CN115033072B - Low-power consumption computer motherboard - Google Patents
Low-power consumption computer motherboard Download PDFInfo
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- CN115033072B CN115033072B CN202210583943.6A CN202210583943A CN115033072B CN 115033072 B CN115033072 B CN 115033072B CN 202210583943 A CN202210583943 A CN 202210583943A CN 115033072 B CN115033072 B CN 115033072B
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 15
- 230000006698 induction Effects 0.000 claims description 12
- 238000009835 boiling Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 43
- 239000000428 dust Substances 0.000 description 12
- 239000000110 cooling liquid Substances 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of computer equipment, and discloses a low-power-consumption computer main board, which comprises a main board body, wherein a bottom plate is arranged at the bottom of the main board body, a convex groove matched with the main board body is formed in the left side of the bottom plate, the main board body is connected in the convex groove in a sliding manner, a liquid collecting cavity is formed in the bottom end of the bottom plate, and a circulating cooling part is arranged on the right side of the bottom plate; according to the invention, the main belt pulley can be driven to rotate by the forward and reverse rotation machine, the main belt pulley drives the auxiliary belt pulleys on two sides to rotate by the belt, the auxiliary belt pulley drives the screw on the main belt pulley to rotate, so that the moving plate can move on the screw and drive the heat dissipation fan to move, and the two heat dissipation fans can move reversely on the screw due to the opposite directions of the threads on the screw, so that the heat dissipation fan can circularly and alternately uniformly dissipate heat of the main board body, the phenomenon of uneven local temperature and uneven cold and heat is avoided, and the service life and the service performance of the main board body are improved.
Description
Technical Field
The invention relates to the technical field of computer equipment, in particular to a low-power consumption computer motherboard.
Background
At present, the main board body of the computer case is divided into two types, namely a commercial main board body and an industrial main board body, which are installed in the case, and are one of the most basic and important components of the computer, wherein the main board body is generally a rectangular circuit board, and main circuit systems forming the computer are installed on the main board body, and the main board body is generally provided with elements such as a Basic Input Output (BIOS) chip, an input/output (I/O) control chip, a key and panel control switch interface, an indicator light plug connector, a direct current power supply plug connector for expanding a first slot, the main board body and a plug card. The low-power consumption computer motherboard is characterized in that in the using process, the temperature of the motherboard body can rise along with the heat generated by long-time use of components on the low-power consumption computer motherboard, and the motherboard body can be radiated in order to prevent the components from being damaged.
But current mainboard body is mostly through screw fixed mounting to one side of quick-witted case, and the radiating part is usually at the externally mounted heat dissipation fan of CPU and display card or adopts the liquid cooling mode to dispel the heat, and other spare parts on the mainboard body and be close to on the one side of quick-witted case do not have the radiating part, make the mainboard body like this can not evenly dispel the heat, and then lead to the life of mainboard body to reduce, simultaneously because the circumstances of local high temperature, can reduce the performance of mainboard body. Therefore, there is a need to design a low power consumption computer motherboard to solve the above problems.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a low-power consumption computer motherboard, which solves the problems that in the prior art, a heat dissipation fan is usually arranged outside a CPU and a display card or a liquid cooling mode is adopted for heat dissipation in the prior art, and other parts of a motherboard body are not provided with heat dissipation devices, so that the motherboard body can not uniformly dissipate heat easily, the service life of the motherboard body is reduced, and meanwhile, the performance of the motherboard body is reduced due to the condition of local high temperature.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a low-power consumption computer motherboard, includes the mainboard body, the bottom of mainboard body is provided with the bottom plate, the protruding type groove with the main plate body looks adaptation is seted up in the left side of bottom plate, mainboard body sliding connection is in the inside of protruding type groove, the liquid collecting cavity has been seted up to the inside bottom of bottom plate, the right side of bottom plate is provided with the circulative cooling part, the equal fixedly connected with guide rail in both sides upper surface of bottom plate, the cross-section of guide rail is protruding style of calligraphy, every all be provided with coupling assembling on the guide rail, two coupling assembling's top is provided with same top radiator unit.
Preferably, the circulation cooling assembly comprises a water chiller, a circulating pump, a water inlet pipe, a connecting pipe and a water outlet pipe, one end of the water inlet pipe is fixedly communicated with the inside of the front end of the liquid collecting cavity, the other end of the water inlet pipe is fixedly communicated with the water inlet end of the circulating pump, the water outlet end of the circulating pump is fixedly communicated with one end of the connecting pipe, the other end of the connecting pipe is fixedly communicated with the water inlet end of the water chiller, the water outlet end of the water chiller is fixedly communicated with one end of the water outlet pipe, the other end of the water outlet pipe is fixedly communicated with the inside of the rear end of the liquid collecting cavity, two lug plates which are symmetrically distributed are fixedly connected to the front side, the rear side and the right side of the bottom plate, and threaded holes are formed in the lug plates.
Preferably, the connecting assembly comprises a sliding block, two connecting columns and a limiting assembly, wherein the two connecting columns are respectively and fixedly connected to the top of the sliding block and the top of the limiting assembly, the sliding block is matched with the guide rail, the sliding block is slidingly connected to the inside of one end of the guide rail, and the bottom of the limiting assembly is slidingly connected to the inside of the other end of the guide rail.
Preferably, the spacing subassembly includes mounting box, T type piece and two joint subassemblies, T type piece fixed connection is in the bottom middle part of mounting box, the installation cavity has all been seted up at the both sides middle part of mounting box, the spacing groove has all been seted up at the upper end both sides middle part of T type piece, and the top of spacing groove extends to the inside of mounting box and is linked together with the installation cavity, the lower surface of mounting box is sliding connection with the upper surface of guide rail, the both sides upper end of T type piece all is sliding connection with the upper end inner wall of guide rail, and the bottom of T type piece is sliding connection with the interior bottom wall of guide rail.
Preferably, two the joint subassembly is symmetric distribution, two the joint subassembly all includes Z template, L template, limiting plate and presses the piece, the top of Z template and the bottom fixed connection of L template, one side lower extreme of limiting plate and the other end fixed connection of L template, the one end and the one end middle part fixed connection of L template are kept away from to the limiting plate of pressing the briquetting, Z template top sliding connection is in the inside of spacing groove, two one side that the lower extreme of Z template kept away from each other and the contact of the both sides inner wall of guide rail, and one side fixedly connected with skid resistant course that the lower extreme of Z template kept away from each other, the lower extreme sliding connection of L template is in the inside of spacing groove extension.
Preferably, the limiting plate sliding connection is in the inside of installation cavity, and one side of limiting plate and the inner wall contact of installation cavity, the one end that the limiting plate was kept away from to the pressing block slides and runs through the inner wall of installation cavity and extends to the outside of installation box, fixedly connected with spring between one side that the limiting plate kept away from the pressing block and the inner wall of installation cavity.
Preferably, the top heat dissipation assembly comprises a mounting plate, a forward and backward rotating motor, two screws, two movable plates and two heat dissipation fans, the lower surface of the mounting plate is fixedly connected with the upper surfaces of four connecting columns, a U-shaped hole is formed in the middle of the mounting plate, the forward and backward rotating motor is fixedly connected to the middle of the inner wall of the rear side of the U-shaped hole, the output end of the forward and backward rotating motor is rotationally connected with the inner wall of the U-shaped hole through a rotating shaft, a main belt wheel is sleeved in the middle of the rotating shaft, the two screws are rotationally connected inside two sides of the U-shaped hole through bearings, auxiliary belt wheels are sleeved at positions, corresponding to the main belt wheels, of the two screws, the two auxiliary belt wheels are in transmission connection with the main belt wheels through belts, the two movable plates are respectively in threaded connection with the corresponding screws, and the two heat dissipation fans are respectively fixedly mounted on the lower surfaces of the corresponding movable plates.
Preferably, guide grooves are formed in inner walls of two sides of the U-shaped hole, connecting rods are connected in a sliding mode in the guide grooves, one ends, away from the guide grooves, of the connecting rods are fixedly connected with the moving plate, and the thread directions of the two screw rods are opposite.
Preferably, the high-voltage direct-current power supply is further arranged, the main board body is an ATX standard main board, the top radiating component comprises a mounting frame, the mounting frame is made of an insulating material, a mounting support rod is arranged between the mounting frame and the main board body, the mounting support rod is fixed between the main board body and the mounting frame, a mounting gap is reserved between the mounting frame and the main board body, a plurality of guide plates made of metal materials are arranged on the mounting frame, one sides of two ends of each guide plate are hinged with the mounting frame, a linkage rod is arranged between the other sides of two ends of each guide plate, and the linkage rod is hinged with each guide plate; the main board body is provided with an induction cylinder, liquid with the boiling point of 50-100 ℃ is filled in the cylinder, the installation frame is provided with an execution cylinder, the execution cylinder and the induction cylinder are provided with air pressure pipes for communicating the execution cylinder and the induction cylinder, the execution cylinder is higher than the induction cylinder after the installation is finished, one end of the execution cylinder is fixed with the installation frame, and the other end of the execution cylinder is hinged with the linkage rod; the mounting frame is provided with a limiting bracket for preventing the backflow plate from excessively rotating, the limiting bracket is fixed on the mounting frame, the limiting bracket is provided with a first contact, the guide plate contacted with the limiting bracket is provided with a second contact which can be contacted with the first contact when the guide plate rotates to the limit position, and the second contact is insulated from the guide plate; a connecting circuit is arranged between the anode and the cathode of the high-voltage direct-current power supply and the guide plates respectively, so that heterogeneous charges are carried between the adjacent guide plates after the connecting circuit is conducted, the connecting circuit is conducted when the first contact contacts with the second contact, a torsion spring is arranged between the guide plates and the mounting frame, and therefore the outer side of the guide plates is nearest to the mounting frame when the execution cylinder does not work.
(III) beneficial effects
Compared with the prior art, the invention provides a low-power consumption computer motherboard, which has the following beneficial effects:
1. according to the invention, the main board body is inserted into the convex groove, so that the lower surface of the main board body is contacted with the inner bottom wall of the convex groove, under the action of the circulating pump, cooling liquid in the liquid collecting cavity enters the water chiller through the water inlet pipe, the circulating pump and the connecting pipe, and then flows back into the liquid collecting cavity through the water outlet pipe to complete a cycle, so that the main board body transfers heat to the bottom board, the heat is taken away through the cooling liquid which flows circularly, and is cooled by the water chiller and flows back into the liquid collecting cavity, and meanwhile, the bottom board can be fixedly arranged on one side of the chassis through the screws and the lug plates, so that the main board body can be protected, the back surface of the main board body can be cooled, the uneven cooling of the main board body is avoided, and the service life of the main board body is prolonged.
2. According to the invention, the main belt pulley can be driven to rotate by the forward and reverse rotation machine, the main belt pulley drives the auxiliary belt pulleys on two sides to rotate by the belt, the auxiliary belt pulley drives the screw on the main belt pulley to rotate, so that the moving plate can move on the screw and drive the heat dissipation fan to move, and the two heat dissipation fans can move reversely on the screw due to the opposite directions of the threads on the screw, so that the heat dissipation fan can circularly and alternately uniformly dissipate heat of the main board body, the phenomenon of uneven local temperature and uneven cold and heat is avoided, and the service life and the service performance of the main board body are improved.
Drawings
FIG. 1 is a schematic overall view of the structure of the present invention;
FIG. 2 is a schematic perspective view of a base plate of the present invention;
FIG. 3 is a schematic top cross-sectional view of the base plate of the present invention;
FIG. 4 is a schematic left-hand cross-sectional view of the base plate of the present invention;
FIG. 5 is an exploded view of a rail and coupling assembly of the present invention;
FIG. 6 is a schematic cross-sectional view of a rail and spacing member of the present invention;
FIG. 7 is an exploded view of a spacing assembly of the present invention;
FIG. 8 is a schematic diagram of a top heat sink assembly of the present invention;
FIG. 9 is an enlarged schematic view of the structure of the present invention at A in FIG. 8;
fig. 10 is a schematic structural diagram of embodiment 2 of the present invention.
In the figure: 1. a main board body; 2. a bottom plate; 201. a convex groove; 202. a liquid collection cavity; 203. a water chiller; 204. a circulation pump; 205. a water inlet pipe; 206. a connecting pipe; 207. a water outlet pipe; 208. ear plates; 3. a guide rail; 4. a connection assembly; 401. a slide block; 402. a connecting column; 5. a limit component; 6. a mounting box; 601. a mounting cavity; 602. a spring; 7. a T-shaped block; 701. a limit groove; 8. a Z-shaped plate; 801. an L-shaped plate; 802. a limiting plate; 803. pressing the blocks; 9. a top heat sink assembly; 901. a mounting plate; 902. a U-shaped hole; 903. a guide groove; 904. a forward and reverse rotation motor; 905. a main belt wheel; 906. a screw; 907. a secondary pulley; 908. a belt; 909. a moving plate; 910. a heat dissipation fan.
Detailed Description
In order to better understand the purpose, structure and function of the present invention, a low power consumption computer motherboard of the present invention is described in further detail below with reference to the accompanying drawings.
Example 1
According to fig. 1-9, the present invention provides a low power consumption computer motherboard: the novel heat-dissipation type mainboard comprises a mainboard body 1, wherein a bottom plate 2 is arranged at the bottom of the mainboard body 1, a convex groove 201 matched with the mainboard body 1 is formed in the left side of the bottom plate 2, the mainboard body 1 is connected inside the convex groove 201 in a sliding mode, a liquid collecting cavity 202 is formed in the bottom end of the bottom plate 2, circulating cooling components are arranged on the right side of the bottom plate 2, guide rails 3 are fixedly connected to the upper surfaces of two sides of the bottom plate 2, a connecting component 4 is arranged on each guide rail 3, the top of each connecting component 4 is provided with the same top heat dissipation component 9, the mainboard body 1 can be inserted into the convex groove 201, the lower surface of the mainboard body 1 is in contact with the inner bottom wall of the convex groove 201, the mainboard body 1 transmits heat to the bottom plate 2, the heat of the bottom plate 2 is transmitted to cooling liquid in the liquid collecting cavity 202, the bottom plate 2 is cooled through the circulating cooling components, the cooling speed of the mainboard body 1 is accelerated, the top heat dissipation components 9 are matched, the mainboard body 1 can be enabled to dissipate heat rapidly and evenly, the performance of the mainboard body 1 is improved, and the service life of the mainboard body 1 is prolonged;
specifically, the circulation cooling assembly comprises a water chiller 203, a circulating pump 204, a water inlet pipe 205, a connecting pipe 206 and a water outlet pipe 207, one end of the water inlet pipe 205 is fixedly communicated with the inside of the front end of the liquid collecting cavity 202, the other end of the water inlet pipe 205 is fixedly communicated with the water inlet end of the circulating pump 204, the water outlet end of the circulating pump 204 is fixedly communicated with one end of the connecting pipe 206, the other end of the connecting pipe 206 is fixedly communicated with the water inlet end of the water chiller 203, the water outlet end of the water chiller 203 is fixedly communicated with one end of the water outlet pipe 207, the other end of the water outlet pipe 207 is fixedly communicated with the inside of the rear end of the liquid collecting cavity 202, two lug plates 208 which are symmetrically distributed are fixedly connected to the front side, the rear side and the right side of the bottom plate 2, threaded holes are formed in the lug plates 208, under the action of the circulating pump 204, cooling liquid in the liquid collecting cavity 202 enters the water chiller 203 through the water inlet pipe 205, the circulating pump 204 and the connecting pipe 206, and then the water outlet pipe 207 flow back into the liquid collecting cavity 202, so that the main body 1 transfers heat to the bottom plate 2, the heat is taken away by the cooling liquid flowing through the circulating liquid, and the cooling liquid in the water chiller 202, and the main body 1 can be cooled down evenly;
wherein, the top heat dissipation component 9 comprises a mounting plate 901, a forward and reverse rotation motor 904, two screw rods 906, two moving plates 909 and two heat dissipation fans 910, the lower surface of the mounting plate 901 is fixedly connected with the upper surfaces of four connecting columns 402, a U-shaped hole 902 is arranged in the middle of the mounting plate 901, the forward and reverse rotation motor 904 is fixedly connected in the middle of the inner wall of the rear side of the U-shaped hole 902, the output end of the forward and reverse rotation motor 904 is rotationally connected with the inner wall of the U-shaped hole 902 through a rotating shaft, a main belt pulley 905 is sleeved in the middle of the rotating shaft, the two screw rods 906 are rotationally connected in the two sides of the U-shaped hole 902 through bearings, auxiliary belt pulleys 907 are sleeved at the positions corresponding to the main belt pulley 905 outside the two screw rods 906, the two auxiliary belt pulleys 907 are in transmission connection with the main belt pulley 905 through a belt 908, the two moving plates 909 are respectively and threadedly connected to the corresponding screw rods 906, the two heat dissipation fans 910 are respectively and fixedly arranged on the lower surfaces of the corresponding moving plates 909, the forward and backward rotating motor 904 can drive the main belt pulley 905 to rotate, the main belt pulley 905 drives the auxiliary belt pulleys 907 on two sides to rotate through the belt 908, the auxiliary belt pulleys 907 drive the screw rods 906 on the main belt pulley 907 to rotate, the moving plates 909 can move on the screw rods 906 and drive the heat dissipation fans 910 to move, and the two heat dissipation fans 910 can reversely move on the screw rods 906 due to the opposite directions of the threads on the screw rods 906, so that the heat dissipation fans 910 can circularly and alternately perform uniform heat dissipation on the main plate body 1, the phenomenon of uneven local temperature and cold and hot is avoided, and the service life and the service performance of the main plate body 1 are improved;
the inner walls inside the two sides of the U-shaped hole 902 are provided with guide grooves 903, the inside of the guide grooves 903 is connected with a connecting rod in a sliding manner, one end of the connecting rod, which is far away from the guide grooves 903, is fixedly connected with the moving plate 909, the screw thread directions of the two screw rods 906 are opposite, and the connecting rod can limit and guide the moving plate 909, so that the moving plate 909 can perform linear motion;
referring to fig. 1, 5, 6 and 7, in order to facilitate the installation of the top heat dissipation component 9 on the bottom plate 2, the connection component 4 may be provided to include a slider 401, two connection columns 402 and a limit component 5, where the two connection columns 402 are respectively fixedly connected to the top of the slider 401 and the top of the limit component 5, the slider 401 is adapted to the guide rail 3, and the slider 401 is slidably connected inside one end of the guide rail 3, and the bottom of the limit component 5 is slidably connected inside the other end of the guide rail 3; the limiting assembly 5 comprises an installation box 6, a T-shaped block 7 and two clamping assemblies, wherein the T-shaped block 7 is fixedly connected to the middle of the bottom end of the installation box 6, an installation cavity 601 is formed in the middle of two sides of the installation box 6, a limiting groove 701 is formed in the middle of two sides of the upper end of the T-shaped block 7, the top end of the limiting groove 701 extends to the inside of the installation box 6 and is communicated with the installation cavity 601, the lower surface of the installation box 6 is in sliding connection with the upper surface of the guide rail 3, the upper ends of two sides of the T-shaped block 7 are in sliding connection with the inner wall of the upper end of the guide rail 3, and the bottom of the T-shaped block 7 is in sliding connection with the inner bottom wall of the guide rail 3; the two clamping components are symmetrically distributed, each clamping component comprises a Z-shaped plate 8, an L-shaped plate 801, a limiting plate 802 and a pressing block 803, the top of the Z-shaped plate 8 is fixedly connected with the bottom of the L-shaped plate 801, one side lower end of the limiting plate 802 is fixedly connected with the other end of the L-shaped plate 801, one end of the pressing block 803 is fixedly connected with the middle part of one end of the limiting plate 802, which is far away from the L-shaped plate 801, the top end of the Z-shaped plate 8 is slidably connected in the limiting groove 701, one sides, which are far away from each other, of the lower ends of the two Z-shaped plates 8 are in contact with the inner walls of two sides of the guide rail 3, the lower ends of the Z-shaped plates 8 are fixedly connected with an anti-skid layer, and the lower end of the L-shaped plate 801 is slidably connected in the extending end of the limiting groove 701; limiting plate 802 sliding connection is in the inside of installing cavity 601, and one side of limiting plate 802 and the inner wall contact of installing cavity 601, press the one end sliding penetration installing cavity 601 of limiting plate 802 of piece 803 and extend to the outside of installing box 6, limiting plate 802 keeps away from the one side of pressing the briquetting 803 and the inner wall of installing cavity 601 between fixedly connected with spring 602, left slider 401 intubates in the guide rail 3, press the briquetting 803 to the internal motion of installing cavity 601 afterwards with the finger, press briquetting 803 to drive limiting plate 802 and move and squeeze spring 602 in installing cavity 601, simultaneously limiting plate 802 drives the upper end of L-type plate 801 and Z-type plate 8 and moves on the inner diapire of installing box 6, make two Z-type plates 8 be close to each other, then continue to promote slider 401 to guide rail 3 internal motion, make two Z-type plates 8 get into the inside of guide rail 3, simultaneously the lower surface of installing box 6 slides on guide rail 3, until slider 401 slides to the leftmost side of guide rail 3, loosen and press briquetting 803, drive limiting plate 802 under the effect of spring 602, press briquetting 803, L-type plate 803 and Z-type plate 8 drive the upper end motion in installing cavity 601 and press the spring 602, simultaneously, the upper end of L-type plate 801 and Z-type plate 8 move on the inner wall of installing box 6, then can be carried out fast and the top of Z-type plate 8 is dismantled with the inside wall of Z-type plate 803, and the top assembly 9 is convenient to install.
The working principle of the invention is as follows: when the novel heat radiation device is used, the main board body 1 is inserted into the convex groove 201, then the top heat radiation component 9 is fixed on the four connecting columns 402, then the left sliding block 401 is inserted into the guide rail 3, then the two pressing blocks 803 are pressed by fingers, so that the pressing blocks 803 move towards the mounting cavity 601, the pressing blocks 803 drive the limiting plates 802 to move in the mounting cavity 601 and press the springs 602, meanwhile, the limiting plates 802 drive the upper ends of the L-shaped plates 801 and the Z-shaped plates 8 to move on the inner bottom wall of the mounting box 6, so that the two Z-shaped plates 8 are close to each other, then the sliding block 401 is continuously pushed to move inside the guide rail 3, the two Z-shaped plates 8 enter the guide rail 3, meanwhile, the lower surface of the mounting box 6 slides on the guide rail 3 until the sliding block 401 slides to the leftmost side of the guide rail 3, the pressing blocks 803 are loosened, and the limiting plates 802, the pressing blocks 803, the L-shaped plates 801 and the Z-shaped plates 8 are driven to reset under the action of the springs 602, so that one side of the Z-shaped plates 8 is in contact with the inner wall of the guide rail 3;
when the main board body 1 operates, the main board body 1 can control the circulating pump 204, the water chiller 203, the forward and backward rotating motor 904 and the heat dissipation fan 910 to start through a CPU (Central processing Unit) on the main board body, under the action of the circulating pump 204, cooling liquid in the liquid collection cavity 202 enters the water chiller 203 through the water inlet pipe 205, the circulating pump 204 and the connecting pipe 206, and then flows back into the liquid collection cavity 202 through the water outlet pipe 207 to complete a circulation, so that the main board body 1 transfers heat to the bottom board 2, takes away the heat through the circulating cooling liquid, and is cooled by the water chiller 203 and flows back into the liquid collection cavity 202 in a circulating way; the forward and reverse rotation motor 904 can drive the main pulley 905 to rotate, and the main pulley 905 drives the secondary pulleys 907 on two sides to rotate through the belt 908, and the secondary pulleys 907 drive the screw 906 on the main pulley 905 to rotate, so that the movable plate 909 can move on the screw 906 and drive the heat dissipation fans 910 to move, and as the directions of threads on the screw 906 are opposite, the two heat dissipation fans 910 can reversely move on the screw 906, so that the heat dissipation fans 910 can circularly and alternately perform uniform heat dissipation on the main board body 1.
Example 2
The labels in fig. 10 include: mounting frame 91, mounting strut 92, deflector 93, actuating cylinder 94.
