CN112030112A - Oxidation-resistant metallized film and manufacturing method thereof - Google Patents
Oxidation-resistant metallized film and manufacturing method thereof Download PDFInfo
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- CN112030112A CN112030112A CN202010877271.0A CN202010877271A CN112030112A CN 112030112 A CN112030112 A CN 112030112A CN 202010877271 A CN202010877271 A CN 202010877271A CN 112030112 A CN112030112 A CN 112030112A
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- 230000003647 oxidation Effects 0.000 title claims abstract description 48
- 238000007254 oxidation reaction Methods 0.000 title claims abstract description 48
- 239000011104 metalized film Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 52
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 52
- 239000010408 film Substances 0.000 claims abstract description 28
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 235000006708 antioxidants Nutrition 0.000 claims description 44
- 238000001704 evaporation Methods 0.000 claims description 29
- 230000008020 evaporation Effects 0.000 claims description 26
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 17
- 229910052725 zinc Inorganic materials 0.000 claims description 16
- 239000011701 zinc Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 8
- 238000001465 metallisation Methods 0.000 claims description 8
- 239000012788 optical film Substances 0.000 claims description 8
- 229920002545 silicone oil Polymers 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 4
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 4
- 229920000728 polyester Polymers 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920006395 saturated elastomer Polymers 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 95
- 230000003064 anti-oxidating effect Effects 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides an antioxidant metallized film, which comprises a first metallized plate layer, a second metallized plate layer and an organic dielectric thin film layer, wherein the second metallized plate layer is arranged at the bottom of the first metallized plate layer; the organic dielectric film further comprises a first oxidation-resistant oil layer and a second oxidation-resistant oil layer, wherein the first oxidation-resistant oil layer is arranged at the top of the first metalized electrode plate layer, and the second oxidation-resistant oil layer is arranged at the bottom of the organic dielectric film layer. The invention has the advantages that the first antioxidant oil layer and the second antioxidant oil layer are added on the existing metallized film structure, the first antioxidant oil layer can isolate the contact between the first metallized plate layer and the second metallized plate layer below the first antioxidant oil layer and the outside air, so as to achieve the purpose of preventing oxidation, after the second antioxidant oil layer is added, two layers of antioxidant oil layers are generated for motion friction, the oil layers cannot be broken, and the antioxidant performance is obviously improved.
Description
Technical Field
The invention relates to the technical field of metallized films, in particular to an antioxidant metallized film and a manufacturing method thereof.
Background
The metallized film for the capacitor is formed by depositing metal such as zinc, aluminum and the like on an organic dielectric film through vacuum evaporation to form a metallized layer, thereby obtaining a metal plate in a capacitor structure. Under the action of external oxygen, the metals can form metal oxides such as zinc oxide, aluminum oxide and the like, the oxides can increase the resistance of the metallization layer and deteriorate the current and voltage bearing capacity of the metallization layer, the zinc oxide cannot form a compact oxidation layer, and after the oxidation lasts for a long time, most of zinc in the metallization layer is oxidized, the metallization film cannot be used.
ZL95120817.9 patent ZL 95120817.9A manufacturing method of a zinc-plated film with improved adhesion and excellent oxidation resistance of a film capacitor discloses a method for depositing a metal with faster oxidation rate than zinc, such as one or more of aluminum, tin and silver, on the surface of a polymer film as a seed layer, and then depositing zinc or zinc-aluminum as an electrode layer.
The invention ZL201410075409.X 'a high-temperature-resistant anti-oxidation metallized film and a preparation method thereof' and the invention 201410308354.2 'a special filler for an anti-oxidation flame-retardant capacitor film and a preparation method thereof' disclose that a metallized film with better performance is obtained by modifying an organic dielectric film.
The prior invention and the published document relate to the structure of a metallization layer and the modification of an organic dielectric film, and do not relate to the addition of a special oxidation resistant layer on the metallization layer, so that the metallization layer is frequently abraded.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an oxidation-resistant metallized film and a manufacturing method thereof.
The invention solves the technical problems through the following technical means:
an anti-oxidation metallized film comprises a first metallized plate layer, a second metallized plate layer and an organic dielectric thin film layer, wherein the second metallized plate layer is arranged at the bottom of the first metallized plate layer, and the organic dielectric thin film layer is arranged at the bottom of the second metallized plate layer;
the organic dielectric film further comprises a first oxidation-resistant oil layer and a second oxidation-resistant oil layer, wherein the first oxidation-resistant oil layer is arranged at the top of the first metalized electrode plate layer, and the second oxidation-resistant oil layer is arranged at the bottom of the organic dielectric film layer.
