CN207503996U - Flexible photovoltaic component lamination supporting plate - Google Patents
Flexible photovoltaic component lamination supporting plate Download PDFInfo
- Publication number
- CN207503996U CN207503996U CN201721641518.9U CN201721641518U CN207503996U CN 207503996 U CN207503996 U CN 207503996U CN 201721641518 U CN201721641518 U CN 201721641518U CN 207503996 U CN207503996 U CN 207503996U
- Authority
- CN
- China
- Prior art keywords
- photovoltaic component
- flexible photovoltaic
- heat
- heat conduction
- supporting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003475 lamination Methods 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims description 29
- 239000012530 fluid Substances 0.000 abstract description 12
- 239000000565 sealant Substances 0.000 abstract description 12
- 210000000746 body region Anatomy 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 10
- 239000003292 glue Substances 0.000 description 9
- 238000010030 laminating Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The utility model discloses a kind of flexible photovoltaic component lamination supporting plate, including high heat conduction frame and heat-conducting plate, wherein, through-hole is provided on high heat conduction frame, heat-conducting plate fixation is embedded in through-holes, and the thermal conductivity factor of high heat conduction frame is higher than the thermal conductivity factor of heat-conducting plate.Flexible photovoltaic component lamination supporting plate provided by the utility model, pass through the high heat conduction frame and heat-conducting plate for setting thermal conductivity factor different, realize flexible photovoltaic component go forward plate body region heating rate be less than fluid sealant region heating rate, and then realize quick conductive to flexible photovoltaic component fluid sealant region, bubble is accelerated to detach, foreboard body region heat-transfer rate is reduced simultaneously, the generation of fold is avoided, reduces the deformation rate of foreboard.
Description
Technical field
The utility model is related to technical field of solar more particularly to a kind of flexible photovoltaic component lamination supporting plates.
Background technology
Compared to traditional rigid solar cell module, flexible solar battery pack is more frivolous, bent, uses
Range is more extensive, and particularly suitable for distributed photovoltaic power generation, but flexible photovoltaic component package yield is generally relatively low, becomes resistance
The major obstacle that flexible photovoltaic component is hindered to mass produce, and it is that flexible photovoltaic component produces undesirable main original to be laminated bad
Cause.
The main bad appearance for being foreboard fold and edge seal glue bubble, not only influencing component in lamination, Er Qieying
The long-term reliability and service life of photovoltaic module are rung, is all very fatal for photovoltaic module, foreboard fold is mainly
Component heats component in the initial evacuation stage of lamination, at this time laminating machine, and component temperature constantly increases, due to flexible photovoltaic
Component foreboard is the stack combinations of high molecule plastic, during heating can contraction distortion, there is local eminence, and with the raising shape of temperature
Variable is increasing, and after vacuumizing phase, into the pressure period, the larger foreboard of deflection is once by laminating machine epicoele
The pressure of room silica gel plate if foreboard can not be flattened smoothly and eliminate deformation, is easy for forming fold, until entire lamination is tied
Beam is also difficult to restore, and generates bad.
Edge seal glue is distributed in the edge of component, and steam enters and corrosion cell when mainly preventing the component from using
Piece, packaging adhesive film and busbar etc., and edge seal glue bubble will reduce its ability that steam is prevented to enter, bubble generation mechanism
It is as follows：In the vacuumizing phase of lamination, laminating machine heats component, and edge seal glue temperature constantly increases, and starts to soften,
Gas above edge seal glue is constantly pumped, and temperature is higher, and fluid sealant mobility is bigger, and neighbouring gas is easier to be taken out
It walks, after the completion of vacuumizing phase, into the pressure period, once pressurization, foreboard edge will be fitted closely with edge seal glue, once
It is pressurized after fitting, unpumped gas is difficult to be extracted again, until lamination is completed, unpumped gas is close at the edge of component
Sealing surface just forms bubble.
Therefore, the temperature before pressurization influences the formation of component foreboard fold and edge seal glue bubble very big, and
Temperature is bigger, and fold is more, and bubble is fewer；Temperature is smaller, and fold is fewer, and bubble is more, and two kinds of defects are shifting, it is difficult to root
It removes.
Utility model content
The purpose of this utility model is to provide a kind of flexible photovoltaic component lamination supporting plate, with solve it is above-mentioned in the prior art before
The problem of plate fold and edge seal glue bubble, the lamination for reducing flexible photovoltaic component are bad.
The utility model provides a kind of flexible photovoltaic component lamination supporting plate, wherein, including：
High heat conduction frame is provided with through-hole on the high heat conduction frame；
Heat-conducting plate, the heat-conducting plate fixation are embedded in the through-hole；
The thermal conductivity factor of the high heat conduction frame is higher than the thermal conductivity factor of the heat-conducting plate.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, the shape of the through-hole is rectangle.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, heat-conducting substrate is further included, the height is led
Hot frame and the heat-conducting plate are fixed on the heat-conducting substrate.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, the high heat conduction frame and the heat conduction base
High temperature resistant glue-line is provided between plate, the high heat conduction frame is fixed at the heat-conducting substrate by the high temperature resistant glue-line
On.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, the heat-conducting plate and the heat-conducting substrate
Between be provided with high temperature resistant glue-line, the heat-conducting plate is fixed at by the high temperature resistant glue-line on the heat-conducting substrate.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, further include detent mechanism, the positioning
Mechanism is fixed on the high heat conduction frame.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, the detent mechanism is positioning plate, institute
It states and high temperature resistant glue-line is provided between positioning plate and the high heat conduction frame, the positioning plate is set by high temperature resistant glue-line fixation
It puts on the high heat conduction frame.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, positioning is provided on the positioning plate
Slot, the opening of the locating slot is towards the through-hole.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, the end of the two side of the locating slot
Fillet is provided with, the fillet is arranged on the end close to the one side edge of the through-hole.
Flexible photovoltaic component lamination supporting plate as described above, these, it is preferred to, the thickness of the positioning plate, which is less than, treats layer
The thickness of the flexible photovoltaic component of pressure.
Flexible photovoltaic component lamination supporting plate provided by the utility model, by the high heat conduction frame that sets thermal conductivity factor different and
Heat-conducting plate, realize flexible photovoltaic component go forward plate body region heating rate be less than fluid sealant region heating rate, into
And the quick conductive to flexible photovoltaic component fluid sealant region is realized, bubble is accelerated to detach, while reduce foreboard body region
Domain heat-transfer rate avoids the generation of fold, reduces the deformation rate of foreboard.
Description of the drawings
Fig. 1 is the structure diagram of flexible photovoltaic component lamination supporting plate that the utility model embodiment provides；
Fig. 2 is the exploded view of flexible photovoltaic component lamination supporting plate that the utility model embodiment provides；
Fig. 3 is the state diagram of the flexible photovoltaic component lamination supporting plate that provides of the utility model embodiment in practical applications；
Fig. 4 is the front view of positioning plate.
Reference sign：
100- heat-conducting plate 200- high heat conduction frame 210- through-holes
300- heat-conducting substrate 400- positioning plate 410- locating slots
420- side wall 421- fillet 500- flexible photovoltaic components
510- foreboard body region 520- fluid sealants region
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and cannot be construed to the utility model
Limitation.
Referring to Fig. 1 to Fig. 3, the utility model embodiment provides a kind of flexible photovoltaic component lamination supporting plate,
Including high heat conduction frame 200 and heat-conducting plate 100, wherein, through-hole 210 is provided on high heat conduction frame 200, the fixation of heat-conducting plate 100 is embedded
In through-hole 210, the thermal conductivity factor of high heat conduction frame 200 is higher than the thermal conductivity factor of heat-conducting plate 100.
As shown in figure 3, in 500 lamination process of flexible photovoltaic component, flexible photovoltaic component 500 needs to be laid on heat-conducting plate
100 and the upper surface of high heat conduction frame 200, wherein, the foreboard body region 510 of flexible photovoltaic component 500 is completely covered on heat conduction
On plate 100, and the surrounding edge fluid sealant region 520 of flexible photovoltaic component 500 is covered on high heat conduction frame 200.That is, heat-conducting plate
100 for heating the foreboard body region 510 of flexible photovoltaic component 500 to be laminated, and high heat conduction frame 200 is used to treat
The fluid sealant region 520 set on the flexible photovoltaic component 500 of lamination is heated, due to the thermal conductivity factor of high heat conduction frame 200
Higher than the thermal conductivity factor of heat-conducting plate 100, therefore the capacity of heat transmission of high heat conduction frame 200 is higher, and temperature rise is very fast, and heat-conducting plate
100 capacity of heat transmission is relatively low, and temperature rise is relatively slow, so as to so that the preceding plate body of flexible photovoltaic component 500
510 rate of rise in temperature of region lags behind the rate of rise in temperature in its edge seal glue region 520, and then realizes to flexible light
The quick conductive in 500 fluid sealant region 520 of component is lied prostrate, bubble is accelerated to detach, while reduces by 510 heat conduction of foreboard body region speed
Degree, avoids the generation of fold, reduces the deformation rate of foreboard.
It, specifically can be according to treating layer it is understood that the shape of through-hole 210 can be circle, ellipse, polygon etc.
The shape of the flexible photovoltaic component 500 of pressure and design, in this embodiment it is preferred that the shape of the through-hole 210 be rectangle.
Wherein, heat-conducting plate 100 and the cooperation of through-hole 210 can be interference fit, to ensure that heat-conducting plate 100 is fixed in through-hole 210
Reliability.
The flexible photovoltaic component lamination supporting plate further includes heat-conducting substrate 300, and high heat conduction frame 200 and heat-conducting plate 100 can be with
It is fixed on heat-conducting substrate 300.The laminating operation of flexible photovoltaic component 500 usually by laminating machine is realized, is laminated
Heating plate is provided on machine, heat-conducting substrate 300 can be placed into the heating plate, wherein, heat-conducting substrate 300 is equal for a kind of material
Even plate-shaped member, after by heater plate, the temperature of heat-conducting substrate 300 everywhere is consistent, and the heat on heat-conducting substrate 300 is passing through
After crossing the different high heat conduction frame 200 of thermal conductivity factor and heat-conducting plate 100, the preceding plate body to flexible photovoltaic component 500 can be realized
Different heats is transmitted in region 510 and fluid sealant region 520.In addition, setting heat-conducting substrate 300 can also be convenient for high heat conduction frame
200 and the fixation and protection of heat-conducting plate 100.
Further, in one embodiment, high temperature resistant glue-line is provided between high heat conduction frame 200 and heat-conducting substrate 300,
High heat conduction frame 200 is fixed at by high temperature resistant glue-line on heat-conducting substrate 300, thereby may be ensured that high heat conduction frame 200 with leading
300 fixed stability of hot substrate, while the high-temperature stability of high temperature resistant glue-line is also possible to prevent it in flexible photovoltaic component 500
Melt deformation in lamination process.And high temperature resistant glue-line can also be provided between heat-conducting plate 100 and heat-conducting substrate 300, certainly,
Other heat resistance substances can be selected between heat-conducting plate 100 and heat-conducting substrate 300 to realize connection, this present embodiment is not made
It limits.Above-mentioned high temperature resistant glue-line can be specifically silicone sealant, be certainly not limited to cited material.
In another embodiment, high temperature resistant glue-line is provided between heat-conducting plate 100 and heat-conducting substrate 300, heat-conducting plate 100 is logical
It crosses high temperature resistant glue-line to be fixed on heat-conducting substrate 300, thereby may be ensured that heat-conducting plate 100 and heat-conducting substrate 300 are fixed
Stability.And high temperature resistant glue-line can also be provided between high heat conduction frame 200 and heat-conducting substrate 300, it is of course also possible to be led in height
Other heat resistance substances are selected between hot frame 200 and heat-conducting substrate 300 to realize connection, this present embodiment is not construed as limiting.
It further, should for the fixed limiting to flexible photovoltaic component 500 on high heat conduction frame 200 and heat-conducting plate 100
Flexible photovoltaic component lamination supporting plate further includes detent mechanism, which is fixed on high heat conduction frame 200.
Specifically, the detent mechanism can be positioning plate 400, it is provided between positioning plate 400 and high heat conduction frame 200 resistance to
High temperature glue-line, positioning plate 400 are fixed at by high temperature resistant glue-line on high heat conduction frame 200, to ensure positioning plate 400 and heat conduction
300 fixed stability of substrate.
Specifically, locating slot 410 is provided on positioning plate 400, the opening of locating slot 410 is towards through-hole 210, so that flexible
The end of photovoltaic module 500 is fastened in the locating slot 410, realizes positioning.
Further, as shown in figure 4, the end set of the two side 420 of locating slot 410 has fillet 421, fillet 421 is set
It puts close to the one side edge of through-hole 210 on end, it is possible thereby to the mistake coordinated in flexible photovoltaic component 500 and positioning plate 400
Cheng Zhong avoids the corner angle of 410 two side 420 of locating slot from scratching flexible photovoltaic component 500.
For the ease of the picking and placeing on the flexible photovoltaic component lamination supporting plate of flexible photovoltaic component 500, the thickness of positioning plate 400
Degree can be less than the thickness of flexible photovoltaic component 500 to be laminated.
The flexible photovoltaic component lamination supporting plate that the utility model embodiment provides, is led by the height for setting thermal conductivity factor different
Hot frame and heat-conducting plate, realize flexible photovoltaic component go forward plate body region heating rate be less than fluid sealant region heating speed
Degree, and then the quick conductive to flexible photovoltaic component fluid sealant region is realized, bubble is accelerated to detach, while reduce foreboard master
Body region heat-transfer rate avoids the generation of fold, reduces the deformation rate of foreboard.
The structure, feature and effect of the utility model are described in detail based on the embodiments shown in the drawings, with
Upper described is only the preferred embodiment of the utility model, but the utility model is to limit practical range shown in drawing, it is every according to
Change that conception according to the utility model is made or the equivalent embodiment for being revised as equivalent variations, still without departing from specification and figure
When showing covered spirit, it should be within the protection scope of the present utility model.
Claims (10)
1. a kind of flexible photovoltaic component lamination supporting plate, which is characterized in that including：
High heat conduction frame is provided with through-hole on the high heat conduction frame；
Heat-conducting plate, the heat-conducting plate fixation are embedded in the through-hole；
The thermal conductivity factor of the high heat conduction frame is higher than the thermal conductivity factor of the heat-conducting plate.
2. flexible photovoltaic component lamination supporting plate according to claim 1, which is characterized in that the shape of the through-hole is square
Shape.
3. flexible photovoltaic component lamination supporting plate according to claim 1, which is characterized in that heat-conducting substrate is further included, it is described
High heat conduction frame and the heat-conducting plate are fixed on the heat-conducting substrate.
4. flexible photovoltaic component lamination supporting plate according to claim 3, which is characterized in that the high heat conduction frame is led with described
High temperature resistant glue-line is provided between hot substrate, the high heat conduction frame is fixed at the heat conduction base by the high temperature resistant glue-line
On plate.
5. flexible photovoltaic component lamination supporting plate according to claim 3, which is characterized in that the heat-conducting plate and the heat conduction
High temperature resistant glue-line is provided between substrate, the heat-conducting plate is fixed at the heat-conducting substrate by the high temperature resistant glue-line
On.
6. flexible photovoltaic component lamination supporting plate according to claim 1, which is characterized in that detent mechanism is further included, it is described
Detent mechanism is fixed on the high heat conduction frame.
7. flexible photovoltaic component lamination supporting plate according to claim 6, which is characterized in that the detent mechanism is positioning
Plate, is provided with high temperature resistant glue-line between the positioning plate and the high heat conduction frame, the positioning plate passes through the high temperature resistant glue-line
It is fixed on the high heat conduction frame.
8. flexible photovoltaic component lamination supporting plate according to claim 7, which is characterized in that it is fixed to be provided on the positioning plate
Position slot, the opening of the locating slot is towards the through-hole.
9. flexible photovoltaic component lamination supporting plate according to claim 8, which is characterized in that the two side of the locating slot
End set has fillet, and the fillet is arranged on the end close to the one side edge of the through-hole.
10. flexible photovoltaic component lamination supporting plate according to claim 7, which is characterized in that the thickness of the positioning plate is small
In the thickness of flexible photovoltaic component to be laminated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721641518.9U CN207503996U (en) | 2017-11-30 | 2017-11-30 | Flexible photovoltaic component lamination supporting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721641518.9U CN207503996U (en) | 2017-11-30 | 2017-11-30 | Flexible photovoltaic component lamination supporting plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207503996U true CN207503996U (en) | 2018-06-15 |
Family
ID=62507663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721641518.9U Active CN207503996U (en) | 2017-11-30 | 2017-11-30 | Flexible photovoltaic component lamination supporting plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207503996U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110027146A (en) * | 2019-04-29 | 2019-07-19 | 席早明 | A kind of rubber production cooling bath |
| CN113471095A (en) * | 2020-03-31 | 2021-10-01 | 长鑫存储技术有限公司 | Chamber applied to semiconductor process |
-
2017
- 2017-11-30 CN CN201721641518.9U patent/CN207503996U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110027146A (en) * | 2019-04-29 | 2019-07-19 | 席早明 | A kind of rubber production cooling bath |
| CN113471095A (en) * | 2020-03-31 | 2021-10-01 | 长鑫存储技术有限公司 | Chamber applied to semiconductor process |
| WO2021197108A1 (en) * | 2020-03-31 | 2021-10-07 | 长鑫存储技术有限公司 | Cavity applied to semiconductor process |
| CN113471095B (en) * | 2020-03-31 | 2024-05-14 | 长鑫存储技术有限公司 | Chamber applied to semiconductor process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207503996U (en) | Flexible photovoltaic component lamination supporting plate | |
| CN204167439U (en) | Heatable battery module of electric automobile | |
| JP2019192900A (en) | Packaging method of solar battery and solar battery device | |
| CN102856410B (en) | Arc solar panel and processing technology | |
| CN106906958A (en) | A kind of photovoltaic building flexible curved surface watt component and its production technology | |
| WO2011158147A1 (en) | System and method for laminating pv device | |
| CN102709374B (en) | Efficient and natural cyclic back radiator for photovoltaic battery panel | |
| CN103337537B (en) | A kind of curved surface BIPV photovoltaic module and preparation technology thereof | |
| CN211641268U (en) | Laminating equipment | |
| CN101777434B (en) | Encapsulating method for all-solid-state dye-sensitized solar cell | |
| CN205828405U (en) | A kind of photovoltaic module | |
| CN202871837U (en) | Photovoltaic-thermal collecting assembly | |
| CN201990627U (en) | Permeable hot-melt adhesive double-side sticky tape with double substrates | |
| CN108831942A (en) | curved surface photovoltaic module and its processing method | |
| CN208722904U (en) | A kind of fixed device | |
| CN209419570U (en) | A kind of heat dissipation type photovoltaic module | |
| CN108054229A (en) | A kind of thin-film solar cells package assembling and its method for packing | |
| CN203950822U (en) | A kind ofly take the photovoltaic and photothermal integral assembly that vacuum glass is backboard | |
| WO2011007122A3 (en) | Composite solar collector | |
| CN209880635U (en) | Photovoltaic solar cell backboard packaging layer of photovoltaic panel | |
| CN209098562U (en) | A kind of low thermal resistance pressure sensitive adhesive tape | |
| CN207441727U (en) | A kind of photovoltaic module | |
| CN103560748A (en) | Integrated solar generation collector | |
| CN207353266U (en) | Photovoltaic module for condenser system | |
| CN207338406U (en) | Weather-proof solar cell backboard |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20200817 Granted publication date: 20180615 |
|
| PD01 | Discharge of preservation of patent | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20230817 Granted publication date: 20180615 |