CN207352539U - A kind of computer motherboard of high efficiency and heat radiation - Google Patents
A kind of computer motherboard of high efficiency and heat radiation Download PDFInfo
- Publication number
- CN207352539U CN207352539U CN201721409767.5U CN201721409767U CN207352539U CN 207352539 U CN207352539 U CN 207352539U CN 201721409767 U CN201721409767 U CN 201721409767U CN 207352539 U CN207352539 U CN 207352539U
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- Prior art keywords
- mainboard
- fan
- fixed seat
- cooling apparatus
- liquid cooling
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Abstract
The utility model proposes a kind of computer motherboard of high efficiency and heat radiation, including mainboard fixed seat, mainboard is fixedly connected with the mainboard fixed seat, the front of the mainboard is provided with hardware, the back side of the mainboard is provided with the liquid cooling apparatus being fixedly connected with mainboard fixed seat, liquid cooling apparatus includes supporting rack and spiral condenser pipe, the front of the mainboard is provided with fan Fixture, activity sets movable fan on the fan Fixture, is movably set with cam link mechanism on the fan Fixture and controls the evolution of movable fan.The utility model realizes that more sites are radiated using movable fan, not only without the weight of increase mainboard, fully two fans can also be used as four, air in computer mainframe box body is quickly and effectively circulated, improve radiating efficiency, it is the variation of mainboard radiating mode using liquid cooling apparatus, further increases heat dissipation effect.
Description
Technical field
The utility model belongs to computer hardware field, more particularly to a kind of computer motherboard of high efficiency and heat radiation.
Background technology
With the development of science and technology, electronic computer obviously becomes the indispensable part of people's daily life, and
Requirement of the people to computer performance is also higher and higher, especially working clan and young man.The heat of computer comes from mostly
Computer-internal, and the performance of computer is higher, and caloric value is also bigger, in order to ensure the normal work of computer, people
Install radiator additional on computers, make every effort to improve the heat dissipation performance of computer, therefore computer radiator is matched somebody with somebody as computer
The big heat topic in part field one.
At present, people usually install radiator additional on computer motherboard, and the radiator fan being especially installed on CPU is recognized
To be essential, but the heat dissipation of other positions also can not be ignored on mainboard, concentrate on processor radiate result is exactly
Heat dissipation effect it is uneven so that the computer lost of life, while occur different degrees of interference to computer performance in itself,
The experience of user is influenced, in addition most of computer is radiated using wind-heat principle, and so heat dissipation is sometimes due to chassis radiating hole
Blocking causes thermal current to circulate or can only radiate in thermo-conducting manner inside computer cabinet, the big discounting of heat dissipation effect
Button.
Utility model content
The utility model is directed to technical problem of the above-mentioned computer radiator in the presence of radiation processes, proposes a kind of
Design reasonable, simple in structure, Mass Distribution uniformly and high efficiency and heat radiation computer motherboard.
In order to achieve the above object, the technical solution adopted in the utility model is that one kind provided by the utility model is efficiently
The computer motherboard of heat dissipation, including mainboard fixed seat, are fixedly connected with mainboard, the front of the mainboard in the mainboard fixed seat
Hardware is provided with, the hardware includes processor, board chip set, pci interface, on/off circuit, memory bar, radiator and inserts
Groove group, the radiator include liquid cooling apparatus and movable fan, and the liquid cooling apparatus is arranged on the back side of mainboard and and mainboard
Fixed seat is fixedly connected, and the liquid cooling apparatus includes supporting rack and spiral helicine condenser pipe, and the front of the mainboard is provided with wind
Fixed frame is fanned, sliding block is provided with the movable fan and is movably arranged on fan Fixture, on the fan Fixture
The track slided for movable fan is provided with, the movable fan shares four sites and controlled by cam link mechanism.
Preferably, the board chip set and processor are located along the same line, the site of the movable fan
Two of which is located at board chip set and processor center.
Preferably, the camshaft of the cam link mechanism is arranged on fan Fixture.
Compared with prior art, it is the advantages of the utility model with good effect,
1st, the computer motherboard of a kind of high efficiency and heat radiation provided by the utility model, realizes that more sites dissipate using movable fan
Heat, not only without the weight of increase mainboard, moreover it is possible to fully use two movable fans as four, by main frame
Air in babinet quickly and effectively circulates, and improves radiating efficiency, while utilize the liquid cold charge for being arranged on the mainboard back side
It is set to mainboard and a variety of radiating modes is provided, is no longer limited to single wind-cooling heat dissipating, further increases heat dissipation effect.This practicality
New to have the characteristics that design is rationally used with a fan, radiating efficiency is high, is adapted to large-scale promotion.
Brief description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment
The attached drawing used is briefly described, it should be apparent that, drawings in the following description are some embodiments of the utility model,
For those of ordinary skill in the art, without having to pay creative labor, can also be obtained according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the overall structure diagram for the computer motherboard that embodiment provides；
Fig. 2 is the structure diagram for the liquid cooling apparatus that embodiment provides；
More than in each figure, 1, mainboard fixed seat；2nd, mainboard；3rd, liquid cooling apparatus；31st, condenser pipe；32nd, supporting rack；4th, fan
Fixed frame；5th, movable fan；6th, cam link mechanism；7th, board chip set；8th, processor；9th, track.
Embodiment
It is below in conjunction with the accompanying drawings and real in order to be more clearly understood that the above-mentioned purpose of the utility model, feature and advantage
Example is applied to be described further the utility model.It should be noted that in the case where there is no conflict, embodiments herein and reality
Applying the feature in example can be mutually combined.
Many details are elaborated in the following description in order to fully understand the utility model, still, this practicality
New to implement using different from other modes described here, therefore, the utility model is not limited to be described below
The limitation of the specific embodiment of specification.
Embodiment, as shown in Figure 1 and Figure 2, the computer motherboard of high efficiency and heat radiation provided by the utility model, including mainboard are consolidated
Reservation 1, is fixedly connected with mainboard 2 in the mainboard fixed seat 1, the front of the mainboard 2 is provided with hardware, and the hardware includes
Processor, board chip set, pci interface, on/off circuit, memory bar, radiator and groups of slots.These structures are existing calculating
The most basic structure of mainboard, belongs to known technology, details are not described herein for the utility model.Since the quality of heat dissipation performance is straight
The experience and work for being related to user are connect, the utility model focuses on improving the heat dissipation performance of mainboard and radiator is shown
And the improvement being clear to.
In order to improve the heat dissipation performance of computer motherboard, radiator provided by the utility model includes liquid cooling apparatus 3 and moves
Dynamic formula fan 2, the radiating principle of movable fan 2 are air transmitted, liquid cooling apparatus 3 using liquid conductive, what this was utilized
It is the heat dissipation of two kinds of different mediums, the liquid that the utility model liquid cooling apparatus is used is water.Wherein the specific heat capacity of water is more than air
Specific heat capacity, and the thermal conductivity of water be more than air thermal conductivity, in other words, air dielectric heat conduction soon radiate also fast, liquid
Heat dissipation is also slow slowly for medium heat conduction, and the water and air under same volume is compared, and the carry-on heat of water is more, utilizes two media
Acted on jointly on mainboard, not only can mutually cover the shortage but also substantially increase heat dissipation performance.The liquid cooling apparatus 3 is arranged on master
The back side of plate is simultaneously fixedly connected with mainboard fixed seat 1, and the liquid cooling apparatus includes supporting rack 32 and spiral helicine condenser pipe 31,
Condenser pipe 31 is fixedly connected with supporting rack 32, and the condenser pipe is connected with liquid case, and liquid case provides liquid for condenser pipe, specifically
Liquid water can be used use condensate liquid because water is cheap and safely, water is preferred.Supporting rack 32 is fixed on master
In plate fixed seat 1.Why liquid cooling apparatus 3 is arranged on to the back side of mainboard, be because the front of mainboard is inserted with more hardware,
The size of hardware, thickness all difference, and only condenser pipe 31 more contacts mainboard and could improve heat dissipation effect, if
Liquid cooling apparatus is arranged on to the front of mainboard, not only influences whether that hardware is even disturbed in the deployment of hardware, it is cold also to reduce liquid
The actual effect of device；Spiral helicine condenser pipe provided by the utility model possesses more compared with general linear condenser pipe
Contact area, improve rate of heat dispation, greatly enhance the heat dissipation effect of radiator, improve computer operation speed
Rate.
In order to which radiator is fully used, fan provided by the utility model is portable movable fan 5.Tool
Say, the front of the mainboard is provided with fan Fixture 4, and sliding block is provided with the movable fan 5 and activity is set body
On fan Fixture 4, movable fan 5 is arranged on to the quality that mainboard 2 is alleviated on fan Fixture 4, compared to existing skill
Fan is fixed on mainboard in art, this mode it also avoid, because of the flexural deformation that mainboard quality is overweight and produces, protecting
The quality and service life of mainboard.The track 9 slided for movable fan 5, the movement are provided with the fan Fixture 4
Formula fan 5 shares four sites, and the arrangement form in the site is 2 × 2, while the movable fan shares two and same
On one horizontal linear, the evolution of movable fan realizes that two movable fans are done at the same time by cam link mechanism control
Lower reciprocating motion, radiates multiple positions, neatly uses two movable fans as four, like this not only
More fan need not be installed also fully the air-flow of cabinet inside equably circulates, avoid air in cabinet inside shape
Into endless loop, heat dissipation effect is substantially increased.
In order to make the heat of the groundwork hardware of mainboard 2 more frequently be swapped with the heat in air, this practicality
The board chip set 7 and processor 8 of new offer are located along the same line, four sites two of which position of movable fan 5
In 8 center of board chip set 7 and processor, that is to say, that board chip set 7 and processor 8 are carried out at the same time heat dissipation work.
Cam link mechanism 6 drives movable fan movement, and centered on camshaft, cam moves to proximal part and then moves the cam
Formula position of fan is in the surface of board chip set 7 and processor 8, and cam moves to distal end then movable fan position
At two other site.The cam link mechanism includes three connecting rods and a cam, and three connecting rods are respectively
First connecting rod, second connecting rod and third connecting rod.Wherein first connecting rod and second connecting rod one end on two movable fans with having one
Fixed connection place, one end of third connecting rod are fixedly connected with the other end of the two connecting rods, and the other end of third connecting rod is connected to
On cam, path of navigation is provided with around the cam, the connecting pin of the third connecting rod and cam is provided with bootstrap block, institute
Stating bootstrap block can move with the movement of cam in path of navigation, and further, the cam is by a micro-machine
Control, micro-machine is linked together with processor by connecting line and corresponding control circuit and program on mainboard, institute
Motor can be started and can guarantee that the normal work of cam by stating program, and the heat dissipation effect for so not only increasing mainboard also achieves
Automatically control, meet the development trend of computer.
The above descriptions are merely preferred embodiments of the present invention, is not to make other forms to the utility model
Limitation, any person skilled in the art is changed or is modified as possibly also with the technology contents of the disclosure above equivalent
The equivalent embodiment of change is applied to other fields, but every without departing from the content of the technical scheme of the utility model, according to this reality
Any simple modification, equivalent variations and the remodeling made with new technical spirit to above example, it is new to still fall within this practicality
The protection domain of type technical solution.
Claims (3)
1. a kind of computer motherboard of high efficiency and heat radiation, including mainboard fixed seat, mainboard is fixedly connected with the mainboard fixed seat,
The front of the mainboard is provided with hardware, and the hardware includes processor, board chip set, pci interface, on/off circuit, interior
Deposit bar, radiator and groups of slots, it is characterised in that the radiator includes liquid cooling apparatus and movable fan, the liquid cold charge
Put the back side for being arranged on mainboard and be fixedly connected with mainboard fixed seat, the liquid cooling apparatus includes supporting rack and spiral helicine condensation
Pipe, the front of the mainboard is provided with fan Fixture, sliding block is provided with the movable fan and is movably arranged on fan
On fixed frame, the track slided for movable fan is provided with the fan Fixture, the movable fan shares four
Site is simultaneously controlled by cam link mechanism.
A kind of 2. computer motherboard of high efficiency and heat radiation according to claim 1, it is characterised in that the board chip set and
Processor is located on one straight line of same level, the two of which in the site of the movable fan respectively with board chip set and processing
Device center is in same vertical line.
A kind of 3. computer motherboard of high efficiency and heat radiation according to claim 2, it is characterised in that the cam link mechanism
Camshaft be arranged on fan Fixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409767.5U CN207352539U (en) | 2017-10-30 | 2017-10-30 | A kind of computer motherboard of high efficiency and heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721409767.5U CN207352539U (en) | 2017-10-30 | 2017-10-30 | A kind of computer motherboard of high efficiency and heat radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207352539U true CN207352539U (en) | 2018-05-11 |
Family
ID=62353320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721409767.5U Expired - Fee Related CN207352539U (en) | 2017-10-30 | 2017-10-30 | A kind of computer motherboard of high efficiency and heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207352539U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110989805A (en) * | 2019-12-05 | 2020-04-10 | 冯王骁 | Big data server cooling system |
| CN112328036A (en) * | 2020-11-25 | 2021-02-05 | 贺学智 | High-efficient radiating device of computer motherboard |
| CN115033072A (en) * | 2022-05-25 | 2022-09-09 | 广西医科大学 | Low-power consumption computer motherboard |
-
2017
- 2017-10-30 CN CN201721409767.5U patent/CN207352539U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110989805A (en) * | 2019-12-05 | 2020-04-10 | 冯王骁 | Big data server cooling system |
| CN112328036A (en) * | 2020-11-25 | 2021-02-05 | 贺学智 | High-efficient radiating device of computer motherboard |
| CN115033072A (en) * | 2022-05-25 | 2022-09-09 | 广西医科大学 | Low-power consumption computer motherboard |
| CN115033072B (en) * | 2022-05-25 | 2024-02-02 | 广西医科大学 | Low-power consumption computer motherboard |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180511 Termination date: 20191030 |
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| CF01 | Termination of patent right due to non-payment of annual fee |