CN207358004U - A kind of IC pin-forming molds - Google Patents

A kind of IC pin-forming molds Download PDF

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Publication number
CN207358004U
CN207358004U CN201720912046.XU CN201720912046U CN207358004U CN 207358004 U CN207358004 U CN 207358004U CN 201720912046 U CN201720912046 U CN 201720912046U CN 207358004 U CN207358004 U CN 207358004U
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CN
China
Prior art keywords
crimps
pin
fixed seat
roller
latch
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Active
Application number
CN201720912046.XU
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Chinese (zh)
Inventor
梁锦昌
门洪达
陶建军
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Dongguan guanzai robot Co., Ltd
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Dongguan View Automation Equipment Co Ltd
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Abstract

A kind of IC pin-forming molds of the utility model, include fixed seat, both crimps, skewback device and cavity plate, the fixed seat is installed on upper mold seat, the fixed seat is hollow structure, the skewback device is arranged in the hollow structure, the fixed seat both sides are arranged with both crimps, the both crimps are vertically set on the fixed seat both ends by the latch, the inner side of the both crimps upper end is equipped with the roller protruded on the inside of the both crimps, the bevel edge of outside extension downwards is equipped with the middle part of the skewback device, the bevel edge is correspondingly arranged at the lower section of the roller, binder block is installed with below the skewback device, the cavity plate is equipped with the groove for placing IC, the cavity plate is equipped with shaping side, formed when the relatively described both crimps of skewback device are moved upwards and clamp movement.The utility model is molded when shaping IC pins using the method for cramping, and pin caused by solving punch forming mode scratches.

Description

A kind of IC pin-forming molds
Technical field
The utility model is specifically related to a kind of IC pin-forming molds.
Background technology
SOP encapsulate, also known as dual-inline package technology, English is Small Out-Line Package, be one kind most One of simple surfaces mount packages, it is in sea-gull wing (zigzag) that pin is drawn from encapsulation both sides, most middle and small scale collection This packing forms are used into circuit (IC).The pin forming mode of traditional more general SOP class wrappers be rigidity into Type mode (i.e. punching type bending and molding), rigid molding mode is simple in structure, since rigid molding mode is being drawn using punch-pin The mode of foot surface contact slide makes pin bending and molding, and the tin coating for inevitably resulting in pin surface is scratched, particularly long After time use, due to the accumulation of convex mould surface tin layers, it is possible to the pin surface of product can be made dew copper phenomenon occur, finally Cause product rejection.
Utility model content
The purpose of this utility model is to provide a kind of cramping mode prevent IC pins scratch IC pin-forming molds, with Solve the technical problem in background technology.
To realize object defined above, the utility model provides following technical solution:
A kind of IC pin-forming molds, comprising fixed seat, both crimps, skewback device and cavity plate, the fixed seat is installed in On upper mold seat, the fixed seat is hollow structure, and the skewback device is arranged in the hollow structure, on the skewback device End is through the fixed seat upper end and is arranged in the upper mold seat, and the fixed seat both sides are arranged with both crimps, the folder Latch is equipped with the middle part of casting die, the latch both ends are installed in the fixed seat, and the both crimps are vertical by the latch The fixed seat both ends are arranged on, the inner side of the both crimps upper end is equipped with the roller protruded on the inside of the both crimps, described oblique The bevel edge of outside extension downwards is equipped with the middle part of block assembly, the bevel edge is correspondingly arranged at the lower section of the roller, the skewback Binder block is installed with below device, the cavity plate is installed on die holder, and the cavity plate is equipped with the groove for placing IC, the pressure Be equipped with the groove identical with the groove structure below material block, the cavity plate be equipped with protrusion and with the both crimps lower junction The corresponding shaping side of structure, when the relatively described both crimps of skewback device are moved upwards, the bevel edge extrudes the roller to two Side move and drive the both crimps top using the latch as side rotary motion axially outward at the same time the both crimps lower part to Inner side rotary motion, which is formed, clamps movement, and when the both crimps lower part clamp movement, the both crimps lower part corresponds to movement To outside the shaping side.
Further, the lower part corner of the fixed seat is equipped with four fixed claws, and fixed claw described in each two is equipped with knot The both crimps are installed in two institutes by the pin hole for wearing latch of structure and position correspondence, the latch through the pin hole State between fixed claw.
Further, the inner side on the both crimps top is equipped with the mounting groove for installing the roller, and the pair of rollers should be set Put in the mounting groove, roller pin is equipped with inside the roller, the roller pin both ends are correspondingly arranged at the both crimps Top.
Further, the skewback device upper end is installed with limited block, and the limited block top is additionally provided with spring, the bullet Spring contacts setting with the upper mold seat.
Further, it is additionally provided with the cushion block being convenient for changing between the skewback device and binder block.
Further, be equipped with the fixed seat top and suppress part, it is described suppress part suppress it is inclined above the roller Outer fix.
Further, thimble is additionally provided with the cavity plate, spring is equipped with below the thimble.
Compared with prior art, the beneficial effect that the utility model produces has:
The utility model is molded using the method for cramping, drawn caused by solving punch forming mode when shaping IC pins Foot scratches.
Various sizes of IC can be molded by replacing cushion block, and use scope is wider.
Roller is contacted with bevel edge for roll mode, and frictional force is small, and service life is longer.
The IC that thimble can complete shaping conveniently takes out out of cavity plate.
Brief description of the drawings
Fig. 1:A kind of diagrammatic cross-section of IC pin-forming molds.
Fig. 2:A kind of fixed seat structure figure of IC pin-forming molds.
Fig. 3:A kind of both crimps schematic diagram of IC pin-forming molds.
Fig. 4:A kind of operation principle schematic diagram of IC pin-forming molds.
Fig. 5:A kind of IC pin-forming molds part of the upper die stereogram.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out Clearly and completely describe.
