CN207425914U - A kind of unsupported encapsulated LED light source - Google Patents
A kind of unsupported encapsulated LED light source Download PDFInfo
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- CN207425914U CN207425914U CN201721409875.2U CN201721409875U CN207425914U CN 207425914 U CN207425914 U CN 207425914U CN 201721409875 U CN201721409875 U CN 201721409875U CN 207425914 U CN207425914 U CN 207425914U
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- mould top
- top glue
- chip
- unsupported
- led light
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Abstract
The utility model discloses a kind of unsupported encapsulated LED light sources, including sheffield plate, the first mould top glue, chip and the second mould top glue, sheffield plate the upper surface of be equipped with the first mould top glue and with the first mould top glue connection, chip be arranged on first mould top glue the upper surface of and with the first mould top glue connection, the second mould top glue is encapsulated on the first mould top glue and by wafer package in the second mould top glue.Unsupported encapsulated LED light source provided by the utility model, sheffield plate is consolidated after the completion of weldering and is encapsulated using mould top glue, improve leakproofness, provide the associativity of sheffield plate and mould top glue, eliminate traditional stent simultaneously, unsupported packaged type is realized, the board human cost of upstream and downstream is considerably reduced, has saved cost.
Description
Technical field
The utility model is related to a kind of unsupported encapsulated LED light sources.
Background technology
It by PCB or stent is carrier that the existing general packaged type of LED light source, which is all, carries out solid solder joint on this basis
Powder, then encapsulate, substrate is essential, and the material of substrate is usually made of plastic cement and metal, such as traditional SMD patch branch
Frame and EMC stents, such stent usually there are poor sealing, with glue associativity it is poor the problems such as, another stent cost can also increase
Add.
More than deficiency, have much room for improvement.
Utility model content
In order to overcome the shortcomings of existing technology, the utility model provides a kind of unsupported encapsulated LED light source.
Technical solutions of the utility model are as described below：
A kind of unsupported encapsulated LED light source, it is described including sheffield plate, the first mould top glue, chip and the second mould top glue
Sheffield plate the upper surface of be equipped with the first mould top glue and with the first mould top glue connection, the chip is arranged on first mould
Push up glue the upper surface of and with the first mould top glue connection, the second mould top glue be encapsulated on the first mould top glue and will described in
Wafer package is in the second mould top glue.
Further, the chip is formal dress chip.
Further, between the sheffield plate and the formal dress chip be equipped with crystal-bonding adhesive, the sheffield plate with it is described
Formal dress chip passes through the die bond glue connection.
Further, the electrode of the formal dress chip is connected with the sheffield plate by gold thread.
Further, the chip is flip chip.
Further, between the sheffield plate and the flip chip be equipped with tin cream, the sheffield plate with it is described fall
Dress chip is connected by the tin cream.
Further, further include fluorescent powder, the fluorescent powder coating on the chip.
According to the utility model of said program, its advantage is, unsupported encapsulation provided by the utility model
Sheffield plate is consolidated after the completion of weldering and is encapsulated using mould top glue, improved leakproofness, provide sheffield plate and mould top by LED light source
The associativity of glue, while traditional stent is eliminated, unsupported packaged type is realized, considerably reduces the machine of upstream and downstream
Platform human cost, has saved cost；First mould top glue, which is covered on sheffield plate to play, protects sheffield plate not to be subject to oxygen
Change.
Description of the drawings
Fig. 1 is the formal dress finished product structure schematic diagram of the utility model.
Fig. 2 is the upside-down mounting finished product structure schematic diagram of the utility model.
Fig. 3 is the copper sheet schematic diagram of the utility model.
Fig. 4 is the etching copper sheet line map of the utility model.
Fig. 5 is the mould top finished product structure schematic diagram of the utility model.
Fig. 6 is the preparation flow figure of the LED light source of the utility model.
Fig. 7 is the production process figure of the sheffield plate of the utility model.
Fig. 8 is the packaging technology figure of the formal dress chip of the utility model.
Fig. 9 is the packaging technology figure of the flip chip of the utility model.
Reference numeral is as follows in the figure：
1- sheffield plates；The first moulds of 2- top glue；3- formal dress chips；4- crystal-bonding adhesives；5- gold threads；6- flip chips；7- tin creams；
The second moulds of 8- top glue；11- copper sheets.
Specific embodiment
Below in conjunction with the accompanying drawings and the utility model is further described in embodiment：
As shown in Figures 1 to 5, a kind of unsupported encapsulated LED light source, including sheffield plate 1, the first mould top glue 2, chip
3 and the second mould top glue 4, sheffield plate 1 the upper surface of be equipped with the first mould top glue 2 and be connected with the first mould top glue 2, chip is arranged on first
Mould top glue 2 the upper surface of is simultaneously connected with the first mould top glue 2, and the second mould top glue envelope 8 exists on the first mould top glue 2 and by wafer package
In second mould top glue 4.
Unsupported encapsulated LED light source provided in this embodiment has the beneficial effect that：No stent provided by the utility model
Encapsulated LED light source, by sheffield plate 1 admittedly weldering after the completion of using mould top glue encapsulate, improve leakproofness, provide sheffield plate
1 with the associativity of mould top glue, while eliminate traditional stent, realize unsupported packaged type, considerably reduce
The board human cost in downstream, has saved cost；First mould top glue 2, which is covered on sheffield plate 1, can play protection silver-plated copper
Piece 1 is not aoxidized.
In one embodiment, further include fluorescent powder, fluorescent powder coating on chip.Coating fluorescent powder on chip can be with
Make the LED light source for sending white light.
In one embodiment, chip is formal dress chip 3.
In one embodiment, crystal-bonding adhesive 4 is equipped between sheffield plate 1 and formal dress chip 3, sheffield plate 1 is brilliant with formal dress
Piece 3 is connected by crystal-bonding adhesive 4.
Preferably, the electrode of formal dress chip 3 is connected with sheffield plate 1 by gold thread 5.Crystal-bonding adhesive 4 is according to formal dress chip 3
Type is selected, the vertical elargol die bond of formal dress chip 3, the insulating cement die bond of plane formal dress chip 3.
In one embodiment, chip is flip chip 6.
In one embodiment, tin cream 7, sheffield plate 1 and flip chip 6 are equipped between sheffield plate 1 and flip chip 6
It is connected by tin cream 7.The size of 7 particle of tin cream determines by the size of flip chip 6, in the present embodiment, with using 4# powder and
Based on 5# powder, and use high temperature tin cream.
Preferably, sheffield plate includes copper sheet 11 and silver layer, silver coated on copper sheet.
Preferably, the thickness of copper sheet 11 is 0.1mm~0.35mm, and the width of copper sheet 11 is not more than 80mm.In an implementation
In example, the thickness of copper sheet 11 is 0.25mm；In one embodiment, the width of the width of copper sheet 11 is 60mm；In an implementation
In example, copper, the width of 11 width is 75mm；In one embodiment, the length of a roll of copper sheet 11 is 100~200m, specifically
Length needs determined according to the thickness of copper sheet.
Material preferably as the base material of sheffield plate 1 is Alloy-194 or C19200.
Preferably, the material of sheffield plate 1 is red metal.
As shown in Figure 6 to 7, the utility model additionally provides a kind of preparation method of unsupported encapsulated LED light source, bag
It includes：
S1：Prepare material；
S2：Sheffield plate is made, is specially：Including：
S201：It determines electroless copper plating film, is specially：Determine the material of electroless copper plating film and the thickness and width of electroless copper plating film；
S202：Operation is etched, is specially：Technique is etched to electroless copper plating film, will etching area protective film removal,
Chemical solution is contacted during etching, has the function that dissolved corrosion, is allowed to form the concave-convex or molding effect of hollow out；
Etch process is by materials'use chemical reaction or physical shock effect and the technology of removal, point temperature etching and dry corrosion
It carves, etching is also referred to as photochemical etching, and in the present embodiment using wet etching, etching line is designed according to product specification
Road.
