CN207611776U - A kind of anti-PID photovoltaic modulies - Google Patents

A kind of anti-PID photovoltaic modulies Download PDF

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Publication number
CN207611776U
CN207611776U CN201721004641.XU CN201721004641U CN207611776U CN 207611776 U CN207611776 U CN 207611776U CN 201721004641 U CN201721004641 U CN 201721004641U CN 207611776 U CN207611776 U CN 207611776U
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China
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encapsulating material
material layer
layer
pid
cell piece
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Chinese (zh)
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赵珍
王海庆
王建波
吕俊
朱琛
邢涛
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Taizhou Longi Solar Technology Co Ltd
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Taizhou Longi Solar Technology Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Photovoltaic Devices (AREA)

Abstract

The utility model belongs to technical field of photovoltaic power generation, more particularly to a kind of anti-PID photovoltaic modulies, including the first glass plate, first encapsulating material layer, cell piece, second encapsulating material layer, bottom plate and frame, the cross section of second encapsulating material layer is U-shaped, the inner bottom surface in the groove of the second encapsulating material layer is arranged in cell piece, first encapsulating material layer is arranged in the upper surface of cell piece, first glass plate is arranged in the upper surface of the first encapsulating material layer, and edge is placed on the side of the second encapsulating material layer, bottom plate is arranged in the lower surface of the second encapsulating material layer, frame is enclosed set on the first glass plate, second encapsulating material layer and bottom plate periphery.The photovoltaic module structure of the utility model is reasonable, can effectively obstruct steam invasion component, prevent PID phenomenons from occurring.

Description

A kind of anti-PID photovoltaic modulies
Technical field
The utility model belongs to technical field of photovoltaic power generation, and in particular to a kind of anti-PID photovoltaic modulies.
Background technology
Currently, largely occurring in photovoltaic plant because (Potential Induced Degradation, potential induction decline PID Subtract) caused by generated energy the problem of significantly decaying.The generation of PID and the four of photovoltaic module kinds of materials (glass, encapsulating material, Cell piece and baseboard material) there are close ties.
Currently, invading component, and encapsulating material since photovoltaic module can't effectively obstruct steam in structure design EVA can not possibly accomplish 100% insulation, and especially in the environment of high temperature and high humidity, the steam of invasion passes through sealed silicone or the back of the body Plate enter component internal cause EVA in acetate chain decompose, generate acetic acid small molecule, acetic acid and glass reaction generate sodium from Son, sodium ion is mobile to battery surface under the action of extra electric field and is enriched to antireflection layer, leads to the generation of PID phenomenons. Easily occur PID phenomenons under conditions of high temperature, high humidity and high pressure, the appearance of PID phenomenons sometimes results in photovoltaic module power and declines More than subtracting 50%, the generated energy and investor's yield in power station are directly affected.
Therefore, there is an urgent need for a kind of reasonable for structure, the anti-PID photovoltaic modulies of steam invasion component can effectively be obstructed.
Invention content
To solve problems of the prior art, the purpose of this utility model is to provide a kind of anti-PID photovoltaic modulies, The photovoltaic module structure is reasonable, can effectively obstruct steam invasion component, prevent PID phenomenons from occurring.
The technical solution of the utility model is as follows:
A kind of anti-PID photovoltaic modulies, including the first glass plate, the first encapsulating material layer, cell piece, the second encapsulating material Layer, bottom plate and frame, the cross section of the second encapsulating material layer are U-shaped, and the groove in the second encapsulating material layer is arranged in cell piece Inner bottom surface, the first encapsulating material layer are arranged in the upper surface of cell piece, and the first glass plate is arranged in the upper of the first encapsulating material layer Surface, and edge is placed on the side of the second encapsulating material layer, bottom plate is arranged in the lower surface of the second encapsulating material layer, and frame encloses Set on the first glass plate, the second encapsulating material layer and bottom plate periphery.
The upper surface of first encapsulating material layer is concordant with the upper surface of the side of the second encapsulating material layer.
Second encapsulating material layer includes first layer and the second layer, and the cross section of the second layer is U-shaped, and first layer setting exists The bottom surface of second layer groove, cell piece are arranged in the upper surface of first layer.
The material of the second layer is anti-PID encapsulating materials.
The material of the second layer is POE resin.
The material of first layer is EVA resin.
The material of first encapsulating material layer is EVA resin.
Compared with prior art, the utility model has the advantages that:
By the way that the cross section of the second encapsulating material layer is set as U-shaped, cell piece is set the anti-PID photovoltaic modulies of the utility model The inner bottom surface in the groove of the second encapsulating material layer is set, the first encapsulating material layer is arranged in the upper surface of cell piece, the first glass Plate is arranged in the upper surface of the first encapsulating material layer, and edge is placed on the side of the second encapsulating material layer, the first glass plate, One encapsulating material layer and the second encapsulating material layer are by battery sheet packaging in the first glass plate and the second encapsulating material layer are formed In chamber, therefore steam invasion component can be effectively obstructed, prevent PID phenomenons from occurring.
Further, the second encapsulating material layer includes first layer and the second layer, and first layer is arranged at the bottom of second layer groove Face, cell piece are arranged in the upper surface of first layer, and first layer can stop the overflow of the material of the second layer in lamination process, to prevent The overflow of the material of the second layer causes the light transmittance of component to reduce.
Description of the drawings
The cross section structure schematic diagram of the anti-PID photovoltaic modulies of Fig. 1 the utility model;
The schematic cross-section of second encapsulating material layer of Fig. 2 the utility model.
Wherein, the first glass plates of 1-, the first encapsulating material layers of 2-, 3- cell pieces, the second encapsulating material layers of 4-, 4-1- first Layer, the 4-2- second layers, 5- bottom plates, 6- frames.
Specific implementation mode
The utility model is further described with reference to the accompanying drawings and examples.
As shown in Figure 1, the anti-PID photovoltaic modulies of the utility model, including the first glass plate 1, the first encapsulating material layer 2, The cross section of cell piece 3, the second encapsulating material layer 4, bottom plate 5 and frame 6, the second encapsulating material layer 4 is U-shaped, and cell piece 3 is arranged In the groove of the second encapsulating material layer 4, cell piece 3 is arranged in the bottom surface of groove, and the first encapsulating material layer 2 is arranged in cell piece 3 upper surface, the upper surface of the first encapsulating material layer 2 is concordant with the upper surface of side of the second encapsulating material layer 4, the first encapsulation The material of material layer 2 is EVA resin, and the first glass plate 1 is arranged in the upper surface of the first encapsulating material layer 2, and edge is placed in the On the side of two encapsulating material layers 4, bottom plate 5 is arranged in the lower surface of the second encapsulating material layer 4, and frame 6 is enclosed set on the first glass 5 periphery of plate 1, the second encapsulating material layer 4 and bottom plate.When photovoltaic module is solar double-glass assemblies, bottom plate 5 is glass plate, when photovoltaic group When part is single glass component, bottom plate 5 is backboard.
As shown in Fig. 2, second encapsulating material layer 4 of the utility model includes first layer 4-1 and second layer 4-2, the second layer The cross section of 4-2 is U-shaped, and first layer 4-1 is arranged in the bottom surface of second layer 4-2 grooves, and cell piece 3 is arranged first layer 4-1's Upper surface;The material of first layer 4-1 is the EVA resin of high light transmission;The material of second layer 4-2 is anti-PID encapsulating materials, preferably POE resin;The anti-PID encapsulating materials of second layer 4-2 wrap up first layer 4-1, and module edge surrounding is encapsulated by second layer 4-2, Realize good water vapor rejection, meanwhile, first layer 4-1 is the EVA resin of high light transmission, can stop lamination process moderate resistance PID materials The second layer 4-2 overflows of material and cause the light transmittance of component to reduce, can ensure 3 upper surface of cell piece be high light transmission EVA trees Fat, lifting assembly generated energy.
The anti-PID photovoltaic modulies of the utility model also have the advantage that:
The material of first layer 4-1 is the EVA resin of high light transmission, and the material of second layer 4-2 is anti-PID encapsulating materials, first The material of encapsulating material layer 2 is EVA resin, therefore can reduce the dosage of anti-PID encapsulating materials, reduces component cost, meanwhile, The U-shaped edge sealing of second layer 4-2 can effectively obstruct steam invasion, it is ensured that the reliability of component.

Claims (7)

1. a kind of anti-PID photovoltaic modulies, which is characterized in that including the first glass plate (1), the first encapsulating material layer (2), cell piece (3), the cross section of the second encapsulating material layer (4), bottom plate (5) and frame (6), the second encapsulating material layer (4) is U-shaped, cell piece (3) setting is in the inner bottom surface of the groove of the second encapsulating material layer (4), and the first encapsulating material layer (2) setting is in the upper of cell piece (3) Surface, the first glass plate (1) is arranged in the upper surface of the first encapsulating material layer (2), and edge is placed in the second encapsulating material layer (4) Side on, bottom plate (5) is arranged in the lower surface of the second encapsulating material layer (4), and frame (6) is enclosed set on the first glass plate (1), the Two encapsulating material layers (4) and bottom plate (5) periphery.
2. a kind of anti-PID photovoltaic modulies according to claim 1, which is characterized in that first encapsulating material layer (2) Upper surface is concordant with the upper surface of side of the second encapsulating material layer (4).
3. a kind of anti-PID photovoltaic modulies according to claim 1 or 2, which is characterized in that second encapsulating material layer (4) include first layer (4-1) and the second layer (4-2), the cross section of the second layer (4-2) is U-shaped, and first layer (4-1) setting is the The bottom surface of the groove of two layers (4-2), cell piece (3) are arranged in the upper surface of first layer (4-1).
4. a kind of anti-PID photovoltaic modulies according to claim 3, which is characterized in that the material of the second layer (4-2) is anti- PID encapsulating materials.
5. a kind of anti-PID photovoltaic modulies according to claim 4, which is characterized in that the material of the second layer (4-2) is POE Resin.
6. a kind of anti-PID photovoltaic modulies according to claim 3, which is characterized in that the material of first layer (4-1) is EVA Resin.
7. a kind of anti-PID photovoltaic modulies according to claim 1, which is characterized in that the material of the first encapsulating material layer (2) For EVA resin.
CN201721004641.XU 2017-08-11 2017-08-11 A kind of anti-PID photovoltaic modulies Active CN207611776U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721004641.XU CN207611776U (en) 2017-08-11 2017-08-11 A kind of anti-PID photovoltaic modulies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721004641.XU CN207611776U (en) 2017-08-11 2017-08-11 A kind of anti-PID photovoltaic modulies

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CN207611776U true CN207611776U (en) 2018-07-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113345983A (en) * 2021-06-08 2021-09-03 天津爱旭太阳能科技有限公司 Manufacturing method of double-glass assembly preventing water vapor from entering and double-glass assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113345983A (en) * 2021-06-08 2021-09-03 天津爱旭太阳能科技有限公司 Manufacturing method of double-glass assembly preventing water vapor from entering and double-glass assembly
CN113345983B (en) * 2021-06-08 2023-01-03 天津爱旭太阳能科技有限公司 Manufacturing method of double-glass assembly preventing water vapor from entering and double-glass assembly

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