CN207542198U - Wafer anneal pallet body - Google Patents
Wafer anneal pallet body Download PDFInfo
- Publication number
- CN207542198U CN207542198U CN201721743756.0U CN201721743756U CN207542198U CN 207542198 U CN207542198 U CN 207542198U CN 201721743756 U CN201721743756 U CN 201721743756U CN 207542198 U CN207542198 U CN 207542198U
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- pallet
- conductive
- plate
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 59
- 239000010703 silicon Substances 0.000 claims abstract description 59
- 239000010445 mica Substances 0.000 claims abstract description 4
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 3
- 238000000137 annealing Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 208000002925 dental caries Diseases 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of wafer anneal pallet bodies, pallet together is piled up including several, the pallet includes silicon chip positioning plate made of mica, silicon chip positioning plate limits the cavity for storing silicon chip, the first conductive plate is fixed in the cavity, conductive column is fixedly connected in the bottom of metallic conduction plate, the other end of the conductive column is fixedly connected with the second conductive plate, and second conductive plate is used to contact conducting with the silicon chip in lower tray.The utility model can carry out silicon chip energization processing while wafer anneal, improve annealing effect, further improve the performance of silicon chip, and extend silicon chip service life.
Description
Technical field
The utility model is related to silicon chip process technology fields, and in particular to the pallet body of a wafer anneal.
Background technology
Containing aerobic in silicon chip, oxygen plays the role of suck up impurity, and silicon chip is made annealing treatment, and can promote to retain in silicon
Oxygen to external diffusion, form low-oxygen environment (clean area) in silicon chip surface, it is brilliant as caused by oxygen so as to reduce or even can eliminate
Volume defect is conducive to late device manufacture, in addition, wafer anneal can impact its resistivity and minority carrier life time.
It has now been found that during wafer anneal, such as maintains it in energized state, enable to the annealing effect of silicon chip
More preferably, has a more superior performance, but there is presently no wafer anneal equipment corresponding device is produced to this, therefore be badly in need of one
Wafer anneal equipment is planted to solve the problems, such as this.
Invention content
The utility model aim is to provide a kind of wafer anneal pallet body, can while wafer anneal,
Energization processing is carried out to silicon chip, annealing effect is improved, further improves the performance of silicon chip, and extend silicon chip service life.
In order to solve the problems, such as it is of the prior art these, technical solution provided by the utility model is：
A kind of wafer anneal pallet body piles up pallet together including several, and the pallet includes mica system
Into silicon chip positioning plate, silicon chip positioning plate limits the cavity for storing silicon chip, and the first conduction is fixed in the cavity
Plate is fixedly connected with conductive column in the bottom of metallic conduction plate, and the other end of the conductive column is fixedly connected with the second conductive plate,
Second conductive plate is used to contact conducting with the silicon chip in lower tray.
For above-mentioned technical proposal, inventor also has further Optimized Measures.
Further, the conductive column includes bushing, connecting pin and spring, and it is conductive that the bushing is fixed on described first
The lower section of plate, the connecting pin coordinate with the casing slip, and the bottom end of the connecting pin is fixedly connected with the second conductive plate, is used for
The spring for providing tensile force is socketed on the outside of the connecting pin.
Further, multiple independent for storing the cavitys of silicon chip, the silicon chip by each cavity is equipped in the pallet
Perforative through-hole up and down is provided on positioning plate, is had and the first conductive plate in adjacent cavities in the through-hole of the pallet of bottom
The conductive metal of electrical connection forms conductive hole, and the pallet body further includes multiple electrodes connecting rod, each electrode connection
Bar passes vertically through the through-hole in several described upper trays and is finally inserted in the conductive hole, wherein, each electrode
Connecting rod is electrically connected with the first conductive plate in the bottom tray in a cavity, forms independent power circuit.
Further, the silicon chip and external electrical connections in the upper tray at top, it is corresponding empty on each pallet
The silicon chip of intracavitary, the first conductive plate, conductive column, the second conductive plate and electrode connecting rod form independent power circuit.
Further, the pallet includes bottom tray and piles up several upper trays in the bottom tray,
The lower section of the bottom tray is smooth tablet pedestal, and the quadrangle of the bottom tray is provided with jack, the upper tray
Lower section correspond to the position of the jack and be provided with the positioning column of pluggable jack, and the top quadrangle of the upper tray is same
Sample is provided with jack.
Further, the pallet body further includes workpiece cover board, and the workpiece cover board is pressed against the support positioned at top layer
On silicon chip in disk.
Solution in compared with the prior art, the utility model advantage are：
The silicon chip placed between layers is together in series, then tie by the utility model by the conductive plate on each layer pallet
The electrode connecting rod connected with bottommost pallet conductive plate is closed, the power circuit be connected with extraneous power supply is formed, enables to silicon
The annealing of piece keeps its energized state simultaneously, and then improves wafer anneal effect, promotes silicon chip performance, improves product competitiveness.
In addition, the conductive column and the second conductive plate set by upper tray bottom can closely connect on adjacent two layers pallet
Silicon chip, improve connection reliability, and can be suitable for different number, different-thickness silicon chip, adapt to scalability it is strong.
Description of the drawings
The utility model is further described with reference to the accompanying drawings and embodiments：
Fig. 1 is the overall structure diagram of the wafer anneal pallet body of the utility model one embodiment；
Fig. 2 is the structure diagram of bottom tray in wafer anneal pallet body shown in FIG. 1；
Fig. 3 is the cross-sectional view of bottom tray shown in Fig. 2；
Fig. 4 is the structure diagram of wafer anneal pallet body shown in FIG. 1 pallet at the middle and upper levels；
Fig. 5 is the cross-sectional view of bottom tray shown in Fig. 2.
Wherein：
1st, pallet；11st, jack；12nd, positioning column；2nd, bottom tray；21st, the conductive hole of fixed electrode connecting rod；3rd, on
Layer pallet；31st, the through-hole of electrode connecting rod is worn；4th, silicon chip；5th, the first conductive plate；6th, conductive column；61st, bushing；62nd, it connects
Pin；63rd, spring；7th, the second conductive plate；8th, electrode connecting rod；9th, silicon chip positioning plate；10th, workpiece cover board.
Specific embodiment
Said program is described further below in conjunction with specific embodiment.It should be understood that these embodiments are for illustrating
The present invention and be not limited to limit the scope of the invention.The implementation condition used in embodiment can be done according to the condition of specific producer
Further adjustment, the implementation condition being not specified is usually the condition in routine experiment.
Embodiment：
Present embodiment describes a kind of wafer anneal pallet body, as shown in Figure 1, its can include in general manner it is several
A pallet 1 piled up together, the pallet 1 include silicon chip positioning plate 9 made of mica, and silicon chip positioning plate 9, which limits, to be used for
The cavity of silicon chip 4 is stored, the first conductive plate 5 is fixed in the cavity, is fixedly connected with and leads in the bottom of metallic conduction plate
Electric column 6, the other end of the conductive column 6 are fixedly connected with the second conductive plate 7, and second conductive plate 7 is used for and lower tray
In silicon chip 4 contact conducting.
Particularly, the pallet 1 includes bottom tray 2 and piles up several upper stratas support in the bottom tray 2
Disk 3, the lower section of the bottom tray 2 is smooth tablet pedestal, and as shown in Fig. 2, Fig. 3, the quadrangle of the bottom tray 2 is set
Be equipped with jack 11, the lower section of upper tray 3 as shown in Figure 4, Figure 5 correspond to the jack 11 position be provided with it is pluggable
The positioning column 12 of jack 11, and the top quadrangle of the upper tray 3 is again provided with jack 11.
Multiple independent for storing the cavitys of silicon chip 4, the silicon chip positioning by each cavity is equipped in each pallet 1
Perforative through-hole 31 up and down is provided on plate 9.And as shown in Figure 2 and Figure 3, have in the through-hole 31 of undermost bottom tray 2
The conductive metal being electrically connected with the first conductive plate 5 in adjacent cavities forms conductive hole 21, and the pallet body further includes multiple
Electrode connecting rod 8, each electrode connecting rod 8 pass vertically through the through-hole 31 in several described upper trays 3 and finally insert
In the conductive hole 21, wherein, each electrode connecting rod 8 and first leading in a cavity in the bottom tray 2
Battery plate 5 is electrically connected, silicon chip 4 and external electrical connections in the upper tray 3 at top, is corresponded in cavity on each pallet 1
Silicon chip 4, the first conductive plate 5, conductive column 6, the second conductive plate 7 and the electrode connecting rod 8 of (being located in same vertical plane) are formed
Independent power circuit
That is, multiple mutually independent power circuits can be constructed in pallet body, i.e., by right on each layer pallet 1
The silicon chip 4 placed between layers is together in series by the conductive plate answered, and electric current is accessed from the silicon chip to be processed 4 of top layer, finally
The electrode connecting rod 8 connected again from the conductive plate with undermost bottom tray 2 is drawn, and forms the power circuit of conducting, can
So that the annealing of silicon chip 4 keeps its energized state simultaneously, and then improve wafer anneal effect, improve silicon chip performance, it is final to realize
The raising of product quality.And in pallet 1 more cavity structures setting, enabling disposably annealed to a large amount of silicon chip and
The processing of energization promotes processing efficiency, saves production cost.
In order to which the silicon chip 4 placed between adjacent two layers pallet 1 is enabled closely to connect, the conductive column 6
Structure also has special design.The conductive column 6 includes bushing 61, connecting pin 62 and spring 63, and the bushing 61 is fixed on
The lower section of first conductive plate 5, the connecting pin 62 are slidably matched with the bushing 61, and the bottom end of the connecting pin 62 is consolidated
Surely the second conductive plate 7 is connected, the spring 63 for providing tensile force is socketed in the outside of the connecting pin 62, and spring
63 one end resists the second conductive plate 7, and the other end resists the bushing 61.By using spring 63 by 3 bottom of upper tray
Second conductive plate 7 is pressed on lower floor's silicon chip 4, and the stabilization in entire circuit, can overlap when ensureing not shift and be powered in wafer anneal
Formula structure design so that the superposition assembling of multiple layer tray 1 can be carried out, improve working efficiency.
6 and second conductive plate 7 of conductive column set by 3 bottom of upper tray can closely connect on adjacent two layers pallet 1
Silicon chip 4, improve connection reliability, and can be suitable for different number, different-thickness silicon chip 4, adapt to scalability it is strong
In order to ensure the smooth of annealing process, prevent silicon chip 4 from coming off, workpiece cover board is further included in the pallet body
10, the workpiece cover board 10 is pressed against on the silicon chip 4 in the pallet of top layer.
The foregoing examples are merely illustrative of the technical concept and features of the invention, its object is to allow the person skilled in the art to be
Present disclosure can be understood and implemented according to this, it is not intended to limit the scope of the present invention.It is all smart according to the present invention
The equivalent transformation or modification that refreshing essence is done, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of wafer anneal pallet body, pallet together is piled up including several, which is characterized in that the pallet packet
Silicon chip positioning plate made of mica is included, silicon chip positioning plate limits the cavity for storing silicon chip, is fixed in the cavity
First conductive plate, conductive column is fixedly connected in the bottom of metallic conduction plate, and the other end of the conductive column is fixedly connected with
Two conductive plates, second conductive plate are used to contact conducting with the silicon chip in lower tray.
2. wafer anneal pallet body according to claim 1, which is characterized in that the conductive column includes bushing, connects
Outbound and spring, the bushing are fixed on the lower section of first conductive plate, and the connecting pin coordinates with the casing slip,
The bottom end of the connecting pin is fixedly connected with the second conductive plate, and the spring for providing tensile force is socketed in outside the connecting pin
Side.
3. wafer anneal pallet body according to claim 1, which is characterized in that multiple independences are equipped in the pallet
For storing the cavity of silicon chip, be provided with perforative through-hole up and down, the support positioned at bottom on the silicon chip positioning plate by each cavity
There is the conductive metal being electrically connected with the first conductive plate in adjacent cavities to form conductive hole, the pallet body in the through-hole of disk
Multiple electrodes connecting rod is further included, each electrode connecting rod passes vertically through the through-hole in several upper trays and finally inserts
In the conductive hole, wherein, each electrode connecting rod is electrically connected with the first conductive plate in bottom tray in a cavity
It connects, forms independent power circuit.
4. wafer anneal pallet body according to claim 3, which is characterized in that the upper tray positioned at top
In silicon chip and external electrical connections, correspond on each pallet silicon chip in cavity, the first conductive plate, conductive column, the second conductive plate with
And electrode connecting rod forms independent power circuit.
5. wafer anneal pallet body according to any one of claim 1 to 4, which is characterized in that the pallet packet
It includes bottom tray and piles up several upper trays in the bottom tray, the lower section of the bottom tray is put down for smooth
Plate pedestal, the quadrangle of the bottom tray are provided with jack, and the lower section of the upper tray is set corresponding to the position of the jack
The positioning column of pluggable jack is equipped with, and the top quadrangle of the upper tray is again provided with jack.
6. wafer anneal pallet body according to claim 5, which is characterized in that the pallet body further includes workpiece
Cover board, the workpiece cover board are pressed against on the silicon chip in the pallet of top layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721743756.0U CN207542198U (en) | 2017-12-14 | 2017-12-14 | Wafer anneal pallet body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721743756.0U CN207542198U (en) | 2017-12-14 | 2017-12-14 | Wafer anneal pallet body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207542198U true CN207542198U (en) | 2018-06-26 |
Family
ID=62618496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721743756.0U Withdrawn - After Issue CN207542198U (en) | 2017-12-14 | 2017-12-14 | Wafer anneal pallet body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207542198U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946192A (en) * | 2017-12-14 | 2018-04-20 | 苏州晶洲装备科技有限公司 | Wafer anneal pallet body |
-
2017
- 2017-12-14 CN CN201721743756.0U patent/CN207542198U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946192A (en) * | 2017-12-14 | 2018-04-20 | 苏州晶洲装备科技有限公司 | Wafer anneal pallet body |
| CN107946192B (en) * | 2017-12-14 | 2024-03-12 | 苏州晶洲装备科技有限公司 | Tray mechanism for annealing silicon wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180626 Effective date of abandoning: 20240312 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20180626 Effective date of abandoning: 20240312 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |