CN207650749U - A kind of chip radiator - Google Patents
A kind of chip radiator Download PDFInfo
- Publication number
- CN207650749U CN207650749U CN201721859893.0U CN201721859893U CN207650749U CN 207650749 U CN207650749 U CN 207650749U CN 201721859893 U CN201721859893 U CN 201721859893U CN 207650749 U CN207650749 U CN 207650749U
- Authority
- CN
- China
- Prior art keywords
- substrate
- flow
- flow channel
- model
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of chip radiators, including substrate, it is equipped with through-flow channel at left and right sides of the upper surface of substrate, through-flow channel includes two spaced through-flow risers, the upper end cover board of two through-flow risers connects to form through-flow channel, substrate, through-flow riser, cover board integral type shape, and being stood on the upper surface of substrate has several heat sinks.In use, being passed through coolant liquid in through-flow channel, cooling can be thus realized well, and the sealing of such through-flow channel is very good.The utility model is used for the heat dissipation of chip.
Description
Technical field
The utility model is related to electronic controller field of radiating, more particularly to a kind of chip radiator.
Background technology
Since cpu chip transportation load is huge on large scale electronic equipment, the heat often generated is also very big, in order to make CPU
It will not the burning because of overtemperature, it is desirable that the radiator heat-dissipation performance of chip is also more much bigger than common aluminium radiator.Conventional aluminium
The contact-type fan cooling of radiator has been unable to meet cooling requirements, therefore this newly developed products innovation uses liquid
Medium is cooled down to carry out the transmission of heat, greatly improves heat-transfer rate.
Utility model content
The technical problems to be solved in the utility model is：A kind of good chip radiator of heat dissipation performance is provided.
The solution that the utility model solves its technical problem is：
A kind of chip radiator, including substrate are equipped with through-flow channel, through-flow channel at left and right sides of the upper surface of substrate
Including two spaced through-flow risers, the upper end cover board connections of two through-flow risers to form through-flow channel, substrate,
Through-flow riser, cover board integral type shape, and being stood on the upper surface of substrate has several heat sinks.
As being further improved for said program, the lower surface of substrate is equipped with heat conduction made of the compacting of several graphite powders
Block.
As being further improved for said program, substrate is made of metal, and heat sink is made of graphite, and heat sink is embedded in
On substrate.
The utility model has the beneficial effects that：A kind of chip radiator, including substrate, the left and right sides of the upper surface of substrate
It is equipped with through-flow channel, through-flow channel includes two spaced through-flow risers, and the upper end of two through-flow risers is connected with cover board
It connects to form through-flow channel, substrate, through-flow riser, cover board integral type shape, and standing on the upper surface of substrate has several heat dissipations
Plate.In use, being passed through coolant liquid in through-flow channel, cooling can be thus realized well, and the sealing of such through-flow channel is non-
Normal is good.The utility model is used for the heat dissipation of chip.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described.Obviously, described attached drawing is a part of the embodiment of the utility model, rather than complete
Portion's embodiment, those skilled in the art without creative efforts, can also be obtained according to these attached drawings it
His design scheme and attached drawing.
Fig. 1 is the structural schematic diagram of the utility model embodiment.
Specific implementation mode
The technique effect of the design of the utility model, concrete structure and generation is carried out below with reference to embodiment and attached drawing
It clearly and completely describes, to be completely understood by the purpose of this utility model, feature and effect.Obviously, described embodiment
It is a part of the embodiment of the utility model, rather than whole embodiments, it is based on the embodiments of the present invention, the skill of this field
The other embodiment that art personnel are obtained without creative efforts belongs to the model of the utility model protection
It encloses.In addition, all connection/connection relations being previously mentioned in text, not singly refer to component and directly connect, and referring to can be according to specific reality
Situation is applied, by adding or reducing couple auxiliary, to form more preferably coupling structure.Each technology in the utility model is special
Sign, can be with combination of interactions under the premise of not conflicting conflict.
Referring to Fig.1, this is the embodiments of the present invention, specifically：
A kind of chip radiator, including substrate 1 are equipped with through-flow channel, draft tube at left and right sides of the upper surface of substrate 1
Road includes two spaced through-flow risers 21, and the upper end cover board 22 of two through-flow risers 21 connects to form draft tube
Road, substrate 1, through-flow riser 21,22 integral type of cover board shape, and being stood on the upper surface of substrate 1 has several heat sinks 3.In use,
It is passed through coolant liquid in through-flow channel, can thus realize cooling well, and the sealing of such through-flow channel is very good.
