CN207458044U - A kind of multi-functional Transfer plates - Google Patents
A kind of multi-functional Transfer plates Download PDFInfo
- Publication number
- CN207458044U CN207458044U CN201721632226.9U CN201721632226U CN207458044U CN 207458044 U CN207458044 U CN 207458044U CN 201721632226 U CN201721632226 U CN 201721632226U CN 207458044 U CN207458044 U CN 207458044U
- Authority
- CN
- China
- Prior art keywords
- chips
- transfer plates
- fan
- pcie
- interfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims abstract description 6
- 230000002708 enhancing effect Effects 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 abstract description 11
- 238000004891 communication Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 241001269238 Data Species 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000021384 green leafy vegetables Nutrition 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
Including substrate, CDFP cable interfaces and Neo Scale high speed connector interfaces are installed on substrate for a kind of multi-functional Transfer plates；CDFP cable interfaces are used for transmission PCIE signal, and CDFP cable interfaces provide the PCIE signal of enhancing by Redriver chips for Neo Scale high speed connector interfaces；Neo Scale high speed connectors interfaces are divided into two groups of I2C links to chip BMC by the SMBUS signals of PCIE BOX, and first group of I2C link is used for the Firmware burnings of Redriver chips, and second group of I2C link monitors for FAN.The utility model with the Firmware of online burning Redriver chips, can enhance the maintainability of system by BMC chip；BMC realizes intelligent monitoring, management and adjusting by NCT7904D4 chips to FAN, effectively reduces the power of FAN, cost-effective.
Description
Technical field
The utility model is related to server datas to exchange board more particularly to a kind of multi-functional Transfer plates.
Background technology
On project framework, Transfer plates are the bridges that the board of project 12U systems is connected with project 4U system boards.
Transfer plates pass through Neo Scale high speed connectors by CDFP cables and the PCIE Expander cartoon letters of 12U systems
Data interaction is carried out with the BOX plates of 4U systems.
Redriver chips, NCT7904D4 chips are integrated on Transfer plates, Redriver chips are used to enhance PCIE
Signal strength improves signal quality, and NCT7904D4 chips are for monitoring, regulating system Fan rotating speeds.On 12U system boards
The communication between PCIE device on CPU and 4U system BOX plates, since whole link is long, PCIE signal attenuation is just big, letter
Number wave distortion, causes signal quality to be deteriorated.
Existing Transfer plates function is relatively simple, scalability is poor, simultaneously because the PCIE signal quality of transmission
It is unstable, FAN power consumptions are also also easy to produce, influence is caused on the raising of server system overall performance.
As Chinese patent (Authorization Notice No. CN205210880U) discloses a kind of " PCIE Box based on high-end server
Pinboard ", the pinboard include CDFP interfaces, PCIE Re-driver chips and 2 high speed connectors, PCIE Box pinboards
One end connects CDFP interfaces by CDFP cables and PCIE expansion board, the other end are mutual by high speed connector and PCIE BOX plates
Even, the high speed connector is directly connected to CDFP interfaces by differential signal line PCIE RX, and the CDFP interfaces pass through difference
Signal wire PCIE TX connection PCIE Re-driver chips, the PCIE Re-driver chips are connected to high speed connector.It should
Pinboard enhances PCIE signal driving force by PCIE Re-driver chips, but autgmentability is still poor, can control
It is limited with the external board or equipment of connection, it is unfavorable for the raising of rate server and efficiency.
Utility model content
The utility model provides a kind of multi-functional Transfer plates, to solve problems of the prior art, leads to
Crossing increases multiple Redriver chips for enhancing PCIE signal intensity, so as to improve signal quality, meets communication requirement；With
BMC establish Direct Communication can online burning Redriver Firmware information, real FAN shows intelligent monitoring, can effectively reduce FAN
Power and cost.
The utility model is achieved by the following technical programs：
A kind of multi-functional Transfer plates, including substrate, installation and the CDFP cables of external plates cartoon news on the substrate
Interface and Neo Scale high speed connector interfaces；The CDFP cable interfaces are used for transmission PCIE signal, and CDFP cable interfaces lead to
Cross the PCIE signal that Redriver chips provide enhancing for Neo Scale high speed connector interfaces；The Neo Scale connect at a high speed
It connects device interface and two groups of I2C links is divided by the SMBUS signals of PCIE BOX to chip BMC, first group of I2C link is used for
The Firmware burnings of Redriver chips, second group of I2C link monitor for FAN.
A kind of multi-functional Transfer plates as described above, first group of I2C link are connected with PCA9546 chips, institute
The I2C interface for stating PCA9546 chips is equipped with multiple I2C passages.
A kind of multi-functional Transfer plates as described above, 2 Redriver chips of the I2C passages connection, 2
Redriver chips share an eeprom chip.
A kind of multi-functional Transfer plates as described above, second group of I2C link are connected with PCA9555 chips.
A kind of multi-functional Transfer plates as described above, second group of I2C link also connect with NCT7904D4 chips
It connects, NCT7904D4 chips adjust the rotating speed of FAN by PWM.
A kind of multi-functional Transfer plates as described above, the NCT7904D4 chips are provided with 2 sets.
Compared with prior art, the utility model has the advantages that：
The utility model can enhance system by BMC chip with the Firmware of online burning Redriver chips
It is maintainable；BMC realizes intelligent monitoring, management and adjusting by NCT7904D4 chips to FAN, effectively reduces the work(of FAN
Rate, it is cost-effective.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described.
Fig. 1 is the flow chart of the utility model；
Fig. 2 is the topological diagram of the utility model.
Reference numeral：1- mainboards, 2- backboards, 3-PCIE Expand plates, 4-Transfer plates, 5-PCIE BOX plates.
Specific embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model part of the embodiment, instead of all the embodiments.
As shown in Figure 1 and Figure 2, present embodiment discloses a kind of multi-functional Transfer plates, including substrate, on the substrate
Installation and the CDFP cable interfaces of external plates cartoon news and Neo Scale high speed connector interfaces；The CDFP cable interfaces are used
In transmission PCIE signal, CDFP cable interfaces provide enhancing by Redriver chips for Neo Scale high speed connector interfaces
PCIE signal；The SMBUS signals point that the Neo Scale high speed connectors interface passes through PCIE BOX to chip BMC
Into two groups of I2C links, first group of I2C link is used for the Firmware burnings of Redriver chips, and second group of I2C link is used for
FAN is monitored.
As shown in Figure 1, Transfer boards 4 and PCIE BOX plates 5 belong to 4U system boards, and mainboard 1, backboard 2, PCIE
Expand plates 3 etc. belong to 12U system boards, 12U systems communicate with 4U systems be exactly by PCIE Expand plates 3 and
CDFP cable interfaces interactive correspondence is realized on Transfer plates 4.4 function of Transfer plates includes enhancing mainboard CPU to PCIE
PCIE signal intensity and the FAN monitoring of BOX plate PCIE Device, signal pass through CDFP cable interfaces and Neo Scale high
Fast connector interface communicates with other boards.
Specifically, in the multi-functional Transfer boards of the present embodiment, the transmission of CDFP cable interfaces is the related letters of PCIE
Number, there are 16 pairs of TX differential pair signals and 16 pairs of Rx differential pair signals on each interface, TX differential pair signals are sent out from CPU ends
The signal gone out, signal pass through board, CONN and cable, and signal attenuation ratio is more serious, and Tx differential pair signals pass through Redriver
It can strengthen PCIE signal intensity, a Redriver chip can connect 8 pairs of Tx differential pair signals, by Redriver chips
Tx differential pair signals, the quality of signal can be effectively improved.
NeoScale high speed connectors interface signal includes the SMBUS signals of PCIE differential pair signals and BMC chip, leads to
Crossing I2C signals can be with the Firmware of 8 Redriver on burning plank, can be with the information of 10 FAN of monitoring system
The signal lead of the relevant SMBUS of BMC chip is arrived by the Neo Scale connectors of PCIE BOX plates 5
Transfer plates 4, SMBUS are divided to for two groups of I2C links, and 1 group of I2C is connected to the PCA9546 that 1 passage turns 4 passages, 4 of PCA9546
I2C passages, each I2C links can hang at most 8 equipment, meet I2C mechanism as long as the address difference of each equipment, pass through
4 I2C passages of PCA9546 can obtain the configuration information of 8 Redriver on plank, and each two Redriver chips share
As soon as eeprom chip, the Firmware of two Redriver burnings is stored in EEPROM, one piece of Redriver from
EEPROM load complete Firmware, another Redriver ability load Firmware, complete configuration.BMC chip can also
By I2C links, the Firmware in update EEPROM.
Another group of I2C link is adjusted for intelligence, the rotating speed of monitoring FAN, I2C interface and the PCA9555 chips of BMC chip
It is connected with the I2C interface of NCT7904D4 chips.PCA9555 chips are a kind of I/O interface expensive chips, by 10 FAN of system
Signal prest# in place BMC chip is issued by I2C buses, a PCA9555 chip can expand 8 interfaces.
NCT7904D4 chips are a kind of intelligent monitoring chips, available for monitoring chip voltage, temperature, NCT7904D4 chips
Generate PWM waveform control FAN rotating speeds.The NCT7904D4 chips used in the present embodiment have 8 Fan interfaces, available for monitoring 8
A Fan.BMC chip by the temperature of system, the state of FAN by I2C buses and NCT7904D4 chip communications, when the normal works of FAN
Make, NCT7904D4 chips will drive status LED display greens；When FAN operation irregularities, NCT7904D4 chips will
Drive fault LED displays red.Temperature is also by I2C link communications, and there are one temperature with BMC chip for NCT7904D4 chips
The mechanism of degree and FAN rotating speeds.When temperature is not less than regulation minimum temperature safety value, NCT7904D4 chips are according to the temperature received
Angle value generates pwm signal, and the periodic adjustment FAN rotating speeds of modulation (PWM) signal.When temperature be more than regulation minimum temperature safety value,
It often raises and once just adjusts the cycle of pwm signal so as to accelerate FAN rotating speeds；When temperature meets or exceeds ceiling temperature safety
Value just adjusts the cycle of pwm signal, so that FAN is rotated at full speed；Otherwise temperature reduces, and can also make the reduction of FAN rotating speeds, FAN's
Fan_tach signals give the current speed feedback of Fan to NCT7904D4 chips.
In use, two NCT7904D4 chips and two PCA9555 chips, while the I2C buses of one group of BMC are connected, firmly
Part physical address is different, ensures that BMC chip and each chip communication are normal.
The utility model can enhance system by BMC chip with the Firmware of online burning Redriver chips
It is maintainable；BMC realizes intelligent monitoring, management and adjusting by NCT7904D4 chips to FAN, effectively reduces the work(of FAN
Rate, it is cost-effective.
The technology contents of the not detailed description of the utility model are known technology.
Claims (6)
1. a kind of multi-functional Transfer plates, including substrate, which is characterized in that installation and external plates cartoon news on the substrate
CDFP cable interfaces and Neo Scale high speed connector interfaces；The CDFP cable interfaces are used for transmission PCIE signal, CDFP lines
Cable interface provides the PCIE signal of enhancing by Redriver chips for Neo Scale high speed connector interfaces；The Neo
Scale high speed connectors interface is divided into two groups of I2C links to chip BMC by the SMBUS signals of PCIE BOX, first group
I2C links are used for the Firmware burnings of Redriver chips, and second group of I2C link monitors for FAN.
2. a kind of multi-functional Transfer plates according to claim 1, which is characterized in that first group of I2C link with
PCA9546 chips connect, and the I2C interface of the PCA9546 chips is equipped with multiple I2C passages.
3. a kind of multi-functional Transfer plates according to claim 2, which is characterized in that the I2C passages connect 2
Redriver chips, 2 Redriver chips share an eeprom chip.
4. a kind of multi-functional Transfer plates according to claim 1, which is characterized in that second group of I2C link with
PCA9555 chips connect.
5. a kind of multi-functional Transfer plates according to claim 4, which is characterized in that second group of I2C link is also
It is connected with NCT7904D4 chips, NCT7904D4 chips adjust the rotating speed of FAN by PWM.
6. a kind of multi-functional Transfer plates according to claim 5, which is characterized in that the NCT7904D4 chips are set
It is equipped with 2 sets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721632226.9U CN207458044U (en) | 2017-11-29 | 2017-11-29 | A kind of multi-functional Transfer plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721632226.9U CN207458044U (en) | 2017-11-29 | 2017-11-29 | A kind of multi-functional Transfer plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207458044U true CN207458044U (en) | 2018-06-05 |
Family
ID=62275493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721632226.9U Expired - Fee Related CN207458044U (en) | 2017-11-29 | 2017-11-29 | A kind of multi-functional Transfer plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207458044U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109162954A (en) * | 2018-11-06 | 2019-01-08 | 迈普通信技术股份有限公司 | A kind of fan control device |
-
2017
- 2017-11-29 CN CN201721632226.9U patent/CN207458044U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109162954A (en) * | 2018-11-06 | 2019-01-08 | 迈普通信技术股份有限公司 | A kind of fan control device |
| CN109162954B (en) * | 2018-11-06 | 2020-04-03 | 迈普通信技术股份有限公司 | Fan control device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109882439B (en) | Fan control system, method and server | |
| CN102817862B (en) | A kind of control method for fan, Apparatus and system | |
| CN105443408B (en) | A kind of fan system | |
| US20160064938A1 (en) | Dynamically Configurable Power-Over-Ethernet Apparatus and Method | |
| CN102510344A (en) | Rack server system | |
| CN109933173A (en) | Fan control device and equipment in a kind of server system | |
| CN207458044U (en) | A kind of multi-functional Transfer plates | |
| CN106951383A (en) | The mainboard and method of a kind of raising PCIE data channel utilization rates | |
| CN104679703A (en) | High-density server system | |
| US11139768B2 (en) | Motor drive with independent physical backplane communication | |
| CN205564031U (en) | Multi-point traffic signal control system | |
| WO2021109539A1 (en) | Led display module, and led display screen and control device therefor | |
| EP3339993B1 (en) | Motor drive with dynamic interval communication | |
| CN204272170U (en) | A kind of BACnet protocol conversion system | |
| CN113883078B (en) | Fan control device and method | |
| CN206686217U (en) | A kind of multiserver network share framework | |
| CN202424755U (en) | Vehicle-mounted data communication device | |
| CN206892854U (en) | A kind of mainboard of raising PCIE data channel utilization rates | |
| CN202422677U (en) | Vehicle-mounted display system | |
| WO2015131670A1 (en) | Device, method and system for achieving rack stacking based on switching network | |
| CN203335450U (en) | Fan connecting and disconnecting state detecting module, device and system | |
| CN207305130U (en) | A kind of integrated patch machine pastes head motor driver | |
| CN110518937A (en) | Junction cable and augmented reality system | |
| CN103019342A (en) | Server system | |
| US20180175772A1 (en) | Motor drive with multi-function high speed communications interface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180605 Termination date: 20181129 |