CN207543219U - Chip assembly and the die assembly, camera and electronic equipment for manufacturing it - Google Patents
Chip assembly and the die assembly, camera and electronic equipment for manufacturing it Download PDFInfo
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- CN207543219U CN207543219U CN201721809499.6U CN201721809499U CN207543219U CN 207543219 U CN207543219 U CN 207543219U CN 201721809499 U CN201721809499 U CN 201721809499U CN 207543219 U CN207543219 U CN 207543219U
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- chip
- conductor wire
- circuit board
- camera
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004020 conductor Substances 0.000 claims abstract description 127
- 238000001746 injection moulding Methods 0.000 claims description 13
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 241000218202 Coptis Species 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 13
- 238000012545 processing Methods 0.000 abstract description 12
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000001413 cellular effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 244000247747 Coptis groenlandica Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a kind of chip assembly and the die assemblies, camera and electronic equipment that manufacture it.Chip assembly includes circuit board, chip and conductor wire.Chip is set on circuit board, and chip is stacked with circuit board.One end of conductor wire and circuit board electrical connection, the other end of conductor wire are electrically connected with chip, and the segment section of conductor wire is bonded with the side wall surface of chip.The chip assembly of camera according to the present utility model, by being sticked a part for conductor wire in the side wall surface of chip, convenient for the fixation of conductor wire, the mounting stability of conductor wire can also be improved, the situation of conductive thread breakage caused by can also avoiding a variety of causes such as stress, processing procedure management and control, failtests after baking, the length of conductor wire can also be shortened, conductor wire is avoided to form arc to increase the situation of the thickness of chip assembly, so as to reduce the design size of chip assembly, convenient for the Miniaturization Design of camera.
Description
Technical field
The utility model is related to technical field of electronic equipment, specifically, more particularly to a kind of chip assembly and manufacturing it
Die assembly, camera and electronic equipment.
Background technology
With the development of electronic equipment the relevant technologies, electronic equipment is gradually to miniaturization.Camera is set as electronics
An important part in standby, the design size of camera are to reduce the key technology point of electronic equipment thickness.In addition, due to outer
Power acts on, and the connecting wire of camera chips and circuit board is easy to be broken.In the relevant technologies, usually in camera 10 '
A conductor wire 130 ' is directly drawn between chip 120 ' and circuit board 110 ' to realize connection, as shown in Figure 5.This connection mode
Would generally have a case that conductor wire 130 ' caused by a variety of causes such as stress, processing procedure management and control, failtests is broken after toasting.
And since conductor wire 130 ' has certain radian, it can also increase the thickness of electronic equipment 1 '.
Utility model content
The utility model is intended at least solve one of technical problem in the prior art.For this purpose, the utility model carries
Go out a kind of chip assembly of camera, the chip assembly of the camera has the advantages that stable structure, size are small.
The utility model also proposes a kind of camera, and the camera includes the chip assembly of camera as described above.
The utility model also proposes a kind of electronic equipment, and the electronic equipment includes camera as described above.
The utility model also proposes a kind of die assembly for being used to manufacture chip assembly, described to be used to manufacture chip assembly
Die assembly has the advantages that simple in structure, easy to operation.
According to the chip assembly of the camera of the utility model embodiment, including：Circuit board；Chip, the chip are set on
The circuit board, the chip are stacked with the circuit board；And conductor wire, one end of the conductor wire and the circuit board
Electrical connection, the other end of the conductor wire are electrically connected with the chip, the side wall of the segment section of the conductor wire and the chip
Face paste is closed.
According to the chip assembly of the camera of the utility model embodiment, by being sticked a part for conductor wire in chip
Side wall surface on, convenient for the fixation of conductor wire, the mounting stability of conductor wire can also be improved, can also avoid after baking should
The situation of conductive thread breakage caused by a variety of causes such as power, processing procedure management and control, failtests can also shorten the length of conductor wire
Degree avoids conductor wire from forming arc to increase the situation of the thickness of chip assembly, so as to reduce the design ruler of chip assembly
It is very little, convenient for the Miniaturization Design of camera.
According to the camera of the utility model embodiment, including：Chip assembly, the chip assembly is takes the photograph as described above
As the chip assembly of head.
According to the camera of the utility model embodiment, by being sticked a part for conductor wire in the side wall surface of chip
On, convenient for the fixation of conductor wire, the mounting stability of conductor wire can also be improved, stress, processing procedure after baking can also be avoided
The situation of conductive thread breakage, can also shorten the length of conductor wire, avoid leading caused by a variety of causes such as management and control, failtests
Wire-shaped camber is to increase the situation of the thickness of chip assembly, so as to reduce the design size of chip assembly, convenient for taking the photograph
As the Miniaturization Design of head.
According to the electronic equipment of the utility model embodiment, including：Camera, the camera are camera shooting as described above
Head.
According to the electronic equipment of the utility model embodiment, by being sticked a part for conductor wire in the side wall surface of chip
On, convenient for the fixation of conductor wire, the mounting stability of conductor wire can also be improved, stress, processing procedure after baking can also be avoided
The situation of conductive thread breakage, can also shorten the length of conductor wire, avoid leading caused by a variety of causes such as management and control, failtests
Wire-shaped camber is to increase the situation of the thickness of chip assembly, so as to reduce the design size of chip assembly, convenient for taking the photograph
As the Miniaturization Design of head.
According to the utility model embodiment for manufacturing the die assembly of chip assembly, the chip assembly includes core
Piece, circuit board and conductor wire, one end of the conductor wire are connect with the circuit board, and the other end is connect with the chip, described
Die assembly has injection molding cavity and injecting hole, and the injecting hole is connected with the injection molding cavity, the chip and the circuit board position
The conductor wire, the part of the conductor wire and the side of the chip are formed in being molded in the injection molding cavity, in the injecting hole
Wall surface is bonded.
According to the utility model embodiment for manufacturing the die assembly of chip assembly, by by the part of conductor wire
It is sticked in the side wall surface of chip, convenient for the fixation of conductor wire, the mounting stability of conductor wire can also be improved, can also be avoided
The situation of conductive thread breakage caused by a variety of causes such as stress, processing procedure management and control, failtests after baking, can also shorten and lead
The length of electric wire avoids conductor wire from forming arc to increase the situation of the thickness of chip assembly, so as to reduce chip assembly
Design size, convenient for the Miniaturization Design of camera.
The additional aspect and advantage of the utility model will be set forth in part in the description, partly will be from following description
In become apparent or recognized by the practice of the utility model.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the utility model will in the description from combination accompanying drawings below to embodiment
Become apparent and be readily appreciated that, wherein：
Fig. 1 is the structure diagram according to the chip assembly of the camera of the utility model embodiment；
Fig. 2 is the structure diagram according to the chip assembly of the camera of the utility model embodiment；
Fig. 3 is the structure diagram for being used to manufacture the die assembly of chip assembly according to the utility model embodiment；
Fig. 4 is the structure diagram according to the electronic equipment of the utility model embodiment；
Fig. 5 is the partial structural diagram of electronic equipment in the relevant technologies.
Reference numeral：
Electronic equipment 1,
Camera 10,
Chip assembly 100, circuit board 110, the first pad 111, chip 120, the second pad 121,
Conductor wire 130, first segment 131, second segment 132, third section 133,
Die assembly 200, injection molding cavity 210, injecting hole 220,
Housing 50, flash lamp 60,
Electronic equipment 1 ', camera 10 ', circuit board 110 ', chip 120 ', conductor wire 130 '.
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and it is not intended that the utility model
Limitation.
In the description of the present invention, it is to be appreciated that term " " center ", " thickness ", " on ", " under ", " left side ",
The orientation or position relationship of the instructions such as " right side ", " interior ", " outer " are based on orientation shown in the drawings or position relationship, merely to just
In description the utility model and simplified description rather than instruction or imply that signified device or element must be with specific sides
Position, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.In addition, define " first ",
One or more this feature can be expressed or be implicitly included to the feature of " second ".In the description of the present invention,
Unless otherwise indicated, " multiple " are meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally
Connection；Can be mechanical connection or electrical connection；It can be directly connected, can also be indirectly connected by intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, can above-mentioned art be understood with concrete condition
Concrete meaning of the language in the utility model.
As Figure 1-Figure 2, according to the chip assembly 100 of the camera of the utility model embodiment 10, including circuit board
110th, chip 120 and conductor wire 130.
Specifically, as Figure 1-Figure 2, chip 120 is set on circuit board 110, and chip 120 is stacked with circuit board 110.
One end of conductor wire 130 is electrically connected with circuit board 110, and the other end of conductor wire 130 is electrically connected with chip 120, conductor wire 130
Segment section is bonded with the side wall surface of chip 120.It is understood that chip 120 at least partially overlaps with circuit board 110, core
Piece 120 can be located at the top of circuit board 110, and circuit board 110 can support chip 120.The both ends of conductor wire 130 can be distinguished
It is electrically connected with chip 120, circuit board 110, so as to realize the indirect electrical connection of chip 120 and circuit board 110.Conductor wire
130 a part of can be sticked in the side wall surface of chip 120.
According to the chip assembly 100 of the camera 10 of the utility model embodiment, by the way that a part for conductor wire 130 is pasted
It is located in the side wall surface of chip 120, the installation that in order to the fixation of conductor wire 130, can also improve conductor wire 130 is stablized
Property, so as to avoid after baking conductor wire 130 caused by a variety of causes such as stress, processing procedure management and control, failtests be broken
Situation.Furthermore it is also possible to shorten the length of conductor wire 130, conductor wire 130 is avoided to form arc to increase chip assembly 100
Thickness situation, so as to reduce the design size of chip assembly 100, convenient for the Miniaturization Design of camera 10.
Some embodiments according to the present utility model, the side wall surface of chip 120 can have a groove, and conductor wire 130 can be with
In embedded groove.It is understood that the side wall surface of chip 120 can be equipped with groove, groove can be in the thickness side of chip 120
Chip 120 is extended upward through, conductor wire 130 can be placed in groove.Thus, it is possible to which conductor wire 130 is located in groove, avoid
Conductor wire 130 due to external force effect deviate, and then conductor wire 130 is caused to be broken, conductor wire 130 is electrically connected with chip 120
It disconnects or the situation for being electrically connected disconnection of conductor wire 130 and circuit board 110.Groove can avoid leading with stop portions external force
Electric wire 130 is broken under the effect of external force, so as to protect conductor wire 130.
For example, as shown in Fig. 2, the first pad 111 can be equipped on circuit board 110, second can be equipped on chip 120
Pad 121, the second pad 121 can be located on chip 120 close to one end of the first pad 111, the first pad 111
It can be located on circuit board 110 close to one end of the second pad 121.Close to the side of the second pad 121 on chip 120
Groove can be equipped in side wall surface, groove can be formed as semi-cylindrical groove, the axis direction of semicolumn and the thickness of chip 120
Direction is consistent, and the part of 130 interlude of conductor wire can be placed in groove.
Some embodiments according to the present utility model, conductor wire 130 can be moulding, and conductor wire 130 is formed in core
The side wall surface of piece 120.In other words, conductor wire 130 can be molded in the side wall surface for being formed in chip 120.Conductor wire as a result,
130 can form an entirety, and the position of conductor wire 130 is fixed with chip 120, and the installation of conductor wire 130 is more firm,
And it will not deform upon under the effect of external force.For example, the conducting medium of liquid can be moulded in the side wall surface of chip 120
Upper formation conductor wire 130.
Some embodiments according to the present utility model, conductor wire 130 can be printed circuit.It is understood that can be with
By the printing means of conductor wire 130 or photosensitive technique in the side wall surface of chip 120, so as to rapid by autoplotter
Ground is directly depicted in conductor wire 130 on collotype and makes a plate, and then prints.Printed circuit can make chip assembly 100
Batch production becomes simple and practicable, can cause 130 performance of conductor wire of printing out consistent, stable quality and compact-sized.
Printed circuit can be omitted welding procedure, and so as to improve the production efficiency of chip assembly 100, and printed circuit can also reach
To high-precision, greatly improve the production efficiency, stability and profit margin of circuit board 110.
Some embodiments according to the present utility model, conductor wire 130 can be gold thread.It is understood that conductor wire 130
Gold may be used to be made.Gold utensil has good ductility, golden stability, and the resistivity of gold is small, good conductivity, is not easy
In fever.
As shown in Figure 1, some embodiments according to the present utility model, conductor wire 130 can include first segment 131 and second
Section 132, wherein, first segment 131 is bonded with the upper surface of circuit board 110, and the lower end of second segment 132 is connect with first segment 131, the
It is bonded with the side wall surface of chip 120 for two section 132.It is understood that conductor wire 130 can include first segment 131 and second segment
132, one end of first segment 131 is electrically connected with circuit board 110, and one end of the other end and second segment 132 of first segment 131 is electrically connected
It connects, first segment 131 can be sticked in circuit board 110 on the surface of the side of chip 120, and second segment 132 can be sticked
In the side wall surface of chip 120.Thus, it is possible to improve the mounting stability of conductor wire 130.
Further, as shown in Figure 1, conductor wire 130 can also include third section 133, third section 133 and second segment 132
Upper end connection, third section 133 is bonded with the upper surface of chip 120.Conductor wire 130 can against chip 120 and circuit as a result,
The surface placement of plate 110 so as to which conductor wire 130 is avoided to be in hanging state, and then can reduce conductor wire 130 and be broken
Probability, the mounting stability of conductor wire 130 can be improved.
For example, as Figure 1-Figure 2, chip 120 can be placed in the upper surface (as shown in Figure 1 is upper) of circuit board 110, core
Piece 120 can be located at the middle position of circuit board 110.Conductor wire 130 can include first segment 131, second segment 132 and third
Section 133.The upper surface (as shown in Figure 1 is upper) of chip 120 can be equipped with the second pad 121, the upper surface of circuit board 110
(as shown in Figure 1 is upper) can be equipped with the first pad 111.One end of first segment 131 can be electrically connected with the first pad 111
It connects, the other end of first segment 131 is electrically connected with one end of second segment 132, and the other end of second segment 132 can be with the second pad
121 electrical connections.First segment 131 can be sticked the upper surface (as shown in Figure 1 upper) of circuit board 110, and second segment 132 can be sticked
In the side wall surface of chip 120, third section 133 can be sticked in the upper surface of chip 120 (as shown in Figure 1 is upper).
According to the camera 10 of the utility model embodiment, including chip assembly, chip assembly is camera shooting as described above
First 10 chip assembly 100.
According to the camera 10 of the utility model embodiment, by being sticked a part for conductor wire 130 in chip 120
In side wall surface, convenient for the fixation of conductor wire 130, the mounting stability of conductor wire 130 can also be improved, can also avoid toasting
The situation that conductor wire 130 caused by a variety of causes such as stress, processing procedure management and control, failtests is broken afterwards, can also shorten conduction
The length of line 130 avoids conductor wire 130 from forming arc to increase the situation of the thickness of chip assembly 100, so as to reduce core
The design size of piece component 100, convenient for the Miniaturization Design of camera 10.
According to the electronic equipment 1 of the utility model embodiment, including camera, camera is camera as described above
10.Camera 10 can be embedded on the housing 50 of electronic equipment 1.
It should be noted that include, but are not limited to be configured to via wired line as " electronic equipment " as used herein
Road connection (such as via Public Switched Telephone Network (PSTN), digital subscriber line (DSL), digital cable, Direct cable connection,
And/or another data connection/network) and/or via (for example, for cellular network, WLAN (WLAN), such as
The digital TV networks of DVB-H networks, satellite network, AM-FM broadcasting transmitter and/or another communication terminal) wirelessly connect
The device of mouth reception/transmission signal of communication.It is configured to that by the electronic equipment of radio interface communication " radio can be referred to as
Sub- equipment ", " wireless device " and/or " mobile electronic device ".The example of mobile electronic device include, but are not limited to satellite or
Cellular phone；It can be with combination cellular radio telephone and the PCS Personal Communications System of data processing, fax and communication ability
(PCS) terminal；Can include radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar with
And/or the PDA of global positioning system (GPS) receiver；And conventional laptop and/or palmtop receiver or including radio
Other electronic devices of telephone transceiver.
According to the electronic equipment 1 of the utility model embodiment, by being sticked a part for conductor wire 130 in chip 120
Side wall surface on, convenient for the fixation of conductor wire 130, the mounting stability of conductor wire 130 can also be improved, can also avoid drying
The situation that conductor wire 130 caused by a variety of causes such as stress, processing procedure management and control, failtests is broken after roasting, can also shorten and lead
The length of electric wire 130 avoids conductor wire 130 from forming arc to increase the situation of the thickness of chip assembly 100, so as to reduce
The design size of chip assembly 100, convenient for the Miniaturization Design of camera 10.
Further, multiple cameras 10 can be equipped on electronic equipment 1.Multiple cameras 10 can be electrically connected, multiple
Camera 10 can coordinate shooting, so as to improve photographic effect.Further, electronic equipment 1 can also include flash of light
Lamp 60, flash lamp 60 can be embedded on housing 50, and flash lamp 60 is close to camera 10.When camera 10 works as a result, flash of light
Lamp 60 can be subject polishing, so as to improve shooting effect.
As shown in figure 3, according to the die assembly 200 for being used to manufacture chip assembly 100 of the utility model embodiment, chip
Component 100 can include chip 120, circuit board 110 and conductor wire 130, and one end of conductor wire 130 connect with circuit board 110, leads
The other end of electric wire 130 is connect with chip 120.Die assembly 200 have injection molding cavity 210 and injecting hole 220, injecting hole 220 with
Injection molding cavity 210 connects.Chip 120 and circuit board 110 are located in injection molding cavity 210, are molded in injecting hole 220 and form conductor wire 130,
The part of conductor wire 130 is bonded with the side wall surface of chip 120.
It is understood that could be formed with injection molding cavity 210 inside die assembly 200, chip 120 and circuit board 110 can
To be located in injection molding cavity 210, injecting hole 220 can be equipped on mold, one end of injecting hole 220 is connected with injection molding cavity 210, note
The other end perforation die assembly 200 of mole 220, can inject conducting medium from injecting hole 220, so as in chip
120 and circuit board 110 on form conductor wire 130, one end of conductor wire 130 can be electrically connected with chip 120, conductor wire 130
The other end can be electrically connected with circuit board 110, and a part of of conductor wire 130 can be formed in the side wall surface of chip 120.
According to the utility model embodiment for manufacturing the die assembly 200 of chip assembly 100, by by conductor wire
130 part is sticked in the side wall surface of chip 120, convenient for the fixation of conductor wire 130, can also improve conductor wire 130
Mounting stability can also avoid conductor wire caused by a variety of causes such as stress, processing procedure management and control, failtests after baking
The situation of 130 fractures can also shorten the length of conductor wire 130, and conductor wire 130 is avoided to form arc to increase chip assembly
The situation of 100 thickness, so as to reduce the design size of chip assembly 100, convenient for the Miniaturization Design of camera 10.
Referring to Fig. 1-Fig. 3 detailed descriptions according to the chip assembly 100 of the camera 10 of the utility model embodiment.
As Figure 1-Figure 2, chip 120 can be formed as rectangular-shaped, and circuit board 110 can also be formed as rectangular-shaped.Core
The top for being arranged in circuit board 110 can be laminated in piece 120, and chip 120 can be located at the middle position of circuit board 110, circuit
Plate 110 can support chip 120.The surface area of chip 120 is less than the surface area of circuit board 110, and chip 120 is placed in circuit board
During 110 top, the edge of chip 120 can be spaced apart with the edge of circuit board 110, and the upper surface of partial circuit plate 110 is (such as
On shown in FIG. 1) it is contacted (under as shown in Figure 1) with the lower surface of chip 120.
As Figure 1-Figure 2, conductor wire 130 can include first segment 131, second segment 132 and third section 133.Chip 120
Upper surface (as shown in Figure 1 upper) the second pad 121, the upper surface of circuit board 110 can be equipped with (as shown in Figure 1 is upper)
The first pad 111 can be equipped at position that is upper, not contacted (under as shown in Figure 1) with the lower surface of chip 120.First segment
131 one end can be electrically connected with the first pad 111, and the other end of first segment 131 is electrically connected with one end of second segment 132,
The other end of second segment 132 can be electrically connected with the second pad 121.First segment 131 can be sticked the upper surface of circuit board 110
(as shown in Figure 1 is upper), second segment 132 can be sticked in the side wall surface of chip 120, and third section 133 can be sticked in chip
120 upper surface (as shown in Figure 1 is upper), the extending direction of first segment 131 can be consistent with the extending direction of third section 133,
The extending direction of second segment 132 can be vertical with the extending direction of first segment 131.
According to the chip assembly 100 of the camera 10 of the utility model embodiment, by the way that a part for conductor wire 130 is pasted
It is located in the side wall surface of chip 120, the installation that in order to the fixation of conductor wire 130, can also improve conductor wire 130 is stablized
Property, so as to avoid after baking conductor wire 130 caused by a variety of causes such as stress, processing procedure management and control, failtests be broken
Situation.Furthermore it is also possible to shorten the length of conductor wire 130, conductor wire 130 is avoided to form arc to increase chip assembly 100
Thickness situation, so as to reduce the design size of chip assembly 100, convenient for the Miniaturization Design of camera 10.At this
In the description of specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ", " example ", " specific
The description of example " or " some examples " etc. mean to combine the specific features that the embodiment or example describe, structure, material or
Feature is contained at least one embodiment or example of the utility model.In the present specification, to the schematic of above-mentioned term
Statement may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It is combined in an appropriate manner in any one or more embodiments or example.
While there has been shown and described that the embodiment of the utility model, it will be understood by those skilled in the art that：
In the case of the principle and objective for not departing from the utility model can these embodiments be carried out with a variety of variations, modification, replaced
And modification, the scope of the utility model are limited by claim and its equivalent.
Claims (10)
1. a kind of chip assembly of camera, which is characterized in that including：
Circuit board；
Chip, the chip are set on the circuit board, and the chip is stacked with the circuit board；With
Conductor wire, one end of the conductor wire and the circuit board electrical connection, the other end of the conductor wire and chip electricity
Connection, the segment section of the conductor wire are bonded with the side wall surface of the chip.
2. the chip assembly of camera according to claim 1, which is characterized in that the side wall surface of the chip has recessed
Slot, the conductor wire are embedded in the groove.
3. the chip assembly of camera according to claim 1, which is characterized in that the conductor wire is moulding and formation
In the side wall surface of the chip.
4. the chip assembly of camera according to claim 1, which is characterized in that the conductor wire is printed circuit.
5. the chip assembly of camera according to claim 1, which is characterized in that the conductor wire is gold thread.
6. the chip assembly of camera according to claim 1, which is characterized in that the conductor wire includes：
First segment, the first segment are bonded with the upper surface of the circuit board；With
Second segment, the lower end of the second segment are connect with the first segment, and the second segment is bonded with the side wall surface of the chip.
7. the chip assembly of camera according to claim 6, which is characterized in that the conductor wire further includes：
Third section, the third section are connect with the upper end of the second segment, and the third section is bonded with the upper surface of the chip.
8. a kind of camera, which is characterized in that including：
Chip assembly, chip assembly of the chip assembly for the camera according to any one of claim 1-7.
9. a kind of electronic equipment, which is characterized in that including：
Camera, the camera are according to camera according to any one of claims 8.
10. a kind of die assembly for being used to manufacture chip assembly, which is characterized in that the chip assembly includes chip, circuit board
And conductor wire, one end of the conductor wire are connect with the circuit board, the other end is connect with the chip,
The die assembly has injection molding cavity and injecting hole, and the injecting hole connects with the injection molding cavity, the chip and described
Circuit board is located in the injection molding cavity, in the injecting hole injection form the conductor wire, the part of the conductor wire with it is described
The side wall surface fitting of chip.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721809499.6U CN207543219U (en) | 2017-12-19 | 2017-12-19 | Chip assembly and the die assembly, camera and electronic equipment for manufacturing it |
| EP18891020.2A EP3712944B1 (en) | 2017-12-19 | 2018-11-19 | Chip assembly and method of manufacturing the same using a mold assembly, camera and electronic device |
| PCT/CN2018/116206 WO2019120015A1 (en) | 2017-12-19 | 2018-11-19 | Chip assembly and mold assembly for fabricating same, camera and electronic device |
| US16/769,870 US11323595B2 (en) | 2017-12-19 | 2018-11-19 | Chip assembly, camera and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721809499.6U CN207543219U (en) | 2017-12-19 | 2017-12-19 | Chip assembly and the die assembly, camera and electronic equipment for manufacturing it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207543219U true CN207543219U (en) | 2018-06-26 |
Family
ID=62619068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721809499.6U Expired - Fee Related CN207543219U (en) | 2017-12-19 | 2017-12-19 | Chip assembly and the die assembly, camera and electronic equipment for manufacturing it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207543219U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107888815A (en) * | 2017-12-19 | 2018-04-06 | 广东欧珀移动通信有限公司 | Chip assembly and the die assembly, camera and electronic equipment for manufacturing it |
| WO2019120015A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip assembly and mold assembly for fabricating same, camera and electronic device |
-
2017
- 2017-12-19 CN CN201721809499.6U patent/CN207543219U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107888815A (en) * | 2017-12-19 | 2018-04-06 | 广东欧珀移动通信有限公司 | Chip assembly and the die assembly, camera and electronic equipment for manufacturing it |
| WO2019120015A1 (en) * | 2017-12-19 | 2019-06-27 | Oppo广东移动通信有限公司 | Chip assembly and mold assembly for fabricating same, camera and electronic device |
| US11323595B2 (en) | 2017-12-19 | 2022-05-03 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Chip assembly, camera and electronic device |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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