CN116021654A - Automatic tool changing device for wafer cutting and tool changing method thereof - Google Patents
Automatic tool changing device for wafer cutting and tool changing method thereof Download PDFInfo
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- CN116021654A CN116021654A CN202310339214.0A CN202310339214A CN116021654A CN 116021654 A CN116021654 A CN 116021654A CN 202310339214 A CN202310339214 A CN 202310339214A CN 116021654 A CN116021654 A CN 116021654A
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The invention belongs to the technical field of wafer cutter changing, and relates to an automatic cutter changing device for wafer cutting and a cutter changing method thereof, wherein the device comprises a cutter cutting mechanism, a height calibration system and a vision system, the cutter cutting mechanism is slidably arranged on a portal frame, the portal frame is arranged on a bench in a crossing manner, and the cutter changing method comprises the following steps: starting the device, resetting each device to zero, recovering the blade to a vertical state, calibrating the height of the blade, and confirming the zero point of the blade; the wafer cutting mechanism starts to cut the wafer, after the wafer is cut, the wafer moves into the view field of the vision system, the controller triggers the camera, and the product is photographed to identify the damage width a of the cutting gap; the damage width a and the standard value a of the regulated damage width 0 And comparing to judge whether the tool needs to be changed. The invention reduces manual intervention, remarkably improves efficiency and promotesThe product cutting quality, the blade service life judgment and the automatic tool changing are effectively combined, the manual intervention is reduced, and the equipment efficiency is greatly improved.
Description
Technical Field
The invention belongs to the technical field of wafer tool changing, and particularly relates to an automatic tool changing device for wafer cutting and a tool changing method thereof.
Background
The dicing product is a brittle material with higher hardness, edge breakage is easy to occur in the dicing process, the problem of edge breakage is solved by adopting a soft blade through a process experiment, but the service life of the blade is shorter, so that the blade with multiple edges is customized. The quality of the cut product is monitored through a visual system, when the quality reduction can not meet the requirement, the rotating system drives the multiple-blade to rotate, automatic tool changing is realized, and meanwhile, the height of the blade after tool changing is accurately confirmed through a height calibration system, so that mechanical errors in the tool changing process are compensated.
For the prior art, the quality of the cutting product cannot be monitored in time, the service life of the blade cannot be accurately judged, the blade is wasted, and the control precision of the blade height is insufficient.
Disclosure of Invention
In view of the above, the present invention is to provide an automatic tool changer for cutting wafers and a tool changing method thereof, wherein the mechanical error of the blade is controlled to be micrometer level by a height calibration system, and the life statistics and tool changing are integrated under the same system, so as to automatically count the life and accurately change the blade.
In order to achieve the above purpose, the following technical scheme is adopted:
the automatic cutter changing device for wafer cutting comprises a cutter cutting mechanism, a height calibration system and a vision system, wherein the cutter cutting mechanism is slidably arranged on a portal frame, and the portal frame is arranged on a machine in a crossing manner;
the scribing cutter blade mechanism comprises a mounting plate, a Z-direction motor is inversely arranged on the mounting plate, a cam is arranged at the lower end of the Z-direction motor, a guide rail is vertically arranged at the lower part of the mounting plate, a sliding block is arranged on the guide rail, the sliding block is fixedly connected with a connecting plate, a roller arranged at the upper end of the connecting plate is propped against the cam, a horizontal motor is arranged at the lower end of the connecting plate, a blade is arranged at the output end of the horizontal motor, and a plurality of cutting edges are arranged on the blade;
the height calibration system comprises an adsorption platform, an image platform and a height elevation sensor, wherein the adsorption platform and the image platform are sequentially arranged on a bench, the bench drives the adsorption platform and the image platform to move, the height elevation sensor is arranged on the adsorption platform and is used for collecting the position height of a cutting edge on a blade, and the image platform is used for searching a cutting path;
the vision system comprises a light source and a camera, wherein the light source and the camera are arranged on the back of the portal frame and are used for detecting the damage width of the wafer cutting gap.
As a further improvement of the invention, the horizontal motor is electrically connected with a photoelectric switch sensor for detecting the rotation angle of the blade.
As a further improvement of the invention, the Z-direction motor, the horizontal motor, the adsorption platform, the image platform, the height elevation sensor, the light source, the camera and the photoelectric switch sensor are respectively and electrically connected with the controller.
As a further improvement of the invention, the height level sensor adopts a pressure sensor.
An automatic tool changing method for wafer cutting comprises the following steps:
s1, starting the device, resetting all equipment to return to zero, recovering the blade to a vertical state, calibrating the height of the blade, and confirming the zero point of the blade;
s2, starting to scribe the wafer by the scribing cutter mechanism, after the wafer is diced, moving the wafer into a view field of a vision system, triggering a camera by a controller, and photographing a product to identify the damage width a of a cutting gap;
s3, the damage width a and the standard value a of the regulated damage width 0 Comparing;
when a is less than a 0 The cutting result meets the requirement, the cutting service life N is increased by 1, and the cutting cycle is continued;
when a is greater than or equal to a 0 The cutting effect does not meet the requirements and the blade or the cutting edge needs to be replaced;
recording the number of the cutting edges of the scribing cutter as m, increasing the number of the cutting edges by 1, and when m is less than or equal to m 0 ，m 0 Rotating a horizontal motor by a certain angle for the number of the blades on the blade, rotating the next blade to the vertical direction, moving a height calibration system to the position below the blade, performing height calibration, compensating mechanical errors in the tool changing process, and continuing wafer dicing circulation;
when a is greater than or equal to a 0 And m is greater than m 0 Outputting the service life N of the blade, giving an alarm to the system, reminding the user of replacing the blade, and ending the cycle.
The beneficial effects of the invention are as follows:
compared with manual tool changing, the automatic tool changing system can reduce manual intervention and obviously improve efficiency; compared with the traditional single blade, the multiple-blade can reduce the times of changing the blade and improve the automation performance of the equipment; compared with the traditional quality judgment according to the number of times of cutting, the quality judgment method has the advantages that the service life of the blade can be accurately judged, and the cutting quality of a product is improved; compared with the traditional direct rotating blade, the application of the height calibration system increases the height calibration, effectively improves the accuracy of the height of the blade, and can effectively improve the quality of products with strictly controlled cutting depth; the service life of the blade is effectively judged and automatically changed, so that manual intervention is reduced, and the equipment efficiency is greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the back structure of the present invention;
FIG. 3 is a schematic view of a dicing blade mechanism according to the present invention;
FIG. 4 is a schematic view of an exploded view of the dicing saw according to the invention;
FIG. 5 is a schematic view of a blade according to the present invention;
FIG. 6 is a schematic view of the width of a lesion according to the present invention;
fig. 7 is a flowchart of the operation of the tool changing system of the present invention.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The invention will be described in detail below with reference to the drawings in connection with embodiments.
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
Please refer to fig. 1-5:
the automatic cutter changing device for wafer cutting comprises a cutter cutting mechanism 1, a height calibration system 2 and a vision system 3, wherein the cutter cutting mechanism 1 is arranged on a portal frame 4, and the portal frame 4 is arranged on a bench machine 5 in a crossing manner;
the scribing and cutting mechanism 1 comprises a mounting plate 11, a Z-direction motor 12 is inversely arranged on the mounting plate 11, a cam 13 is arranged at the lower end of the Z-direction motor 12, a guide rail 14 is vertically arranged on the mounting plate 11, a sliding block 15 is slidably arranged on the guide rail 14, the sliding block 15 is fixedly connected with a connecting plate 16, a roller 17 arranged at the upper end of the connecting plate 16 is propped against the cam 13, a horizontal motor 18 is arranged at the lower end of the connecting plate 16, a blade 19 is arranged at the output end of the horizontal motor 18, and a plurality of cutting edges 191 are arranged on the blade 19;
the height calibration system 2 comprises an adsorption platform 21, an image platform 22 and a height elevation sensor 23, wherein the adsorption platform 21 and the image platform 22 are sequentially arranged on the bench machine 5 and driven by the bench machine 5 to move, the height elevation sensor 23 is arranged on the adsorption platform 21 and used for collecting the position height of the cutting edge 191 on the blade 19, and the image platform 22 is used for searching a cutting path;
the vision system 3 includes a light source 31 and a camera 32, and the light source 31 and the camera 32 are mounted on the back of the gantry 4 for detecting the damage width of the wafer dicing gap.
The horizontal motor 18 is electrically connected with a photoelectric switch sensor 20 for detecting the rotation angle of the blade 191; the Z-direction motor 12, the horizontal motor 18, the adsorption platform 21, the image platform 22, the height elevation sensor 23, the light source 31, the camera 32 and the photoelectric switch sensor 20 are respectively and electrically connected with the controller; the height level sensor 23 employs a pressure sensor to determine the zero point of the blade 19 by determining the stroke of the blade 191 based on a fixed value of the pressure of the blade 191 against the wafer, i.e., a fixed value of the pressing pressure.
