CN207489891U - Solar powered system on chip - Google Patents
Solar powered system on chip Download PDFInfo
- Publication number
- CN207489891U CN207489891U CN201721541551.4U CN201721541551U CN207489891U CN 207489891 U CN207489891 U CN 207489891U CN 201721541551 U CN201721541551 U CN 201721541551U CN 207489891 U CN207489891 U CN 207489891U
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- solar
- powered system
- power generation
- chip
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The utility model provides a kind of solar powered system on chip, wherein, including solar power generation layer, pcb layer and component layer from top to bottom；The electrical energy inputs of pcb layer are connected with the electric energy output end of solar power generation layer；The electric energy output end of pcb layer is connected with external equipment；Component layer is arranged on the downside of pcb layer, and component layer forms circuit loop.Solar powered system on chip provided by the utility model is stratiform by setting whole installation, electric energy is converted into using solar power generation, electric energy is exported by pcb layer power to external equipment again, solve the problems of the prior art, reduce solar chip cuts and cascades difficulty, generating efficiency is improved, simplifies electrical equipment.
Description
Technical field
The utility model is related to heliotechnics more particularly to a kind of solar powered systems on chip.
Background technology
Science and technology rapid development, digital electronic goods type is various, and heliotechnics has more and more appeared in portable electricity
On sub- product (such as calculator, miniature positioning device, gun sight etc.).
Solar power generation material of the prior art has low (such as the GaAs material of frangible (such as crystal silicon material), efficiency
Material), it is unyielding determine, have been unable to meet the functional requirements such as changeable mobile product moulding, environmental resistance, energy supply be abundant.Separately
On the one hand, the single-chip voltage of solar power generation material is low, and multi-disc cascade is needed just to can reach higher voltage.But it is limited to ruler
Very little and area, cut out and the cascade process complexity of existing solar chip, is not easy to integrate.
Utility model content
The purpose of this utility model is to provide a kind of solar powered system on chip, to solve the problems of the prior art,
Reduce solar chip cuts and cascades difficulty, improves generating efficiency, simplifies electrical equipment.
The utility model provides a kind of solar powered system on chip, wherein, including solar power generation from top to bottom
Layer, pcb layer and component layer；
The electrical energy inputs of the pcb layer are connected with the electric energy output end of the solar power generation layer；The wiring board
The electric energy output end of layer is connected with external equipment；
The component layer is arranged on the downside of the pcb layer, and the component layer forms circuit loop.
Solar powered system on chip as described above, these, it is preferred to, the solar power generation layer includes flexibility too
Positive energy component.
Solar powered system on chip as described above, these, it is preferred to, the flexible solar component is copper and indium gallium
Se solar component.
Solar powered system on chip as described above, these, it is preferred to, sealer is further included, is covered in institute
State the top of solar power generation layer.
Solar powered system on chip as described above, these, it is preferred to, the thickness of the sealer is
0.05-0.15mm。
Solar powered system on chip as described above, these, it is preferred to, insulation adhesive linkage is further included, is arranged on institute
It states between solar power generation layer and the pcb layer.
Solar powered system on chip as described above, these, it is preferred to, protection shell is further included, outside the protection
Shell coats the side of the solar power generation layer, insulation adhesive linkage, pcb layer and component layer, while by the component
The bottom surface cladding of layer.
Solar powered system on chip as described above, these, it is preferred to, the material of the protection shell is glass fibers
Tie up reinforced resin.
Solar powered system on chip as described above, these, it is preferred to, the protection shell and the component layer
Between, side and the solar power generation layer of the protection shell, insulation adhesive linkage, pcb layer and component layer side
Between, it is both provided with insulation fill stratum.
Solar powered system on chip as described above, these, it is preferred to, the insulation fill stratum is contains silicone
Casting glue.
Solar powered system on chip provided by the utility model is stratiform by whole installation, is turned using solar power generation
Electric energy is turned to, electric energy is exported by pcb layer power to external equipment again, solved the problems of the prior art, reduce too
Positive energy chip cuts and cascades difficulty, improves generating efficiency, simplifies electrical equipment.
Further, it by the way that solar power generation layer is set to include flexible solar component, is cut so as to further reduced
With cascade difficulty.
Description of the drawings
Fig. 1 is the cross-section diagram of solar powered system on chip that the utility model embodiment provides；
Fig. 2 is the vertical view of solar powered system on chip that the utility model embodiment provides；
Fig. 3 is the bottom view of solar powered system on chip that the utility model embodiment provides.
Reference sign：
1- solar power generation layer 2- pcb layer 3- component layer 4- sealers 5- insulation adhesive linkages
6- protects shell 7- insulation fill stratum 8- output lead 9- connecting wires
Specific embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and cannot be construed to the utility model
Limitation.
As shown in Figure 1 to Figure 3, the utility model embodiment provides a kind of solar powered system on chip, including by upper
Solar power generation layer 1, pcb layer 2 and component layer 3 under.
Wherein, solar power generation layer 1 has electric energy output end, the electrical energy inputs of pcb layer 2 and the electric energy output end
It is connected；The electric energy output end of pcb layer 2 is connected with external equipment.Component layer 3 is arranged on the downside of pcb layer 2, this yuan
Device layer 3 forms circuit loop.
The solar powered system on chip that the utility model embodiment provides is by setting whole installation as stratiform, using too
Sun, which can generate electricity, is converted into electric energy, and electric energy is exported by pcb layer power to external equipment again, solves of the prior art ask
Topic, reduce solar chip cuts and cascades difficulty, improves generating efficiency, simplifies electrical equipment.
Solar powered system on chip provided in this embodiment is a kind of sheet (plane or single-curved surface), packaged, interior
Portion is integrated with the solar powered system on chip of power circuit (pcb layer 2), and size is generally no greater than 30mmx30mm, typical
Size be 20mmx10mmx3mm.The output voltage of system can be programmed, and voltage can be adjusted in 2V~12V.
Preferably, solar power generation layer 1 includes flexible solar component, and difficulty is cut and cascade so as to further reduce.
The flexible solar component is copper indium gallium selenide (CIGS) solar components, whole flexible, bending diameter be not less than 10mm,
Thickness is 0.3~0.5mm.Solar power generation layer 1 is made of multiple solar chips through connection in series-parallel cascade, each solar chip
Voltage be 0.5V, power/current is related to the area of solar chip.1 typical size of solar power generation layer be
20mmx10mmx0.3mm is connected in series by the solar chip of two 10mmx10mm sizes, forms the solar energy hair of 1V, 28mW
Electric layer 1.Solar power generation layer 1 is designed with positive and negative anodes output solder joint, can be drawn electric energy by output lead 8.
Pcb layer 2 (PCB) can be the board-like material by insulating resin and copper foil circuit making, and typical size is
20mmx10mmx1mm.Pcb layer 2 is provided with the solderable component of exposed pad, forms circuit, pcb layer 2 it is positive and negative
Two sides can make odt circuit design.Solder joint is also provided on pcb layer 2, passes through connecting wire 9 and solar power generation layer 1
It is connected.Pcb layer 2 is designed with output port, is sent out the electric energy after adjusting by output lead 8 mentioned above.
Component layer 3 can use resistance, the components such as inductively or capacitively, be welded on above-mentioned pcb layer 2, form electricity
Road circuit.Circuit package mode is preferably surface mount package.Component layer 3 forms wide range input, maximum generation work(
The power circuit that rate tracking, output voltage are adjusted is that external equipment and circuit are powered.Its input voltage range is 0.5V~5V,
Representative value is 1V, and regulating circuit is designed using MPPT maximal power tracings, can pass through the size setting output electricity of three resistance values
The size of pressure.Electric energy output can be supplied with external circuit/equipment and use, or external cell (button cell etc.) fills
Electricity.In above-mentioned component layer 3, can needs be inputted according to the electric energy of electronic product, by different component (resistance, capacitance or
Other components) wiring and design on assist side layer 2, to realize different output demands.
Further, which further includes sealer 4, is covered in the top of solar power generation layer 1.The surface
Protective layer 4 can be made of ETFE and the film that blocks water, transparency height, uvioresistant, corrosion-resistant, and can prevent steam intrusion solar energy
Electric layer 1 and component layer 3.The 4 typical thickness of sealer is 0.05-0.15mm, preferably 0.1mm.
On the basis of above-described embodiment, which further includes insulation adhesive linkage 5, is arranged on solar power generation layer 1
Between pcb layer 2.PET insulating materials can be used in the insulation adhesive linkage 5, and it is fixed to play the role of insulation.
Further, protection shell 6 is further included, protection shell 6 is by solar power generation layer 1, insulate adhesive linkage 5, wiring board
The side of layer 2 and component layer 3 cladding, while the bottom surface of component layer 3 is coated, to play the role of protection.Outside the protection
The material of shell 6 can be galss fiber reinforced resin or other corrosion-resistant, resistance to ultraviolet organic materials.
Preferably, it protects between shell 6 and component layer 3, protect the side of shell 6 and solar power generation layer 1, insulating sticky
Between the side for connecing layer 5, pcb layer 2 and component layer 3, it is both provided with insulation fill stratum 7.The insulation fill stratum 7 can be
Two-component casting glue containing silicone is protected component layer 3 by certain filling thickness, absorbing external physical impact,
And provide electric insulation.
The structure, feature and effect of the utility model are described in detail based on the embodiments shown in the drawings, with
Upper described is only the preferred embodiment of the utility model, but the utility model is to limit practical range shown in drawing, it is every according to
Change that conception according to the utility model is made or the equivalent embodiment for being revised as equivalent variations, still without departing from specification and figure
When showing covered spirit, it should be within the protection scope of the present utility model.
Claims (10)
1. a kind of solar powered system on chip, which is characterized in that including from top to bottom solar power generation layer, pcb layer and
Component layer；
The electrical energy inputs of the pcb layer are connected with the electric energy output end of the solar power generation layer；The pcb layer
Electric energy output end is connected with external equipment；
The component layer is arranged on the downside of the pcb layer, and the component layer forms circuit loop.
2. solar powered system on chip according to claim 1, which is characterized in that the solar power generation layer includes soft
Property solar components.
3. solar powered system on chip according to claim 2, which is characterized in that the flexible solar component is copper
Indium gallium Se solar component.
4. according to the solar powered system on chip of claim 1-3 any one of them, which is characterized in that further include surface protection
Layer is covered in the top of the solar power generation layer.
5. solar powered system on chip according to claim 4, which is characterized in that the thickness of the sealer is
0.05-0.15mm。
6. solar powered system on chip according to claim 4, which is characterized in that further include insulation adhesive linkage, set
Between the solar power generation layer and the pcb layer.
7. solar powered system on chip according to claim 6, which is characterized in that further include protection shell, the guarantor
It protects shell to coat the side of the solar power generation layer, insulation adhesive linkage, pcb layer and component layer, while by the member
The bottom surface cladding of device layer.
8. solar powered system on chip according to claim 7, which is characterized in that the material of the protection shell is glass
Glass fiber-reinforced resin.
9. solar powered system on chip according to claim 7, which is characterized in that the protection shell and first device
Between part layer, side and the solar power generation layer of the protection shell, insulation adhesive linkage, pcb layer and component layer
Between side, it is both provided with insulation fill stratum.
10. solar powered system on chip according to claim 9, which is characterized in that the insulation fill stratum be containing
The casting glue of silicone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721541551.4U CN207489891U (en) | 2017-11-17 | 2017-11-17 | Solar powered system on chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721541551.4U CN207489891U (en) | 2017-11-17 | 2017-11-17 | Solar powered system on chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207489891U true CN207489891U (en) | 2018-06-12 |
Family
ID=62473751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721541551.4U Active CN207489891U (en) | 2017-11-17 | 2017-11-17 | Solar powered system on chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207489891U (en) |
-
2017
- 2017-11-17 CN CN201721541551.4U patent/CN207489891U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 100076 6015, 6th floor, building 8, 9 Yingshun Road, Yinghai Town, Daxing District, Beijing Patentee after: Beijing Dingrong Photovoltaic Technology Co.,Ltd. Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Rongchang East Street 7 hospital 6 Building 3001 room. Patentee before: BEIJING APOLLO DING RONG SOLAR TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210603 Address after: 518002 Room 201, building a, No.1 Qianwan 1st Road, Qianhai Shenzhen Hong Kong cooperation zone, Shenzhen City, Guangdong Province Patentee after: Hongyi Technology Co.,Ltd. Address before: 100076 6015, 6th floor, building 8, 9 Yingshun Road, Yinghai Town, Daxing District, Beijing Patentee before: Beijing Dingrong Photovoltaic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |