CN207448235U - Lapping liquid feed unit and the substrate grinding device for possessing it - Google Patents
Lapping liquid feed unit and the substrate grinding device for possessing it Download PDFInfo
- Publication number
- CN207448235U CN207448235U CN201721240939.0U CN201721240939U CN207448235U CN 207448235 U CN207448235 U CN 207448235U CN 201721240939 U CN201721240939 U CN 201721240939U CN 207448235 U CN207448235 U CN 207448235U
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- Prior art keywords
- lapping liquid
- substrate
- shell
- grinding
- liquid feed
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
It discloses a kind of lapping liquid feed unit and possesses its substrate grinding device, lapping liquid can be equably supplied in grinding pad by lapping liquid feed unit.Lapping liquid feed unit includes shell, lapping liquid supply unit and flexible support portion, shell is arranged to below from grinding pad surface floating predetermined distance, lapping liquid is supplied in the grinding pad by lapping liquid supply unit, and utilize the supply pressure of lapping liquid, interval below the shell between the grinding pad is adjusted, flexible support portion is arranged at the top of the shell, and elastic pressurized is carried out to the shell compared with the grinding pad.
Description
Technical field
The utility model is related to a kind of lapping liquid feed unit and the substrate grinding device for possessing it, lapping liquid feed units
For being applied to the lapping liquid of substrate grinding.
Background technology
In the manufacture of semiconductor devices, it is necessary to the CMP (chemical machineries including grinding and polishing (buffing) and cleaning
Grinding, chemical mechanical polishing) operation.For semiconductor devices, be formed as the shape of multilayered structure
State, and it is formed with transistor (transistor) device with diffusion zone in substrate layer.In substrate layer, metal wire is connected
It is patterned and is electrically connected to the transistor device for being formed with functional device.It is well known that patterned conductive layer is using such as
The same insulating materials of silica mutually insulate with other conductive layers.Because form more metal layers and associated with metal layer
Insulating layer so that the flat necessity of insulating materials is increased.If not planarizing, because being permitted in configuration of surface
Changeable dynamic, the manufacture of additional metal layer actually becomes more difficult.In addition, metal line pattern is formed by insulating materials, lead to
Substrate grinding operation is crossed, removes excessive metal object.
For existing substrate grinding device, the one or both sides of substrate are as the structure for grinding and polishing and clean
Into element, the mechanical lapping component for including conveyer belt (belt), grinding pad (Pad) or cleaning brush (Brush) is provided with, by grinding
Chemical composition in grinding fluid solution causes grinding operation to be promoted and strengthen.
In addition, in general, for existing substrate grinding device, the lapping liquid including polishing particles is supplied in and is attached to
The grinding pad of grinding flat plate (platen) and be installed between the substrate of carrier head (carrier head), at the same make grinding pad and
Substrate is rotated to equidirectional, accordingly, grinding is realized using the relative rotational between grinding pad and substrate.
But in existing substrate grinding device, if because supplying lapping liquid from the outside of substrate, lapping liquid passes through
The rotation of substrate and grinding pad is by from the outside to central supply, so the lapping liquid quantity delivered of the marginal portion of substrate is more than center
Part, and be difficult that the amount of lapping liquid is supplied uniformly across in substrate entire surface.In particular, with the gradual large area of the size of substrate
Change, be difficult to be supplied uniformly across lapping liquid using existing lapping liquid supply mode.For example, in order to by lapping liquid supply pipe in big face
Long-pending substrate and in the case that multiple nozzles are set, it is overlapped from the region of multiple nozzles supply lapping liquid, so as to lapping liquid
Supply can become uneven.In addition, in order to by lapping liquid supply pipe in the substrate of large area, the lapping liquid supplied out from nozzle
Emitted dose it is excessive, it is more so as to the consumption quantitative change of lapping liquid, and in the lapping liquid quantity delivered at the edge of substrate and central part
Difference become much larger.Because the reason, it is difficult to lapping liquid is equably coated on to the entire surface of large area grinding pad,
The grinding uniformity can be substantially reduced as a result,.
Utility model content
Embodiment according to the present utility model discloses a kind of lapping liquid feed unit and possesses its substrate grinding dress
It puts, the lapping liquid feed unit can reduce the consumption of lapping liquid, and being capable of equably coated abrasive liquid.
The problem that the utility model is wanted to solve is not intended to be limited to the problem referred to, and is not just mentioned to again another
For outer problem, those skilled in the art can be clearly understood that from following record.
According to multiple embodiments of the utility model for being used to implement the purpose of this utility model, grind and fill in substrate
In putting, lapping liquid supply pipe is utilized to the pressure that lapping liquid is supplied in grinding pad in the lapping liquid feed unit of grinding pad, automatically
Interval between lapping liquid feed unit and grinding pad is adjusted, so as to so that the certain form of amount of flow by lapping liquid
Equably it is supplied in the entire surface of grinding pad, and flexible support portion prevents the interval between lapping liquid feed unit and grinding pad
It is too greatly separated, so that the quantity delivered of lapping liquid keeps stablizing.
In addition, for substrate grinding device, it is provided with to being measured in the changed pressure of grinding pad support portion
Pressure measurement unit, so as to controlling the quantity delivered of lapping liquid using pressure change measured value, and then may insure to grind
The uniformity.In addition, for substrate grinding device, the temperature measuring portion being measured to the temperature change of grinding pad is provided with,
So as to be controlled using temperature measuring value the quantity delivered of lapping liquid, and then technological temperature can be caused to keep stablizing.
The various embodiments of the utility model can have more than one effect in following effect.
As described above, embodiment according to the present utility model, using lapping liquid supply pressure to lapping liquid feed unit and
Interval between grinding pad is adjusted, and is controlled so as to the supply flow rate to lapping liquid, therefore can be with certain thick
Degree and certain flow supply lapping liquid.
Furthermore, it is possible to lapping liquid is equably supplied, so as to prevent the reduction of the grinding uniformity.
Description of the drawings
Fig. 1 is the stereogram of the substrate grinding device of one embodiment according to the present utility model.
Fig. 2 is the side view of the substrate grinding device of Fig. 1.
Fig. 3 is according to the sectional view of the lapping liquid feed unit of I-I line in the substrate grinding device of Fig. 1.
Fig. 4 and Fig. 5 is according to the sectional view of the lapping liquid feed unit of II-II line in the substrate grinding device of Fig. 1.
Specific embodiment
Hereinafter, by the attached drawing of illustration, the part of the embodiment of the utility model is described in detail.To each attached
The inscape of figure assigns reference numeral, wherein, it should be noted that for identical inscape, even if being shown in different attached
On figure, identical label is also made it have as far as possible.In addition, when the embodiment to the utility model illustrates, judging
For compared with it is related known composition or function illustrate interfere for the embodiment of the utility model understanding when, omit it
Detailed description.
In addition, when the inscape of the embodiment to the utility model illustrates, can use first, second, A,
B, the term of (a), (b) etc..The term is only intended to the inscape and other inscapes being distinguished, and is not
The essence or order of corresponding inscape or order etc. are defined by the term." connect when recording some inscape
Connect ", " with reference to " or " engagement " be when other inscapes, it is understood that, the inscape can be directly connected to or engage
In other described inscapes, but " can also be connected " between each inscape, " with reference to " or " engagement " have and in addition
Inscape.
Hereinafter, referring to figs. 1 to Fig. 5, lapping liquid feed unit 13 to embodiment according to the present utility model and possesses it
Substrate grinding device 10 composition and operation illustrate.
As reference, Fig. 1 is the stereogram of the substrate grinding device 10 of one embodiment according to the present utility model, Fig. 2
It is the side view of the substrate grinding device 10 of Fig. 1.And Fig. 3 is according to the grinding of I-I line in the substrate grinding device 10 of Fig. 1
The sectional view of liquid feed unit 13, Fig. 4 and Fig. 5 are to be supplied in the substrate grinding device 10 of Fig. 1 according to the lapping liquid of II-II line
The sectional view of unit 13.
Referring to the drawings, substrate grinding device 10 includes：Grinding flat plate 12 is attached with grinding pad 121；Carrier head 11,
Substrate 1 is held, and is pressurizeed and is rotated for grinding pad 121；And lapping liquid feed unit 13, by lapping liquid
S is supplied in grinding pad 121.
As reference, in the following description, in substrate 1, the face for being in contact with grinding pad 121 and performing grinding is known as
" abradant surface ", the back side of the abradant surface are known as " holding face ".
Grinding flat plate 12 is provided with the grinding pad 121 for the grinding of substrate 1 above, and is revolved with fixing speed
Turn.
Here, although a grinding flat plate 12 is shown in the drawings, the utility model is not limited to this, also can
Composition has multiple grinding flat plates 12, so as to which substrate 1 is moved on multiple grinding flat plates along circulation path, while performs and grinds
Grinding process.Although in addition, grinding flat plate 12 is shown as circle, the utility model is not limited to this, and grinding flat plate
12 size and shape are indeed it is possible to numerous variations.
Carrier head 11 is arranged on grinding flat plate 12, and the holding face of substrate 1 is held.For example, carrier head 11 is logical
It crosses and defined vacuum is supplied in 1 holding face of substrate, so as to be held to substrate 1.Here, carrier head 11 is except vacuum
Outside substrate 1 can also be held with variform.Although in addition, it is illustrated as the entirely handle that carrier head 11 holds substrate 1
Face is held, but unlike this, also it is capable of the edge of a holding substrate 1.
In a state that carrier head 11 in its lower section holds the holding face of substrate 1, grinding is stressed on authorized pressure
It is rotated while above pad 121 with certain speed.In addition, carrier head 11 can be carried out on grinding pad 121 with certain amplitude it is past
Substrate 1 is ground while moving again.Carrier head 11 is rotated in same direction with grinding flat plate 12, with mutual
Different speed are rotated, using the relative rotational difference between grinding flat plate 12 and carrier head 11, so that base
The abradant surface smoothing of plate 1.
In addition, the shape of carrier head 11 is defined not by attached drawing, for the detailed construction of carrier head 11, omit detailed
Explanation and diagram.
Lapping liquid feed unit 13 is arranged at the front of the moving direction of substrate 1 on grinding pad 121, and by lapping liquid S
It is supplied in grinding pad 121.In addition, lapping liquid feed unit 13 is arranged to float on the predetermined distance top with grinding pad 121, and
And using the pressure for supplying lapping liquid S, the interval between grinding pad 121 and lapping liquid feed unit 13 is adjusted, accordingly
Adjust the supply flow rate of lapping liquid S.
In detail, lapping liquid feed unit 13 includes shell 131 and lapping liquid supply unit 132 and flexible support portion 133.
Shell 131 is arranged at the front of carrier head 11 and substrate 1, in the form of being approximately perpendicular to the moving direction of substrate 1
It is configured.There is flat plane configuration, to correspond to grinding pad 121 below shell 131 and grinding pad 121 are facing
Surface, lapping liquid S be filled in grinding pad 121 and below between interval.
In the following description, in shell 131, the diametric(al) of substantially grinding pad 121 is referred to as " length direction ", vertically
In length direction, substantially substrate 1 moving direction be " width ".As described above, being configured to by shell 131 and base
The moving direction of plate 1 is perpendicular, so that substrate 1 can be uniformly in contact in the grinding supplied from lapping liquid feed unit 13
Liquid S.In addition, the length of shell 131 is formed as identical or longer with the diameter of substrate, so as to which lapping liquid S is equably supplied
It should be in the entire surface of substrate 1.
However, different from the embodiment, shell 131 can also be configured along the diametric(al) of grinding pad 121.This
Outside, the shape of shell 131 is also defined not by attached drawing.For example, shell 131 can have it is opposite with the outer circumferential surface of substrate 1
The arc or curved-surface shape with curvature answered.In addition, shell 131 can essentially have various shapes.
Lapping liquid supply unit 132 is formed at below shell 131, and including lapping liquid S is supplied in grinding pad 121
Multiple holes or slit (slit) or opening etc..Lapping liquid supply unit 132 is formed at certain intervals, and can be formed as a row
Or multiple row.In addition, lapping liquid supply unit 132 is configured along the length direction of shell 131, the track of supply lapping liquid S with
Substrate 1 is generally perpendicularly intersected.
As described above, by forming lapping liquid supply unit 132, lapping liquid supply unit 132 can cause the flowing of lapping liquid S
It measures and keeps certain on the track of supply lapping liquid S.However, the size and shape of lapping liquid supply unit 132 and its interval are simultaneously
It is not defined by attached drawing, indeed it is possible to numerous variations.
Lapping liquid supply unit 132 can be formed inside lapping liquid feed trough 321.Lapping liquid feed trough 321 is in shell 131
Below with the recessed formation of prescribed depth, and formed in long way along the length direction of shell 131.Also, at least lapping liquid
The floor space or width of feed trough 321 can be formed as or bigger identical with the size of lapping liquid supply unit 132, so as to lapping liquid
Feed trough 321 can be formed with lapping liquid supply unit 132 in inside.For example, its section of lapping liquid feed trough 321 can be formed as
The slot of quadrangle.However, the utility model is not limited to this, the section shape and size of lapping liquid feed trough 321 are actually
It can carry out numerous variations.
In addition, the utility model is not limited to this, and it can also only form lapping liquid supply unit 132 or lapping liquid confession
To arbitrary one side in slot 321.
It could be formed in 131 inside of shell for so that lapping liquid S supplies and flow to grinding for lapping liquid supply unit 132
Grinding fluid supply buffer (buffer) 322.However, the utility model is not limited to this, lapping liquid supply buffer 322 can be with
It omits.
Flexible support portion 133 is arranged at the top of shell 131, carries out elasticity to shell 131 compared with grinding pad 121 and adds
Pressure.
Flexible support portion 133 includes elastic pressurized body 331 and braced frame 332 and position-regulation portion 333, elastic pressurized body
331 are incorporated into shell 131, and braced frame 332 is supported elastic pressurized body 331, and position-regulation portion 333 is to shell 131
Position is adjusted.
Elastic pressurized body 331 is arranged along carrying out shell 131 elastic add compared with the direction that grinding pad 121 pressurizes
Pressure.For example, elastic pressurized body 331 can include the elastomer that spring is included.Here, the shape of elastic pressurized body 331
And position is defined not by attached drawing, and indeed it is possible to numerous variations.In addition, in addition to spring, elastic pressurized
Body 331 can also be used can be to a variety of devices that shell 131 pressurizes as hydraulic pressure or air pressure.
By setting flexible support portion 133, thus compared with grinding pad 121 with certain pressure to lapping liquid feed unit
13 are supported, and using the pressure for supplying lapping liquid S, can prevent the pressure of lapping liquid feed unit 13 from changing.
In detail, flexible support portion 133, can using the supply pressure of the lapping liquid S supplied from lapping liquid feed unit 13
To prevent the interval between lapping liquid feed unit 13 and grinding pad 121 from separated too much to be more than needs.In other words, because
It is pressurizeed for flexible support portion 133 compared with grinding pad 121 with defined plus-pressure to shell 131, so even if lapping liquid S
Supply pressure increases to more than prescribed level, the interval between shell 131 and grinding pad 121 will not be caused to separate for a spacing
From more than, thus, it is possible to prevent lapping liquid S from losing to outside.
In addition, according to the supply pressure of the lapping liquid S supplied from lapping liquid feed unit 13, shell 131 and grinding pad 121
Between occurred at intervals variation, but because lapping liquid S supply pressures are low when the flow of lapping liquid S is small, shell 131 and grinding
Enough intervals can not be generated between pad 121.
As described above, by the supply pressure or flow of lapping liquid S, position-regulation portion 333 is not to shell 131 and grinding
Interval between pad 121 is suitably adjusted, and in the case, is adjusted by the position of itself to lapping liquid feed unit 13
Section, so as to the elastic force or plus-pressure of regulation elasticity support portion 133.
In detail, for position-regulation portion 333, when lapping liquid S supply pressures are excessive so that flexible support portion 133
It is moved to 121 side of grinding pad, when lapping liquid S supply pressures are too small so that flexible support portion 133 is with separate grinding pad 121
Form is moved, so as to which the elastic pressurized power of flexible support portion 133 be adjusted, and then even if in particular flow rate condition
Under, lapping liquid S can also be supplied uniformly across.
Position-regulation portion 333 is arranged at the outside of flexible support portion 133, and to flexible support portion 133 and shell 131
Position is adjusted.For example, position-regulation portion 333 is incorporated into the other termination (or braced frame 332) of elastic pressurized body 331, and
And can also have the defined frame or rod-shape in the outside for extending to grinding flat plate 12.In addition, position-regulation portion 333 can be with
Including driving portion (not shown), driving portion causes upright position to move, so that flexible support portion 133 and shell 131 are separate or connect
It is bordering on grinding pad 121.Here, position-regulation portion 333 can include enabling the cylinder that the position of shell 131 is moved
(cylinder) or the device of motor etc..However, the utility model is not limited to this, position-regulation portion 333 can use energy
Enough variforms that the upright position of shell 131 is adjusted.
The flowing guiding 134 that the amount of flow of lapping liquid S is adjusted is provided in the lower end one side of shell 131.Stream
Dynamic guiding 134 extends specific length towards grinding pad 121 from the lower end of shell 131 and is formed, end with 121 phase of grinding pad
The form of contact is formed.Alternatively, 134 its end of flowing guiding separate certain intervals from 121 surface of grinding pad, with shell 131
The interval between grinding pad 121 is compared below, is therebetween formed by separating to be small in the form of.
The amount of flow of the lapping liquid S at 134 pairs of intervals being supplied between shell 131 and grinding pad 121 of flowing guiding carries out
It adjusts, when the lapping liquid S supplied from lapping liquid supply unit 132 is excessive, using flowing guiding 134 so that the grinding of glut
The flowing of liquid S is blocked, and is centainly adjusted so as to the amount of flow to lapping liquid S.In addition, flowing guiding 134 can rise
To the flowing of lapping liquid S is caused to slow to a degree of effect, so as to which lapping liquid S is filled in shell to a certain degree
Interval between 131 and grinding pad 121.Accordingly, for lapping liquid feed unit 13, supplied from lapping liquid supply unit 132
Lapping liquid S is supplied in grinding pad 121 while being filled between shell 131 and grinding pad 121, utilize 134 resistance of flowing guiding
The disconnected lapping liquid S supplied too much is flowed to 1 side of substrate, is centainly adjusted so as to the amount of flow to lapping liquid S.
Flowing guiding 134 can by closer to grinding pad 121 its thickness it is thinner in the form of formed.In addition, flowing guiding
134 can be formed as approaching more from the end of shell 131 to grinding pad 121, and end more tilts down.
In addition, flowing guiding 134 is formed by elastic material or formed by flexibility material, so as to carry out elastic change
Shape.Alternatively, it is at least formed in flowing guiding 134 with the part that grinding pad 121 is in contact by elasticity and flexibility material.For example,
134 entirety of flowing guiding or a part for the end being in contact with grinding pad 121 are by including rubber or silicones
(silicone) material is formed.
In addition, substrate grinding device 10 is provided with the temperature measuring portion 14 being measured to the temperature of grinding pad 121.Temperature
Determination part 14 is measured the temperature of grinding pad 121 in the part of the grinding of completing substrate 1, so as to grinding technics temperature into
Row measures.In other words, temperature measuring portion 14 is arranged at the rear of the moving direction of substrate 1 on grinding pad 121, measures complete
Into the temperature of the grinding pad 121 of the part of grinding.Also, using being measured as described above in temperature measuring portion 14 as a result, grinding
The quantity delivered of lapping liquid S is adjusted in liquid feed unit 13.
In detail, if grinding temperature increases to more than set point of temperature, can be contained in lapping liquid S polishing particles and
The chemomorphosis of lapping liquid S solution, therefore grinding rate can change.Lapping liquid supply is single if grinding temperature increase as a result,
Member 13 so as to using lapping liquid S substrate 1 and grinding pad 121 be caused to cool down, and then can make so that the increase of lapping liquid S quantity delivereds
Grinding technics temperature is obtained to keep stablizing.
In addition, non-uniform shape is presented in its surface of substrate 1, therefore, in grinding technics, according to the surface shape of substrate 1
Shape, the plus-pressure to pressurize from carrier head 11 to substrate 1 change.Change as described above to monitor (monitoring)
Stressed variation, can the one side of carrier head 11 set pressure measurement unit 15.Also, lapping liquid feed unit 13 is real-time
The change value of pressure that pressure measurement unit 15 is measured is obtained, and the quantity delivered of lapping liquid S is adjusted using described value.
This, the grinding rate of substrate 1 is proportional to pressure, and proportional to lapping liquid S quantity delivereds.Accordingly, lapping liquid feed unit 13
Cause the flow of lapping liquid S to increase in the low section of plus-pressure, the flow for causing lapping liquid S in the high section of plus-pressure is reduced.
Accordingly, increased by the quantity delivered in the low section lapping liquid S of plus-pressure, so that the substrate as caused by declining pressure
1 grinding rate is reduced to rise with the grinding rate of substrate 1 caused by the quantity delivered increase as lapping liquid S and cancelled out each other, and then can be with
So that the grinding rate of substrate 1 keeps certain.Equally, by reducing the quantity delivered of lapping liquid S in the high section of plus-pressure, so that
Obtain the grinding rate rising of the substrate 1 as caused by rising pressure and the grinding rate of substrate 1 caused by the quantity delivered reduction as lapping liquid S
Decline is cancelled out each other, and then the grinding rate of substrate 1 can be caused to keep certain, and may insure the grinding uniformity.
According to the present embodiment, lapping liquid feed unit 13 is arranged to the state in 121 top floating predetermined distance of grinding pad,
The interval between lapping liquid feed unit 13 and grinding pad 121 is adjusted using the quantity delivered of lapping liquid S, so as to right
The flow of lapping liquid S is adjusted, it is possible to so that the grinding rate of substrate 1 keeps certain.In addition, lapping liquid feed unit 13
Lapping liquid S can be equably supplied in 121 entire surface of grinding pad, accordingly, certain grinding rate can be obtained.In addition, grinding
Liquid feed unit 13 is adjusted lapping liquid S quantity delivereds by measuring the temperature of variation when substrate 1 is ground, so as to
So that the technological temperature stablized is maintained.In addition, lapping liquid feed unit 13 when substrate 1 is ground the real time measure occur plus
Pressure change, and can utilize the plus-pressure variation of the measure that the quantity delivered of lapping liquid S is adjusted.
As described above, although multiple embodiments are illustrated by the embodiment and attached drawing of restriction, if institute
Belong to the technical staff that technical field has general knowledge, then can be based on described record and carry out a variety of modifications and deformation.For example, with
Different order implements illustrated technology and illustrated method, alternatively, and/or cause illustrated system, structure,
The inscape of device, circuit etc. is combined or combined or even with other with illustrated method in the form of different
Inscape or equipollent are replaced or replaced, and can also realize suitable result.
Therefore, other are realized, other embodiment and fall within the right described below with the technology of claims equalization
The scope of claim.
Label declaration
1：Substrate
10:Substrate grinding device
11:Carrier head
12:Grinding flat plate
121:Grinding pad
13:Lapping liquid feed unit
131:Shell
132:Lapping liquid supply unit
321:Lapping liquid feed trough
322:Lapping liquid supplies buffer
133：Flexible support portion
331：Elastic pressurized body
332：Braced frame
333：Position-regulation portion
14：Temperature measuring portion
15：Pressure measurement unit
S：Lapping liquid
Claims (31)
1. a kind of lapping liquid feed unit of substrate grinding device, lapping liquid feed unit is used to grind in substrate grinding device
Grinding fluid is supplied in grinding pad, and the lapping liquid feed unit of the substrate grinding device includes：
Shell is arranged to below from grinding pad surface floating predetermined distance；
Lapping liquid is supplied in the grinding pad by lapping liquid supply unit, and using the supply pressure of lapping liquid, to described outer
Interval below shell between the grinding pad is adjusted；And
Flexible support portion is arranged at the top of the shell, and elastic pressurized is carried out to the shell compared with the grinding pad.
2. the lapping liquid feed unit of substrate grinding device according to claim 1, which is characterized in that
The lapping liquid supply unit includes the multiple holes formed along the length direction of the shell or slit.
3. the lapping liquid feed unit of substrate grinding device according to claim 2, which is characterized in that
The lapping liquid supply unit is configured to more than at least one row.
4. the lapping liquid feed unit of substrate grinding device according to claim 2, which is characterized in that
The lapping liquid supply unit be formed as supplying lapping liquid track is at least identical with the diameter of substrate or bigger.
5. the lapping liquid feed unit of substrate grinding device according to claim 2, which is characterized in that
The shell is formed with the lapping liquid feed trough of prescribed depth along the length direction of the shell below,
The lapping liquid supply unit is formed inside the lapping liquid feed trough.
6. the lapping liquid feed unit of substrate grinding device according to claim 5, which is characterized in that
The lapping liquid feed trough be formed in the form of being mutually parallel it is multiple,
Lapping liquid supply unit is respectively formed with inside the multiple lapping liquid feed trough.
7. the lapping liquid feed unit of substrate grinding device according to claim 1, which is characterized in that
The flexible support portion includes：
Elastic pressurized body is arranged at the top of the shell so that the shell is along pressurizeing compared with the grinding pad
Direction acts on plus-pressure；And
Position-regulation portion is arranged at the rear of the elastic pressurized body so that the position movement of the flexible support portion, so as to
The plus-pressure of the flexible support portion is adjusted.
8. the lapping liquid feed unit of substrate grinding device according to claim 7, which is characterized in that
The position-regulation portion causes the shell to be vertically moved in the form of being close or be spaced with the grinding pad.
9. the lapping liquid feed unit of substrate grinding device according to claim 1, which is characterized in that
The shell is configured to parallel with the diametric(al) of the substrate in the front of substrate moving direction.
10. the lapping liquid feed unit of substrate grinding device according to claim 1, which is characterized in that
Be formed as below the shell and the corresponding plane in the surface of the grinding pad.
11. the lapping liquid feed unit of substrate grinding device according to claim 1, which is characterized in that
The shell is additionally provided with flowing guiding in one side, and flowing guiding is to supplying between the shell and the grinding pad
The amount of flow of the lapping liquid is adjusted.
12. the lapping liquid feed unit of substrate grinding device according to claim 11, which is characterized in that
The flowing guiding is arranged at rear side lower end in the direction of rotation of the shell along the grinding pad.
13. the lapping liquid feed unit of substrate grinding device according to claim 11, which is characterized in that
The flowing guiding is arranged at front and rear side lower end in the direction of rotation of the shell along the grinding pad.
14. the lapping liquid feed unit of substrate grinding device according to claim 11, which is characterized in that
The flowing guiding is formed as end and is in contact or is spaced certain intervals with the grinding pad.
15. the lapping liquid feed unit of substrate grinding device according to claim 11, which is characterized in that
All or at least a part for end is formed by elasticity and flexibility material for the flowing guiding.
16. the lapping liquid feed unit of substrate grinding device according to claim 15, which is characterized in that
The flowing guiding is formed in the form of being got thinner closer to the grinding mat thickness.
17. a kind of substrate grinding device, including：
Grinding flat plate, grinding pad are formed at grinding flat plate；
Carrier head is arranged on the grinding pad so that substrate is fixed, and causes the relatively described grinding of the substrate
Pad is pressurizeed and is rotated；
Lapping liquid feed unit is arranged to separate predetermined distance from the grinding pad surface, and lapping liquid is supplied in described grind
Mill pad, and pressure pair and the interval of the grinding pad by supplying the lapping liquid are adjusted,
The lapping liquid feed unit includes：
Shell；
Lapping liquid is supplied in the grinding pad by lapping liquid supply unit；And
Flexible support portion is arranged at the top of the shell, and elastic pressurized is carried out to the shell compared with the grinding pad.
18. substrate grinding device according to claim 17, further includes：
Temperature measuring portion is measured the temperature of the grinding pad,
The temperature measuring portion is arranged to be measured the temperature for completing the part of the substrate grinding in the grinding pad.
19. substrate grinding device according to claim 18, which is characterized in that
The temperature change that the lapping liquid feed unit is measured using the temperature measuring portion is to being supplied in the grinding pad
The quantity delivered of lapping liquid is adjusted.
20. substrate grinding device according to claim 17, which is characterized in that
The carrier head one side is provided with pressure measurement unit,
The pressure measurement unit the carrier head pair so that the relatively described grinding pad of the substrate pressurize it is stressed
Variation is measured.
21. substrate grinding device according to claim 20, which is characterized in that
The lapping liquid feed unit is using the pressure change that the pressure measurement unit is measured to being supplied in the grinding pad
The quantity delivered of lapping liquid is adjusted.
22. substrate grinding device according to claim 17, which is characterized in that
The flexible support portion includes：
Elastic pressurized body is arranged at the top of the shell so that the shell is along pressurizeing compared with the grinding pad
Direction acts on plus-pressure；And
Position-regulation portion is arranged at the rear of the elastic pressurized body so that the position movement of the elastic pressurized body, so as to
The plus-pressure of the elastic pressurized body is adjusted.
23. substrate grinding device according to claim 17, which is characterized in that
Flowing guiding is additionally provided in the one side of the shell, flowing guiding is to supplying between the shell and the grinding pad
The amount of flow of the lapping liquid be adjusted,
The flowing guiding is arranged at the rear side lower end of the shell compared with the moving direction of the substrate, and from institute
Shell is stated to extend to be formed towards the grinding pad.
24. substrate grinding device according to claim 23, which is characterized in that
The flowing guiding is also disposed on the front side lower end of the shell compared with the moving direction of the substrate.
25. substrate grinding device according to claim 23, which is characterized in that
All or at least a part for end is formed by elasticity and flexibility material for the flowing guiding.
26. substrate grinding device according to claim 17, which is characterized in that
The shell is arranged to be formed flatly below, and separates certain intervals from the grinding pad surface.
27. substrate grinding device according to claim 26, which is characterized in that
The shell is configured to the diametric(al) parallel to the substrate in the front of the moving direction of the substrate.
28. substrate grinding device according to claim 17, which is characterized in that
The lapping liquid supply unit includes the multiple holes formed along the diametric(al) of the grinding pad or slit.
29. substrate grinding device according to claim 28, which is characterized in that
The lapping liquid supply unit be formed as supplying the lapping liquid track is at least identical with the diameter of the substrate or bigger.
30. substrate grinding device according to claim 27, which is characterized in that
The shell is alongst formed with the lapping liquid feed trough of prescribed depth below,
The lapping liquid supply unit is formed inside the lapping liquid feed trough.
31. substrate grinding device according to claim 30, which is characterized in that
The lapping liquid feed trough be formed in the form of being mutually parallel it is multiple,
Lapping liquid supply unit is respectively formed with inside the multiple lapping liquid feed trough.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170085936A KR101966952B1 (en) | 2017-07-06 | 2017-07-06 | Slurry supply unit and apparatus for polishing substrate having the slurry supply device |
| KR10-2017-0085936 | 2017-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207448235U true CN207448235U (en) | 2018-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721240939.0U Active CN207448235U (en) | 2017-07-06 | 2017-09-26 | Lapping liquid feed unit and the substrate grinding device for possessing it |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101966952B1 (en) |
| CN (1) | CN207448235U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019246396A1 (en) * | 2018-06-21 | 2019-12-26 | Illinois Tool Works Inc. | Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine |
| CN111230726A (en) * | 2018-11-28 | 2020-06-05 | 株式会社荏原制作所 | Temperature adjusting device and grinding device |
| CN114833725A (en) * | 2022-05-18 | 2022-08-02 | 北京烁科精微电子装备有限公司 | Grinding fluid supply device and grinding machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6135865A (en) * | 1998-08-31 | 2000-10-24 | International Business Machines Corporation | CMP apparatus with built-in slurry distribution and removal |
| US6050882A (en) * | 1999-06-10 | 2000-04-18 | Applied Materials, Inc. | Carrier head to apply pressure to and retain a substrate |
| JP4790322B2 (en) * | 2005-06-10 | 2011-10-12 | 株式会社ディスコ | Processing apparatus and processing method |
| WO2010019264A2 (en) | 2008-08-14 | 2010-02-18 | Applied Materials, Inc. | Chemical mechanical polisher having movable slurry dispensers and method |
| KR101722555B1 (en) * | 2016-03-08 | 2017-04-03 | 주식회사 케이씨텍 | Chemical mechanical polishing apparatus and method |
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2017
- 2017-07-06 KR KR1020170085936A patent/KR101966952B1/en active IP Right Grant
- 2017-09-26 CN CN201721240939.0U patent/CN207448235U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019246396A1 (en) * | 2018-06-21 | 2019-12-26 | Illinois Tool Works Inc. | Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine |
| CN112969553A (en) * | 2018-06-21 | 2021-06-15 | 伊利诺斯工具制品有限公司 | Method and apparatus for controlling fluid dispensers on metallurgical sample preparation machines |
| JP2021529095A (en) * | 2018-06-21 | 2021-10-28 | イリノイ トゥール ワークス インコーポレイティド | Methods and equipment for controlling fluid supply equipment in metallurgical sample preparation machines |
| US11787007B2 (en) | 2018-06-21 | 2023-10-17 | Illinois Tool Works Inc. | Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine |
| CN112969553B (en) * | 2018-06-21 | 2024-02-06 | 伊利诺斯工具制品有限公司 | Method and device for controlling a fluid distributor on a metallurgical sample preparation machine |
| CN111230726A (en) * | 2018-11-28 | 2020-06-05 | 株式会社荏原制作所 | Temperature adjusting device and grinding device |
| CN114833725A (en) * | 2022-05-18 | 2022-08-02 | 北京烁科精微电子装备有限公司 | Grinding fluid supply device and grinding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190005383A (en) | 2019-01-16 |
| KR101966952B1 (en) | 2019-04-18 |
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