Please refer to fig. 6-7:
an automatic tool changing method for wafer cutting comprises the following steps:
s1, starting the device, resetting all equipment to zero, recovering the blade 19 to a vertical state, calibrating the height of the blade 19, and confirming the zero point of the blade 19;
s2, starting to scribe the wafer by the scribing cutter mechanism 1, after the wafer is diced, moving the wafer into a view field of the vision system 3, triggering the camera 32 by the controller, and photographing the product to identify the damage width a of the cutting gap;
s3, the damage width a and the standard value a of the regulated damage width 0 Comparing;
when a is less than a 0 The cutting result meets the requirement, the cutting service life N is increased by 1, and the cutting cycle is continued;
when a is greater than or equal to a 0 The dicing effect does not meet the requirements and requires replacement of the blade 19 or the blade 191;
the number of the scribing knife edges 191 is recorded as m, and the number of the knife edges 191 is increased by 1 at the same time, when m is less than or equal to m 0 ，m 0 For the number of the blades 191 on the blade 19, the horizontal motor 18 rotates a certain angle, the next blade 191 rotates to the vertical direction, the height calibration system 2 moves to the position below the blade 19 to perform height calibration, the mechanical error in the tool changing process is compensated, and the wafer dicing cycle is continued;
when a is greater than or equal to a 0 And m is greater than m 0 The service life N of the blade 19 is output, the system alarms,the user is alerted to perform the blade 19 change and the cycle is ended.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides an automatic tool changer of wafer cutting, includes and draws cutter piece mechanism, high calibration system and vision system, draws cutter piece mechanism slidable mounting on the portal frame, and the portal frame strides to establish on the machine, its characterized in that:
the scribing cutter blade mechanism comprises a mounting plate, a Z-direction motor is inversely arranged on the mounting plate, a cam is arranged at the lower end of the Z-direction motor, a guide rail is vertically arranged at the lower part of the mounting plate, a sliding block is arranged on the guide rail, the sliding block is fixedly connected with a connecting plate, a roller arranged at the upper end of the connecting plate is propped against the cam, a horizontal motor is arranged at the lower end of the connecting plate, a blade is arranged at the output end of the horizontal motor, and a plurality of cutting edges are arranged on the blade;
the height calibration system comprises an adsorption platform, an image platform and a height elevation sensor, wherein the adsorption platform and the image platform are sequentially arranged on a bench, the bench drives the adsorption platform and the image platform to move, the height elevation sensor is arranged on the adsorption platform and is used for collecting the position height of a cutting edge on a blade, and the image platform is used for searching a cutting path;
the vision system comprises a light source and a camera, wherein the light source and the camera are arranged on the back of the portal frame and are used for detecting the damage width of the wafer cutting gap.
2. The automatic wafer cutting and tool changing device according to claim 1, wherein the horizontal motor is electrically connected with a photoelectric switch sensor for detecting the rotation angle of the blade.
3. The automatic wafer cutting and tool changing device according to claim 2, wherein the Z-direction motor, the horizontal motor, the adsorption platform, the image platform, the height elevation sensor, the light source, the camera and the photoelectric switch sensor are respectively electrically connected with the controller.
4. A wafer cutting automatic tool changer according to claim 3, wherein the elevation sensor is a pressure sensor.
5. A method of changing a wafer cutting automatic changing tool according to any one of claims 1 to 4, comprising the steps of:
s1, starting the device, resetting all equipment to return to zero, recovering the blade to a vertical state, calibrating the height of the blade, and confirming the zero point of the blade;
s2, starting to scribe the wafer by the scribing cutter mechanism, after the wafer is diced, moving the wafer into a view field of a vision system, triggering a camera by a controller, and photographing a product to identify the damage width a of a cutting gap;
s3, the damage width a and the standard value a of the regulated damage width 0 Comparing;
when a is less than a 0 The cutting result meets the requirement, the cutting service life N is increased by 1, and the cutting cycle is continued;
when a is greater than or equal to a 0 The cutting effect does not meet the requirements and the blade or the cutting edge needs to be replaced;
recording the number of the cutting edges of the scribing cutter as m, increasing the number of the cutting edges by 1, and when m is less than or equal to m 0 ，m 0 Rotating a horizontal motor by a certain angle for the number of the blades on the blade, rotating the next blade to the vertical direction, moving a height calibration system to the position below the blade, performing height calibration, compensating mechanical errors in the tool changing process, and continuing wafer dicing circulation;
when a is greater than or equal to a 0 And m is greater than m 0 Outputting the service life N of the blade, giving an alarm to the system, reminding the user of replacing the blade, and ending the cycle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310339214.0A CN116021654B (en) | 2023-04-02 | 2023-04-02 | Tool changing method of automatic tool changing device for wafer cutting |
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| CN202310339214.0A CN116021654B (en) | 2023-04-02 | 2023-04-02 | Tool changing method of automatic tool changing device for wafer cutting |
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| CN116021654B CN116021654B (en) | 2023-07-25 |
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| JP2021058986A (en) * | 2019-10-09 | 2021-04-15 | 株式会社ディスコ | Identification method for cutting blade and processing device |
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| JP2008170253A (en) * | 2007-01-11 | 2008-07-24 | Kayaba Ind Co Ltd | Surface flaw inspection device |
| CN103538157A (en) * | 2011-12-31 | 2014-01-29 | 英利能源（中国）有限公司 | Method for cutting crystalline silicon blocks |
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