Compared with the embodiment 1 (as shown in fig. 10), the difference is that the air conditioner further comprises a high-voltage direct-current power supply (which is powered by a chassis self-powered power supply and then obtained after boosting, namely a boosting device is essentially purchased), the main board body 1 is an ATX standard main board, the top heat dissipation component 9 comprises a mounting frame 91, the mounting frame 91 is made of an insulating material, a mounting support rod 92 is arranged between the mounting frame 91 and the main board body 1, the mounting support rod 92 is fixed between the main board body 1 and the mounting frame 91 through bolts, a mounting gap is reserved between the mounting frame 91 and the main board body 1, a plurality of guide plates 93 made of metal materials are arranged on the mounting frame 91 (the width of each guide plate 93 can be determined according to the actual situation, the width of each guide plate 93 is slightly higher in fig. 10, mainly for guaranteeing the effect of guide), a linkage rod is arranged between one side of two ends of each guide plate 93 and the other, and the other side of each guide plate 93 is hinged; the main board body 1 is provided with an induction cylinder, alcohol (liquid with boiling point of 50-100 ℃ can be other liquid of course, clear water can be used, however, the temperature of the CPU can be 100 ℃, the main board is usually 60 ℃ and high temperature is calculated at about 80 ℃, the boiling point of the alcohol is about 80 ℃), the installation frame 91 is provided with an execution cylinder 94, the execution cylinder 94 and the induction cylinder are provided with air pressure pipes for communicating the execution cylinder 94 and the induction cylinder, the execution cylinder 94 is higher than the induction cylinder after the installation is finished, one end of the execution cylinder 94 is fixed with the installation frame 91, and the other end of the execution cylinder 94 is hinged with a linkage rod; the mounting frame 91 is provided with a limit bracket for preventing the backflow plate from excessively rotating, the limit bracket is fixed on the mounting frame 91, the limit bracket is provided with a first contact, the guide plate 93 contacted with the limit bracket is provided with a second contact which can be contacted with the first contact when the guide plate 93 rotates to a limit position, and the second contact is insulated from the guide plate 93; a connecting circuit is arranged between the positive electrode and the negative electrode of the high-voltage direct-current power supply and the guide plates 93 respectively, so that heterogeneous charges are carried between the adjacent guide plates 93 after the connecting circuit is connected, and the connecting circuit is connected when the first contact contacts with the second contact; a torsion spring is provided between the baffle 93 and the mounting frame 91 so that the outside of the baffle 93 is closest to the mounting frame 91 when the actuating cylinder 94 is not in operation.
In particular use, according to the standards of an ATX case, the air flow enters from the right side (the through holes in the case are on the right side, so the air flow enters from the right side and then exits from the facial tissue face direction, i.e., the rear side of the case), first contacts the baffle 93. If the temperature of the main board body 1 is low at this time, the alcohol is in a liquid state, and when the temperature of the main board body 1 is low, the requirement on the heat dissipation air flow is low, so that the problem of dust removal needs to be considered. At this time, when the air current contacts with the deflector 93, part of ash layer will naturally adhere to the deflector 93 (at least will lose kinetic energy), then fall to the bottom of the chassis under the effect of gravity, reduce the contact of dust and the radiator fan of CPU, reduce the absorption of dust on the radiator fan of CPU, promote the heat dissipation ability, avoid the CPU high temperature because of the heat dissipation ability leads to for the energy consumption loss that the CPU fan rotational speed rises and brings.
After the temperature of the main board body 1 increases, alcohol boils with the increase of the temperature, the volatilization speed increases, the pressure in the induction cylinder and the execution cylinder 94 increases, the execution cylinder 94 starts to work, the linkage rod is stressed, then the guide plate 93 overcomes the elasticity of the torsion spring, and the included angle between the guide plate 93 and the mounting frame 91 increases, as shown in fig. 10, by 90 degrees at maximum. At this time, the first contact on the deflector 93 is contacted with the second contact on the limiting support, so that the deflector 93 is charged with positive and negative charges at intervals, and 3 independent parallel plate capacitors are formed between the deflector 93. At this time, the air flow passes through the gap of the parallel plate capacitor, and dust can be easily adsorbed by the negatively charged deflector 93. In addition, in the use state, the guide plate 93 is in a vertical state, dust can naturally fall to the bottom of the chassis, so that the adsorption of the dust on the CPU cooling fan is reduced, the heat dissipation capacity is improved, and the high temperature of the CPU caused by the heat dissipation capacity is avoided, so that the energy consumption loss caused by the rising of the rotation speed of the CPU fan is avoided.
In summary, this embodiment promptly can be when low temperature, rely on the air current direction to be different with the direction of guiding of guide plate 93, let the dust in the air current strike on guide plate 93 to under the action of gravity, realize simple self-cleaning, avoided the dust direct with the radiator fan direct contact of CPU, reduce the absorption of the last dust of CPU radiator fan, promote the heat dissipation ability, avoid the CPU high temperature because of the heat dissipation ability leads to for the energy consumption loss that CPU fan rotational speed risees and brings. Meanwhile, the air duct can be opened at high temperature, the air flow is prevented from being blocked by the guide plate 93, meanwhile, heterogeneous charges (no current is needed, power and power consumption are very small) are carried on the guide plate 93, dust in the air flow is adsorbed, namely, when the temperature is high, the adsorption of the dust is realized on the premise that heat dissipation and low power consumption are not influenced, and the self cleaning of the dust is realized by means of gravity, so that the air duct has a long service life. Moreover, the scheme is to realize the electrifying when the right end of the guide plate 93 is farthest from the mounting frame 91, so that the possible short circuit condition caused by contact between the guide plate 93 plates is avoided, and the high reliability is realized.
It will be understood that the invention has been described in terms of several embodiments, and that various changes and equivalents may be made to these features and embodiments by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (8)
1. The utility model provides a low-power consumption computer motherboard, includes mainboard body (1), its characterized in that: the novel intelligent cooling device comprises a main board body (1), and is characterized in that a bottom board (2) is arranged at the bottom of the main board body (1), a convex groove (201) matched with the main board body (1) is formed in the left side of the bottom board (2), the main board body (1) is slidably connected inside the convex groove (201), a liquid collecting cavity (202) is formed in the bottom end of the bottom board (2), circulating cooling components are arranged on the right side of the bottom board (2), guide rails (3) are fixedly connected to the upper surfaces of two sides of the bottom board (2), the cross sections of the guide rails (3) are in a convex shape, a connecting component (4) is arranged on each guide rail (3), and the tops of the two connecting components (4) are provided with the same top cooling component (9);
the high-voltage direct-current power supply is characterized by further comprising a high-voltage direct-current power supply, wherein the main board body (1) is an ATX standard main board, the top radiating component (9) comprises a mounting frame (91), the mounting frame (91) is made of insulating materials, a mounting support rod (92) is arranged between the mounting frame (91) and the main board body (1), the mounting support rod (92) is fixed between the main board body (1) and the mounting frame (91) and enables a mounting gap to be reserved between the mounting frame (91) and the main board body (1), a plurality of guide plates (93) made of metal materials are arranged on the mounting frame (91), one sides of two ends of the guide plates (93) are hinged with the mounting frame, and a linkage rod is arranged between the other sides of two ends of the guide plates (93) and hinged with the guide plates (93); an induction cylinder is arranged on the main board body (1), liquid with the boiling point of 50-100 ℃ is filled in the cylinder, an execution cylinder (94) is arranged on the installation frame, an air pressure pipe used for communicating the execution cylinder (94) and the induction cylinder is arranged on the execution cylinder (94), the execution cylinder (94) is higher than the induction cylinder after the installation is completed, one end of the execution cylinder (94) is fixed with the installation frame, and the other end of the execution cylinder (94) is hinged with the linkage rod; a limiting bracket for preventing the backflow plate from excessively rotating is arranged on the mounting frame (91), the limiting bracket is fixed on the mounting frame, a first contact is arranged on the limiting bracket, a second contact which can be contacted with the first contact when the guide plate (93) rotates to the limit position is arranged on the guide plate which is contacted with the limiting bracket, and the second contact is insulated from the guide plate (93); a connecting circuit is arranged between the anode and the cathode of the high-voltage direct-current power supply and the guide plates (93) respectively, so that heterogeneous charges are carried between adjacent guide plates after the connecting circuit is conducted, the connecting circuit is conducted when the first contact contacts with the second contact, a torsion spring is arranged between the guide plates (93) and the mounting frame (91), and therefore when the execution cylinder does not work, the outer side of the guide plates (90) is nearest to the mounting frame (91).
2. The low power consumption computer motherboard of claim 1, wherein: the utility model provides a cooling part circulates, including cooling water machine (203), circulating pump (204), inlet tube (205), connecting pipe (206) and outlet pipe (207), the inside fixed intercommunication of front end and the liquid collecting cavity (202) of inlet tube (205), and the other end and the inlet end fixed intercommunication of circulating pump (204) of inlet tube (205), the outlet end and the one end fixed intercommunication of connecting pipe (206) of circulating pump (204), and the other end and the inlet end fixed intercommunication of cooling water machine (203) of connecting pipe (206), the outlet end and the one end fixed intercommunication of outlet pipe (207) of cooling water machine (203), and the other end and the inside fixed intercommunication of rear end of liquid collecting cavity (202) of outlet pipe (207), front side, rear side and the equal fixedly connected with of right side of bottom plate (2) are two otic placodes (208) of symmetric distribution, and offer the screw hole on otic placode (208).
3. The low power consumption computer motherboard of claim 1, wherein: coupling assembling (4) include slider (401), two spliced pole (402) and spacing subassembly (5), two spliced pole (402) are fixed connection respectively at the top of slider (401) and the top of spacing subassembly (5), slider (401) and guide rail (3) looks adaptation, and slider (401) sliding connection is inside the one end of guide rail (3), the bottom sliding connection of spacing subassembly (5) is inside the other end of guide rail (3).
4. A low power computer motherboard as recited in claim 3, wherein: spacing subassembly (5) are including mounting box (6), T type piece (7) and two joint subassemblies, T type piece (7) fixed connection is in the bottom middle part of mounting box (6), installation cavity (601) have all been seted up at the both sides middle part of mounting box (6), spacing groove (701) have all been seted up at the upper end both sides middle part of T type piece (7), and the top of spacing groove (701) extends to the inside of mounting box (6) and is linked together with installation cavity (601), the lower surface of mounting box (6) is sliding connection with the upper surface of guide rail (3), the both sides upper end of T type piece (7) all is sliding connection with the upper end inner wall of guide rail (3), and the bottom of T type piece (7) is sliding connection with the interior diapire of guide rail (3).
5. The low power consumption computer motherboard of claim 4, wherein: two joint subassembly is symmetric distribution, two joint subassembly all includes Z template (8), L template (801), limiting plate (802) and presses piece (803), the top of Z template (8) and the bottom fixed connection of L template (801), one side lower extreme and the other end fixed connection of L template (801) of limiting plate (802), the one end of pressing piece (803) is kept away from the one end middle part fixed connection of L template (801) with limiting plate (802), Z template (8) top sliding connection is in the inside of spacing groove (701), two one side that the lower extreme of Z template (8) kept away from each other and the both sides inner wall contact of guide rail (3), and one side fixedly connected with skid resistant course that the lower extreme of Z template (8) kept away from each other, the lower extreme sliding connection of L template (801) is in the inside of spacing groove (701) extension end.
6. The low power consumption computer motherboard of claim 5, wherein: limiting plate (802) sliding connection is in the inside of installing cavity (601), and one side of limiting plate (802) and the inner wall contact of installing cavity (601), the one end that limiting plate (802) was kept away from to pressing piece (803) slides and runs through the inner wall of installing cavity (601) and extends to the outside of installing box (6), fixedly connected with spring (602) between one side that limiting plate (802) kept away from pressing piece (803) and the inner wall of installing cavity (601).
7. The low power consumption computer motherboard of claim 1, wherein: the top heat dissipation assembly (9) comprises a mounting plate (901), a forward and backward rotation motor (904), two screw rods (906), two moving plates (909) and two heat dissipation fans (910), wherein the lower surface of the mounting plate (901) is fixedly connected with the upper surfaces of four connecting columns (402), a U-shaped hole (902) is formed in the middle of the mounting plate (901), the forward and backward rotation motor (904) is fixedly connected to the middle of the inner wall of the rear side of the U-shaped hole (902), the output end of the forward and backward rotation motor (904) is rotatably connected with the inner wall of the U-shaped hole (902) through a rotating shaft, the middle part of the rotating shaft is sleeved with a main belt wheel (905), the two screw rods (906) are rotatably connected to the inner sides of the U-shaped hole (902) through bearings, auxiliary belt wheels (907) are sleeved at positions corresponding to the main belt wheels (905), the two auxiliary belt wheels (907) are in transmission connection with the main belt wheels (905), the two moving plates (909) are in threaded connection with the corresponding screw rods (905) respectively, and the two moving plates (906) are mounted on the two corresponding moving plates (906) respectively.
8. The low power consumption computer motherboard of claim 7, wherein: guide grooves (903) are formed in the inner walls of the two sides of the U-shaped hole (902), connecting rods are connected to the inner portions of the guide grooves (903) in a sliding mode, one ends, away from the guide grooves (903), of the connecting rods are fixedly connected with the moving plate (909), and the thread directions of the two screw rods (906) are opposite.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210583943.6A CN115033072B (en) | 2022-05-25 | 2022-05-25 | Low-power consumption computer motherboard |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210583943.6A CN115033072B (en) | 2022-05-25 | 2022-05-25 | Low-power consumption computer motherboard |
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| CN115033072B true CN115033072B (en) | 2024-02-02 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207352539U (en) * | 2017-10-30 | 2018-05-11 | 江西水利职业学院 | A kind of computer motherboard of high efficiency and heat radiation |
| CN211073624U (en) * | 2019-11-12 | 2020-07-24 | 卢致丞 | Robot controller convenient to use |
| CN211577828U (en) * | 2019-12-04 | 2020-09-25 | 淮北职业技术学院 | Low-power-consumption cloud computer case cooling system |
| CN112328036A (en) * | 2020-11-25 | 2021-02-05 | 贺学智 | High-efficient radiating device of computer motherboard |
| CN213088507U (en) * | 2020-08-28 | 2021-04-30 | 浙江天裕自动化科技有限公司 | Linear guide rail with limiting mechanism |
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2022
- 2022-05-25 CN CN202210583943.6A patent/CN115033072B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207352539U (en) * | 2017-10-30 | 2018-05-11 | 江西水利职业学院 | A kind of computer motherboard of high efficiency and heat radiation |
| CN211073624U (en) * | 2019-11-12 | 2020-07-24 | 卢致丞 | Robot controller convenient to use |
| CN211577828U (en) * | 2019-12-04 | 2020-09-25 | 淮北职业技术学院 | Low-power-consumption cloud computer case cooling system |
| CN213088507U (en) * | 2020-08-28 | 2021-04-30 | 浙江天裕自动化科技有限公司 | Linear guide rail with limiting mechanism |
| CN112328036A (en) * | 2020-11-25 | 2021-02-05 | 贺学智 | High-efficient radiating device of computer motherboard |
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| CN115033072A (en) | 2022-09-09 |
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