CN207600985U - A kind of big temperature difference environment thermoelectricity capability test device - Google Patents

A kind of big temperature difference environment thermoelectricity capability test device Download PDF

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Publication number
CN207600985U
CN207600985U CN201721428756.1U CN201721428756U CN207600985U CN 207600985 U CN207600985 U CN 207600985U CN 201721428756 U CN201721428756 U CN 201721428756U CN 207600985 U CN207600985 U CN 207600985U
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China
Prior art keywords
heat source
low
source side
temperature receiver
temperature
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CN201721428756.1U
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Chinese (zh)
Inventor
陈建文
王修才
于昕梅
段志奎
樊耘
朱珍
谭海曙
何志敏
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Foshan University
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Foshan University
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Abstract

The utility model discloses a kind of big temperature difference environment thermoelectricity capability test devices, including heat source side, the low-temperature receiver end opposite with heat source side and heat source side is arranged on, for testing the thermoelectricity test suite of thermoelectricity capability parameter, further including the stent for being used to support heat source side and low-temperature receiver end on low-temperature receiver end;The guide rail for adjusting heat source side and low-temperature receiver end relative distance is provided on stent;The test device is simple in structure, and reliability is high, of low cost, can be applied to the places such as laboratory, not tested person environmental restrictions.

Description

A kind of big temperature difference environment thermoelectricity capability test device
Technical field
The utility model is related to thermoelectricity capability testing field, particularly a kind of big temperature difference environment thermoelectricity capability test device.
Background technology
Thermoelectricity capability test mainly includes pyroelectric material performance test and two class testing method of thermo-electric device performance test.Heat Electric material performance test lays particular emphasis on the basic parameter of material, such as Seebeck coefficient, conductivity and thermal conductivity.Thermo-electric device performance is surveyed Examination then lays particular emphasis on test peak power output, the parameters such as internal resistance and transfer efficiency.Existing thermoelectric material is ground with device performance test It is usually all to separate research to study carefully, and thermoelectric material researcher is caused often to only focus on some basic parameters of thermoelectric material without noting Thermoelectric material anticipate as the composite factor paid close attention to needed for the potential using value of device;Similary device researcher is often also only closed The application parameter of heat injection electrical part, and the correlation between not knowing about thermo-electric device these performance parameters.
Although the performance test of thermoelectric material and device parameter different from of concern, the original of this two classes system acquisition Beginning data are similar, mainly include the parameters such as both ends temperature, thermoelectricity potential difference, resistivity and thermal conductivity.It therefore can be according to reality The specific works occasion of thermoelectric material and device, simulates its actual working environment, and then tests its working condition correlated performance, has It is studied conducive to the overall performance optimization for accelerating thermoelectric material to thermo-electric device.No matter current thermo-electric device is applied to thermoelectric cooling With or as cogeneration, it will all face and be applied under big temperature difference condition, be needed before application to thermoelectric material or thermoelectricity Device carries out thermoelectricity capability test, and test environment is various limited, and inclement condition, is not easy to developer and carries out test to grind Study carefully.
Invention content
To solve the above problems, the purpose of this utility model is to provide a kind of big temperature difference environment thermoelectricity capability test dresses It puts, using the big temperature difference operating mode of the unit simulation, thermoelectric material or thermo-electric device is tested under big temperature difference environment convenient for research staff Thermoelectricity capability, so as to carrying out performance optimization to it, existing pyroelectric material performance test device and thermo-electric device performance can be used as The advantageous supplement of test device.
Technical solution is used by the invention for solving the technical problem:
A kind of big temperature difference environment thermoelectricity capability test device, including heat source side and the low-temperature receiver end opposite with heat source side, is also wrapped Include the stent for being used to support heat source side and low-temperature receiver end;The heat source side is respectively used to generate high and low temperature with low-temperature receiver end so that heat source The big temperature difference environment for being convenient for test is formed between end and low-temperature receiver end.
Further, the stent includes substrate, the connecting pole being disposed on the substrate and the source branch being arranged on connecting pole Frame.Low-temperature receiver end and heat source side are associated with by connecting pole.
Further, guide rail is provided on the connecting pole, the rail axis is parallel with connection mast axis, the source branch Frame is arranged on guide rail and can be moved along rail axis.Guide rail causes low-temperature receiver end and heat source side relative distance be adjusted so as to So that the test device is adapted to each size dimension test sample.
Further, a kind of source in the heat source side and low-temperature receiver end is fixed on substrate, another source setting Opposite with former source on source stent, the source stent drives source thereon to move to adjust along rail axis The distance between heat source side and low-temperature receiver end.Low-temperature receiver end and heat source side are opposite, and the space between them is made to form big temperature difference environment.
Further, the thermoelectricity test suite includes the heat source termination electrode and low-temperature receiver end electricity for testing unit for electrical property parameters Pole further includes heat source side thermocouple and low-temperature receiver end thermocouple for testing Thermal Parameter.
Further, the heat source side includes heater strip and is covered in around heater strip being used for accumulation of heat and stablizing heat source side temperature The metal regenerative block of degree, the heat source termination electrode is covered in the metal regenerative block one side opposite with low-temperature receiver end, for ensureing heat Source and test sample are in electrical contact, and the metal regenerative block other faces are covered with for preventing metal regenerative block from carrying out heat with extraneous The heat source side thermal insulation layer of transmission;The heat source side thermocouple is arranged on heat source termination electrode, for test sample close to heat source side The temperature of side.Heat source side is heated using heater strip, ensures heat source side temperature by the accumulation of heat of metal regenerative block, heat source side is made to form height Warm environment.
Further, the low-temperature receiver end includes semiconductor thermoelectric refrigeration piece, the cold end and use of the semiconductor thermoelectric refrigeration piece In cold-storage and the end thereof contacts for the metal cool accumulating block for stablizing cold source end temperature, the low-temperature receiver termination electrode is covered in metal cool accumulating block The other end, for ensureing that low-temperature receiver end and test sample electrical contact are good, low-temperature receiver end thermocouple is arranged on low-temperature receiver termination electrode, For test sample close to the temperature of low-temperature receiver end side;The hot junction of the semiconductor thermoelectric refrigeration piece is provided with for by semiconductor The radiator that the heat in thermoelectric module hot junction distributes.Low-temperature receiver end is freezed using semiconductor thermoelectric refrigeration piece, by radiating Device accelerates heat dissipation and ensures cold source end temperature, and low-temperature receiver end is made to form low temperature environment and the big temperature difference ring of hot environment composition of heat source side Border.
Further, the heat source termination electrode and low-temperature receiver termination electrode are anti-oxidation metal electrode.Anti-oxidation metal electrode uses Long lifespan and conductive and heat-conductive is good.
Further, it is both provided with to completely cut off semiconductor heat in addition to cold end and hot junction around the semiconductor thermoelectric refrigeration piece Electric cooling piece and the extraneous low-temperature receiver end thermal insulation layer for carrying out hot transmission.Low-temperature receiver end thermal insulation layer ensure that the low temperature environment at low-temperature receiver end.
Further, the radiator includes water cooling plant and the cooling fin being arranged on water cooling plant;The water cooling dress It puts including heat-sink unit and water circulation unit.Water cooling plant makes better heat-radiation effect.
Further, the water circulation unit includes the water-cooling groove contacted with semiconductor thermoelectric refrigeration piece hot junction, with the water The cycle water conduit of cold trap connection, the immersible pump and sink being connect with cycle water conduit, the immersible pump are arranged on bottom of gullet; The heat-sink unit includes the radiator being covered in outside cycle water conduit and the radiator fan for being arranged on radiator side, the water Slot is arranged on radiator opposite side.Semiconductor thermoelectric refrigeration piece hot junction heat is transmitted to heat dissipation by water-cooling groove by recycling water conduit Unit and sink accelerate heat dissipation.
The beneficial effects of the utility model are:A kind of big temperature difference environment thermoelectricity capability test dress that the utility model uses It puts, is oppositely arranged using low-temperature receiver end and heat source side, low-temperature receiver end generates low temperature, and heat source side generates high temperature, the shape between two sources Into the test section of one big temperature difference band, to realize that the thermoelectricity capability under the big temperature difference working condition of thermoelectric material and thermo-electric device is surveyed Examination research;And the utility model is simple in structure, reliability is high, of low cost, can be applied to the places such as laboratory, will not be tested Try research environment limitation.
Description of the drawings
The utility model is described in further detail with example below in conjunction with the accompanying drawings.
Fig. 1 is the test device structure diagram of hot and cold source vertical direction setting;
Fig. 2 is the vertical view for the simplified schematic diagram that hot and cold source is arranged on horizontal direction.
Specific embodiment
With reference to Fig. 1, a kind of big temperature difference environment thermoelectricity capability test device of the utility model, including heat source side and and heat source Opposite low-temperature receiver end is held, further includes the stent for being used to support heat source side and low-temperature receiver end;Heat source side is respectively used to generate with low-temperature receiver end High and low temperature so that the big temperature difference environment for being convenient for test is formed between heat source side and low-temperature receiver end.
Wherein, stent includes substrate 31, and heat source side is fixedly installed on substrate 31, further includes setting setting on the substrate 31 Connecting pole 32 and the source stent 33 that is arranged on connecting pole 32, be provided with low-temperature receiver end on source stent 33;On connecting pole 32 Guide rail 34 is provided with, 34 axis of guide rail is parallel with 32 axis of connecting pole, and 33 one end of source stent connect with guide rail 34 and can drive Low-temperature receiver end moves up and down to adjust the distance between heat source side and low-temperature receiver end along 34 axis of guide rail;Heat source side and low-temperature receiver end phase It is right, make to form the test section of big temperature difference environment between them;
Heat source side includes heater strip 11, covered with for accumulation of heat and stablizing the metal storage of heat source side temperature around heater strip 11 Heat block 12, the top of metal regenerative block 12 is covered with for ensureing heat source side and the heat source termination electrode 13 of test sample electrical contact, heat It is provided on source electrode 13 for the heat source side thermocouple 15 of test sample temperature at heat source side;Metal regenerative block 12 with Between substrate 31 and 12 surrounding of metal regenerative block is all covered with preventing metal regenerative block 12 and the extraneous heat for carrying out hot transmission Source thermal insulation layer 14;Heat source side is heated using heater strip 11, is ensured heat source side temperature by 12 accumulation of heat of metal regenerative block, is made heat source side Keep hot environment;
Low-temperature receiver end includes semiconductor thermoelectric refrigeration piece 21, and the cold end of semiconductor thermoelectric refrigeration piece 21 is with being used for cold-storage and stabilization The end thereof contacts of the metal cool accumulating block 22 of cold source end temperature, the other end of metal cool accumulating block 22 covered with for ensure low-temperature receiver end with Test sample is in electrical contact good low-temperature receiver termination electrode 23, is provided on low-temperature receiver termination electrode 23 for test sample at low-temperature receiver end The low-temperature receiver end thermocouple 24 of temperature;It is both provided in addition to cold end and hot junction around semiconductor thermoelectric refrigeration piece 21 and is partly led for completely cutting off Body thermoelectric module 21 ensure that the low of low-temperature receiver end with the extraneous low-temperature receiver end thermal insulation layer 25 for carrying out hot transmission, low-temperature receiver end thermal insulation layer 25 Warm environment.
The hot junction of semiconductor thermoelectric refrigeration piece 21 is provided with for the heat in 21 hot junction of semiconductor thermoelectric refrigeration piece is timely The radiator distributed;Low-temperature receiver end is freezed using semiconductor thermoelectric refrigeration piece 21, and it is cold to accelerate heat dissipation guarantee by radiator Source end temperature makes low-temperature receiver end form low temperature environment and the big temperature difference environment of hot environment composition of heat source side;Specifically, heat source side is electric Pole 13 and low-temperature receiver termination electrode 23 be long for service life and the good anti-oxidation metal electrode of conductive and heat-conductive;
Wherein, radiator includes the water-cooling groove 42 for being arranged on 21 hot junction of semiconductor thermoelectric refrigeration piece, and water-cooling groove 42 is used for The heat that 21 hot junction of semiconductor thermoelectric refrigeration piece distributes is taken away, 42 top of water-cooling groove is covered with cooling fin 41, to accelerate water Heat distributes in cold trap 42;Water-cooling groove 42 is also connected by a cycle water conduit 43 with a sink 45, specifically with setting The immersible pump 44 for putting the bottom in sink 45 is connected, and immersible pump 44 makes water-cooling groove 42 be recycled with hot and cold water in sink 45 for providing Power;Radiator 46 is also enclosed with outside cycle water conduit 43,46 side of radiator is equipped with the radiator fan 47 for accelerating heat dissipation.
During using the big temperature difference environment thermoelectricity capability test device, adjustment is provided with 33 position of source stent at low-temperature receiver end, It is made to reserve suitable distance between heat source side, then sample to be tested 5 is placed on heat source termination electrode 13, and makes sample to be tested 5 It is in close contact with heat source termination electrode 13, adjusts 33 position of source stent again, low-temperature receiver termination electrode 23 is made closely to be connect with sample to be tested 5 It touches, is then electrified to open all switches, begins to warm up heater strip 11, semiconductor thermoelectric refrigeration piece 21 is made to start to freeze, make to dissipate Thermal brings into operation, and so as to form big temperature difference environment test section between heat source side and low-temperature receiver end, utilizes testing tool later Testing research is carried out to sample to be tested.
It should be noted that described above, the only preferred embodiment of the utility model, the utility model not office It is limited to the above embodiment, as long as it reaches the technique effect of the utility model with identical means, it is new should all belongs to this practicality The protection domain of type;Such as heat source side and low-temperature receiver end position can be interchanged, low-temperature receiver end is fixed on the substrate 31, and heat source side is arranged on On moveable source stent 33;Heat source side and low-temperature receiver end can also be respectively provided in the horizontal plane, as shown in the schematic diagram of Fig. 2, Fig. 2 Heat source side and low-temperature receiver end position relationship only described, structure and to be not drawn into part identical with structure in Fig. 1 repeats no more.

Claims (4)

1. a kind of big temperature difference environment thermoelectricity capability test device, it is characterised in that:Including heat source side, the low-temperature receiver opposite with heat source side Heat source side is held and is arranged on, for testing the thermoelectricity test suite of thermoelectricity capability parameter, further including and being used to support on low-temperature receiver end Heat source side and the stent at low-temperature receiver end;
The stent includes substrate (31), the connecting pole (32) being arranged on substrate (31) and the source being arranged on connecting pole (32) Hold stent (33);Guide rail (34) is provided on the connecting pole (32), guide rail (34) axis is put down with connecting pole (32) axis Row, the source stent (33) are arranged on guide rail (34) and can be moved along guide rail (34) axis;
A kind of source in the heat source side and low-temperature receiver end is fixed on substrate (31), and another source is arranged on source branch On frame (33), the source stent (33) drives source thereon to be moved along guide rail (34) axis so as to adjust heat source side and low-temperature receiver The distance between end;
The thermoelectricity test suite includes testing the heat source termination electrode (13) of unit for electrical property parameters and low-temperature receiver termination electrode (23), also Including being used to test the heat source side thermocouple (15) of Thermal Parameter and low-temperature receiver end thermocouple (24);
The heat source side includes heater strip (11) and is covered in around heater strip (11) being used for accumulation of heat and stablizing heat source side temperature Metal regenerative block (12), the metal regenerative block (12) one side opposite with low-temperature receiver end covered with for ensure heat source side with survey The heat source termination electrode (13) of test agent electrical contact, metal regenerative block (12) other faces are covered with for preventing metal from storing Heat block (12) and the extraneous heat source side thermal insulation layer (14) for carrying out hot transmission;It is provided with to test on the heat source termination electrode (13) Sample is close to the heat source side thermocouple (15) of the temperature of heat source side side;
The low-temperature receiver end includes semiconductor thermoelectric refrigeration piece (21) and is used for what semiconductor thermoelectric refrigeration piece (21) cold end contacted Cold-storage and the metal cool accumulating block (22) for stablizing cold source end temperature, the metal cool accumulating block (22) close to heat source side one side covered with For ensureing that low-temperature receiver end and test sample are in electrical contact the good low-temperature receiver termination electrode (23), set on the low-temperature receiver termination electrode (23) It is equipped with the low-temperature receiver end thermocouple (24) close to the temperature of low-temperature receiver end side for test sample.
2. a kind of big temperature difference environment thermoelectricity capability test device according to claim 1, it is characterised in that:The semiconductor The hot junction of thermoelectric module (21) is provided with the heat dissipation for the heat in semiconductor thermoelectric refrigeration piece (21) hot junction to be distributed Device.
3. a kind of big temperature difference environment thermoelectricity capability test device according to claim 2, it is characterised in that:The heat dissipation dress It puts including water cooling plant and the cooling fin (41) being arranged on water cooling plant;The water cooling plant includes heat-sink unit and water recycles Unit.
4. a kind of big temperature difference environment thermoelectricity capability test device according to claim 3, it is characterised in that:The water cycle Unit includes the water-cooling groove (42) contacted with semiconductor thermoelectric refrigeration piece (21) hot junction, the cycle being connect with the water-cooling groove (42) Water conduit (43), the immersible pump (44) being connect with cycle water conduit (43) and sink (45), the immersible pump (44) are arranged on water Slot (45) bottom;The heat-sink unit includes being covered in cycle water conduit (43) outer radiator (46) and is arranged on radiator (46) other radiator fan (47).
CN201721428756.1U 2017-10-30 2017-10-30 A kind of big temperature difference environment thermoelectricity capability test device Expired - Fee Related CN207600985U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107655928A (en) * 2017-10-30 2018-02-02 佛山科学技术学院 A kind of big temperature difference environment thermoelectricity capability test device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107655928A (en) * 2017-10-30 2018-02-02 佛山科学技术学院 A kind of big temperature difference environment thermoelectricity capability test device

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