packaging body 300 and reduces the weight of packaging body 300.Further, in the present embodiment, second step
Portion 330 includes the second load plane 332 and the second skew wall 334 being connected, the axis of the second load plane 332 and packaging body 300
Line 20a is vertically arranged, and the second skew wall 334 is 15~45 ° relative to the slanted angle of the central axes 20a of packaging body 300.Second tiltedly
Wall 334 can increase luminous flux, convenient for demoulding and being thrown away convenient for cleaning solution centrifugation, can also reduce the material of packaging body 300
Cost and the weight for reducing packaging body 300.
Further, as shown in figure 3, in the present embodiment, the both ends of conductor wire 600 respectively with wiring board 100 and photosensitive
Chip 200 connects, namely in the present embodiment, wiring board 100 is electrically connected with sensitive chip 200 by conductor wire 600, can be with
Understand, in other embodiments, wiring board 100 and sensitive chip 200 can also using be electrically connected contact and the contact that is electrically connected it is direct
The mode of contact realizes electrical connection.Conductor wire 600 is closed in packaging body 300, namely when forming packaging body 300, you can Gu
Determine conductor wire 600, the case where so as to effectively avoid conductor wire 600 from loosening, namely is not in wiring board 100 and sense
The situation of 200 open circuit of optical chip.Specifically, conductor wire 600 is gold thread.
Electronic component 700 is located on wiring board 100, and is electrically connected with wiring board 100.Electronic component 700 is closed in encapsulation
In body 300, namely when forming packaging body 300, you can fixed electronic component 700 can effectively avoid electronic component 700 from pine occur
De- situation.And electronic component 700 is closed in packaging body 300, can also avoid contaminants electronic component 700.Tool
Body, in the present embodiment, conductor wire 600 is between electronic component 700 and sensitive chip 200, and 700, electronic component
In the periphery of sensitive chip 200.Electronic component 700 is the devices such as resistance, capacitance.
Further, as shown in figure 4, in the present embodiment, wiring board 100 is equipped with the first link block 110, camera lens 500
Equipped with second link block (not shown) corresponding with the first link block 110, the outer wall of packaging body 300 is equipped with escape groove 340, the
Two link blocks are electrically connected across escape groove 340 with the first link block 110.By the way of escape groove 340 is arranged, to make camera lens
500 are electrically connected with wiring board 100, convenient for the overall structure of optimization camera module 20, obtain the smaller camera module 20 of size.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.