The lower surface of substrate 1 is equipped with heat-conducting block 5 made of the compacting of several graphite powders.Protrude substrate 1 in the lower surface of substrate 1
The height of 0.05~0.1mm of lower surface is convenient for smearing thermally conductive grease, silica gel in this way, simultaneously because heat-conducting block is suppressed for graphite powder
Form, thus heat-conducting block be very susceptible to it is broken, and it is broken after, graphite powder is easy to the pit and not of filled core on piece
Flat place thus can allow the heat conductivility of the utility model very good.
Substrate 1 is made of metal, and heat sink 3 is made of graphite, and heat sink 3 is inlayed on substrate 1.It can thus improve scattered
The thermal efficiency, and the structure that graphite is inlayed is also this field uses for the first time.
The better embodiment of the utility model is illustrated above, but the utility model be not limited to it is described
Embodiment, those skilled in the art can also make various equivalent changes without departing from the spirit of the present invention
Type or replacement, these equivalent modifications or replacement are all contained in the application claim limited range.
Claims (3)
1. a kind of chip radiator, including substrate (1), it is characterised in that：It is equipped at left and right sides of the upper surface of substrate (1) logical
Flow tube road, through-flow channel include two spaced through-flow risers (21), the upper end cover board of two through-flow risers (21)
(22) connect to form through-flow channel, substrate (1), through-flow riser (21), the forming of cover board (22) integral type, substrate (1) it is upper
Being stood on surface has several heat sinks (3).
2. a kind of chip radiator according to claim 1, it is characterised in that：The lower surface of substrate (1) is equipped with several
Heat-conducting block (5) made of graphite powder compacting.
3. a kind of chip radiator according to claim 1, it is characterised in that：Substrate (1) is made of metal, heat sink
(3) it is made of graphite, heat sink (3) is embedded on substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859893.0U CN207650749U (en) | 2017-12-26 | 2017-12-26 | A kind of chip radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859893.0U CN207650749U (en) | 2017-12-26 | 2017-12-26 | A kind of chip radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207650749U true CN207650749U (en) | 2018-07-24 |
Family
ID=62875606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721859893.0U Active CN207650749U (en) | 2017-12-26 | 2017-12-26 | A kind of chip radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207650749U (en) |
-
2017
- 2017-12-26 CN CN201721859893.0U patent/CN207650749U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106406477A (en) | Tandem type CPU heat dissipating and cooling device | |
| CN103687450A (en) | Circuit board heat conduction optimization design structure for onboard aviation product | |
| CN207650749U (en) | A kind of chip radiator | |
| CN204836913U (en) | Compound radiator and heat dissipation module | |
| CN107357397A (en) | A kind of novel C PU radiators | |
| CN207639075U (en) | A kind of radiator of controller | |
| CN206339926U (en) | The built-in radiator of notebook | |
| CN207639076U (en) | A kind of chip tubular radiator | |
| CN107946264A (en) | graphene composite radiating structure | |
| CN208706629U (en) | A kind of semi-shaped medium Copper-Graphite Composite radiator based on liquid metal | |
| CN203376679U (en) | CPU radiating sheet | |
| CN209710564U (en) | A kind of new radiator | |
| CN207531170U (en) | A kind of cooling circuit board | |
| CN201243012Y (en) | Cuprum aluminum composite radiating plate for IC chip | |
| CN207650750U (en) | A kind of frequency conversion chip radiator | |
| CN208188773U (en) | A kind of computer housing water-cooled radiator | |
| CN205667070U (en) | Novel cooler | |
| CN207651472U (en) | A kind of chip radiator that height is small | |
| CN203773456U (en) | Mainboard radiator for sealed computer case | |
| CN205066526U (en) | Welding radiator | |
| CN204707389U (en) | A kind of flexible heat sink fin | |
| CN208821147U (en) | Microchannel heat sink | |
| CN205681745U (en) | A kind of radiator | |
| CN205334352U (en) | Computer radiator | |
| CN203378200U (en) | Heat dissipation fin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |