CN207665276U - A kind of HDI high-density lamination circuit boards - Google Patents
A kind of HDI high-density lamination circuit boards Download PDFInfo
- Publication number
- CN207665276U CN207665276U CN201721904640.0U CN201721904640U CN207665276U CN 207665276 U CN207665276 U CN 207665276U CN 201721904640 U CN201721904640 U CN 201721904640U CN 207665276 U CN207665276 U CN 207665276U
- Authority
- CN
- China
- Prior art keywords
- fixture block
- wiring board
- fixed block
- block
- lower section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of HDI high-density lamination circuit boards, including the first fixed block, the first fixture block, the second fixture block, the second fixed block, screw, the side of the wiring board is provided with the first fixture block, and the other side of wiring board is provided with the second fixture block, it is provided with mounting plate below the wiring board, the side of first fixture block far from wiring board is provided with the first fixed block, the utility model has the beneficial effects that：When installation, the first fixture block is operated to stick into the card slot in the first fixed block, sliding fixture block is pressed to shrapnel direction, the second fixture block is operated to stick on sliding fixture block in corresponding card slot, the pressure applied on sliding fixture block is removed, clamping wiring board facilitates staff to install, when maintenance, wiring board can be removed by opening snapping connection between wiring board and fixed block；By the way that wiring board to be vacantly mounted on to the top of mounting plate, the gap between wiring board and mounting plate facilitates air to flow, facilitates the heat dissipation of wiring board.
Description
Technical field
The utility model belongs to wiring board technology field, and in particular to a kind of HDI high-density lamination circuit boards.
Background technology
High density interconnects the field that (HDI) manufacture is with fastest developing speed in printed circuit board industry.Use micro- blind buried via hole
A kind of circuit board that circuit distribution density is relatively high of technology.HDI aims at the compact products of low capacity user design.It is used
Modularization can Parallel Design, a module capacity 1000VA (height 1U), natural cooling can be directly placed into 19 " rack, it is maximum
It can 6 modules in parallel.The product uses complete digital signal process control (DSP) technology and multinomial patented technology, has gamut
Load capacity and stronger short-time overload capacity are adapted to, the power-factor of load and peak factor can not be considered from Hewlett-Packard in 1985
The First thirty-two bit computer of release uses the bus of 36 sequentiallylaminated mulitlayers and the miniature via of stack by now
Family server, the miniature via technologies of HDI/ are undoubtedly following PCB frameworks.Device spacing smaller, I/O pins and embedded passive
More large size ASIC and FPGA has shorter and shorter rise time and higher frequency to device, they require smaller PCB
Characteristic size, this has pushed the tight demand to the miniature vias of HDI/.
The HDI high-density lamination circuit boards of the prior art have the following problems：Wiring board is close to mounting plate, radiating efficiency compared with
It is low, influence the service life of wiring board and electric elements；It is installed and is bothered using screw.
Utility model content
To solve the problems mentioned above in the background art.The utility model provides a kind of HDI high-density laminations circuit
Plate, have the characteristics that heat dissipation, it is easy for installation.
To achieve the above object, the utility model provides the following technical solutions：A kind of HDI high-density lamination circuit boards, packet
The first fixed block, the first fixture block, the second fixture block, the second fixed block, screw are included, the side of the wiring board is provided with the first card
Block, and the other side of wiring board is provided with the second fixture block, and mounting plate is provided with below the wiring board, first fixture block is remote
Side from wiring board is provided with the first fixed block, and the side of second fixture block far from wiring board is provided with sliding fixture block, institute
The other side for stating sliding fixture block is provided with the second fixed block, and the centre of second fixed block and sliding fixture block is provided with shrapnel；
The wiring board includes solder mask, the first inner plating, and the first inner plating, first internal layer are provided with below the solder mask
It is provided with bus plane below plate, is provided with the first prepreg below the bus plane, under first prepreg
Side is provided with core material, and the second prepreg, the lower section of second prepreg are provided with below the core material
It is provided with stratum, the second inner plating is provided with below the stratum, solder mask is also equipped with below second inner plating,
The wiring board is internally provided with buried via hole.
Preferably, the wiring board corresponds to the first fixture block and the surface of the second fixture block is provided with card slot, and wiring board is embedded in
Mounted on the inside of card slot.
