CN207581933U - A kind of spray equipment of MOCVD device - Google Patents

A kind of spray equipment of MOCVD device Download PDF

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Publication number
CN207581933U
CN207581933U CN201721649992.6U CN201721649992U CN207581933U CN 207581933 U CN207581933 U CN 207581933U CN 201721649992 U CN201721649992 U CN 201721649992U CN 207581933 U CN207581933 U CN 207581933U
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uniform flow
flow
uniform
spray
chamber
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CN201721649992.6U
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张新云
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Zishi Energy Co ltd
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Beijing Chong Yu Technology Co Ltd
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Abstract

The utility model discloses a kind of spray equipments of MOCVD device, including divided flow box and spray system, the spray system includes spray ontology, uniform flow chamber and back cavity, the uniform flow chamber and the back cavity are set on the both sides of the spray ontology, the outlet of the divided flow box is connected with the entrance of the uniform flow chamber, the uniform flow chamber is connected with the back cavity by cooling duct, and even flow plate is equipped between the uniform flow chamber and the cooling duct, and the even flow plate is equipped with uniform flow hole;The utility model separates uniform flow chamber and cooling duct by even flow plate, and uniform flow hole is set on even flow plate, the cooling agent for flowing through spray system can be shunted, it realizes and the flow distribution of cooling agent is regulated and controled, ensure that cooling agent equably takes away the heat of spray system, improve the temperature uniformity on spray system surface corresponding with chip, improve the quality of wafer film layer.

Description

A kind of spray equipment of MOCVD device
Technical field
The utility model is related to semiconductor thin film deposition equipment technical field, the spray dress of particularly a kind of MOCVD device It puts.
Background technology
Spray equipment is the key components in MOCVD device, is the core that MOCVD device carries out thin film deposition processes Component.In technical process, for the temperature of chip generally between 700-1500K, the spacing of spray equipment and chip is usually 10mm, The temperature of spray equipment easily steeply rises under heat radiation effect.
In addition, in photovoltaic field, the general volume of spray equipment of MOCVD device is larger, and production capacity is higher Equipment, the volume of spray equipment also accordingly become larger, and area corresponding with chip corresponding can also increase, therefore it is difficult to ensure that spray Device corresponds to the temperature uniformity of wafer surface.
In addition, cooling is led in process gas antedating response in spray equipment, usually use in spray equipment in order to prevent The mode of agent ensures that the temperature of process gas is maintained at stable section.And being unevenly distributed for cooling agent can cause spray equipment Temperature distribution is non-uniform, directly affects the quality of film layer.It is therefore desirable to design a kind of spray equipment, by making cooling agent Spray head uniformly is flowed through, so as to improve the uniformity cooling structure of spray equipment surface temperature.
Utility model content
The purpose of this utility model is to provide a kind of spray equipment of MOCVD device, is filled with solving spray in the prior art The technical issues of putting the non-uniform temperature of corresponding wafer surface, the cooling agent that it can ensure to flow through spray equipment are equably taken away Heat improves the temperature uniformity on spray equipment surface corresponding with chip.
To achieve these goals, the utility model provides following technical solution:
A kind of spray equipment of MOCVD device, including divided flow box and spray system, the spray system includes spray originally Body, uniform flow chamber and back cavity, the uniform flow chamber and the back cavity are set on the both sides of the spray ontology, and the divided flow box goes out Mouth is connected with the entrance of the uniform flow chamber, and the uniform flow chamber is connected with the back cavity by cooling duct, the uniform flow chamber and institute It states and even flow plate is equipped between cooling duct, the even flow plate is equipped with uniform flow hole.
Preferably, deflecting plate, described deflecting plate one end and the spray ontology are additionally provided with below the entrance of the uniform flow chamber Connection, the bottom surface of the deflecting plate is connect with the top of the even flow plate.
Preferably, the even flow plate is rectangular slab, and the uniform flow hole is interspersed on the even flow plate.
Preferably, the uniform flow chamber is equipped with multiple entrances, and the back cavity is equipped with multiple outlets.
Preferably, the even flow plate is equipped with the subregion equal with the entry number of the uniform flow chamber, each subregion packet Include several uniform flow areas, be equipped with the uniform flow hole in the uniform flow area, the uniform flow hole in the adjacent uniform flow area it is straight Diameter is different.
It is preferably located in the middle part of the subregion and the diameter in the uniform flow hole at both ends is more than the uniform flow in other regions The diameter in hole.
Preferably, each subregion include the first uniform flow area, the second uniform flow area, third uniform flow area, the 4th uniform flow area and 5th uniform flow area, the diameter phase in the uniform flow hole in the first uniform flow area, the third uniform flow area and the 5th uniform flow area Together, the second uniform flow area is identical with the diameter in the uniform flow hole in the 4th uniform flow area, and the institute in the first uniform flow area State the diameter of the diameter more than the uniform flow hole in the second uniform flow area in uniform flow hole.
Preferably, the divided flow box is cylindrical cavities structure, and the entrance of the divided flow box is set on the cylindrical cavities structure Axial end face on, the divided flow box outlet uniformly set on the cylindrical cavities structure side wall on, the divided flow box goes out Mouth is connect with the entrance of the uniform flow chamber.
Preferably, the outlet of the divided flow box is uniformly distributed along the circumferential direction of the cylindrical cavities structure.
Preferably, distribution pipeline, the shunting are equipped between the outlet of the divided flow box and the entrance of the uniform flow chamber The structure of pipeline is identical.
The beneficial effects of the utility model are:
The utility model provides a kind of spray equipment of MOCVD device, including divided flow box and spray system, the spray System includes spray ontology, uniform flow chamber and back cavity, and the uniform flow chamber and the back cavity are set on the both sides of the spray ontology, The outlet of the divided flow box is connected with the entrance of the uniform flow chamber, and the uniform flow chamber is connected with the back cavity by cooling duct, Even flow plate is equipped between the uniform flow chamber and the cooling duct, the even flow plate is equipped with uniform flow hole;The utility model The spray equipment of MOCVD device by setting even flow plate between uniform flow chamber and cooling duct, and sets uniform flow on even flow plate Hole can carry out uniform divided flows to the cooling agent for flowing through spray system, realize the flow distribution regulation and control to cooling agent, it is ensured that cooling The heat of spray system is equably taken away in agent, and compared with prior art, the utility model can improve spray system and chip pair The temperature uniformity on surface is answered, improves the quality of wafer film layer.
Description of the drawings
Fig. 1 is the structure diagram of the spray equipment of the MOCVD device of the utility model embodiment;
Fig. 2 is the sectional view of the spray system of the utility model embodiment;
Fig. 3 is the structure diagram of the even flow plate of the utility model embodiment;
Fig. 4 is the stereogram of the divided flow box of the utility model embodiment.
Reference sign:
1- die heaters, 2- divided flow boxes, 3- spray systems, 4- spray ontologies, 5- uniform flow chambers, 6- back cavities, 7- cooling ducts, 8- even flow plates, 9- uniform flows hole, 10- deflecting plates, 11- distribution pipelines.
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and cannot be construed to the utility model Limitation.
As depicted in figs. 1 and 2, the embodiment of the utility model provides a kind of spray equipment of MOCVD device, including shunting Box 2 and spray system 3, the spray system 3 include spray ontology 4, uniform flow chamber 5 and back cavity 6, the uniform flow chamber 5 and described Back cavity 6 is set on the both sides of the spray ontology 4, and the outlet of the divided flow box 2 is connected with the entrance of the uniform flow chamber 5, described Uniform flow chamber 5 is connected with the back cavity 6 by cooling duct 7, and even flow plate is equipped between the uniform flow chamber 5 and the cooling duct 7 8, the even flow plate 8 is equipped with uniform flow hole 9.Wherein, the cooling duct 7 of connection uniform flow chamber 5 and back cavity 6 is equipped with several, It is even to be distributed in spray system 3, to ensure the cooling effect to spray system 3.Spray system 3 and spray ontology 4 are preferably set It is set to rectangular-shape structure.The shape and diameter of several cooling ducts 7 are preferably identical, the center line of cooling duct 7 and spray The spacing of the lower surface of leaching system 3 is it is also preferred that be set as equal, to ensure that spray system 3 is equably taken away heat.Cooling is logical The axis in road 7 is parallel with the lower face of the spray system 3.The diameter of the cooling duct 7 is preferably 8-10mm.
The application method of the utility model:Cooling agent is supplied to divided flow box 2 by die heater 1, and divided flow box 2 leads to cooling agent Piping distributes to uniform flow chamber 5, and the cooling agent in uniform flow chamber 5 flows through cooling duct 7 after even flow plate 8 and uniform flow hole 9 shunt Spray ontology 4 is cooled down, back cavity 6 is then flowed into, finally flows back to die heater 1 by the road, start next cycle;By Aforesaid operations step carries out spray system 3 by cooling duct 7 it is found that the spray equipment of the MOCVD device of the utility model Cooling coordinates even flow plate 8 and uniform flow hole 9, the cooling agent for flowing through spray system 3 can be shunted as needed, realization pair The flow distribution regulation and control of cooling agent, it is ensured that cooling agent equably takes away the heat of spray system 3, improves spray system 3 and chip The temperature uniformity on corresponding surface improves the quality of wafer film layer.
On the basis of above structure, deflecting plate 10, the deflecting plate 10 1 are additionally provided with below the entrance of the uniform flow chamber 5 End is connect with the spray ontology 4, and the bottom surface of the deflecting plate 10 is connect with the top of the even flow plate 8.As shown in Fig. 2, In one embodiment, deflecting plate 10 is preferably tablet, is arranged on the underface of the entrance of uniform flow chamber 5, and the size of deflecting plate 10 is big In the size of 5 entrance of uniform flow chamber, even flow plate 8 is arranged in uniform flow chamber 5, and deflecting plate 10 and spray ontology 4 and even flow plate 8 are vertical Connection, the cooperation even flow plate 8 of deflecting plate 10 flows into the cooling agent of uniform flow chamber 5, first along deflecting plate 10 and the roof of uniform flow chamber 5 The channel flowing of formation, then turns to 90 °, and the channel formed along the side wall of even flow plate 8 and uniform flow chamber 5 flows, in the process, The path of cooling agent flowing is not only increased, slows down the flowing velocity of cooling agent, and when turning to, can also be lost a part of cold But the kinetic energy of agent so that cooling agent can be more gentle flows through even flow plate 8 and uniform flow hole 9, and then more slowly flow through spray Ontology 4 is drenched, cooling agent is enabled more fully to absorb the heat of spray ontology 4, enhances the cooling-down effect to spray system 3.It turns to Plate 10 is preferably connect with spraying the middle part of ontology 4.Can certainly be as needed, it is set as such structure:8 top of even flow plate with The bottom connection of ontology 4 is sprayed, the other end is connect with the inner wall of cooling duct 7, deflecting plate 10 and spray 4 vertical connection of ontology, Under such structure, deflecting plate 10 can also carry out a degree of changed course to the cooling agent for entering uniform flow chamber 5.
In order to more neatly regulate and control to flow through the cooling agent of spray ontology 4, it is equal further to improve 3 surface temperature of spray system Even property, detects the uniformity of Temperature Distribution, and the lower surface of the spray system 3 is equipped with temperature sensor.Temperature sensor plays The effect of monitoring 3 underlaying surface temperature of spray system in real time.The setting of above structure is conducive to improve the distribution of cooling agent, into one Step improves the temperature uniformity on the surface corresponding with chip of spray system 3.
More specifically, the even flow plate 8 is rectangular slab, and the uniform flow hole 9 is interspersed on even flow plate 8, described even Center line of the discharge orifice 9 on every row is parallel with the side of the even flow plate 8.Different-diameter is preferably provided on even flow plate 8 Uniform flow hole 9, to obtain the function that the flow of cooling agent is adjusted.
In order to reduce difficulty of processing, technique and cost are saved, the uniform flow chamber 5 is similar for structure with the back cavity 6 Rectangular-shape cavity, the uniform flow chamber 5 have multiple entrances, and the back cavity 6 has multiple outlets.The multiple entrance and described more Center line symmetrical setting of a outlet preferably about the spray ontology 4.
Preferably, the even flow plate 8 is equipped with the subregion equal with the entry number of the uniform flow chamber 5, each subregion Including uniform flow area connected in sequence, it is equipped with the uniform flow hole 9 in the uniform flow area, it is described even in the adjacent uniform flow area The diameter of discharge orifice 9 is different.The diameter in the uniform flow hole 9 in the adjacent uniform flow area is set as different, can be realized pair The flow in uniform flow area is adjusted.
Further, it is more than described in other regions with the diameter in the uniform flow hole 9 at both ends in the middle part of the subregion The diameter in uniform flow hole 9.In general, the setting of above structure meets the flow behavior of cooling agent.
Further, each subregion includes the first uniform flow area, the second uniform flow area, third uniform flow area, the 4th uniform flow Area and the 5th uniform flow area, the uniform flow hole 9 in the first uniform flow area, the third uniform flow area and the 5th uniform flow area it is straight Diameter is identical, and the second uniform flow area is identical with the diameter in the uniform flow hole 9 in the 4th uniform flow area, and the first uniform flow area The uniform flow hole 9 diameter be more than the second uniform flow area the uniform flow hole 9 diameter.As shown in figure 3, in an implementation In example, even flow plate 8 can be divided into subregion (virtual area does not separate actually) corresponding with 5 entry number of uniform flow chamber, the present embodiment pair 4 entrances are answered, even flow plate can be divided into 4 subregions, and each subregion can be divided into 5 uniform flow areas (Fig. 3 dotted line frames), That is the first uniform flow area, the second uniform flow area, third uniform flow area, the 4th uniform flow area and the 5th uniform flow area.First uniform flow area is provided with directly Diameter is the uniform flow hole 9 of 3mm, and the uniform flow hole 9 of a diameter of 2.5mm is provided in the second uniform flow area, and third uniform flow is also equipped in area Diameter is the uniform flow hole 9 of 3mm, and the uniform flow hole 9 of a diameter of 2.5mm is provided in the 4th uniform flow area, is set in the 5th uniform flow area There is the uniform flow hole 9 that diameter is 3mm.The distribution of cooling agent is adjusted in the uniform flow hole 9 of different-diameter, uniformly enters cooling agent Cooling duct 7, so as to preferably realize the distribution to the flow of cooling agent, the coolant flow for improving different location is non-uniform Problem.
As shown in figure 4, the divided flow box 2 is cylindrical cavities structure, the entrance of the divided flow box 2 is set on the cylindrical cavities On the axial end face of structure, the outlet of the divided flow box 2 is uniformly set on the side wall of the cylindrical cavities structure, the divided flow box 2 outlet is connect with the entrance of the uniform flow chamber 5.Wherein, entrance of the outlet of the divided flow box 2 preferably with the divided flow box 2 Vertically.After cooling agent reaches divided flow box 2, the entrance of uniform flow chamber 5 can be equally distributed to by equally distributed outlet, is ensured The coolant flow of each entrance in uniform flow chamber 5 is consistent.As shown in figure 4, the divided flow box 2 is with the entrance of divided flow box 2 Centered on, 4 outlets are evenly arranged with, and 4 outlets are vertical with the entrance of divided flow box 2, the design of this kind of structure is conducive to Cooling agent is made uniformly to discharge from dividing in chamber.
More specifically, the outlet of the divided flow box 2 is uniformly distributed along the circumferential direction of the cylindrical cavities structure.It is in addition, every The exit of a divided flow box 2 is equipped with connecting pipe, and the connecting pipe is uniform along the circumferential direction of the cylindrical cavities structure Distribution.As shown in figure 4, the outlet of the divided flow box 2 and the connecting pipe share 4, along the week of the cylindrical cavities structure To being uniformly distributed.
In another embodiment, it is equipped with shunting between the outlet of the divided flow box 2 and the entrance of the uniform flow chamber 5 Pipeline 11, the structure of the distribution pipeline 11 are identical.As shown in Figure 1, the uniform flow chamber 5 is equipped with 4 entrances, the back cavity 6 Equipped with 4 outlets, it is equipped with described in distribution pipeline 11,4 between the outlet of the divided flow box 2 and the entrance of the uniform flow chamber 5 The structure of distribution pipeline 11 is identical.Cross section, trend and the length of distribution pipeline 11 are preferably equal, to ensure to flow to uniform flow chamber The flow of cooling agent in 5 is consistent, and the heat equally to absorb spray system 3 is ready.
In order to avoid the impurity in cooling agent enters spray ontology 4, the inlet of the uniform flow chamber 5 was also preferably equipped with Strainer.
The structure, feature and effect of the utility model are described in detail based on the embodiments shown in the drawings, with Upper described is only the preferred embodiment of the utility model, but the utility model is to limit practical range shown in drawing, it is every according to Change that conception according to the utility model is made or the equivalent embodiment for being revised as equivalent variations, still without departing from specification and figure When showing covered spirit, it should be within the protection scope of the present utility model.

Claims (10)

1. a kind of spray equipment of MOCVD device, including divided flow box (2) and spray system (3), which is characterized in that the spray System (3) is set on including spray ontology (4), uniform flow chamber (5) and back cavity (6), the uniform flow chamber (5) and the back cavity (6) The both sides of the spray ontology (4), the outlet of the divided flow box (2) are connected with the entrance of the uniform flow chamber (5), the uniform flow chamber (5) it is connected, is equipped between the uniform flow chamber (5) and the cooling duct (7) even by cooling duct (7) with the back cavity (6) Flowing plate (8), the even flow plate (8) are equipped with uniform flow hole (9).
2. the spray equipment of MOCVD device according to claim 1, which is characterized in that under the entrance of the uniform flow chamber (5) Side is additionally provided with deflecting plate (10), and described deflecting plate (10) one end is connect with the spray ontology (4), the bottom of the deflecting plate (10) Face is connect with the top of the even flow plate (8).
3. the spray equipment of MOCVD device according to claim 1, which is characterized in that the even flow plate (8) is rectangle Plate, the uniform flow hole (9) are interspersed on the even flow plate (8).
4. according to the spray equipment of claim 1-3 any one of them MOCVD devices, which is characterized in that the uniform flow chamber (5) Equipped with multiple entrances, the back cavity (6) is equipped with multiple outlets.
5. the spray equipment of MOCVD device according to claim 4, which is characterized in that the even flow plate (8) equipped with institute The equal subregion of the entry number of uniform flow chamber (5) is stated, each subregion includes several uniform flow areas, being equipped in the uniform flow area The uniform flow hole (9), the diameter of the uniform flow hole (9) in the adjacent uniform flow area are different.
6. the spray equipment of MOCVD device according to claim 5, which is characterized in that positioned at subregion middle part and two The diameter of the uniform flow hole (9) at end is more than the diameter of the uniform flow hole (9) in other regions.
7. the spray equipment of MOCVD device according to claim 5, which is characterized in that each subregion includes first Uniform flow area, the second uniform flow area, third uniform flow area, the 4th uniform flow area and the 5th uniform flow area, the first uniform flow area, the third are even It is identical with the diameter of the uniform flow hole (9) in the 5th uniform flow area to flow area, the second uniform flow area and the 4th uniform flow area The uniform flow hole (9) diameter it is identical, and the diameter of the uniform flow hole (9) in the first uniform flow area be more than it is described second even Flow the diameter of the uniform flow hole (9) in area.
8. the spray equipment of MOCVD device according to claim 1, which is characterized in that the divided flow box (2) is column chamber Body structure, the entrance of the divided flow box (2) are set on the axial end face of the cylindrical cavities structure, and divided flow box (2) go out Uniformly on the side wall of the cylindrical cavities structure, the outlet of the divided flow box (2) and the entrance of the uniform flow chamber (5) connect mouth It connects.
9. the spray equipment of MOCVD device according to claim 8, which is characterized in that the outlet edge of the divided flow box (2) The circumferential direction of the cylindrical cavities structure is uniformly distributed.
10. the spray equipment of MOCVD device according to claim 9, which is characterized in that the outlet of the divided flow box (2) Distribution pipeline (11) is equipped between the entrance of the uniform flow chamber (5), the structure of the distribution pipeline (11) is identical.
CN201721649992.6U 2017-11-30 2017-11-30 A kind of spray equipment of MOCVD device Active CN207581933U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721649992.6U CN207581933U (en) 2017-11-30 2017-11-30 A kind of spray equipment of MOCVD device

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Application Number Priority Date Filing Date Title
CN201721649992.6U CN207581933U (en) 2017-11-30 2017-11-30 A kind of spray equipment of MOCVD device

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CN207581933U true CN207581933U (en) 2018-07-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112979176A (en) * 2021-02-20 2021-06-18 苏州晶洲装备科技有限公司 Spraying device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112979176A (en) * 2021-02-20 2021-06-18 苏州晶洲装备科技有限公司 Spraying device

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Address after: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing

Patentee after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd.

Address before: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing

Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd.

Address after: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing

Patentee after: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY (BEIJING) Co.,Ltd.

Address before: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing

Patentee before: BEIJING CHUANGYU TECHNOLOGY Co.,Ltd.

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Effective date of registration: 20191129

Address after: 518112 Room 403, unit 2, building C, Dongfang Shengshi, Jinpai community, Buji street, Longgang District, Shenzhen City, Guangdong Province

Patentee after: Shenzhen yongshenglong Technology Co.,Ltd.

Address before: 102299 room A129-1, No. 10, Zhongxing Road, Changping District science and Technology Park, Beijing

Patentee before: DONGTAI HI-TECH EQUIPMENT TECHNOLOGY Co.,Ltd.

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Effective date of registration: 20210301

Address after: Unit 611, unit 3, 6 / F, building 1, yard 30, Yuzhi East Road, Changping District, Beijing 102208

Patentee after: Zishi Energy Co.,Ltd.

Address before: Room 403, unit 2, building C, Dongfang Shengshi, Jinpai community, Buji street, Longgang District, Shenzhen, Guangdong 518112

Patentee before: Shenzhen yongshenglong Technology Co.,Ltd.

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