CN207624554U - Metallized film and capacitor containing the metallized film - Google Patents
Metallized film and capacitor containing the metallized film Download PDFInfo
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- CN207624554U CN207624554U CN201721822987.0U CN201721822987U CN207624554U CN 207624554 U CN207624554 U CN 207624554U CN 201721822987 U CN201721822987 U CN 201721822987U CN 207624554 U CN207624554 U CN 207624554U
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Abstract
The utility model discloses a kind of metallized film and contain the capacitor of the metallized film.The metallized film and capacitor containing the metallized film; by covering the first protective film in the side of substrate film; so as to cover substrate film relative coarseness surface; and plasma treatment layer is formed by the surface cure in the first protective film; it can make in capacitor manufactures; it is amplexiformed between metallized film and the film layer of metallized film closer; to which remaining air is less; external moisture is also difficult to invade; there is huge promotion for the humidity resistance of capacitor, technical support is provided to produce high performance capacitor.
Description
Technical field
The utility model is related to metallic film capacitor field more particularly to a kind of metallized film and contain the metal
Change the capacitor of film.
Background technology
With the rapid development of electronics industry, capacitor is as a kind of important energy storage electronic component, using increasingly
Extensively.Metallic film capacitor (i.e. the capacitor containing metallized film) is due to excellent mechanical performance and electrical property
Can, such as it is flexible, dielectric loss is low, the variation of high pressure resistant, dielectric constant with temperature and frequency is small, application is more and more extensive,
And gradually replace traditional capacitor.Needs of the metallic film capacitor because of characteristic, it is often necessary to the moisture resistance of capacitor is improved,
And as the metallized film of capacitor main material, there is significant impact to the moisture resistance of capacitor.
Traditional metallized film is just completed after metal deposition film portion is deposited on substrate film, or in metal evaporation
In spray last layer oil in film portion.But since the roughness by substrate film is influenced, often can not between capacitor inner membrance interlayer
Ground residual air is avoided, occurs the problem of moisture intrusion leads to capacity fluctuation in use to easily cause capacitor.
Utility model content
Based on this, it is necessary to provide a kind of metallized film that can improve capacitor humidity resistance and contain the metallization
The capacitor of film.
A kind of metallized film, including substrate film, metal deposition film and the first protective film, the side of the substrate film
There is steam plating part and blank edge, the metal deposition film to be stayed to be located on the steam plating part on surface, the first protective film covering
On another side surface of the substrate film and the surface of first protective film has plasma treatment layer.
First protective film is silicon oil membrane, fluorocarbon oil film, paraffin oil film or perfluoro polyether oil in one of the embodiments,
Film.
The thickness of first protective film meets 0.01~0.1 μ g/cm in one of the embodiments,2。
The surface tension of the plasma treatment layer is more than 33mN/m in one of the embodiments,.
The blank stays edge longitudinally disposed on the substrate film in one of the embodiments, and the blank is stayed
The width of edge is not more than 5mm.
The entire metal deposition film on the substrate film is an integral structure in one of the embodiments,.
The metal deposition film is aluminium film, zinc film or aluminum/zinc alloy film in one of the embodiments,.
The metal deposition film and/or the blank are stayed the surface of edge to be equipped with second and are protected in one of the embodiments,
Cuticula.
Second protective film is silicon oil membrane, fluorocarbon oil film, paraffin oil film or perfluoro polyether oil in one of the embodiments,
Film.
A kind of capacitor contains the metallized film described in any of the above-described embodiment.
Above-mentioned metallized film and capacitor containing the metallized film, by covering first in the side of substrate film
Protective film, so as to cover substrate film relative coarseness surface, and by being formed in the surface cure of the first protective film
Plasma treatment layer can make in capacitor manufactures, and be amplexiformed between metallized film and the film layer of metallized film tighter
Close, to which remaining air is less, external moisture is also difficult to invade, and has huge promotion for the humidity resistance of capacitor,
Technical support is provided to produce high performance capacitor.
Description of the drawings
Fig. 1 is the structural schematic diagram of the metallized film of an embodiment；
Fig. 2 is the part-structure schematic diagram of the capacitor containing metallic film shown in Fig. 1.
Specific implementation mode
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can in many different forms come in fact
It is existing, however it is not limited to embodiment described herein.Make public affairs to the utility model on the contrary, purpose of providing these embodiments is
The understanding for opening content is more thorough and comprehensive.