Please refer to Fig.1 to Fig. 5, in the utility model embodiment, a kind of IC pin-forming molds, comprising upper die and lower die, Wherein fixed seat 1, both crimps 2, skewback device 3 and upper mold seat form upper mold, and fixed seat 1, both crimps 2 and skewback device 3 are fixed On upper mold seat, cavity plate 4 and die holder form lower die, and cavity plate 4 is fixed on die holder, and the fixed seat 1 is hollow structure, institute State skewback device 2 to be arranged in the hollow structure, 2 upper end of skewback device is set through 1 upper end of fixed seat and extension To put in the upper mold seat, 1 both sides of fixed seat are arranged with both crimps 2, and the middle part of both crimps 2 is equipped with latch 21, 21 both ends of latch are installed in the fixed seat 1, and the both crimps 2 are vertically set on the fixation by the latch 21 1 both ends of seat, the inner side (inner side refers to the side inside under normal circumstances) of 2 upper end of both crimps are equipped with and protrude the folder The roller 22 of the inner side of casting die 2, the middle part of skewback device 3 is equipped with the bevel edge 31 that outside extends downwards, and (bevel edge 31 forms prominent Rise), under upper mold state, the bevel edge 31 is correspondingly arranged at the lower section of the roller 22, and the lower section of skewback device 2 is installed with Binder block 5, is additionally provided with the cushion block 51 being convenient for changing between skewback device 3 and binder block 5, replace the cushion block 51 of different-thickness, can To be molded various sizes of IC, the cavity plate 4 is equipped with the groove 41 for placing IC, the lower section of binder block 51 be equipped with it is described The identical groove of 41 structure of groove, the cavity plate 4 are equipped with shaping side prominent and corresponding with 2 substructure of both crimps 42, when being molded IC, first IC is placed in groove 41, IC pins positioned at shaping while on 42 and extend to shaping while 42 outside, Upper mold moves downward, and when upper mold moves to certain position, binder block 5 first pushes down IC, when upper mold is moved still further below at this time, due to Binder block 5 has touched IC and can not move downward, and then skewback device 3 can not also move downward, and both crimps 2 continue to Lower movement (being moved upwards equivalent to the relatively described both crimps 2 of skewback device 3), bevel edge 31 extrudes the roller 22 and is moved to both sides And drive 2 top of both crimps with the latch 21 for side rotary motion axially outward while the inside sidespin in 2 lower part of both crimps Dynamic formed of transhipment clamps movement, and when 2 lower part of both crimps clamp movement, 2 lower part of both crimps corresponds to and moves to institute State outside shaping side 42, IC pins are clamped between both crimps 2 and shaping side 42, complete the shaping of IC pins.
Referring to Fig. 2, (lower part refers to that under normal operating condition fixed seat 1 is upward in the utility model embodiment Position be top, device downward is lower part, for the structure of clear explanation fixed seat 1 in Fig. 2, upward be 1 lower part of fixed seat), the lower part corner of the fixed seat 1 is equipped with four fixed claws 21, and fixed claw 21 described in each two is equipped with knot The pin hole 12 for wearing latch 21 of structure and position correspondence, the latch 21 consolidate the both crimps 2 through the pin hole 12 It is located between two fixed claws 11.
Referring to Fig. 3, in the utility model embodiment, the inner side on 2 top of both crimps, which is equipped with, installs the roller 22 Mounting groove, the roller 22 is correspondingly arranged in the mounting groove, and roller pin 221 is equipped with inside the roller 22, described 221 both ends of roller pin are correspondingly arranged at 2 top of both crimps.
Referring to Fig. 1, in the utility model embodiment, 3 upper end of skewback device is installed with limited block 32, described spacing 32 top of block is additionally provided with spring, and the spring contacts setting with the upper mold seat, when under die opening state, under the action of the spring, Skewback device 3 moves downward at the same time with limited block 32, bevel edge 31 is located at the lower section of roller 22, when limited block 32 is moved downwardly to When contacting 1 upper end of fixed seat, limited block 32 stops moving downward and then limiting skewback device 3 continuing to move downward, and prevents skewback Device 3 comes off out of fixed seat 1.
Please refer to Fig.1 and Fig. 4, being equipped with installation in the utility model embodiment, in 1 top of fixed seat suppresses part 6 Mounting hole, suppresses part 6 and is correspondingly arranged on roller 22 and identical with the quantity of both crimps 2, suppress part 6 and suppress in the roller The inclined outer fix of 22 tops, suppresses part 6 and is made of spring and hoodle, hoodle under the action of the spring, is directly suppressed in roller Inclined outer fix on 22, when the bevel edge 31 of skewback device 3 is located at the lower position of roller 22, roller 22 is suppressing the work of part 6 With lower inwardly lateral movement and drive the top of both crimps 2 with latch 21 for side rotary motion axially inwards, make the lower part of both crimps 2 In open configuration.
Thimble 43 is additionally provided with the cavity plate 4, the lower section of thimble 43 is equipped with spring, after the completion of IC pin formings, top The movement upwards under the action of the spring of pin 43, IC is ejected upwards, the convenient IC for taking out shaping and completing.
It is obvious to a person skilled in the art that the utility model is not limited to the details of foregoing example embodiment, and And in the case of the spirit or essential attributes without departing substantially from the utility model, it can realize that this practicality is new in other specific forms Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new The scope of type limits by appended claims rather than preceding description, it is intended that the equivalency fallen in claim is contained All changes in justice and scope are embraced therein.Any reference numeral in claim should not be considered as limitation Involved claim.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped Containing an independent technical solution, this narrating mode of specification is only that those skilled in the art should for clarity Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art It is appreciated that other embodiment.

Claims (7)

1. a kind of IC pin-forming molds, include fixed seat, both crimps, skewback device and cavity plate, it is characterised in that the fixation Seat is installed on upper mold seat, and the fixed seat is hollow structure, and the skewback device is arranged in the hollow structure, described oblique Block assembly upper end is through the fixed seat upper end and is arranged in the upper mold seat, and the fixed seat both sides are arranged with cramping Part, the both crimps middle part are equipped with latch, and the latch both ends are installed in the fixed seat, and the both crimps pass through described Latch is vertically set on the fixed seat both ends, and the inner side of the both crimps upper end is equipped with the rolling protruded on the inside of the both crimps Wheel, the skewback device middle part are equipped with the bevel edge of outside extension downwards, and the bevel edge is correspondingly arranged at the lower section of the roller, Binder block is installed with below the skewback device, the cavity plate is installed on die holder, and the cavity plate, which is equipped with, places the recessed of IC Groove, is equipped with the groove identical with the groove structure below the binder block, the cavity plate be equipped with protrusion and with the folder The corresponding shaping side of casting die substructure, when the relatively described both crimps of skewback device are moved upwards, the bevel edge extrudes institute Roller is stated to move to both sides and drive the both crimps top using the latch as side rotary motion axially outward while the folder Rotary motion forms cramping movement inwardly for casting die lower part, when the both crimps lower part clamp movement, under the both crimps Portion, which corresponds to, to be moved to outside the shaping side.
A kind of 2. IC pin-forming molds according to claim 1, it is characterised in that:The lower part corner of the fixed seat is set There are four fixed claws, fixed claw described in each two is equipped with the pin hole for wearing latch of structure and position correspondence, the latch The both crimps are installed in two fixed claws through the pin hole.
A kind of 3. IC pin-forming molds according to claim 2, it is characterised in that:Set on the inside of the both crimps top There is the mounting groove for installing the roller, the roller is correspondingly arranged in the mounting groove, and roller is equipped with inside the roller Pin, the roller pin both ends are correspondingly arranged at the both crimps top.
A kind of 4. IC pin-forming molds according to claim 3, it is characterised in that:The skewback device upper end is installed with Limited block, the limited block top are additionally provided with spring, and the spring contacts setting with the upper mold seat.
A kind of 5. IC pin-forming molds according to claim 4, it is characterised in that:The skewback device and binder block it Between be additionally provided with the cushion block being convenient for changing.
A kind of 6. IC pin-forming molds according to claim 5, it is characterised in that:Bullet is equipped with the fixed seat top Casting die, the part that suppresses suppress inclined outer fix above the roller.
A kind of 7. IC pin-forming molds according to claim 6, it is characterised in that:Thimble is additionally provided with the cavity plate, Spring is equipped with below the thimble.
CN201720912046.XU 2017-07-26 2017-07-26 A kind of IC pin-forming molds Active CN207358004U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720912046.XU CN207358004U (en) 2017-07-26 2017-07-26 A kind of IC pin-forming molds

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720912046.XU CN207358004U (en) 2017-07-26 2017-07-26 A kind of IC pin-forming molds

Publications (1)

Publication Number Publication Date
CN207358004U true CN207358004U (en) 2018-05-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720912046.XU Active CN207358004U (en) 2017-07-26 2017-07-26 A kind of IC pin-forming molds

Country Status (1)

Country Link
CN (1) CN207358004U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111112495A (en) * 2019-12-03 2020-05-08 铜陵三佳山田科技股份有限公司 Flexible forming method and forming die for pins of SOT integrated circuit packaging products
CN112387898A (en) * 2020-10-27 2021-02-23 华东光电集成器件研究所 Shaping device for shaping plug-in component into surface-mounted component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111112495A (en) * 2019-12-03 2020-05-08 铜陵三佳山田科技股份有限公司 Flexible forming method and forming die for pins of SOT integrated circuit packaging products
CN112387898A (en) * 2020-10-27 2021-02-23 华东光电集成器件研究所 Shaping device for shaping plug-in component into surface-mounted component
CN112387898B (en) * 2020-10-27 2024-03-22 华东光电集成器件研究所 Shaping device for shaping plug-in components into mounted components

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Address after: 523000 Guangdong province Dongguan City Dalingshan Town Village Industrial Zone B building

Patentee after: Dongguan guanzai robot Co., Ltd

Address before: 523000 Guangdong province Dongguan City Dalingshan Town Village Industrial Zone B building

Patentee before: DONGGUAN AVATAR SYSTEMS AUTOMATION EQUIPMENT Co.,Ltd.

CP01 Change in the name or title of a patent holder