CN207338342U - A kind of semiconductor wafer cutting machine - Google Patents
A kind of semiconductor wafer cutting machine Download PDFInfo
- Publication number
- CN207338342U CN207338342U CN201721366020.6U CN201721366020U CN207338342U CN 207338342 U CN207338342 U CN 207338342U CN 201721366020 U CN201721366020 U CN 201721366020U CN 207338342 U CN207338342 U CN 207338342U
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- semiconductor wafer
- blade
- cutting machine
- guide rails
- lead screw
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Abstract
It the utility model is related to a kind of semiconductor wafer cutting machine, including cutting mechanism and control system, cutting mechanism includes cutter device and position regulator, the cutter device includes the blade for cutting semiconductor chip, the position regulator is connected with the cutter device, for adjusting the position of the blade；Control system is connected with the cutting mechanism, for controlling the cutter device to be cut, and controls the position of the position regulator adjustment blade；Image collecting device is further included, it is connected with the control system, for collecting the tool marks image left after the blade cut crystal and being uploaded to the control system.The semiconductor wafer cutting machine of the utility model, has the advantages that：Improve the inspection efficiency of blade height and adjust efficiency, so as to greatly increase the cutting efficiency of semiconductor wafer；Simple in structure, cost is low, easy to operation.
Description
Technical field
A kind of sheet material cutter device is the utility model is related to, more particularly to a kind of semiconductor wafer cutting machine.
Background technology
Semiconductor wafer cutting machine is the commonly used equipment for carrying out chip segmentation, such as the segmentation for LED wafer, forms
LED core particle.In cutting operation, cutting knife up (distance of the blade low side apart from slide glass panel surface) be influence the back of the body collapse it is main because
Element.The blade height of cutting machine of the prior art adjusts and generally requires artificial intervention, by frequently stopping knife inspection, manually into
The up and down adjustment of row blade, not only expends a large amount of manpowers, also have impact on very much production efficiency greatly.
Utility model content
In view of the foregoing deficiencies of prior art, the purpose of this utility model is to provide a kind of cutting of semiconductor wafer
Machine, by adding image collecting device, in order to improve the inspection efficiency of blade height and adjust efficiency, so as to greatly increase half
The cutting efficiency of conductor chip.
In order to achieve the above objects and other related objects, the utility model provides a kind of semiconductor wafer cutting machine, including
Cutting mechanism and control system, cutting mechanism include cutter device and position regulator, and the cutter device includes being used to cut
The blade of semiconductor wafer is cut, the position regulator is connected with the cutter device, for adjusting the position of the blade；
Control system is connected with the cutting mechanism, for controlling the cutter device to be cut, and controls the position adjustment to fill
Put the position for adjusting the blade；Image collecting device is further included, it is connected with the control system, for collecting the blade
The tool marks image that is left after cut crystal is simultaneously uploaded to the control system.
In one embodiment, the position regulator includes vertically arranged lead screw guide rails, described vertically arranged
Lead screw guide rails include vertical leading screw and vertical sliding block, vertically leading screw moves up and down vertical sliding block；The cutter device also wraps
Cutting cutter shaft is included, it is rotatably installed on the vertical sliding block, and the blade is installed on the free end of the cutting cutter shaft.
In one embodiment, one end of the vertical leading screw is connected with vertical driving motor, the control system control
Make the rotation of the vertical driving motor.
In one embodiment, the cutting mechanism further includes horizontally disposed first lead screw guide rails and the second leading screw is led
Rail, first lead screw guide rails and second lead screw guide rails include horizontal screw lead and horizontal slider, the horizontal screw lead
One end connects horizontal drive motor, and the control system controls the rotation of two horizontal drive motors；Second leading screw
Guide rail is perpendicular to first lead screw guide rails；Slide glass dish is installed on the horizontal slider of first lead screw guide rails；It is described vertical
The lead screw guide rails of setting are installed on the horizontal slider of the second lead screw guide rails.
In one embodiment, described image harvester is ccd image sensor.
In one embodiment, described image harvester is arranged on above the side of the blade.
In one embodiment, the cutting machine further includes cooling spray mechanism, for cooling down blade.
In one embodiment, the guide rail is equipped with the sensor of detection slide position.
In one embodiment, the driving motor is servomotor.
In one embodiment, clamp structure is additionally provided with the slide glass dish, for gripping semiconductor wafer.
As described above, semiconductor wafer cutting machine provided by the utility model, has the advantages that：
1. by adding image collecting device, improve the inspection efficiency of blade height and adjust efficiency, so as to greatly increase
The cutting efficiency of semiconductor wafer；2. simple in structure, cost is low, easy to operation.
Brief description of the drawings
Fig. 1 is shown as each composition part-structure relation signal of the utility model semiconductor wafer cutting machine one embodiment
Figure；
Fig. 2 is shown as the structure diagram of the utility model position regulator one embodiment.