It should be noted that when element is referred to as " being set to " another element, it can directly on another element or
There may also be elements placed in the middle by person.When an element is considered as " connection " another element, it can be directly to
Another element may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model
The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein "and/or" includes
Any and all combinations of one or more relevant Listed Items.
As shown in Figure 1, the metallized film 100 of an embodiment includes substrate film 110, metal deposition film 120 and the
One protective film 130.Metal deposition film 120 and the first protective film 130 are respectively arranged on the both side surface of substrate film 110.
Specifically, in the present embodiment, there is steam plating part and blank to stay edge for a side surface of substrate film 110.Gold
Belong to evaporation film 120 to be located on steam plating part.First protective film 130 is covered on another side surface of substrate film 110 and first protects
The surface of cuticula 130 has plasma treatment layer 132.
Substrate film 110 can be selected but to be not limited to polypropylene film, polyester film, PPS films, makrolon thin
Film, polyphenyl methylene naphthalene film or polyvinylidene difluoride membrane.Substrate film 110 has excellent physicochemical property, as heat resistance is high,
Mechanical performance is strong, electrical characteristic is excellent etc..
Blank stays edge i.e. 110 surface of substrate film to be not provided with the surface region of metal deposition film 120.Blank stays edge
It is longitudinally disposed on substrate film 110, stay side to be longitudinal.Blank stay edge be not limited to be located at the one side on 110 surface of substrate film,
Any position at both sides or middle part.Blank stays the quantity of edge that can be more than 1.Such as in diagrammatically shown specific embodiment,
Blank stays edge to be arranged close to the one side edge of substrate film 110.Blank stays edge width to be preferably no greater than 5mm.
Metal deposition film 120 is located on the steam plating part of substrate film 110.Metal deposition film 120 may be designed to as needed
Various metal patterns, such as it is strip, latticed.The metal or metal that metal deposition film portion 120 selects corona deterioration smaller close
Gold makes, such as aluminium, zinc or aluminum/zinc alloy.Alumin(i)um zinc alloy has excellent weatherability, a variety of environment is can adapt to, using model
It encloses relatively wide.In one embodiment, the entire metal deposition film 120 on substrate film 110 is an integral structure.
Further, metal deposition film 120 and/or blank stay the surface of edge to be covered with the second protective film 140, as shown in
Shown in specific embodiment, metal deposition film 120 and blank stay the surface of edge to be covered with the second protective film 140, at it
In his embodiment, can also metal deposition film 120 and blank stay one of edge to cover second protective film 140 on surface.Second
Protective film 140 is selected from silicon oil membrane, fluorocarbon oil film, paraffin oil film or perfluoropolyether oil film.Second protective film 140 can enhance metallization
The moisture resistance of film 100, and improve the weatherability of metallized film 100.
In one embodiment, the first protective film 130 is also selected from silicon oil membrane, fluorocarbon oil film, paraffin oil film or perfluoro polyether oil
Film.
Further, in one embodiment, the thickness of the first protective film 130 meets 0.01~0.1 μ g/cm2。
Further, in one embodiment, the surface tension of plasma treatment layer 132 is more than 33mN/m.Preferably, etc.
Ion processing layer 132 needs to cover the surface of entire first protective film 130.
By covering the first protective film 130 in the side of substrate film 110, so as to cover the phase of substrate film 110
Plasma treatment layer 132 is formed to coarse surface, and by the surface cure in the first protective film 130, can be made in electricity
In vessel fabrication, amplexiformed between metallized film 100 and the film layer of metallized film 100 it is closer, to remaining air more
Few, external moisture is also difficult to invade, and has huge promotion for the humidity resistance of capacitor, to produce high performance capacitor
Provide technical support.
As shown in Fig. 2, a kind of capacitor 200, the metallized film 100 containing any of the above-described embodiment.In the capacitance
In the structure of device 200, amplexiformed by 132 phase of plasma treatment layer between metallized film 100 and metallized film 100, and phase
Adjacent 100 stagger setting of metallized film, such as the 1mm that is staggered.The mutually metallized film compared with traditional capacitor and metallization
Directly connected by substrate film between film, between increase the first protective film with plasma treatment layer 132
130, it can to contact closer, residual air is less, and outside moisture is also more difficult to enter, and can improve the stabilization of capacitor
Property, reduce the fluctuation of condenser capacity.
It is specific embodiment and comparative example part below.
Embodiment 1
Using the metallized film 100 of structure as shown in Figure 1, after the formation of metal deposition film 120, in metal deposition film
120 place side sprays coat silicone oil, form the second protective film 140, then spray silicone oil in the other side of substrate film 110, form the
One protective film 130, then plasma treatment layer 132 is formed on the surface of the first protective film 130, with the table to the first protective film 130
Face carries out curing process.
By detection, the thickness of first protective film 130 is 0.02 μ g/cm in the metallized film 1002, and surface wettability
Tension is 35mN/m.
Comparative example 1
The structure of the metallized film of comparative example 1 is essentially identical with embodiment 1, the difference is that substrate film is another
Side is not provided with the first protective film and covers the plasma treatment layer of the first protective film.Pass through detection, the metallized film
The surface wettability tension for being not provided with the side of the first protective film is 31mN/m.
Following table 1 is that the metallic film capacitor that the metallized film of embodiment 1 and comparative example 1 is made is respectively adopted to close
(1000 hours Capacitance Shift Rates (hereinafter referred to as " double 85 △ C/C ") are run at Un*85 DEG C of * 85%RH in moisture resistance
Contrast test data：
Table 1
The humidity resistance as can be seen that capacitor made of the metallized film 100 of embodiment 1 is compared by table 1
It significantly increases, is conducive to the quality and stability that improve capacitor product in this way.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of metallized film, which is characterized in that including substrate film, metal deposition film and the first protective film, the substrate
There is steam plating part and blank edge, the metal deposition film to be stayed to be located on the steam plating part for one side surface of film, and described first
Protective film is covered on another side surface of the substrate film and the surface of first protective film has plasma treatment layer.
2. metallized film as described in claim 1, which is characterized in that first protective film is silicon oil membrane, fluorocarbon oil film, stone
Wax oil film or perfluoropolyether oil film.
3. metallized film as claimed in claim 2, which is characterized in that the thickness satisfaction 0.01 of first protective film~
0.1μg/cm2。
4. metallized film as claimed in claim 3, which is characterized in that the surface tension of the plasma treatment layer is more than
33mN/m。
5. metallized film as described in any one of claims 1 to 4, which is characterized in that the blank stays edge described
Longitudinally disposed on substrate film, the blank stays the width of edge to be not more than 5mm.
6. metallized film as described in any one of claims 1 to 4, which is characterized in that entire on the substrate film
The metal deposition film is an integral structure.
7. metallized film as claimed in claim 6, which is characterized in that the metal deposition film is aluminium film, zinc film or aluminium/zinc
Alloy film.
8. metallized film as described in any one of claims 1 to 4, which is characterized in that the metal deposition film and/or institute
Stating blank stays the surface of edge to be equipped with the second protective film.
9. metallized film as claimed in claim 8, which is characterized in that second protective film is silicon oil membrane, fluorocarbon oil film, stone
Wax oil film or perfluoropolyether oil film.
10. a kind of capacitor, which is characterized in that containing such as metallized film according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721822987.0U CN207624554U (en) | 2017-12-21 | 2017-12-21 | Metallized film and capacitor containing the metallized film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721822987.0U CN207624554U (en) | 2017-12-21 | 2017-12-21 | Metallized film and capacitor containing the metallized film |
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| Publication Number | Publication Date |
|---|---|
| CN207624554U true CN207624554U (en) | 2018-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721822987.0U Active CN207624554U (en) | 2017-12-21 | 2017-12-21 | Metallized film and capacitor containing the metallized film |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112030112A (en) * | 2020-08-27 | 2020-12-04 | 安徽赛福电子有限公司 | Oxidation-resistant metallized film and manufacturing method thereof |
| CN113012937A (en) * | 2019-12-20 | 2021-06-22 | 东丽先端材料研究开发（中国）有限公司 | Metallized film for humidity-resistant and heat-resistant capacitor |
| CN113470974A (en) * | 2021-06-09 | 2021-10-01 | 东丽薄膜加工（中山）有限公司 | Film, preparation method thereof and capacitor |
-
2017
- 2017-12-21 CN CN201721822987.0U patent/CN207624554U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113012937A (en) * | 2019-12-20 | 2021-06-22 | 东丽先端材料研究开发（中国）有限公司 | Metallized film for humidity-resistant and heat-resistant capacitor |
| CN112030112A (en) * | 2020-08-27 | 2020-12-04 | 安徽赛福电子有限公司 | Oxidation-resistant metallized film and manufacturing method thereof |
| CN113470974A (en) * | 2021-06-09 | 2021-10-01 | 东丽薄膜加工（中山）有限公司 | Film, preparation method thereof and capacitor |
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