CN207547632U - Composite polycrystal-diamond - Google Patents
Composite polycrystal-diamond Download PDFInfo
- Publication number
- CN207547632U CN207547632U CN201721043377.0U CN201721043377U CN207547632U CN 207547632 U CN207547632 U CN 207547632U CN 201721043377 U CN201721043377 U CN 201721043377U CN 207547632 U CN207547632 U CN 207547632U
- Authority
- CN
- China
- Prior art keywords
- layer
- diamond
- polycrystalline diamond
- hard alloy
- alloy substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Carbon And Carbon Compounds (AREA)
Abstract
The utility model discloses a kind of composite polycrystal-diamonds.The utility model composite polycrystal-diamond includes hard alloy substrate layer and polycrystalline diamond layer, it is characterised in that：Stress transfer layer is further included, and the hard alloy substrate layer, the stress transfer layer and the polycrystalline diamond layer stack gradually combination.Above-mentioned composite polycrystal-diamond in polycrystalline diamond layer and hard alloy substrate layer by being additionally arranged stress transfer layer, so as to which the residual stress at polycrystalline diamond layer and hard alloy substrate bed boundary effectively is dispersed to hard alloy substrate layer, influence of the interface residual stress to polycrystalline diamond layer is considerably reduced；Stress transfer layer enhances the bond strength of polycrystalline diamond layer and hard alloy substrate layer simultaneously.
Description
Technical field
The utility model belongs to super-hard compound material technical field, relate particularly to a kind of composite polycrystal-diamond and
Preparation method.
Background technology
Composite polycrystal-diamond (Polycrystalline Diamond Compacts, abbreviation PDC composite sheet) be by
The super-hard compound material of hard alloy layer and polycrystalline diamond layer composition has the high-wearing feature and hard alloy of diamond
Toughness, weldability feature.Moreover, diamond has the advantages that high-termal conductivity, during the cutting use of cutter material
In time by heat derives, enrichment of the heat in composite polycrystal-diamond part is reduced, extends the service life of composite sheet.Cause
This, composite polycrystal-diamond is widely used as excellent cutter material, especially oil, geological drilling and
Mechanical processing industry.
During the use of composite sheet, polycrystalline diamond layer is because with hardness, the high-wearing feature characteristic close to diamond
And it is used to directly and isoelectric membrane, force destruction be carried out to object.However, the failure mode of composite sheet is mainly shown as glomerocryst
Diamond layer edge break comes off along interface large area.Composite sheet fail the reason of mainly due to polycrystalline diamond layer with
The difference of physical characteristic between hard alloy substrate, such as coefficient of thermal expansion, in finished product composite sheet, especially in polycrystalline diamond
Interface between layer and hard alloy substrate, remains a large amount of thermal residual strain.The presence of thermal residual strain is to composite sheet
Harmful, during composite sheet is used, under the action of external impact force is continuous, easily causes crackle and produced in marginal portion
It is raw, lead to fringe region spring sword, severe patient even causes polycrystalline diamond layer partial exfoliation.Therefore, how interface is reduced as possible
The size of the residual stress at place optimizes its distribution in interface, is to improve polycrystalline diamond layer and hard alloy in composite sheet
The effective measures of bond strength between matrix.
At present, for the method that bond strength this problem generally uses for addition stress transfer layer to realize residual stress
Effective transition between hard alloy substrate and polycrystalline diamond layer.Such as in a disclosed patent of invention, in glomerocryst gold
One layer of stress transfer layer containing tungsten carbide is additionally arranged between hard rock layer and hard alloy substrate, to realize alleviation polycrystalline diamond
The harm of residual stress between layer and carbide matrix body interface, improves the knot between hard alloy substrate and polycrystalline diamond layer
With joint efforts.But it has been investigated that, although the stress transfer layer can be in the residual stress danger between a degree of alleviation interface
Evil, but is the doping by using tungsten carbide to diamond in stress transfer layer so that residual stress stress transfer layer with
Span scope between polycrystalline diamond layer is still larger, and the residual stress between interface endangers eradicating efficacy and still pays no attention to
Think.
Utility model content
The purpose of the utility model is to overcome the above-mentioned deficiency of the prior art, provide a kind of composite polycrystal-diamond and
Preparation method, it is remaining between hard alloy substrate and polycrystalline diamond bed boundary to solve existing composite polycrystal-diamond
Stress endangers the technical issues of eradicating efficacy is still undesirable.
In order to realize above-mentioned purpose of utility model, it is compound to provide a kind of polycrystalline diamond for the one side of the utility model
Piece.The composite polycrystal-diamond includes hard alloy substrate layer and polycrystalline diamond layer, further includes stress transfer layer, and institute
It states hard alloy substrate layer, the stress transfer layer and the polycrystalline diamond layer and stacks gradually combination.
The another aspect of the utility model provides a kind of preparation method of composite polycrystal-diamond, including walking as follows
Suddenly：
Diamond powder layer, stress transfer layer and hard alloy substrate layer are sequentially laminated successively, form polycrystalline diamond
The presoma of composite sheet；
By residing for the presoma environment carry out vacuumize process, after be sintered according to polycrystalline diamond formation condition
Processing.
Compared with prior art, above-mentioned composite polycrystal-diamond passes through in polycrystalline diamond layer and hard alloy substrate layer
Stress transfer layer is additionally arranged, so as to effectively by the residual stress point at polycrystalline diamond layer and hard alloy substrate bed boundary
Hard alloy substrate layer is dissipated to, considerably reduces influence of the interface residual stress to polycrystalline diamond layer；On the other hand, stress
Transport layer enhances the bond strength of polycrystalline diamond layer and hard alloy substrate layer.
Above-mentioned composite polycrystal-diamond preparation method will be by diamond powder layer, stress transfer layer and carbide matrix
Integrally sintering is formed body layer, therefore so that stress transfer layer can be effectively connected with reference to polycrystalline diamond layer and carbide matrix
Body layer, can will be at polycrystalline diamond layer and hard alloy substrate bed boundary so as to give full play to the effect of stress transfer layer
Residual stress be dispersed to hard alloy substrate layer, considerably reduce influence of the interface residual stress to polycrystalline diamond layer；
The bond strength of polycrystalline diamond layer and hard alloy substrate layer is enhanced simultaneously.In addition, preparation method process conditions are easily-controllable,
The composite polycrystal-diamond performance of preparation is stablized.
Description of the drawings
Fig. 1 is a kind of structure diagram of the utility model embodiment composite polycrystal-diamond；
Fig. 2 is another structure diagram of the utility model embodiment composite polycrystal-diamond.
Specific embodiment
In order to which the technical problems to be solved in the utility model, technical solution and advantageous effect is more clearly understood, below
In conjunction with the embodiments with attached drawing, the present invention is further described in detail.It should be appreciated that specific implementation described herein
Example is only used to explain the utility model, is not used to limit the utility model.
On the one hand, the utility model embodiment provides a kind of composite polycrystal-diamond.The polycrystalline diamond is compound
The structure of piece is as shown in Figure 1, it includes hard alloy substrate layer 1, stress transfer layer 2 and polycrystalline diamond layer 3.Along hard alloy
The direction that 1 center of base layer extends to surface, sequence is laminated and combines stress biography successively on a surface of hard alloy substrate layer 1
Defeated layer 2 and hard alloy substrate layer 1.
Wherein, the hard alloy substrate layer 1 contained by above-mentioned composite polycrystal-diamond can select conventional glomerocryst gold
Hard alloy substrate contained by hard rock composite sheet.In one embodiment, the material of the hard alloy substrate layer 1 for tungsten carbide particle with
The mixture of cobalt powder, in specific embodiment, mass percent of the cobalt powder in hard alloy substrate layer 1 is 15%-30%.
The stacking of stress transfer layer 2 contained by above-mentioned composite polycrystal-diamond is incorporated in hard alloy substrate layer 1 and glomerocryst
Between diamond layer 3, stress transfer peptizaiton is played, it can be effectively by 3 boundary of hard alloy substrate layer 1 and polycrystalline diamond layer
Residual stress is transferred in hard alloy substrate layer 1 at face, and residual stress is avoided to injure, and improves above-mentioned composite polycrystal-diamond
Structural stability.Meanwhile stress transfer layer 2 plays the role of enhancing connection, enhances polycrystalline diamond layer 3 and hard alloy
The bond strength of base layer 1.In one embodiment, above-mentioned stress transfer layer 2 is tungsten layer, and in a particular embodiment, which is more
Hole tungsten metal layer.In another embodiment, the thickness of the stress transfer layer 2 such as tungsten layer is 5-15 μm.Pass through layer 2 excessive to stress
Material and thickness control and optimization, the effect of the stress transfer layer 2 dispersion residual stress can be improved, reduce residual stress wound
Evil.In addition, stress transfer layer 2 is arranged to porous tungsten layer, the residual stress in addition to can effectively disperse interface, moreover it is possible to be cobalt
Metal migrates into the excessive layer 2 of stress from hard alloy substrate layer 1 and provides migrating channels, so as to improve cobalt in stress transfer layer 2
The content of metal, to improve the bond strength between the excessive connection hard alloy substrate of layer 2 layer 1 of stress and polycrystalline diamond layer 3.
Polycrystalline diamond layer 3 contained by above-mentioned composite polycrystal-diamond can be conventional polycrystalline diamond layer structure.
In one embodiment, above-mentioned polycrystalline diamond layer 3 includes the first polycrystalline diamond layer 31 and the second glomerocryst Buddha's warrior attendant combined is laminated
Rock layers 32, as shown in Figure 2.Wherein, the second polycrystalline diamond layer 32 has two opposite surfaces, wherein a surface is poly- with first
Diamond layer 31, another surface is convex surface 320, at this point, second polycrystalline diamond layer 32 is exactly a convex body, and the stress
The stacking of transport layer 2 is incorporated on the convex surface 320 of second polycrystalline diamond layer 32, that is to say the stress transfer layer 2 in accordance with convex
The shape in face 320 and be bonded, therefore, 2 outer surface of stress transfer layer also shows the shape on convex surface 320 at this time.So hard closes
The surface combined is laminated as concave surface 10 with institute's stress transfer layer 2 in golden base layer 1, and the concave surface 10 matches with the convex surface 320,
Both concave surface 10 and convex surface 320 are seamless, and stacking is combined as a whole.Second polycrystalline diamond layer 32 contains 320 protrusion extension of convex surface
To hard alloy substrate layer 1, in this way, the residual stress between 1 interface of polycrystalline diamond layer 3 and hard alloy substrate layer can
It is more effectively acted synergistically by protrusion and stress transfer layer 2, the effect of dispersion residual stress is capable of providing, by hard alloy substrate
The residual stress of layer 1 and 3 interface of polycrystalline diamond layer is more effectively dispersed in hard alloy substrate layer 1, moreover, this has
The protrusion on the convex surface 320 increases the contact area between hard alloy substrate layer 1, so as to improve above-mentioned polycrystalline diamond layer
Bond strength between 3 and hard alloy substrate layer 1 improves the structural stability of above-mentioned composite polycrystal-diamond.
In one embodiment, above-mentioned second polycrystalline diamond layer 32 is conical convex surface containing convex surface 320, then at this point,
The protrusion with the convex surface 320 is stated as cone, that is to say that the stress transfer layer 2 is pasted in accordance with the shape on conical convex surface 320
It closes, therefore, 2 outer surface of stress transfer layer also shows the shape on conical convex surface 320 at this time.So hard alloy substrate layer 1
It is conical concave surface 10 that the surface combined is laminated with institute stress transfer layer 2, and the conical concave surface 10 and the conical surface
320 match, and both conical concave surface 10 and conical convex surface 320 are seamless, and stacking is combined as a whole.It is described in further embodiment
The base diameter on conical convex surface 320 is (10-20) with height ratio:(3-7).In this way, by the way that concave surface 10 is arranged to circular cone
Shape concave surface 10, and pass through the size of the conical concave surface 10 of optimization, it improves and eliminates polycrystalline diamond layer 3 and hard alloy substrate layer 1
The residual stress of interface is effectively effectively dispersed in hard alloy substrate layer 1, and carries by the effect of the residual stress of interface
Bond strength between high polycrystalline diamond layer 3 and hard alloy substrate layer 1, further improves above-mentioned composite polycrystal-diamond
Structural stability.
On the basis of the various embodiments described above, in an embodiment, doped with silicon in above-mentioned second polycrystalline diamond layer 32.
I other words the material of the second polycrystalline diamond layer 32 includes the mixture of diamond and silicon.By in the second polycrystalline diamond
Doped silicon in layer 32, effectively improve the second polycrystalline diamond layer 32 heat resisting temperature and the first polycrystalline diamond layer 31 of connection with firmly
1 grade layers structure bonding strength of matter alloy substrate layer, while the content of the cobalt metal of the second polycrystalline diamond layer 32 is reduced, such as can
Reduction is entered by stress transfer layer 2 in the second polycrystalline diamond layer 32 by the cobalt metal in hard alloy substrate layer 1, so as to
The stability of the second polycrystalline diamond layer 32 is improved, that is to say the stability for improving above-mentioned polycrystalline diamond layer 3.One embodiment
In, the silicon adulterated in above-mentioned second polycrystalline diamond layer 32 accounts for the 10%-20% of 32 gross mass of the second polycrystalline diamond layer.Pass through
Optimize the amount of silicon doping, layer effect and heat resistance is connected as described above in the second polycrystalline diamond layer 32 of optimization, improves above-mentioned glomerocryst gold
The structural stability of hard rock composite sheet.
The first polycrystalline diamond layer 31 in the various embodiments described above can be poly- contained by conventional polycrystalline diamond compact
Diamond layer, such as in one embodiment, the thickness of first polycrystalline diamond layer 21 is 1.5-3mm.
Therefore, the composite polycrystal-diamond in the various embodiments described above passes through in polycrystalline diamond layer 3 and carbide matrix
Body layer 1 is additionally arranged stress transfer layer 2, so as to effectively by the residual of polycrystalline diamond layer 3 and 1 interface of hard alloy substrate layer
Residue stress is dispersed to hard alloy substrate layer 1, considerably reduces influence of the interface residual stress to polycrystalline diamond layer 3.Together
When pass through the setting to 32 structure of the second polycrystalline diamond layer contained by polycrystalline diamond layer 3, improve reduce polycrystalline diamond layer 3
With 1 interface residual stress effect of hard alloy substrate layer, the knot of polycrystalline diamond layer 3 and hard alloy substrate layer 1 is enhanced
Close intensity.
Correspondingly, the utility model embodiment additionally provides a kind of preparation about composite polycrystal-diamond described above
Method.Referring to composite polycrystal-diamond structure chart 1,2, which includes the following steps：
S01. diamond powder layer, stress transfer layer 2 and hard alloy substrate layer 1 successively sequence are laminated, form glomerocryst
The presoma of diamond compact；
S02. by residing for the presoma environment carry out vacuumize process, after according to polycrystalline diamond formation condition carry out
Sintering processes.
Wherein, in above-mentioned steps S01, polycrystalline diamond of the diamond powder layer contained by composite polycrystal-diamond above
The precursor layer structure of layer 3 forms polycrystalline diamond layer 3 after sintering.The diamond powder layer is laid with diamond powder
It forms, wherein, the grain size of diamond powder is 5-30 μm, and the thickness being laid with can be the thickness of polycrystalline diamond layer routine.
One embodiment, diamond powder layer include the layer structure of two-layer laminate：First diamond powder layer and and with it is described
Second diadust layer of the first diamond powder layer stackup.Wherein, the second diadust layer is by bortz powder
Body is molded the idiosome to be formed, and the idiosome has two opposite surfaces, and a surface and the first diamond powder are layer by layer
Folded, another surface is convex surface, and the stress transfer layer 2 is layered on the convex surface, and the hard alloy substrate layer 1 is answered with described
It is concave surface 10 that the surface combined, which is laminated, in power transport layer 2, and the concave surface 10 matches with the convex surface.
It, should when the second diadust layer the second polycrystalline diamond layer 32 for example above contains silicon in further embodiment
The second diadust layer is to be molded the idiosome formed by the mixture of diamond powder and silicon.One embodiment, the silica flour
The grain size of body is 5-10 μm
Further, above-mentioned second diadust layer can be formed by molding together with stress transfer layer 2, specifically
Be that stress transfer layer 2 is laid on mold bottom, then to 2 surface of stress transfer layer fill the second diadust layer material
It such as diamond powder or the mixture of diamond and silicon, is then molded, the green body of formation so that stress transfer layer 2 is laminated
On the convex surface of the second diadust layer.
In one embodiment, the convex surface of above-mentioned second diadust layer is conical convex surface, that is to say above-mentioned second Buddha's warrior attendant
Stone micro mist layer is cone idiosome.In one embodiment, after the size of cone green body should preferably ensure processing to be sintered, ruler
Very little is the base diameter of cone and cone height ratio is (10-20)：(3-7).At this point, stress transfer layer 2 is layered in circle
On the circular cone convex surface of cone idiosome.
Above-mentioned molding formed the second diadust layer pressure can with but not only control as 15MPa, which is provided
Pressure can be hydraulic press provide.
In addition, the grain size for being used to form the diamond powder of above-mentioned second diadust layer can be 5-65 μm.For
The grain size for forming the diamond powder of above-mentioned first diadust layer can be 5-30 μm, and the thickness being laid with, which should be ensured that, to be treated
The thickness of the first polycrystalline diamond layer 31 formed after sintering processes is advisable in 1.5-3mm.
In one embodiment, the stress transfer layer 2 in step S01 is tungsten foil.In a further embodiment, which is more
Hole tungsten foil.After the thickness of the tungsten foil should be guaranteed that sintering, stress transfer layer 2 is tungsten foil specifically if POROUS TUNGSTEN foil thickness is 5-15
μm。
Hard alloy substrate layer 1 can be conventional hard alloy substrate in step S01.When above-mentioned diamond powder layer
During including having the second diadust layer on convex surface as described above, which is laminated with stress transfer layer 2
Surface is concave surface, and the concave surface matches with the convex surface, forms seamless stacking.Specifically, when above-mentioned second diadust
Layer is the surface that the hard alloy substrate layer 1 is combined with above-mentioned second diadust layer stackup when being molded the cone formed
For conical concave surface, and the concave surface matches with the conical convex surface, forms seamless stacking.
Certainly, above-mentioned hard alloy substrate layer 1 can also be the raw material of hard alloy substrate on 2 surface of stress transfer layer
It is laid with and is formed.After sintering processes, hard alloy substrate layer 1 is formed.As in one embodiment, by tungsten carbide particle and cobalt powder
Mixture powder is directly laid with the precursor layer of hard alloy substrate layer 1 on 2 surface of stress transfer layer.Wherein, cobalt powder is controlled
Mass percent is 15-30%, and tungsten carbide particle size is 1-15 μm, and cobalt granule size is 5-10 μm.
The presoma of composite polycrystal-diamond can be carried out, and according to glomerocryst in metal molybdenum cup in step S01
The structural order of diamond compact is laid with the precursor layer of each layer successively.Furthermore it is also possible to the diamond in metal molybdenum cup
A cobalt foil can also be laminated in micro mist layer or the first bortz powder external surface, during the sintering processes in following step S02,
The cobalt content in polycrystalline diamond layer 3 is adjusted in realization.
In above-mentioned steps S02, presoma is subjected to the air that vacuumize process can be effectively in removing system, to avoid sky
Gas adversely affects the generation of each layer structure during being sintered to presoma, ensure each layer structure generation and
The composite polycrystal-diamond performance of preparation is stablized.In one embodiment, the vacuumize process is will be residing for the presoma
Environment temperature be increased to carry out vacuum processing at 500-700 DEG C.The time of vacuumize process should be sufficient, as 2-10 is small
When, fully to remove the air in environment.It should be understood of course that in the process for carrying out vacuumize process, by step S01
The presoma of preparation must be among the environment being evacuated, convenient for follow-up sintering processing.
During sintering processes after vacuumize process, the diamond powder layer in above-mentioned steps S01 is sintered to be formed
Polycrystalline diamond layer 3 described in text.When diamond powder layer is is the first diamond powder layer as described in above-mentioned steps S01
During with the second diadust layer with the first diamond powder layer stackup, the diamond powder layer be sintered to be formed it is above-mentioned
The first polycrystalline diamond layer 31 and the second polycrystalline diamond layer 32 combined is laminated.When hard alloy substrate layer 1 is as hard above
When matter alloy substrate mixture is laid with the precursor layer of hard alloy substrate layer 1, sintering forms hard alloy substrate layer 1.In addition,
After sintering processes, each layer structure includes the sintering of stress transfer layer 2 and is linked to be integrally.In one embodiment, the sintering processes
Temperature is 1500-1700 DEG C, sintering time 10-15min, pressure 5-7Gpa.In a particular embodiment, before sintering,
It is that the metal molybdenum cup of internal installing presoma is placed in pyrophyllite block to be sintered.
In addition, after sintering processes, pressure loading is removed, cools to room temperature with the furnace.It is compound to take out sinter polycrystalline diamond
After piece crude product, further include to the progress sanding and polishing processing of composite polycrystal-diamond crude product.Specifically such as in Buddha's warrior attendant
Composite polycrystal-diamond crude product is polished polishing on stone polishing machine.
Therefore, above-mentioned composite polycrystal-diamond preparation method will be by diamond powder layer, stress transfer layer 2 and hard
The 1 one sintering of alloy substrate layer is formed so that stress transfer layer 2 can be connected effectively to be closed with reference to polycrystalline diamond layer 3 and hard
Golden base layer 1, can be by polycrystalline diamond layer 3 and hard alloy substrate layer so as to give full play to the effect of stress transfer layer 2
The residual stress of 1 interface is dispersed in hard alloy substrate layer 1.When diamond powder layer is the first diamond powder and second
During diadust layer, since the main component of composite diamond powder layer is identical with diamond powder layer, so that sintering
Bond strength is high between the two, and can also be with stress for the first polycrystalline diamond layer 31 and the second polycrystalline diamond layer 32 formed
Transport layer 2 acts synergistically, and the residual stress of interface is dispersed to hard alloy substrate layer 1, so as to reduce remnants between interface
The harm of stress.In addition, preparation method process conditions are easily-controllable, the composite polycrystal-diamond performance of preparation is stablized.
In conjunction with specific example, to structure of the utility model embodiment composite polycrystal-diamond and preparation method thereof into
Row is further described.Hereinafter "/" is represented to be laminated and be combined.
Embodiment 1
The utility model provides a kind of composite polycrystal-diamond, and structure is as shown in Figure 1, including stacking gradually combination
1/ stress transfer layer of hard alloy substrate layer, 2/ polycrystalline diamond layer 3.Wherein, stress transfer layer 2 be POROUS TUNGSTEN foil, thickness 10
μm。
Preparation method is as follows：
(1) it is sequentially placed into cobalt foil in special stainless steel grinding tool, granule size is 5-30 μm of diadust stratum granulosum,
POROUS TUNGSTEN foil and hard alloy substrate form composite polycrystal-diamond presoma；
(2) composite polycrystal-diamond presoma is put into molybdenum cup, vacuum processing 2 hours at 500 DEG C, finally
The above-mentioned metal cup assembly after vacuum processing is placed in pyrophyllite block, high-tension apparatus is put into and is sintered, sintering temperature
It it is 1500 DEG C, sintering time 10min removes pressure loading, cools to room temperature with the furnace；
(3) sanding and polishing is carried out on diamond polisher.
Embodiment 2
The utility model provides a kind of composite polycrystal-diamond, and structure is as shown in Fig. 2, including stacking gradually combination
1/ stress transfer layer of hard alloy substrate layer, 2/ second polycrystalline diamond layer, 32/ first polycrystalline diamond layer 31.Wherein, stress passes
Defeated layer 2 is POROUS TUNGSTEN foil, and thickness is 10 μm, and the second polycrystalline diamond layer 32 is cone, cone bottom surface and the first glomerocryst gold
Hard rock layer 31 be laminated combine, stress transfer layer 2 stacking be incorporated in the conical surface of cone, and hard alloy substrate layer 1 with
It is circular cone concave surface that the surface combined, which is laminated, in stress transfer layer 2, and the concave surface is combined with seamless be laminated in the convex surface.Conical convex surface
Base diameter and height ratio be 15:5.
Preparation method is as follows：
(1) the equal of the POROUS TUNGSTEN foils of 10 μ m-thicks, diadust and silica flour is sequentially placed into special stainless steel grinding tool
Even mixed powder is forced into 15MPa with hydraulic press and is made blank, the blank shape of cold moudling be it is coniform, the cone by
It is outer to be followed successively by tungsten layers of foil, the mixed powder bed of material to interior；
(2) be sequentially placed into special stainless steel grinding tool cobalt foil, granule size for 5-30 μm of diadust stratum granulosum,
The coniform blank layer of cold moudling, tungsten carbide particle and the cobalt powder mixing bed of material in step (1) form composite polycrystal-diamond
Presoma；
(3) composite polycrystal-diamond presoma is put into molybdenum cup, vacuum processing 7 hours at 600 DEG C, finally
The above-mentioned metal cup assembly after vacuum processing is placed in pyrophyllite block, high-tension apparatus is put into and is sintered, sintering temperature
It it is 1600 DEG C, sintering time 13min removes pressure loading, cools to room temperature with the furnace；
(4) sanding and polishing is carried out on diamond polisher.
Embodiment 3
The utility model provides a kind of composite polycrystal-diamond, and structure is as shown in Fig. 2, including stacking gradually combination
1/ stress transfer layer of hard alloy substrate layer, 2/ second polycrystalline diamond layer, 32/ first polycrystalline diamond layer 31.Wherein, stress passes
Defeated layer 2 is POROUS TUNGSTEN foil, and thickness is 8 μm, and the second polycrystalline diamond layer 32 is cone, cone bottom surface and the first glomerocryst Buddha's warrior attendant
Rock layers 31, which are laminated, to be combined, and the stacking of stress transfer layer 2 is incorporated in the conical surface of cone, and hard alloy substrate layer 1 is with answering
It is circular cone concave surface that the surface combined, which is laminated, in power transport layer 2, and the concave surface is combined with seamless be laminated in the convex surface.Conical convex surface
Base diameter is 10 with height ratio:3.
Preparation method is as follows：
(1) the uniform of the POROUS TUNGSTEN foils of 8 μ m-thicks, diadust and silica flour is sequentially placed into special stainless steel grinding tool
Mixed powder is forced into 15MPa with hydraulic press and blank is made, and the blank shape of cold moudling is coniform, and the cone is by outer
Tungsten layers of foil, the mixed powder bed of material are followed successively by interior；
(2) be sequentially placed into special stainless steel grinding tool cobalt foil, granule size for 5-30 μm of diadust stratum granulosum,
The coniform blank layer of cold moudling, tungsten carbide particle and the cobalt powder mixing bed of material in step (1) form composite polycrystal-diamond
Presoma；
(3) composite polycrystal-diamond presoma is put into molybdenum cup, vacuum processing 10 hours at 700 DEG C, most
The above-mentioned metal cup assembly after vacuum processing is placed in pyrophyllite block afterwards, high-tension apparatus is put into and is sintered, sintering temperature
It is 1700 DEG C to spend, and sintering time 15min removes pressure loading, cools to room temperature with the furnace；
(4) sanding and polishing is carried out on diamond polisher.
Embodiment 4
The utility model provides a kind of composite polycrystal-diamond, and structure is as shown in Fig. 2, including stacking gradually combination
1/ stress transfer layer of hard alloy substrate layer, 2/ second polycrystalline diamond layer, 32/ first polycrystalline diamond layer 31.Wherein, stress passes
Defeated layer 2 is POROUS TUNGSTEN foil, and thickness is 15 μm, and the second polycrystalline diamond layer 32 is cone, cone bottom surface and the first glomerocryst gold
Hard rock layer 31 be laminated combine, stress transfer layer 2 stacking be incorporated in the conical surface of cone, and hard alloy substrate layer 1 with
It is circular cone concave surface that the surface combined, which is laminated, in stress transfer layer 2, and the concave surface is combined with seamless be laminated in the convex surface.Conical convex surface
Base diameter and height ratio be 20:7.
Preparation method is as follows：
(1) POROUS TUNGSTEN foil, the diadust of 8 μ m-thicks are sequentially placed into special stainless steel grinding tool, with hydraulic press plus
It is depressed into 15MPa and blank is made, the blank shape of cold moudling is coniform, which is followed successively by tungsten layers of foil, mixes from outside to inside
Close powder layer；
(2) be sequentially placed into special stainless steel grinding tool cobalt foil, granule size for 5-30 μm of diadust stratum granulosum,
The coniform blank layer of cold moudling, tungsten carbide particle and the cobalt powder mixing bed of material in step (1) form composite polycrystal-diamond
Presoma；
(3) composite polycrystal-diamond presoma is put into molybdenum cup, vacuum processing 10 hours at 700 DEG C, most
The above-mentioned metal cup assembly after vacuum processing is placed in pyrophyllite block afterwards, high-tension apparatus is put into and is sintered, sintering temperature
It is 1700 DEG C to spend, and sintering time 15min removes pressure loading, cools to room temperature with the furnace；
(4) sanding and polishing is carried out on diamond polisher.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (7)
1. a kind of composite polycrystal-diamond, including hard alloy substrate layer and polycrystalline diamond layer, it is characterised in that：It further includes
Stress transfer layer, and the hard alloy substrate layer, the stress transfer layer and the polycrystalline diamond layer stack gradually combination；
The polycrystalline diamond layer includes the first polycrystalline diamond layer and the second polycrystalline diamond layer combined being laminated, and described second is poly-
The surface opposite with the first polycrystalline diamond layer faying face of diamond layer be convex surface, the stress transfer layer stackup knot
It closes on the convex surface, the surface that the hard alloy substrate layer is combined with the stress transfer layer stackup is concave surface, and described
Concave surface matches with the convex surface.
2. composite polycrystal-diamond according to claim 1, it is characterised in that：The stress transfer layer is tungsten layer.
3. composite polycrystal-diamond according to claim 2, it is characterised in that：The tungsten layer is POROUS TUNGSTEN foil.
4. according to any composite polycrystal-diamonds of claim 1-3, it is characterised in that：The thickness of the stress transfer layer
Spend is 5-15 μm.
5. composite polycrystal-diamond according to claim 1, it is characterised in that：The convex surface is conical convex surface.
6. composite polycrystal-diamond according to claim 5, it is characterised in that：The base diameter on the cone convex surface
It is (10-20) with height ratio:(3-7).
7. according to any composite polycrystal-diamond in claim 1-3,5,6, it is characterised in that：The first glomerocryst gold
The thickness of hard rock layer is 1.5-3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721043377.0U CN207547632U (en) | 2017-08-18 | 2017-08-18 | Composite polycrystal-diamond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721043377.0U CN207547632U (en) | 2017-08-18 | 2017-08-18 | Composite polycrystal-diamond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207547632U true CN207547632U (en) | 2018-06-29 |
Family
ID=62675771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721043377.0U Active CN207547632U (en) | 2017-08-18 | 2017-08-18 | Composite polycrystal-diamond |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207547632U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109396448A (en) * | 2017-08-18 | 2019-03-01 | 深圳先进技术研究院 | Composite polycrystal-diamond and preparation method thereof |
-
2017
- 2017-08-18 CN CN201721043377.0U patent/CN207547632U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109396448A (en) * | 2017-08-18 | 2019-03-01 | 深圳先进技术研究院 | Composite polycrystal-diamond and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2426532A1 (en) | A method of making a composite abrasive compact | |
| CN109093122B (en) | Cutting type diamond cutter and preparation method thereof | |
| JP2005516139A (en) | Abrasive layered green compact | |
| CA2647414A1 (en) | A sofc stack having a high temperature bonded ceramic interconnect and method for making same | |
| KR20030052618A (en) | Method for joining cemented carbide to base metal | |
| GB2498034A (en) | A tip for a pick tool | |
| US4824442A (en) | Method of manufacturing composite thermostable abrasive products | |
| CN110465669B (en) | Gradient composite cubic boron nitride material and preparation process and application thereof | |
| CN207547632U (en) | Composite polycrystal-diamond | |
| CN100365148C (en) | Composite material | |
| EP0037956B1 (en) | A rotary anode for an x-ray tube and a method for manufacturing the same | |
| CN206884330U (en) | Composite polycrystal-diamond | |
| CN113976892A (en) | Manufacturing method of low-residual-stress polycrystalline diamond compact | |
| JP5152667B2 (en) | Cubic boron nitride sintered tool | |
| CN109396448A (en) | Composite polycrystal-diamond and preparation method thereof | |
| CN106392084A (en) | Polycrystalline diamond composite piece and preparation method thereof | |
| CN112647852B (en) | Hard alloy matrix material for polycrystalline diamond compact and application thereof | |
| JP6564686B2 (en) | Vitrified bond superabrasive wheel and wafer manufacturing method using the same | |
| CN101846333B (en) | Silicon carbonitride igniter and manufacturing method thereof | |
| US20160347668A1 (en) | Polycrystalline diamond compact | |
| JPH03264263A (en) | Porous metal bond grinding wheel and manufacture thereof | |
| US20160221152A1 (en) | Cemented tungsten carbide bodies having a cobalt-boron alloy matrix | |
| CN110317047A (en) | A kind of temperature gradient selfreparing multi-layered ceramic cutter | |
| KR102331710B1 (en) | Functionally graded composites for joining different kind materials and method for manufacturing the same | |
| JP4843759B2 (en) | Superabrasive cutter substrate, manufacturing method thereof, and superabrasive cutter using the substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |