CN207407389U - A kind of infrared temperature sensor structure of electromagnetic oven - Google Patents
A kind of infrared temperature sensor structure of electromagnetic oven Download PDFInfo
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- CN207407389U CN207407389U CN201721192311.8U CN201721192311U CN207407389U CN 207407389 U CN207407389 U CN 207407389U CN 201721192311 U CN201721192311 U CN 201721192311U CN 207407389 U CN207407389 U CN 207407389U
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- temperature
- electromagnetic oven
- temperature sensor
- sensitive lid
- sensor structure
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Abstract
The utility model discloses a kind of infrared temperature sensor structures of electromagnetic oven, including magnetic furnace base, coil panel is provided in the magnetic furnace base, the magnetic furnace base upper end is provided with the panel of supporting pan body, limit hole is formed in the panel, the temperature-sensitive lid of flexible contact pot is provided in the limit hole, the temperature-sensitive lid is internally provided with the measurement non-contacting infrared probe of temperature-sensitive lid temperature.The utility model can make temperature-sensitive lid be in compression fit-state with pot by telescopic temperature-sensitive lid, reception measurement is carried out to the heat radiation of temperature-sensitive lid by non-contacting infrared probe in temperature-sensitive lid, and calculate temperature of boiler, investigative range is increased by inverted draw cut, assembling, flexible and driving are realized by support base, the utility model thermometric is accurate, rapid.
Description
Technical field
The utility model belongs to a kind of parts of electric energy heating stove, and in particular to a kind of infrared temperature-sensitive knot of electromagnetic oven
Structure.
Background technology
Electromagnetic oven is also known as electromagnetic stove, and the changing alternating magnetic field in direction is generated by coil using alternating current,
The inside of conductor in alternating magnetic field will be present with vortex current, and the joule heating effect of vortex current makes conductor heat up, from
And realize heating.
Electromagnetic oven generally includes following component, for the main base of high pressure for carrying the panel of cookware, forming main current loop
Plate, the low pressure main substrate for computer control function, display working condition and transmission operational order LED circuit board hand over high frequency
Time-dependent current is converted into the coil panel of alternating magnetic field, controlled by low current signal high current break-make IGBT, by AC power
Temperature controller component for be converted to the bridge rectifier block of DC power supply, heat signal being transferred to control circuit etc..
At present, sold electromagnetic oven temperature-sensing element temperature surface is substantially and is arranged on microcrystal glass plate bottom on the market, in reality
Because the hysteresis quality of devitrified glass temperature-sensitive in the course of work of border, the temperature of temperature-sensing element sensing and the temperature difference of food materials inside cookware
It is different very big, electromagnetic oven cooking is caused often to be sticking.
At present, there is related patents proposition that infrared temperature-sensing probe is set in electromagnetic oven for gathering electromagnetic oven cooking pot tool
Real time temperature data by the characteristic of infrared sensor, are gathered using the characteristic of the external heat radiation of material by infrared sensor
Signal identifies cookware temperature, promotes temperature-sensitive accuracy.But due on the market can the cookware material species that uses of mating electromagnetic oven
It is more, and cookware process of surface treatment is even more numerous and diverse various.These can all influence the slin emissivity of cookware Facing material, according to
This parameter of this fence of making a mistake-Boltzmann's law material surface emissivity is to directly affect infrared temperature-sensing probe for temperature data again
Judgement.Therefore, set the temperature signal that the infrared sensor of similary parameter is gathered in mating different cookwares can be because of cookware material
The variation of matter, the difference of process of surface treatment and there is bigger deviation, influence temperature-sensitive accuracy.
The content of the invention
The utility model for solve the problems, such as it is existing in the prior art propose, the purpose is to provide a kind of electromagnetic oven infrared sense
Warm structure.
The technical solution of the utility model is：A kind of infrared temperature sensor structure of electromagnetic oven, including magnetic furnace base, the magnetic furnace bottom
Coil panel is provided in seat, the magnetic furnace base upper end is provided with the panel of supporting pan body, and limit hole, institute are formed in the panel
The temperature-sensitive lid that flexible contact pot is provided in limit hole is stated, the temperature-sensitive lid is internally provided with measurement temperature-sensitive lid temperature and is connect with non-
Tactile infrared probe., the temperature-sensitive lid material is heat transfer is good and the fixed material of material surface emissivity such as copper, aluminium, stone
Ink etc..
Guide channel is formed in the coil panel, the guide channel and limit hole are coaxial.
Telescoping support seat is provided in the guide channel, temperature-sensitive lid is provided on the support base.
The support base upper end forms inverted draw cut, and the pilot hole connected with inverted draw cut is formed in support base.
The infrared probe is arranged in pilot hole, and infrared probe end of probe is located in inverted draw cut.
Mounting ring is formed at the support base outer wall, the mounting ring is slided along guide channel.
The mounting ring lower end forms card slot, and the spring of driving support base is provided in the card slot.
The mounting ring forms side channel with support base transition position.
It is clearance fit between temperature-sensitive lid, limit hole between the mounting ring, guide channel.
The utility model can make temperature-sensitive lid be in compression fit-state with pot by telescopic temperature-sensitive lid, pass through sense
Non-contacting infrared probe carries out reception measurement to the heat radiation of temperature-sensitive lid in temperature lid, and calculates temperature of boiler, passes through inverted draw cut
Increase investigative range, assembling, flexible and driving are realized by support base, the utility model thermometric is accurate, rapid.
Description of the drawings
Fig. 1 is the front view of the utility model；
Fig. 2 is that the utility model places the front view after pot；
Fig. 3 is the assembling schematic diagram of support base in the utility model；
Wherein：
1 coil panel, 2 panel
3 temperature-sensitive lid, 4 infrared probe
5 support base, 6 pot
7 inverted draw cut, 8 side channel
9 mounting ring, 10 pilot hole
11 card slots.
Specific embodiment
Hereinafter, the utility model is described in detail with embodiment referring to the drawings：
As shown in Fig. 1 ~ 3, a kind of infrared temperature sensor structure of electromagnetic oven including magnetic furnace base, is provided in the magnetic furnace base
Coil panel 1, the magnetic furnace base upper end are provided with the panel 2 of supporting pan body 6, limit hole, the /V are formed in the panel 2
It is provided with the temperature-sensitive lid 3 of flexible contact pot 6 in hole, the temperature-sensitive lid 3 is internally provided with 3 temperature of measurement temperature-sensitive lid with non-contact
Infrared probe 4., 3 material of temperature-sensitive lid is heat transfer is good and the fixed material of material surface emissivity such as copper, aluminium, stone
Ink etc..
The pot 6 is placed on panel 2, and temperature-sensitive lid 3 is pressed by pot 6 in panel 2, while in the effect of pressing force
Lower 3 upper end of temperature-sensitive lid can compress with the bottom of pot 6 and be bonded, and temperature-sensitive lid 3 is with specific slin emissivity by the temperature shape of itself
State passes to 4 infrared probe 4 of infrared probe by the form of heat radiation can draw current cookware temperature shape by handling computing
State information.
Guide channel is formed in the coil panel 1, the guide channel and limit hole are coaxial.
The limit hole can only be by temperature-sensitive lid 3, so as to limit the axial length leant out of temperature-sensitive lid 3.
The guide channel can be oriented to the support base 5 for supporting temperature-sensitive lid 3.
The guide channel, limit hole are located at the center of panel 2.
Telescoping support seat 5 is provided in the guide channel, temperature-sensitive lid 3 is provided on the support base 5.
The temperature-sensitive lid 3 is held in the upper end of support base 5.
5 upper end of support base forms inverted draw cut 7, and the pilot hole 10 connected with inverted draw cut 7 is formed in support base 5.
The slot footpath of the inverted draw cut 7 is more than the aperture of pilot hole 10, so as to increase the temperature-sensitive area of infrared probe 4, carries
The accuracy of high temperature-sensitive data.
The pilot hole 10 is stepped hole, facilitates the assembling of infrared probe 4.
The infrared probe 4 is arranged in pilot hole 10, and 4 end of probe of infrared probe is located in inverted draw cut 7.
Mounting ring 9 is formed at 5 outer wall of support base, the mounting ring 9 is slided along guide channel.
9 lower end of mounting ring forms card slot 11, and the spring of driving support base 5 is provided in the card slot 11.
The mounting ring 9 forms side channel 8 with 5 transition position of support base.