Preferably, it is fixedly connected by screw between first fixed block and the second fixed block and mounting plate.
Preferably, the sliding fixture block corresponds to the sliding groove that is internally provided with of the second fixed block, and slides fixture block and second
Fixed block is slidably connected.
Preferably, the shrapnel is shaped to arch.
Preferably, it is snapped connection between first fixture block and the first fixed block and the second fixture block and sliding fixture block.
Compared with prior art, the utility model has the beneficial effects that：
1, when the utility model is installed, the first fixture block of operation sticks into the card slot in the first fixed block, is pressed to shrapnel direction
Pressure sliding fixture block, sliding fixture block are moved to the direction of the second fixed block, and the distance between the first fixture block and sliding fixture block become larger, and grasp
Make the second fixture block and sticks into the pressure in corresponding card slot, removing on sliding fixture block and applying on sliding fixture block, under the action of shrapnel,
It slides fixture block to move to the direction of the first fixed block, the distance between the first fixture block and sliding fixture block is reduced, to clamping circuit
Plate fixes wiring board, and staff is facilitated to install, and when maintenance, opens snapping connection between wiring board and fixed block
Wiring board is removed, is improved work efficiency；
2, the utility model is by vacantly mounted on the top of mounting plate, making the heat dissipation area of wiring board increase wiring board
Greatly, the gap between wiring board and mounting plate facilitates air to flow, and facilitates the heat dissipation of wiring board.
Description of the drawings
Fig. 1 is the assembling schematic diagram of the utility model；
Fig. 2 is the circuit board structure schematic diagram of the utility model；
Fig. 3 is the shrapnel cross-sectional view of the utility model；
In figure：1, the first fixed block；2, the first fixture block；3, the second fixture block；4, shrapnel；5, the second fixed block；6, screw；7、
Mounting plate；8, wiring board；9, fixture block is slided；10, the first inner plating；11, the first prepreg；12, the second prepreg；13、
Second inner plating；14, buried via hole；15, solder mask；16, bus plane；17, core material；18, stratum.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides following technical scheme：A kind of HDI high-density lamination circuit boards, including the
The side of one fixed block 1, the first fixture block 2, the second fixture block 3, the second fixed block 5, screw 6, wiring board 8 is provided with the first fixture block 2,
And the other side of wiring board 8 is provided with the second fixture block 3, wiring board 8 corresponds to the first fixture block 2 and the surface of the second fixture block 3 is provided with
Card slot, and the insertion of wiring board 8 makes wiring board 8 facilitate fixation, while protection circuit plate 8, makes wiring board mounted on the inside of card slot
The lower section of 8 uniform forces, wiring board 8 is provided with mounting plate 7, leads between the first fixed block 1 and the second fixed block 5 and mounting plate 7
It crosses screw 6 to be fixedly connected, the first side of the fixture block 2 far from wiring board 8 is provided with the first fixed block 1, and the second fixture block 3 is far from circuit
The side of plate 8 is provided between sliding fixture block 9, the first fixture block 2 and the first fixed block 1 and the second fixture block 3 and sliding fixture block 9 and carries out
It snaps connection, makes 8 easy disassembly of wiring board, the other side of sliding fixture block 9 is provided with the second fixed block 5, and sliding fixture block 9 corresponds to the
Two fixed blocks 5 are internally provided with sliding groove, and slide fixture block 9 and be slidably connected with the second fixed block 5, and wiring board 8 is made conveniently to tear open
The centre of dress, the second fixed block 5 and sliding fixture block 9 is provided with shrapnel 4, and shrapnel 4 is shaped to arch, makes sliding fixture block 9
It can reset, wiring board 8 is limited；Wiring board 8 includes solder mask 15, the first inner plating 10, and the lower section of solder mask 15 is provided with
The lower section of first inner plating 10, the first inner plating 10 is provided with bus plane 16, and the lower section of bus plane 16 is provided with the first semi-solid preparation
The lower section of plate 11, the first prepreg 11 is provided with core material 17, and the lower section of core material 17 is provided with the second prepreg
12, the lower section of the second prepreg 12 is provided with stratum 18, and the lower section on stratum 18 is provided with the second inner plating 13, the second inner plating
13 lower section is also equipped with solder mask 15, and wiring board 8 is internally provided with buried via hole 14.
The operation principle and process for using of the utility model：When the utility model is installed, the first fixture block 2 of operation sticks into first
In card slot in fixed block 1, sliding fixture block 9 is pressed to 4 direction of shrapnel, shrapnel 4 deforms upon under the effect of the pressure, sliding card
Block 9 is moved to the direction of the second fixed block 5, and the distance between the first fixture block 2 and sliding fixture block 9 become larger, operation the second fixture block 3 card
On into sliding fixture block 9 in corresponding card slot, the pressure applied on sliding fixture block 9 is removed, shrapnel 4 restores original shape, drives and slides
Dynamic fixture block 9 is moved to the direction of the first fixed block 1, and fixing circuit board 8, wiring board 8 vacantly in the top of mounting plate 7, makes circuit
The heat dissipation area of plate 8 increases, and the gap between wiring board 8 and mounting plate 7 facilitates air to flow, facilitates heat dissipation.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of HDI high-density lamination circuit boards, including the first fixed block（1）, the first fixture block（2）, the second fixture block（3）, second
Fixed block（5）, screw（6）, it is characterised in that：The wiring board（8）Side be provided with the first fixture block（2）, and wiring board（8）
The other side be provided with the second fixture block（3）, the wiring board（8）Lower section be provided with mounting plate（7）, first fixture block（2）
Far from wiring board（8）Side be provided with the first fixed block（1）, second fixture block（3）Far from wiring board（8）Side setting
There is sliding fixture block（9）, the sliding fixture block（9）The other side be provided with the second fixed block（5）, second fixed block（5）With
Slide fixture block（9）Centre be provided with shrapnel（4）；The wiring board（8）Including solder mask（15）, the first inner plating（10）, institute
State solder mask（15）Lower section be provided with the first inner plating（10）, first inner plating（10）Lower section be provided with bus plane
（16）, the bus plane（16）Lower section be provided with the first prepreg（11）, first prepreg（11）Lower section set
It is equipped with core material（17）, the core material（17）Lower section be provided with the second prepreg（12）, second semi-solid preparation
Plate（12）Lower section be provided with stratum（18）, the stratum（18）Lower section be provided with the second inner plating（13）, in described second
Laminate（13）Lower section be also equipped with solder mask（15）, the wiring board（8）Be internally provided with buried via hole（14）.
2. a kind of HDI high-density lamination circuit boards according to claim 1, it is characterised in that：The wiring board（8）It is corresponding
First fixture block（2）With the second fixture block（3）Surface be provided with card slot, and wiring board（8）The embedded inside for being mounted on card slot.
3. a kind of HDI high-density lamination circuit boards according to claim 1, it is characterised in that：First fixed block（1）
With the second fixed block（5）With mounting plate（7）Between pass through screw（6）It is fixedly connected.
4. a kind of HDI high-density lamination circuit boards according to claim 1, it is characterised in that：The sliding fixture block（9）It is right
Answer the second fixed block（5）Be internally provided with sliding groove, and slide fixture block（9）With the second fixed block（5）It is slidably connected.
5. a kind of HDI high-density lamination circuit boards according to claim 1, it is characterised in that：The shrapnel（4）Shape
It is set as arch.
6. a kind of HDI high-density lamination circuit boards according to claim 1, it is characterised in that：First fixture block（2）With
First fixed block（1）With the second fixture block（3）With sliding fixture block（9）Between snapped connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721904640.0U CN207665276U (en) | 2017-12-29 | 2017-12-29 | A kind of HDI high-density lamination circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721904640.0U CN207665276U (en) | 2017-12-29 | 2017-12-29 | A kind of HDI high-density lamination circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207665276U true CN207665276U (en) | 2018-07-27 |
Family
ID=62944437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721904640.0U Expired - Fee Related CN207665276U (en) | 2017-12-29 | 2017-12-29 | A kind of HDI high-density lamination circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207665276U (en) |
-
2017
- 2017-12-29 CN CN201721904640.0U patent/CN207665276U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180727 Termination date: 20211229 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |