CN207622684U - Bonding interface stress and strain based on Sputtering Thinfilm Technology monitors microsensor - Google Patents
Bonding interface stress and strain based on Sputtering Thinfilm Technology monitors microsensor Download PDFInfo
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- CN207622684U CN207622684U CN201721777203.7U CN201721777203U CN207622684U CN 207622684 U CN207622684 U CN 207622684U CN 201721777203 U CN201721777203 U CN 201721777203U CN 207622684 U CN207622684 U CN 207622684U
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Abstract
The utility model discloses a kind of, and the bonding interface stress and strain based on Sputtering Thinfilm Technology monitors sensor, including flexible flat cable, elastic structure and metal sensitive core body.The elastic structure inner surface of micro-stress/strain transducer plates metal sensitive core body, forms metallic film sensitive grid, and complete assembly using electrostatic encapsulation technology.Microsensor is embedded to bonding interface, and Nian Jie with upper and lower surface using bonding agent, sensor is connected with signal demodulation module with flexible flat cable, is bonded along bonding interface.The utility model can realize stress/strain, the unsticking monitoring that real-time online is carried out to internal bonded structure, and sensor has many advantages, such as long-term reliability height, long lifespan, high certainty of measurement.
Description
Technical field
The utility model belongs to sensor field, and in particular to a kind of online stress/strain applied to bonding interface is supervised
The microsensor of survey.
Background technology
A large amount of solid engines experiments have shown that, the unsticking destruction of the bonding interface between propellant/lining/heat insulation layer is dress
One of the critical forms that medicine engine structural integrity destroys, can seriously affect the service life of solid engines.To ensure
The integrality of charge constitution and the reliability of engine, it is necessary to assure solid engines bonding interface is good.Therefore it needs to be unfolded
Targetedly technical research.
Currently, the technology for being usually used in solid engines bonding interface adhering state Gernral Check-up mainly has three classes, it is respectively
Acoustic method, ray method and embedment microsensor, wherein first two technology are all not easy to carry out long term monitoring to in-service equipment, and
And it is expensive, need a large amount of human and material resources.Microsensor technology is embedded to examine as emerging bonding interface adhering state
Survey technology is quickly grown in recent years, and achieves certain achievement in research.
Commonly embedment sensor type has at this stage：Fiber bragg grating pressure sensor, semiconductor strain chip pressure pass
Sensor and ceramic thick film strain gauge.These embedded-type sensors all can not avoid the structure of bonding interface from causing certain journey
The destruction of degree, and measured value cannot truly represent actual value, while influencing solid engines powder charge integrality, cause compared with
Big measurement error.
In view of the above-mentioned problems, proposing the real-time stress/strain monitoring technology method of solid engines bonding interface, develop
A kind of novel flush type microsensor --- a kind of bonding interface stress/strain monitoring based on Sputtering Thinfilm Technology is miniature
Sensor is answered under the premise of reducing the influence of bonding interface environment as much as possible by real time on-line monitoring bonding interface bonding
The size of power and the microstrain of bonding interface, judge the adhering state of bonding interface on this basis, if having unsticking phenomenon hair
It is raw, and evaluate solid engines health status and internal injury is monitored.
Utility model content
The purpose of this utility model is to provide a kind of micro sensing of the online real-time stress and strain monitoring of bonding interface
Device, the sensor have the ability that bonding interface stress/strain measures, unsticking monitors, can identify internal debonding state,
Its sensor has the characteristics that high reliability, long-life, high measurement accuracy.It can be achieved to carry out real-time online to internal bonded structure
Stress/strain, unsticking monitoring, and sensor has the characteristics that long-term reliability height, long lifespan, high certainty of measurement.
To achieve the goals above, the utility model adopts the following technical scheme：
A kind of bonding interface stress and strain monitoring microsensor based on Sputtering Thinfilm Technology, it is characterised in that：Institute
It includes flexible flat cable, elastic structure and metal sensitive core body to state sensor, and the metal sensitive core body passes through sputtering
For mode by metallic target ion sputtering to elastic structure surface, shape is wire grid circulating type, metal sensitive core body perception elasticity knot
The stress and strain of structure body supervises the adhesive stress and strain of bonding interface with monitoring the deformation on elastic structure surface
It surveys, wherein flat cable, elastic structure and metal sensitive core body are bilayer.
In the sensor, metal sensitive core body is made of four wire grid resistance, and is stayed there are four solder joint, with flat cable
Four solder joints connection, form wheatstone bridge circuits.
In the sensor, every layer of metal sensitive core body has a set of wheatstone bridge circuits, constitutes two-way sensitive core body, on
Layer sensitive core body measures the deformation of bonding interface surface structure to be measured, and lower layer's sensitive core body measures bonding interface lower surface to be measured
Malformation.
In the sensor, the generation phenomena such as oxidation of metal sensitive core body, corrosion in order to prevent, in metal sensitive core body
Surface sputtering has one layer of Si3N4Protective film, protection film thickness is smaller than metal sensitive grid thickness, achievees the purpose that protection.
In the sensor, elastic structure is made of flexible preferable insulating materials, has good flexibility, such as
Flexible ceramic piece etc..
In the sensor, metal sensitive core body, elastic structure and flat cable realize envelope using electrostatic encapsulation technology
Dress, sealing.
In the sensor, metal sensitive core body is made of sputtered film preparation process, the gold of material selection easy conductive
Belong to material, such as copper, nichrome.
In the sensor, metallic film is connect with flat cable end, realizes reliable, effective electrical contact.
Compared with prior art, the miniature biography of the real-time stress/strain monitoring of a kind of bonding interface described in the utility model
Sensor has the following advantages that：
1, the utility model has the characteristics that the stress/strain of bonding interface, unsticking etc. carry out real time on-line monitoring, realizes
Accurate measurement to special construction internal modification.
2, metal sensitive core body is made of four wire grid resistance, and is stayed there are four solder joint, four solder joints with flat cable
Connection forms wheatstone bridge circuits, and can reduce the offset output etc. of sensor by designing sensitive grid, ensures sensor
Excellent performance and high-acruracy survey.
3, metal sensitive core body is made of upper layer and lower layer sensitive core body, referred to as two-way sensitive core body circuit, upper layer sensitivity core
The deformation of bulk measurement surface structure, lower layer's sensitive core body measure the malformation of lower surface, being capable of more detailed measurement quilt
Survey the deformation at position.
4, the utility model is based on sputtered film technique, and Sputtering Thinfilm Technology is applied to microsensor development, is prepared
The sensitive core body gone out integrated can be sputtered and be prepared, and the reliability of sensor is ensure that in technique, has highly reliable, low work(
The advantages of consumption, long-life.
5, protective layer is by sputtering technology by Si in the utility model3N4It is splashed to sensitive grid surface, prevents sensitive core body
Further oxidation, plays the role of protection.
Description of the drawings
Fig. 1 is the microsensor structural schematic diagram of the utility model, and L is the length of sensor；H is the height of sensor
Degree.
Fig. 2 is the sensitive core body structural schematic diagram of the utility model.
Fig. 3 is the sensor scheme of installation of the utility model.
Drawing reference numeral is：1 flat cable；2 elastic structures；3 metal sensitive core bodies；3a metal sensitive core body solder joints；3b
Metal sensitive core body sensitive grid；4 solid engines shells；5 solid propellant propulsions.
Specific implementation mode
Referring to attached drawing 1, a kind of bonding interface stress/strain monitoring based on Sputtering Thinfilm Technology described in the utility model
Microsensor, including flexible flat cable 1, elastic structure 2 and metallic film sensitive core body 3.
Attached drawing 2 is participated in, the sensitive core body 3 in microsensor described in the utility model passes through sputtered film technique system
Standby, four wire grid resistance form Wheatstone bridge, are connect with flat cable 1 by solder joint 3a, and are designed with two-way sensitivity
Core, can more comprehensive, monitor structural stress/strained situation, unsticking phenomenon generation etc..
It is solid engines shell to participate in attached drawing 3,4；5 be solid propellant.Micro-stress described in the utility model/answer
Become sensor and can be used material of the flexible ceramic piece as elastic structure 2, the ceramic gold-plated category sensitive core body 3 of plate inner surface, and
It completes to assemble using electrostatic encapsulation technology.Microsensor is embedded to bonding interface to be measured, and using phenolic aldehyde base bonding agent with it is upper
Lower surface bonds, sensor and signal demodulation module are connected with flexible flat cable 1, are bonded along bonding interface.
Metal sensitive core body 3 in microsensor is deformed by perceiving elastic structure 2, and signal is passed through flat cable
1 is transmitted to external reception system, realizes that the stress/strain to bonded structure, unsticking are monitored and measured.When the bonding of bonding interface
When state changes, has the tendency that unsticking, sensor elastic structure 2 can be caused to deform upon, to make metal sensitivity core
Body 3 deforms upon, its resistance value is caused to change, and by measuring the variation of Wheatstone bridge voltage output, calculates metal sensitization
Feel 3 deformation size of core, as micro- deformation of bonding interface calculates stress intensity in conjunction with principle of elasticity, in conjunction with answering
Two parameters of power/strain, the final adhering state for judging bonding interface, assess the health status of solid engines.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvement and supplement without departing from the principle of this utility model, these are improved and supplement
Also it should be regarded as the scope of protection of the utility model.
Claims (6)
1. a kind of bonding interface stress and strain based on Sputtering Thinfilm Technology monitors microsensor, it is characterised in that：It is described
Sensor includes flexible flat cable (1), elastic structure (2) and metal sensitive core body (3), the metal sensitive core body (3)
By metallic target ion sputtering to elastic structure (2) surface by way of sputtering, shape is wire grid circulating type, metal sensitivity core
Body (3) perceives the stress and strain of elastic structure (2), to monitor the deformation on elastic structure (2) surface, to bonding interface
Adhesive stress and strain are monitored, and wherein flat cable (1), elastic structure (2) and metal sensitive core body (3) are double
Layer.
2. a kind of bonding interface stress and strain based on Sputtering Thinfilm Technology according to claim 1 monitors micro sensing
Device, it is characterised in that：The metal sensitive core body (3) is made of four groups of metal sensitive grid (3b) resistance, and stays there are four solder joint
(3a) is connect with four solder joints of flexible flat cable (1), forms wheatstone bridge circuits.
3. a kind of bonding interface stress and strain based on Sputtering Thinfilm Technology according to claim 2 monitors micro sensing
Device, it is characterised in that：Every layer of the metal sensitive core body (3) has a set of wheatstone bridge circuits, constitutes two-way sensitive core body, on
Layer sensitive core body measures the deformation of bonding interface surface structure to be measured, and lower layer's sensitive core body measures bonding interface lower surface to be measured
Malformation.
4. a kind of bonding interface stress and strain based on Sputtering Thinfilm Technology according to claim 2 monitors micro sensing
Device, it is characterised in that：The solder joint (3a) of described metal sensitive core body (3) one end is connect with flat cable (1), by metal target ion
It is splashed to flat cable (1) junction, realizes propagation of electrical signals, the stress and strain information that metal sensitive core body (3) is perceived
It is transmitted to external reception system.
5. a kind of bonding interface stress and strain based on Sputtering Thinfilm Technology according to claim 2 monitors micro sensing
Device, it is characterised in that：Described surface metal sensitive grid (3b) is coated with one layer of Si3N4Protective film, protection film thickness compare metal sensitization
It is small to feel grid (3b) thickness.
6. a kind of bonding interface stress and strain based on Sputtering Thinfilm Technology according to claim 1 monitors micro sensing
Device, it is characterised in that：The metal sensitive core body (3), elastic structure (2) and flat cable (1) utilize electrostatic encapsulation technology
Realize encapsulation, sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721777203.7U CN207622684U (en) | 2017-12-15 | 2017-12-15 | Bonding interface stress and strain based on Sputtering Thinfilm Technology monitors microsensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721777203.7U CN207622684U (en) | 2017-12-15 | 2017-12-15 | Bonding interface stress and strain based on Sputtering Thinfilm Technology monitors microsensor |
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| Publication Number | Publication Date |
|---|---|
| CN207622684U true CN207622684U (en) | 2018-07-17 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109632006A (en) * | 2019-01-11 | 2019-04-16 | 重庆大学 | A kind of intelligent wireless bolt and on-line monitoring system |
| CN112484630A (en) * | 2020-12-09 | 2021-03-12 | 湖南启泰传感科技有限公司 | Thin film resistance strain pressure sensor and layout optimization method thereof |
| CN112484631A (en) * | 2020-12-09 | 2021-03-12 | 湖南启泰传感科技有限公司 | Film pressure sensor and layout method thereof |
-
2017
- 2017-12-15 CN CN201721777203.7U patent/CN207622684U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109632006A (en) * | 2019-01-11 | 2019-04-16 | 重庆大学 | A kind of intelligent wireless bolt and on-line monitoring system |
| CN112484630A (en) * | 2020-12-09 | 2021-03-12 | 湖南启泰传感科技有限公司 | Thin film resistance strain pressure sensor and layout optimization method thereof |
| CN112484631A (en) * | 2020-12-09 | 2021-03-12 | 湖南启泰传感科技有限公司 | Film pressure sensor and layout method thereof |
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