The side channel 8 can make 3 lower end of temperature-sensitive lid neither contact with mounting ring 9 nor be contacted with support base 5.
It is clearance fit between temperature-sensitive lid 3, limit hole between the mounting ring 9, guide channel.
The spring pocket is mounted in 5 lower end of support base and passes through the progress upper limit of card slot 11.
3 material of temperature-sensitive lid is heat transfer is good and the fixed material of material surface emissivity such as copper, aluminium, graphite etc..
The utility model can make temperature-sensitive lid be in compression fit-state with pot by telescopic temperature-sensitive lid, pass through sense
Non-contacting infrared probe carries out reception measurement to the heat radiation of temperature-sensitive lid in temperature lid, and calculates temperature of boiler, passes through inverted draw cut
Increase investigative range, assembling, flexible and driving are realized by support base, the utility model thermometric is accurate, rapid.
Claims (9)
1. including magnetic furnace base, coil panel is provided in the magnetic furnace base for a kind of infrared temperature sensor structure of electromagnetic oven（1）, it is described
Magnetic furnace base upper end is provided with supporting pan body（6）Panel（2）, it is characterised in that：The panel（2）Middle formation limit hole, institute
It states and flexible contact pot is provided in limit hole（6）Temperature-sensitive lid（3）, the temperature-sensitive lid（3）It is internally provided with measurement temperature-sensitive lid
（3）The non-contacting infrared probe of temperature（4）, the temperature-sensitive lid（3）Material is that heat transfer is good and material surface emissivity is consolidated
Fixed material, the material is copper, one kind in aluminium, graphite.
2. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 1, it is characterised in that：The coil panel（1）Middle shape
Into guide channel, the guide channel and limit hole are coaxial.
3. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 2, it is characterised in that：It is set in the guide channel
There is telescoping support seat（5）, the support base（5）On be provided with temperature-sensitive lid（3）.
4. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 3, it is characterised in that：The support base（5）Upper end
Form inverted draw cut（7）, support base（5）Middle formation and inverted draw cut（7）The pilot hole of connection（10）.
5. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 4, it is characterised in that：The infrared probe（4）If
It puts in pilot hole（10）In, infrared probe（4）End of probe is located at inverted draw cut（7）In.
6. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 3, it is characterised in that：The support base（5）Outer wall
Place forms mounting ring（9）, the mounting ring（9）It is slided along guide channel.
7. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 6, it is characterised in that：The mounting ring（9）Lower end
Form card slot（11）, the card slot（11）In be provided with driving support base（5）Spring.
8. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 6, it is characterised in that：The mounting ring（9）With branch
Support seat（5）Transition position forms side channel（8）.
9. a kind of infrared temperature sensor structure of electromagnetic oven according to claim 6, it is characterised in that：The mounting ring（9）, be oriented to
Between passage, temperature-sensitive lid（3）, between limit hole be clearance fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721192311.8U CN207407389U (en) | 2017-09-18 | 2017-09-18 | A kind of infrared temperature sensor structure of electromagnetic oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721192311.8U CN207407389U (en) | 2017-09-18 | 2017-09-18 | A kind of infrared temperature sensor structure of electromagnetic oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207407389U true CN207407389U (en) | 2018-05-25 |
Family
ID=62405747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721192311.8U Active CN207407389U (en) | 2017-09-18 | 2017-09-18 | A kind of infrared temperature sensor structure of electromagnetic oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207407389U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112336169A (en) * | 2020-10-23 | 2021-02-09 | 中国航天员科研训练中心 | Frying pan assembly |
-
2017
- 2017-09-18 CN CN201721192311.8U patent/CN207407389U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112336169A (en) * | 2020-10-23 | 2021-02-09 | 中国航天员科研训练中心 | Frying pan assembly |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 01-04, 1st floor, No.2 Lane 60, Naxian Road, Pudong New Area pilot Free Trade Zone, Shanghai 201203 Patentee after: Chunmi Technology (Shanghai) Co.,Ltd. Patentee after: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Address before: 201203 room 01-04, 1st floor, building 2, 60 Naxian Road, Pudong New Area, Shanghai Patentee before: SHANGHAI CHUNMI ELECTRONICS TECHNOLOGY Co.,Ltd. Patentee before: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. |