Preferably, the oil-containing component in the first antioxidant oil layer and the second antioxidant oil layer is silicone oil.
Preferably, the silicone oil is hexamethyldisiloxane having viscosity CS 10.
Preferably, the thickness of the second oxidation-resistant oil layer is less than that of the first oxidation-resistant oil layer, the thickness of the first oxidation-resistant oil layer is less than 50 angstroms, and the thickness of the second oxidation-resistant oil layer is less than 30 angstroms.
Preferably, the first metalized plate layer is zinc with the thickness of less than 1000 angstroms, and the second metalized plate layer is aluminum with the thickness of less than 100 angstroms.
Preferably, the organic dielectric thin film layer is polypropylene optical film BOPP or polyester optical film BOPET, and the thickness of the organic dielectric thin film layer is 1.0-15.0 μm.
A method for manufacturing an oxidation-resistant metallized film comprises the following steps:
s1, placing the metallized film in a high-vacuum chamber of a film plating machine, and adjusting the vacuum pressure to 10-2pa is more than;
s2, the evaporated metal vapor reaches the saturated vapor pressure, and the evaporation temperature is as follows: the temperature of an aluminum wire evaporation source is 1200-1600 ℃, the temperature of a zinc bar evaporation source is 500-600 ℃, and aluminum is evaporated on the organic dielectric film before zinc;
s3, unwinding the organic dielectric film to be evaporated by an unwinding system, evaporating a metalized layer by an evaporation roller, and winding by a winding system;
s4, arranging an antioxidant oil pipe made of stainless steel behind the evaporation roller, setting the heating temperature to be 80-90 ℃, and allowing hexamethyldisiloxane to escape from the narrow gap to form an antioxidant oil layer;
s5, arranging a first oil pipe and a second oil pipe on two sides of the film respectively, wherein the pipes are provided with long and thin narrow slits, the length of each narrow slit is larger than the width of the metallized film roll, and the width of the narrow slit of the first oil pipe forming the second antioxidant oil layer is smaller than the width of the narrow slit of the second oil pipe forming the first antioxidant oil layer.
Preferably, the temperature of the evaporation roller is maintained at-30 to-10 ℃.
The invention has the advantages that: a first anti-oxidation oil layer and a second anti-oxidation oil layer are added on the existing metallized film structure, the first anti-oxidation oil layer can isolate the contact between a first metallized plate layer and a second metallized plate layer below the first anti-oxidation oil layer and the outside air, and the purpose of preventing oxidation is achieved; set up the anti-oxidant oil reservoir of second under organic dielectric thin film layer, because metallized film coating by vaporization rolling is with when being cut into the paired metallized film that can make the condenser separately, be the roll-like form that stacks layer upon layer, if do not have the anti-oxidant oil reservoir of second, the organic dielectric thin film layer of outer lane just in time carries out the motion friction with the first anti-oxidant oil reservoir of inner circle, can make first anti-oxidant oil reservoir damaged, can not form compact protective layer, oxidation resistance is not good, increase behind the anti-oxidant oil reservoir of second, it is two-layer anti-oxidant oil reservoir to take place the motion friction, the oil reservoir can not break, oxidation resistance is.
Drawings
FIG. 1 is a schematic structural diagram of an oxidation-resistant metallized film according to the present invention;
FIG. 2 is a schematic diagram of the fabrication of an oxidation-resistant metallized film according to the present invention.
Reference numbers in the figures: 11. the device comprises a first antioxidant oil layer, 12, a second metalized plate layer, 13, a second metalized plate layer, 14, an organic dielectric film layer, 15, a second antioxidant oil layer, 21, a vacuum degree chamber, 22, an aluminum wire evaporation source, 23, a zinc wire evaporation source, 24, an organic dielectric film, 25, an unreeling system, 27, a reeling system, 28, a first oil pipe, 29 and a second oil pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
An anti-oxidation metallized film comprises a first metallized plate layer 12, a second metallized plate layer 13 and an organic dielectric thin film layer 14, wherein the second metallized plate layer 13 is arranged at the bottom of the first metallized plate layer 12, and the organic dielectric thin film layer 14 is arranged at the bottom of the second metallized plate layer 14;
the capacitor further comprises a first oxidation-resistant oil layer 11 and a second oxidation-resistant oil layer 15, wherein the first oxidation-resistant oil layer 11 is arranged on the top of the first metalized plate layer 12, and the second oxidation-resistant oil layer 15 is arranged on the bottom of the organic dielectric thin film layer 14.
The first oxidation-resistant oil layer 11 and the second oxidation-resistant oil layer 15 contain oil as a silicone oil.
The silicone oil is hexamethyldisiloxane having a viscosity of CS 10.
The thickness of the second oxidation resistant oil layer 15 is smaller than that of the first oxidation resistant oil layer 11, the thickness of the first oxidation resistant oil layer 11 is smaller than 50 angstroms, and the thickness of the second oxidation resistant oil layer 15 is smaller than 30 angstroms.
The first metalized plate layer 12 is zinc with a thickness of less than 1000 angstroms, and the second metalized plate layer 13 is aluminum with a thickness of less than 100 angstroms.
The organic dielectric thin film layer 14 is polypropylene optical film BOPP or polyester optical film BOPET, and the thickness is 1.0-15.0 μm.
The metallized film is manufactured in a high-vacuum chamber in a film coating machine;
the evaporated metal vapor needs to reach saturated vapor pressure, the evaporation temperature of the metal is higher than the melting point of the metal, and an aluminum evaporation source is arranged in front of a zinc evaporation source;
the organic dielectric film to be evaporated is unreeled by an unreeling system, is evaporated to form a metallized layer by an evaporation roller, and is reeled by a reeling system, and the evaporation roller keeps low temperature to rapidly cool the film;
an antioxidant oil pipe is arranged behind the evaporation roller, a long and thin narrow gap is formed in the antioxidant oil pipe, the antioxidant oil pipe is heated, and antioxidant oil injected into the antioxidant oil pipe escapes through the narrow gap to form an antioxidant oil layer;
and arranging an antioxidant oil pipe on each of two sides of the film to form a first antioxidant oil layer and a second antioxidant oil layer.
As shown in fig. 1, the structure of the metallized film is as follows from top to bottom:
(1) a first antioxidant oil layer 11, which is composed of silicone oil, preferably hexamethyldisiloxane with viscosity of CS10, and has a thickness of less than 50 angstroms (10-10 m, 0.1 nm);
(2) the first metalized polar plate layer 12 is made of zinc and has a thickness of less than 1000 angstroms;
(3) the second metalized plate layer 13 is made of aluminum, the thickness of the second metalized plate layer is less than 100 angstroms, and the thickness of the aluminum layer is far less than that of the zinc layer;
(4) the organic dielectric thin film layer 14 is a polypropylene optical film BOPP or a polyester optical film BOPET, and the thickness of the organic dielectric thin film layer is 1.0-15.0 mu m;
(5) the second antioxidant oil layer 15 is composed of silicone oil, preferably hexamethyldisiloxane with viscosity of CS10, and has a thickness of less than 30 angstroms (10-10 m, 0.1 nm), and the second antioxidant oil layer 15 has a thickness of less than that of the first antioxidant oil layer 11.
A method for manufacturing an oxidation-resistant metallized film comprises the following steps:
s1, placing the metallized film in a high-vacuum-degree bin 21 in a film plating machine, and adjusting the vacuum degree pressure to be more than 10-2pa10-4 mbar;
s2, the evaporated metal vapor reaches the saturated vapor pressure, and the evaporation temperature is as follows: the temperature of the aluminum wire evaporation source 22 is 1200-1600 ℃, the temperature of the zinc bar evaporation source 23 is 500-600 ℃, and aluminum is evaporated on the organic dielectric film before zinc;
s3, unwinding the organic dielectric film 24 to be evaporated by an unwinding system 25, evaporating a metalized layer by an evaporation roller 26, and winding by a winding system 27;
s4, arranging an antioxidant oil pipe made of stainless steel behind the evaporation roller 26, setting the heating temperature to be 80-90 ℃, and allowing hexamethyldisiloxane to escape from the narrow gap to form an antioxidant oil layer;
s5, arranging a first oil pipe 28 and a second oil pipe 29 on two sides of the film respectively, wherein the pipes are provided with slender narrow slits, the length of the narrow slits is larger than the width of the metallized film roll, and the width of the narrow slits of the first oil pipe 28 forming the second oxidation-resistant oil layer 15 is smaller than the width of the narrow slits of the second oil pipe 29 forming the first oxidation-resistant oil layer 11.
The temperature of the evaporation roller 26 is maintained at-30 to-10 ℃.
It is noted that, in this document, relational terms such as first and second, and the like, if any, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. An oxidation-resistant metallized film characterized by: the organic thin-film transistor comprises a first metalized polar plate layer (12), a second metalized polar plate layer (13) and an organic dielectric thin-film layer (14), wherein the second metalized polar plate layer (13) is arranged at the bottom of the first metalized polar plate layer (12), and the organic dielectric thin-film layer (14) is arranged at the bottom of the second metalized polar plate layer (14);
still include first anti-oxidant oil reservoir (11) and second anti-oxidant oil reservoir (15), first anti-oxidant oil reservoir (11) set up at first metallization utmost point sheet layer (12) top, second anti-oxidant oil reservoir (15) set up in organic dielectric thin film layer (14) bottom.
2. The oxidation-resistant metallized film of claim 1, wherein: the first antioxidant oil layer (11) and the second antioxidant oil layer (15) contain silicone oil as an oil component.
3. The oxidation-resistant metallized film of claim 2, wherein: the silicone oil is hexamethyldisiloxane having a viscosity of CS 10.
4. The oxidation-resistant metallized film of any one of claims 1-3, wherein: the thickness of the second antioxidant oil layer (15) is smaller than that of the first antioxidant oil layer (11), the thickness of the first antioxidant oil layer (11) is smaller than 50 angstroms, and the thickness of the second antioxidant oil layer (15) is smaller than 30 angstroms.
5. The oxidation-resistant metallized film of claim 1, wherein: the first metalized polar plate layer (12) is zinc and is less than 1000 angstroms thick, and the second metalized polar plate layer (13) is aluminum and is less than 100 angstroms thick.
6. The oxidation-resistant metallized film of claim 5, wherein: the organic dielectric thin film layer (14) is polypropylene optical film BOPP or polyester optical film BOPET, and the thickness of the organic dielectric thin film layer is 1.0-15.0 mu m.
7. The method of making an oxidation-resistant metallized film of claim 1, wherein: the method comprises the following steps:
s1, placing the metallized film in a vacuum degree bin (21) in a film plating machine, and adjusting the vacuum degree pressure to be more than 10-2pa (10-4 mbar);
s2, the evaporated metal vapor reaches the saturated vapor pressure, and the evaporation temperature is as follows: the temperature of the aluminum wire evaporation source (22) is 1200-1600 ℃, the temperature of the zinc bar evaporation source (23) is 500-600 ℃, and aluminum is evaporated on the organic dielectric film before zinc;
s3, unwinding the organic dielectric film (24) to be evaporated by an unwinding system (25), evaporating a metalized layer by an evaporation roller (26), and winding by a winding system (27);
s4, arranging an antioxidant oil pipe made of stainless steel behind the evaporation roller (26), setting the heating temperature to be 80-90 ℃, and allowing hexamethyldisiloxane to escape from the narrow gap to form an antioxidant oil layer;
s5, arranging a first oil pipe (28) and a second oil pipe (29) on two sides of the film respectively, wherein the pipes are provided with slender narrow slits, the length of each narrow slit is larger than the width of the metallized film roll, and the width of the narrow slit of the first oil pipe (28) forming the second antioxidant oil layer (15) is smaller than that of the narrow slit of the second oil pipe (29) forming the first antioxidant oil layer (11).
8. The method of making an oxidation-resistant metallized film of claim 7, wherein: the temperature of the evaporation roller (26) is kept between-30 ℃ and-10 ℃.
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| CN202010877271.0A CN112030112A (en) | 2020-08-27 | 2020-08-27 | Oxidation-resistant metallized film and manufacturing method thereof |
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Citations (5)
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| CN202610311U (en) * | 2012-04-06 | 2012-12-19 | 安徽源光电器有限公司 | Vacuum coater used for capacitor diaphragm |
| CN204537853U (en) * | 2015-04-14 | 2015-08-05 | 铜陵其利电子材料有限公司 | The two-sided metallized film of a kind of vehicle-mounted capacitor |
| CN107039181A (en) * | 2016-10-26 | 2017-08-11 | 安徽飞达电气科技有限公司 | A kind of resistance to high current, long-service-life metal thin film capacitor |
| CN207624554U (en) * | 2017-12-21 | 2018-07-17 | 东丽薄膜加工（中山）有限公司 | Metallized film and capacitor containing the metallized film |
| CN210223788U (en) * | 2019-08-02 | 2020-03-31 | 浙江双凯电子科技有限公司 | High-performance capacitor film |
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2020
- 2020-08-27 CN CN202010877271.0A patent/CN112030112A/en active Pending
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| CN202610311U (en) * | 2012-04-06 | 2012-12-19 | 安徽源光电器有限公司 | Vacuum coater used for capacitor diaphragm |
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| CN107039181A (en) * | 2016-10-26 | 2017-08-11 | 安徽飞达电气科技有限公司 | A kind of resistance to high current, long-service-life metal thin film capacitor |
| CN207624554U (en) * | 2017-12-21 | 2018-07-17 | 东丽薄膜加工（中山）有限公司 | Metallized film and capacitor containing the metallized film |
| CN210223788U (en) * | 2019-08-02 | 2020-03-31 | 浙江双凯电子科技有限公司 | High-performance capacitor film |
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