The idiographic flow of etching is as follows：Sawing sheet-material preparation-material clean-drying-pad pasting or coating-drying-
Exposure-development-drying-etching-demoulding-completion；
S203：Micro- roughening treatment, specially：After electroless copper plating film is etched and then carry out at the micro- roughening of electroless copper plating film progress
Reason, handles electroless copper plating film surface to obtain a kind of structure of micro-rough, is allowed to become hydrophily from hydrophobicity, for improving
Electroless copper plating film surface is to the combination power of silver layer；
Micro- roughening is that workpiece surface is handled with Mechanical Method or chemical method, i.e., using mechanical wear or chemical attack
Workpiece surface is handled, carries out micro- roughening treatment on copper surface, the surface through micro- roughening can significantly improve metal surface
Real table area, and then improve adhesion property of the copper surface to silver layer；
S204：Silver coating operation, specially：After electroless copper plating film carries out micro- roughening treatment, then carried out on the surface of electroless copper plating film
Silver coating, the thickness of silver coating is depending on the different requirements of product quality, and the thickness of general silver coating is 1~4um；
Silver-plated to be silver-colored on nickel, another silver-plated point of full plating and choosing are plated, and full plating is that entire copper sheet is plated silver, and choosing plating is then only to plate
Functional areas, the utility model are applicable in, to be cost-effective, the mode of selection choosing plating；
S205：Section operation：Specially：The sheffield plate to complete using cutting die is cut off, cuts off ruler
Very little is 110~180mm；
S3：LED packaging technologies are carried out in sheffield plate.
A kind of preparation method of unsupported encapsulated LED light source provided in this embodiment, no branch provided by the utility model
Sheffield plate is consolidated after the completion of weldering and is encapsulated using mould top glue by the preparation method of the encapsulated LED light source of frame, simple for process, improves
Leakproofness, provides the associativity of sheffield plate and mould top glue, while eliminates traditional stent, realizes unsupported envelope
Dress mode considerably reduces the board human cost of upstream and downstream, has saved cost.
As shown in figure 8, in S3, carry out LED packaging technologies in sheffield plate and be included in setting formal dress crystalline substance on sheffield plate
The packaging technology of piece, including：
S3101：Prepare material, be specially：Preparing material is included sheffield plate, crystal-bonding adhesive, the chip needed for die bond, Gu
Brilliant glue shifts to an earlier date 2H and thaws and stir, and holds predetermined magazine successfully by copper sheet width, for bonder of die bond etc..
S3102：Expand brilliant operation, be specially：Formal dress chip is expanded, convenient for die bond operation；
S3103：Point crystal-bonding adhesive operation, specially：Crystal-bonding adhesive need to make choice according to the classification of formal dress chip, crystal-bonding adhesive root
It is selected according to the type of formal dress chip, vertical formal dress chip elargol die bond, plane formal dress chip insulating cement die bond.
S3104：Die bond operation, specially：Die bond operation is carried out using bonder；
S3105：Operation is toasted, is specially：Die bond semi-finished product are put into oven to toast, baking temperature and time requirement
It is determined by crystal-bonding adhesive；
S3106：Bonding wire operation, specially：Bonding wire operation is carried out by bonding equipment after the completion of baking；
S3107：Spray fluorescent powder operation：Specially：In order to which solid weldering semi-finished product is made preferably to be combined with mould top glue, spray is glimmering
Plasma machine is first carried out before light powder to be cleaned, the parameter of plasma machine can be measured by the test of water droplet angle board,
Water droplet angle is less than 5 degree, then can start to dust, and material is stored with magazine in operation process, is put into when idle in proof cabinet, spray
Solid weldering semi-finished product are fixed by the gauge that dusts during fluorescent powder, then are sprayed by the board that dusts；Dust glue match ratio by into
Depending on the parameter request of the setting of product LED light source；
S3108：Operation is toasted, is specially：Then characteristic of the condition of baking depending on the glue that dusts, first carries out low-temperature setting
It is roasting to carry out high temperature length；
S3109：The operation of mould top, specially：The semi-finished product that will dust carry out plasma cleaning using plasma cleaner, then
Mould top is carried out by mould top board and mold, the design of mould backform tool depends on the appearance and size and light emitting anger of LED light source finished product
Degree requirement；
S3110：Operation is toasted, is specially：After the completion of the operation of mould top, mould top semi-finished product are put in oven and are toasted, dried
Roasting temperature depends on the characteristic of mould top glue；
S3111：Cutting operation, specially：The mould top semi-finished product toasted are positioned over laminator, UV is pasted by laminator
Film operation, patch UV films are for stent top semi-finished product, then the mould top semi-finished product for posting UV films are positioned in cutting machine, cutting machine
Cutting process is finished by sheffield plate Cutting Road position and finished product appearance and size requirement in advance, then carries out cutting operation, is cut
Dispergation in UV dispergation machines is put into after finishing to be convenient for removing a point material single good；
S3112：Operation is toasted, is specially：Since cutting process using cutting crosses product with cooling water saturates, so needing
It is toasted, baking principle is dry moisture content to be toasted；
S3113：Operation is divided, is specially：The finished product LED light source of single will be divided by being divided board by production color area requirement
It is divided；
S3114：Braid operation, specially：Light splitting semi-finished product are subjected to braid operation, are used convenient for preserving with SMT processing procedures；
S3115：Packaging and storage, specially：The LED finished products for finishing band are vacuum-packed with antistatic bag, after finishing
Storage.
As shown in figure 8, in S3, carry out LED packaging technologies in sheffield plate and be included in setting upside-down mounting crystalline substance on sheffield plate
The packaging technology of piece, including：
S3201：Prepare material；
S3202：Expand brilliant operation, be specially：Flip chip is expanded, convenient for die bond operation；
S3203：Print solder paste operation, specially：With printing machine by paste solder printing on the position of sheffield plate die bond, print
Brush steel mesh perforate size determines that tin cream granular size is determined by wafer size by flip chip pad size；
S3204：Die bond operation, specially：Flip chip is fixed on to the position of print solder paste, then using bonder into
Row die bond operation；
S3205：Reflow Soldering operation, specially：Die bond semi-finished product are put into progress Reflow Soldering operation in reflow machine；
S3206：Spray fluorescent powder operation：Specially：In order to which solid weldering semi-finished product is made preferably to be combined with mould top glue, spray is glimmering
Plasma machine is first carried out before light powder to be cleaned, the parameter of plasma machine can be measured by the test of water droplet angle board,
Water droplet angle is less than 5 degree, then can start to dust, and material is stored with magazine in operation process, is put into when idle in proof cabinet, spray
Solid weldering semi-finished product are fixed by the gauge that dusts during fluorescent powder, then are sprayed by the board that dusts；Dust glue match ratio by into
Depending on the parameter request of the setting of product LED light source；
S3207：Operation is toasted, is specially：Then characteristic of the condition of baking depending on the glue that dusts, first carries out low-temperature setting
It is roasting to carry out high temperature length；
S3208：The operation of mould top, specially：The semi-finished product that will dust carry out plasma cleaning using plasma cleaner, then
Mould top is carried out by mould top board and mold, the design of mould backform tool depends on the appearance and size and light emitting anger of LED light source finished product
Degree requirement；
S3209：Operation is toasted, is specially：After the completion of the operation of mould top, mould top semi-finished product are put in oven and are toasted, dried
Roasting temperature depends on the characteristic of mould top glue；
S3210：Cutting operation, specially：The mould top semi-finished product toasted are positioned over laminator, UV is pasted by laminator
Film operation, patch UV films are for stent top semi-finished product, then the mould top semi-finished product for posting UV films are positioned in cutting machine, cutting machine
Cutting process is finished by sheffield plate Cutting Road position and finished product appearance and size requirement in advance, then carries out cutting operation, is cut
Dispergation in UV dispergation machines is put into after finishing to be convenient for removing a point material single good；
S3211：Operation is toasted, is specially：Since cutting process using cutting crosses product with cooling water saturates, so needing
It is toasted, baking principle is dry moisture content to be toasted；
S3212：Operation is divided, is specially：The finished product LED light source of single will be divided by being divided board by production color area requirement
It is divided；
S3213：Braid operation, specially：Light splitting semi-finished product are subjected to braid operation, are used convenient for preserving with SMT processing procedures；
S3214：Packaging and storage, specially：The LED finished products for finishing band are vacuum-packed with antistatic bag, after finishing
Storage.
It should be appreciated that for those of ordinary skills, can be improved or converted according to the above description,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Illustrative description is carried out to the utility model patent above in conjunction with attached drawing, it is clear that the reality of the utility model patent
Now be not subject to the restrictions described above, if employ the utility model patent methodology and technical solution carry out it is various
Improve or it is not improved the design of the utility model patent and technical solution are directly applied into other occasions, in this reality
With in new protection domain.
Claims (7)
1. a kind of unsupported encapsulated LED light source, which is characterized in that including sheffield plate, the first mould top glue, chip and the second mould
Push up glue, described sheffield plate the upper surface of be equipped with the first mould top glue and with the first mould top glue connection, the chip is arranged on
Described first mould top glue the upper surface of and with the first mould top glue connection, the second mould top glue is encapsulated in the first mould top glue
Above and by the wafer package in the second mould top glue.
2. unsupported encapsulated LED light source according to claim 1, which is characterized in that the chip is formal dress chip.
3. unsupported encapsulated LED light source according to claim 2, which is characterized in that the sheffield plate with it is described just
Crystal-bonding adhesive is equipped between dress chip, the sheffield plate passes through the die bond glue connection with the formal dress chip.
4. unsupported encapsulated LED light source according to claim 3, which is characterized in that the electrode of the formal dress chip with
The sheffield plate is connected by gold thread.
5. unsupported encapsulated LED light source according to claim 1, which is characterized in that the chip is flip chip.
6. unsupported encapsulated LED light source according to claim 5, which is characterized in that the sheffield plate with it is described fall
Tin cream is equipped between dress chip, the sheffield plate is connected with the flip chip by the tin cream.
7. unsupported encapsulated LED light source according to claim 1, which is characterized in that further include fluorescent powder, the fluorescence
In powder coating and the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409875.2U CN207425914U (en) | 2017-10-30 | 2017-10-30 | A kind of unsupported encapsulated LED light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409875.2U CN207425914U (en) | 2017-10-30 | 2017-10-30 | A kind of unsupported encapsulated LED light source |
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| CN207425914U true CN207425914U (en) | 2018-05-29 |
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| CN201721409875.2U Active CN207425914U (en) | 2017-10-30 | 2017-10-30 | A kind of unsupported encapsulated LED light source |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107634134A (en) * | 2017-10-30 | 2018-01-26 | 深圳市立洋光电子股份有限公司 | A kind of unsupported encapsulated LED light source and preparation method thereof |
-
2017
- 2017-10-30 CN CN201721409875.2U patent/CN207425914U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107634134A (en) * | 2017-10-30 | 2018-01-26 | 深圳市立洋光电子股份有限公司 | A kind of unsupported encapsulated LED light source and preparation method thereof |
| WO2019085479A1 (en) * | 2017-10-30 | 2019-05-09 | 深圳市立洋光电子股份有限公司 | Support-free packaged led light source and manufacturing method therefor |
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