CN219028216U

CN219028216U - Floating embedded block assembly of camera module chip packaging die cavity

Info

Publication number: CN219028216U
Application number: CN202222954679.0U
Authority: CN
Inventors: 陈健; 杜伟娜
Original assignee: Shenzhen Yihao Precision Semiconductor Equipment Co ltd
Current assignee: Shenzhen Yihao Precision Semiconductor Equipment Co ltd
Priority date: 2022-11-07
Filing date: 2022-11-07
Publication date: 2023-05-16
Anticipated expiration: 2032-11-07

Abstract

The utility model relates to the technical field of wafer processing, in particular to a floating insert assembly of a die cavity of a camera module chip package. The floating cog assembly of the die cavity of the chip encapsulation of the camera module, including upper die carrier, cope match-plate pattern, backup pad and multiple floating cog; the upper die plate and the supporting plate are arranged up and down and are arranged on the upper die frame, the floating embedded blocks can be arranged on the supporting plate in a vertically floating mode, and the lower side faces of the floating embedded blocks are exposed below the supporting plate and spliced to form a pressing surface for pressing the surface of the wafer to be packaged. The chip packaging device mainly comprises a plurality of floating embedded blocks, wherein a pressing surface for pressing the surface of a chip to be packaged is formed by splicing the lower side surfaces of the floating embedded blocks, and in practice, even if the upper surface of the chip is uneven, the floating embedded blocks can automatically adapt to the surface of the chip with different heights, so that the chip is sufficiently pressed, and the packaging quality is ensured.

Description

Floating embedded block assembly of camera module chip packaging die cavity

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a floating insert assembly of a die cavity of a camera module chip package.

Background

For the manufacture of the camera module chip, when the wafer is packaged, the wafer is required to be placed in a corresponding packaging mould, then the wafer is pressed by an upper mould to position the wafer, and the upper surface of the wafer is inevitably uneven due to the problem of processing precision, so that the situation that the upper mould cannot sufficiently press the wafer, the packaging quality is reduced, and even unqualified products appear.

Disclosure of Invention

In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its main objective is to provide a floating insert assembly for a die cavity of a camera module chip package, which enables an upper die to fully press a die, thereby ensuring the package quality.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

a floating insert assembly of a die cavity of a camera module chip package comprises an upper die carrier, an upper die plate, a supporting plate and a plurality of floating inserts; the upper die plate and the supporting plate are arranged up and down and are arranged on the upper die frame, the floating embedded blocks are arranged on the supporting plate in a vertically floating mode, the lower side faces of the floating embedded blocks are exposed below the supporting plate and are spliced to form a pressing surface for pressing the surface of a wafer to be packaged, and an elastic piece which enables the floating embedded blocks to move downwards all the time is arranged between the floating embedded blocks and the supporting plate.

Preferably, the lower side of the floating insert is square or rectangular.

Preferably, the floating inserts are at least three in transverse rows and three in longitudinal rows.

As a preferable scheme, a plurality of guide sliding grooves which are communicated up and down are formed in the supporting plate, the upper surface of the body of each floating embedded block is provided with a guide sliding rod which protrudes upwards, and each guide sliding rod is in sliding fit connection with the corresponding guide sliding groove.

As a preferable scheme, the elastic piece is a plurality of springs, each spring is sleeved on the corresponding guide sliding rod, and two ends of the spring respectively prop against the lower side surface of the supporting plate and the upper surface of the body of the floating insert.

Compared with the prior art, the utility model has obvious advantages and beneficial effects, in particular, the technical proposal shows that the utility model mainly comprises a plurality of floating embedded blocks, and the pressing surface for pressing the surface of the wafer to be packaged is formed by splicing the lower side surfaces of the floating embedded blocks, in practice, even if the upper surface of the wafer is uneven, the floating embedded blocks can automatically adapt to the surfaces of wafers with different heights, thereby sufficiently pressing the wafer and ensuring the packaging quality.

In order to more clearly illustrate the structural features and efficacy of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and examples.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present utility model.

FIG. 2 is a schematic diagram of another view of an embodiment of the present utility model.

FIG. 3 is a cross-sectional view of an embodiment of the present utility model.

FIG. 4 is a schematic view of a portion of the structure of an embodiment of the present utility model.

Reference numerals illustrate:

10. a die carrier is arranged; 20. an upper template; 30. a support plate; 31. a guide chute; 40. a floating insert; 41. a pressing surface; 42. a guide slide bar; 50. an elastic member.

Detailed Description

For the purpose of making the technical solution and advantages of the present utility model more apparent, the present utility model will be further described in detail below with reference to the accompanying drawings and examples of implementation. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Referring to fig. 1 to 4, an embodiment of the present utility model provides a floating insert assembly of a die cavity of a chip package of a camera module, which includes an upper die frame 10, an upper die plate 20, a support plate 30, and a plurality of floating inserts 40; the upper mold plate 20 and the support plate 30 are arranged up and down and are both arranged on the upper mold frame 10, a plurality of floating embedded blocks 40 are arranged on the support plate 30 in a vertically floating manner, the lower side surfaces of the floating embedded blocks 40 are exposed below the support plate 30 and are spliced to form a pressing surface 41 for pressing the surface of a wafer to be packaged, and an elastic piece 50 which enables the floating embedded blocks 40 to always move downwards is arranged between the floating embedded blocks 40 and the support plate 30. By providing the plurality of floating embedded blocks 40, and the pressing surface 41 for pressing the surface of the wafer to be packaged is formed by splicing the lower side surfaces of the plurality of floating embedded blocks 40, in practice, even if the upper surface of the wafer is uneven, the plurality of floating embedded blocks 40 can automatically adapt to the wafer surfaces with different heights, thereby sufficiently pressing the wafer and ensuring the packaging quality.

Further, the lower side of the floating insert 40 is square or rectangular, and in this embodiment, the lower side of the floating insert 40 is square, however, in other embodiments, other polygons, such as pentagons and hexagons, are also possible, but not limited to.

Further, the number of the floating blocks 40 is at least three in a horizontal row and three in a vertical row, preferably, the number of the floating blocks 40 is six in a horizontal row and six in a vertical row, and the larger the number of the floating blocks 40 is, the more the floating blocks can adapt to the concave-convex state of the wafer surface, so that the floating blocks can be in contact with the wafer surface more fully.

Further, specifically, in order to realize the up-and-down movement of the floating cog block 40, the supporting plate 30 is provided with a plurality of guiding sliding grooves 31 penetrating up and down, the upper surface of the body of each floating cog block 40 is provided with a guiding sliding rod 42 protruding upwards, each guiding sliding rod 42 is slidably matched and connected with the corresponding guiding sliding groove 31, the elastic member 50 is a plurality of springs, each spring is sleeved on the corresponding guiding sliding rod 42, and two ends of each spring respectively abut against the lower side surface of the supporting plate 30 and the upper surface of the body of the floating cog block 40.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the utility model, but any modifications, equivalents, improvements, etc. within the principles of the present utility model should be included in the scope of the present utility model.

Claims

1. A floating insert assembly for a camera module chip package mold cavity, characterized by: comprises an upper die frame, an upper die plate, a supporting plate and a plurality of floating embedded blocks; the upper die plate and the supporting plate are arranged up and down and are arranged on the upper die frame, the floating embedded blocks are arranged on the supporting plate in a vertically floating mode, the lower side faces of the floating embedded blocks are exposed below the supporting plate and are spliced to form a pressing surface for pressing the surface of a wafer to be packaged, and an elastic piece which enables the floating embedded blocks to move downwards all the time is arranged between the floating embedded blocks and the supporting plate.

2. The floating insert assembly of claim 1, wherein the cavity is encapsulated by a camera module chip: the lower side surface of the floating embedded block is square or rectangular.

3. The floating insert assembly of claim 1, wherein the cavity is encapsulated by a camera module chip: the floating inserts are at least three in transverse rows and three in longitudinal rows.

4. The floating insert assembly of claim 1, wherein the cavity is encapsulated by a camera module chip: a plurality of guide sliding grooves which are vertically communicated are formed in the supporting plate, the upper surface of the body of each floating embedded block is provided with a guide sliding rod which protrudes upwards, and each guide sliding rod is in sliding fit connection with the corresponding guide sliding groove.

5. The floating insert assembly of claim 4, wherein said cavity is encapsulated by said camera module chip: the spring is a plurality of springs, each spring is sleeved on the corresponding guide sliding rod, and two ends of the spring respectively prop against the lower side surface of the supporting plate and the upper surface of the body of the floating embedded block.