Component label instructions
1 rack, 8 Y-axis lead screw guide rails, 15 Z axis leading screw
2 X-axis lead screw guide rails, 9 y-axis motor, 16 Z axis sensor
3 X-axis slide block, 10 Y-axis leading screw 17 cuts cutter shaft
4 X-axis motor, 11 Y-axis sensor, 18 blade
5 X-axis leading screw, 12 Z axis lead screw guide rails, 19 image collecting device
6 X-axis sensor, 13 Z axis sliding block, 20 position regulator
7 slide glass dish, 14 Z axis motor, 21 control system
Embodiment
Illustrate the embodiment of the utility model by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
Please refer to Fig.1.It should be clear that structure, ratio, size depicted in this specification institute accompanying drawings etc., only coordinating
The revealed content of specification, so that those skilled in the art understands and reads, being not limited to the utility model can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of the utility model can be generated and the purpose that can reach, should all still fall in the utility model institute
The technology contents of announcement are obtained in the range of covering.Meanwhile in this specification it is cited as " on ", " under ", "left", "right",
The term of " centre " and " one " etc., is merely convenient to understanding for narration, and is not used to limit the enforceable scope of the utility model,
Its relativeness is altered or modified, in the case where changing technology contents without essence, when being also considered as the enforceable category of the utility model.
As shown in Figure 1, semiconductor wafer cutting machine provided by the utility model includes cutting mechanism and control system 21, cut
Cutting mill structure includes cutter device and position regulator 20, and the cutter device includes the blade 18 for cutting semiconductor chip
With the cutting cutter shaft 17 of installation blade, the position regulator is connected with the cutter device, for adjusting the blade
Position；Control system 21 is connected with the cutting mechanism, for controlling the cutter device to be cut, and controls the position
Adjusting apparatus adjusts the position of the blade.This is also the general structure of existing semiconductor wafer cutting machine.Except above-mentioned composition portion
Exceptionally, the semiconductor wafer cutting machine of the utility model further includes image collecting device 19, is arranged above the side of blade 18, its
It is connected with control system 21, for collecting the tool marks image left after 18 cut crystal of blade and being uploaded to control system 21.
Fig. 2 shows one embodiment of the utility model semiconductor wafer cutting machine position regulator, position adjustment dress
Install and be placed on the table top of rack 1, including X-axis lead screw guide rails 2, Y-axis lead screw guide rails 8 and Z axis lead screw guide rails 12.X-axis leading screw is led
Rail 2 and Y-axis lead screw guide rails 8 are horizontally disposed, and are mutually perpendicular to.X-axis lead screw guide rails 2 include X-axis leading screw 5 and X-axis slide block 3, and X-axis is slided
The bottom of block 3 is threadedly coupled by feed screw nut with X-axis leading screw 5, one end connection X-axis motor 4 of X-axis leading screw 5.Y-axis leading screw is led
Rail 8 includes Y-axis leading screw 10 and Y-axis sliding block 12, and the bottom of Y-axis sliding block 12 is threadedly coupled by feed screw nut with Y-axis leading screw 10, Y
One end connection y-axis motor 9 of axial filament thick stick 10.Slide glass dish 7 is fixed with X-axis slide block 3, for carrying crystalline substance to be cut or in cutting
Piece.Z axis lead screw guide rails 12 are vertically arranged, and Y-axis sliding block is fixed in its lower end, or as shown in Fig. 2, Z axis lead screw guide rails 12 are slided with Y-axis
Block uses the form of integrative-structure.Z axis lead screw guide rails 12 include Z axis leading screw 15 and Z axis sliding block 13, and the bottom of Z axis sliding block 13 leads to
Cross feed screw nut to be threadedly coupled with Z axis leading screw 15, one end connection Z axis motor 14 of Z axis leading screw 15.Cut cutter shaft 17 rotationally
Z axis sliding block 13 is installed on, its free end installation blade.
At work, the control system of cutting machine is driven respectively by controlling X-axis motor 4, y-axis motor 9 and Z axis motor 14
Dynamic X-axis leading screw 5, Y-axis leading screw 10 and Z axis leading screw 15 rotate, and then drive X-axis slide block 3, Y-axis sliding block and Z axis sliding block 13 to move,
So as to fulfill the chip in blade 18 and slide glass dish 7 and slide glass dish 7 around and upper and lower relative position adjusts.When
After blade 18 and chip to be cut to be adjusted to the relative position suitable for cutting, control system is by cutting the driving motor of cutter shaft
(not shown) or other suitable driving mechanism driving cutting cutter shafts 17 are rotated with cutting blade 18, and chip is cut.
In the present embodiment, control system can both use the microcontroller or Programmable logical controller chip of embedded cutting machine, by pre-
The program of microcontroller or Programmable logical controller chip is first write to realize the control to cutting mechanism；Can also be directly using meter
Calculation machine, by the way that computer is connected with cutting mechanism, is directly controlled cutting mechanism.
In cutting process, bottom of wafer is lined with glued membrane, and the more suitable height of cutting blade should be such that blade
Bottom is located at the intersection of bottom of wafer and glued membrane.If the tool marks on glued membrane are in dashed lines states, illustrate just to cut to chip
Bottom, if tool marks are in solid line state, need to heighten the height of cutting blade；And when on glued membrane without tool marks, then need to adjust
The height of undercut cutting blade.In the above-described embodiments, which is set to ccd image sensor, may be provided at Z axis sliding block
On 13, it is connected with the control system of cutting machine.
In the cutting process of chip, image acquisition device cutting image, i.e., the tool marks image on glued membrane, and should
Image is sent to control system.Wherein,
In a preferred embodiment, operator accurately easily recognizes knife by checking the cutting image in control system
The state of trace, so as to adjust the height of cutting blade；
In a further preferred embodiment, control system can also be directly sharp according to the cutting image of image acquisition device
With image recognition technology, the automatic state for recognizing tool marks, is automatically controlled Z axis motor 14, to realize cutting blade height
Automatic adjustment.
In addition, it is respectively equipped with X-axis sensor 6, Y in X-axis lead screw guide rails 2, Y-axis lead screw guide rails 8 and Z axis lead screw guide rails 12
Axle sensor 11 and Z axis sensor 16.Control system can control each sliding block by the position for each sliding block that each sensor detects
It is mobile.
In a preferred embodiment, X-axis motor 4, y-axis motor 9 and Z axis motor 14 are servomotor.
In a preferred embodiment, clamp structure is additionally provided with the slide glass dish, for gripping the semiconductor
Chip.
In a preferred embodiment, cutting machine further includes cooling spray mechanism (not shown), in cutting process
Spray cooling liquid, cools down blade.
The above embodiments are only illustrative of the principle and efficacy of the utility model, new not for this practicality is limited
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
God and all equivalent modifications completed under technological thought or change, should be covered by the claim of the utility model.
Claims (10)
1. a kind of semiconductor wafer cutting machine, including：
Cutting mechanism, including cutter device and position regulator, the cutter device are included for cutting semiconductor chip
Blade, the position regulator are connected with the cutter device, for adjusting the position of the blade；
Control system, is connected with the cutting mechanism, for controlling the cutter device to be cut, and controls the position tune
Engagement positions adjust the position of the blade；
It is characterized in that：
Image collecting device is further included, it is connected with the control system, for collecting what is left after the blade cut crystal
Tool marks image is simultaneously uploaded to the control system.
A kind of 2. semiconductor wafer cutting machine according to claim 1, it is characterised in that：
The position regulator includes vertically arranged lead screw guide rails, and the vertically arranged lead screw guide rails include vertical leading screw
With vertical sliding block, vertically leading screw moves up and down vertical sliding block；
The cutter device further includes cutting cutter shaft, it is rotatably installed on the vertical sliding block, and the blade is installed on institute
State the free end of cutting cutter shaft.
A kind of 3. semiconductor wafer cutting machine according to claim 2, it is characterised in that：
One end of the vertical leading screw is connected with vertical driving motor, and the control system control vertical driving motor turns
It is dynamic.
A kind of 4. semiconductor wafer cutting machine according to claim 2, it is characterised in that：
The cutting mechanism further includes horizontally disposed first lead screw guide rails and the second lead screw guide rails, first lead screw guide rails and
Second lead screw guide rails include horizontal screw lead and horizontal slider, and one end of the horizontal screw lead connects horizontal drive motor,
The control system controls the rotation of two horizontal drive motors；
Second lead screw guide rails are perpendicular to first lead screw guide rails；
Slide glass dish is installed on the horizontal slider of first lead screw guide rails；
The vertically arranged lead screw guide rails are installed on the horizontal slider of the second lead screw guide rails.
5. semiconductor wafer cutting machine according to claim 1, it is characterised in that：Described image harvester is schemed for CCD
As sensor.
A kind of 6. semiconductor wafer cutting machine according to claim 1, it is characterised in that：Described image harvester is set
Above the side of the blade.
A kind of 7. semiconductor wafer cutting machine according to claim 1, it is characterised in that：The cutting machine further includes cooling
Nozzle mechanism, for cooling down blade.
8. the semiconductor wafer cutting machine according to claim 2 or 4, it is characterised in that：The guide rail is equipped with detection and slides
The sensor of block position.
A kind of 9. semiconductor wafer cutting machine according to claim 3 or 4, it is characterised in that：
The driving motor is servomotor.
10. semiconductor wafer cutting machine according to claim 4, it is characterised in that：Folder is additionally provided with the slide glass dish
Structure is held, for gripping semiconductor wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721366020.6U CN207338342U (en) | 2017-10-20 | 2017-10-20 | A kind of semiconductor wafer cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721366020.6U CN207338342U (en) | 2017-10-20 | 2017-10-20 | A kind of semiconductor wafer cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207338342U true CN207338342U (en) | 2018-05-08 |
Family
ID=62366232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721366020.6U Active CN207338342U (en) | 2017-10-20 | 2017-10-20 | A kind of semiconductor wafer cutting machine |
Country Status (1)
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|---|---|
| CN (1) | CN207338342U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116021654A (en) * | 2023-04-02 | 2023-04-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Automatic tool changing device for wafer cutting and tool changing method thereof |
-
2017
- 2017-10-20 CN CN201721366020.6U patent/CN207338342U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116021654A (en) * | 2023-04-02 | 2023-04-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Automatic tool changing device for wafer cutting and tool changing method thereof |
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