CN213106751U

CN213106751U - Anti-collision storage device for semiconductor precision die

Info

Publication number: CN213106751U
Application number: CN202022061954.7U
Authority: CN
Inventors: 张一恒
Original assignee: Shijiazhuang Xinyue Precision Mould Co ltd
Current assignee: Tunghsu Technology Group Co Ltd
Priority date: 2020-09-19
Filing date: 2020-09-19
Publication date: 2021-05-04
Anticipated expiration: 2030-09-19

Abstract

The utility model relates to an accurate mould technical field discloses an anticollision strorage device for accurate mould of semiconductor, including last mould and lower mould, going up the mould and being located the lower mould directly over, the both sides top surface of lower mould all is fixed with a piece, and the surface of a piece has seted up a groove, the last mould downside fixed surface of a piece top has a bottom plate, and the last mould fixed surface of bottom plate top has an upper fixed plate, and vertical slidable between upper fixed plate and the bottom plate runs through there is branch, and the below of branch is located a piece directly over, and the top welding of branch has last limiting plate. The utility model discloses a vertical branch that sets up in the both sides surface of last mould, the lower mould surface setting of its below contains a groove a piece, when last mould is close to the lower mould, at first branch is contradicted in a groove, under the cushioning effect of spring, can avoid the contact of last mould and lower mould crashworthiness, can also guarantee simultaneously that mould and lower mould are pasted tightly, the effectual accurate mould that has protected.

Description

Anti-collision storage device for semiconductor precision die

Technical Field

The utility model relates to an accurate mould technical field specifically is an anticollision strorage device for accurate mould of semiconductor.

Background

At present, the precision die forging equipment is a processing method which utilizes forging machinery to apply pressure on a metal blank to enable the metal blank to generate plastic deformation so as to obtain a forged piece with certain mechanical property, certain shape and certain size.

The precision mold is generally made of metal, when the upper mold and the lower mold are closed, the upper mold and the lower mold are easy to collide, certain damage is caused to the surface of the upper mold or the lower mold, the service life of the precision mold is finally shortened, and if a rubber pad is used for preventing collision, the upper mold and the lower mold can be closed insufficiently. Therefore, an anti-collision storage device for a semiconductor precision die is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an anticollision strorage device for accurate mould of semiconductor, through the vertical branch that sets up in the both sides surface of last mould, the lower mould surface setting of its below contains a supporting channel's piece, when last mould is close to the lower mould, at first branch is contradicted at a supporting channel, under the cushioning effect of spring, can avoid the contact of last mould and lower mould crashworthiness, can also guarantee simultaneously that mould and lower mould paste tightly, the effectual accurate mould that has protected has solved the problem that proposes in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: an anti-collision storage device for a semiconductor precision mold comprises an upper mold and a lower mold, wherein the upper mold is positioned right above the lower mold, supporting blocks are fixed on the upper surfaces of two sides of the lower mold, and supporting grooves are formed in the surfaces of the supporting blocks;

the utility model discloses a supporting piece, including a support piece, the last mould downside fixed surface of support piece top has a bottom plate, the last mould surface of bottom plate top has an upper fixed plate, and vertical slidable runs through between upper fixed plate and the bottom plate has branch, the below of branch is located a piece directly over, the top welding of branch has last spacing board, the below of going up the spacing board is contradicted at the upper surface of upper fixed plate, the branch outer lane fixed surface of bottom plate top has lower spacing board, the below of lower spacing board is contradicted at the upper surface of bottom plate, the spring has been set to the branch outer lane cover between upper fixed plate below and the lower spacing board, and the spring is contradicted on the surface of upper fixed plate and lower spacing board.

As an preferable embodiment of the present invention, a rubber pad is supported and fixed in the supporting groove, and the bottom of the rubber pad is attached to the surface of the supporting groove.

As a preferred embodiment of the present invention, the supporting groove is located under the supporting rod, and the inner diameter of the supporting groove is greater than the diameter of the supporting rod.

As a preferred embodiment of the utility model, go up the limiting plate and all be provided with the through-hole with the limiting plate down, branch passes through-hole slidable and runs through upper fixed plate and bottom plate.

As a preferred embodiment of the present invention, the support rod is located at the middle position of the surfaces of the two sides of the upper mold.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses an anticollision strorage device for semiconductor precision mould through the vertical branch that sets up in the both sides surface of last mould, and the lower mould surface setting of its below contains a supporting shoe of a groove, when last mould is close to the lower mould, at first branch is contradicted in a supporting shoe, under the cushioning effect of spring, can avoid the contact of last mould and lower mould crashworthiness, can also guarantee simultaneously that mould and lower mould paste tightly, the effectual precision mould that has protected.

2. The utility model discloses an anticollision strorage device for semiconductor precision mould supports through making the supporting groove and is fixed with the rubber pad, and the bottom of rubber pad pastes the surface tightly at the supporting groove, at first contacts with the rubber pad when branch contacts to the supporting groove in, has certain guard action to the bottom of branch.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic view of the overall structure of the anti-collision storage device for the semiconductor precision mold of the present invention;

fig. 2 is a detailed structural schematic diagram of a position a of the anti-collision storage device for the semiconductor precision mold of the present invention.

In the figure: 1. an upper die; 2. a lower die; 3. supporting a block; 4. a strut; 5. an upper fixing plate; 6. a lower fixing plate; 7. a spring; 8. an upper limiting plate; 9. a lower limiting plate; 10. a rubber pad; 11. and (7) supporting the groove.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "disposed" are to be interpreted broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed; the utility model discloses in provide only supply the reference with the model of electrical apparatus. For those skilled in the art, different types of electrical appliances with the same function can be replaced according to actual use conditions, and for those skilled in the art, the specific meaning of the above terms in the present invention can be understood in specific situations.

Referring to fig. 1-2, the present invention provides a technical solution: an anti-collision storage device for a semiconductor precision mold comprises an upper mold 1 and a lower mold 2, wherein the upper mold 1 is positioned right above the lower mold 2, supporting blocks 3 are fixed on the upper surfaces of two sides of the lower mold 2, and supporting grooves 11 are formed in the surfaces of the supporting blocks 3;

the utility model discloses a support 3, the last mould 1 downside fixed surface of top of piece has

bottom plate

6, 1 fixed surface of last mould above bottom plate 6 has an upper fixed plate 5, and vertical slidable runs through between upper fixed plate 5 and the bottom plate 6 has branch 4, the below of branch 4 is located a piece 3 directly over, the top welding of branch 4 has last spacing board 8, the below of going up spacing board 8 is contradicted at the upper surface of upper

fixed plate

5, 4 outer lane fixed surfaces of branch above the bottom plate 6 have lower spacing board 9, the below of lower spacing board 9 is contradicted at the upper surface of bottom plate 6, spring 7 has been set to 4 outer lane cover of branch between 5 below of upper fixed plate and the lower spacing board 9, and spring 7 is contradicted on the surface of upper fixed plate 5 and lower spacing board 9.

In this embodiment (please refer to fig. 1 and 2), the supporting rods 4 are vertically arranged on the surfaces of the two sides of the upper die 1, and the supporting block 3 with the supporting groove 11 is arranged on the surface of the lower die 2 below the upper die 1, so that when the upper die 1 is close to the lower die 2, the supporting rods 4 firstly abut against the supporting groove 11, and under the buffer action of the spring 7, the collision contact between the upper die 1 and the lower die 2 can be avoided, and meanwhile, the upper die 1 and the lower die 2 can be ensured to be tightly attached, thereby effectively protecting the precision die.

Wherein, a rubber pad 10 is supported and fixed in the supporting groove 11, and the bottom of the rubber pad 10 is tightly attached to the surface of the supporting groove 11.

In this embodiment (see fig. 2), the rubber pad 10 is supported and fixed in the supporting groove 11, and the bottom of the rubber pad 10 is tightly attached to the surface of the supporting groove 11, so that the supporting rod 4 is first contacted with the rubber pad 10 when contacting the supporting groove 11, and a certain protection effect is provided for the bottom of the supporting rod 4.

The branch groove 11 is located right below the support rod 4, and the inner diameter of the branch groove 11 is larger than the diameter of the support rod 4.

Wherein, go up limiting plate 8 and limiting plate 9 down and all be provided with the through-hole, branch 4 passes through upper fixed plate 5 and bottom plate 6 through the through-hole slidable.

Wherein, the supporting rod 4 is positioned in the middle position of the two side surfaces of the upper die 1.

It should be noted that the utility model relates to an anticollision strorage device for semiconductor precision die, including upper die 1, lower die 2, a supporting block 3, a supporting rod 4, an upper fixing plate 5, a lower fixing plate 6, a spring 7, an upper limiting plate 8, a lower limiting plate 9, a rubber pad 10, a supporting groove 11, the components are all general standard components or the components known by the technicians in this field, the structure and principle of the components are known by technicians in this field through technical manuals or conventional experimental methods, in operation, the upper die 1 and the lower die 2 are fixedly installed on a designated die spotting machine, when the upper die 1 is driven to be close to the lower die 2 downwards, the bottom of the supporting rod 4 is firstly contacted to the supporting groove 11, then the spring 7 is compressed to have a certain buffer effect on the closing of the upper die 1 and the lower die 2, when the spring 7 is compressed, the upper die 1 and the lower die 2 can be closed to be closely attached, have the anticollision guard action to the precision mould, can also guarantee simultaneously that mould 1 and lower mould 2 paste tightly, the effectual precision mould that has protected.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a precision semiconductor anticollision strorage device for mould, includes mould (1) and lower mould (2), its characterized in that: the upper die (1) is positioned right above the lower die (2), the upper surfaces of two sides of the lower die (2) are respectively fixed with a support block (3), and the surface of each support block (3) is provided with a support groove (11);

a lower fixing plate (6) is fixed on the surface of the lower side of the upper die (1) above the supporting block (3), an upper fixing plate (5) is fixed on the surface of the upper die (1) above the lower fixing plate (6), a supporting rod (4) is vertically and slidably penetrated between the upper fixing plate (5) and the lower fixing plate (6), the lower part of the supporting rod (4) is positioned right above the supporting block (3), an upper limiting plate (8) is welded at the top of the supporting rod (4), the lower part of the upper limiting plate (8) is propped against the upper surface of the upper fixing plate (5), a lower limiting plate (9) is fixed on the surface of the outer ring of the supporting rod (4) above the lower fixing plate (6), the lower part of the lower limiting plate (9) is propped against the upper surface of the lower fixing plate (6), a spring (7) is sleeved on the outer ring of the supporting rod (4) between the lower part of the upper fixing plate (5) and the lower limiting plate (9), and the spring (7) is abutted against the surfaces of the upper fixing plate (5) and the lower limiting plate (9).

2. The anti-collision storage device for the semiconductor precision mold as claimed in claim 1, wherein: a rubber pad (10) is supported and fixed in the supporting groove (11), and the bottom of the rubber pad (10) is tightly attached to the surface of the supporting groove (11).

3. The anti-collision storage device for the semiconductor precision mold as claimed in claim 1, wherein: the branch groove (11) is positioned under the support rod (4), and the inner diameter of the branch groove (11) is larger than the diameter of the support rod (4).

4. The anti-collision storage device for the semiconductor precision mold as claimed in claim 1, wherein: go up limiting plate (8) and limiting plate (9) down and all be provided with the through-hole, branch (4) are through-hole slidable run through upper fixed plate (5) and bottom plate (6).

5. The anti-collision storage device for the semiconductor precision mold as claimed in claim 1, wherein: the supporting rod (4) is positioned in the middle of the surfaces of the two sides of the upper die (1).