CN207338305U - A kind of glassivation chip glass cement coating unit - Google Patents

A kind of glassivation chip glass cement coating unit Download PDF

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Publication number
CN207338305U
CN207338305U CN201721515385.0U CN201721515385U CN207338305U CN 207338305 U CN207338305 U CN 207338305U CN 201721515385 U CN201721515385 U CN 201721515385U CN 207338305 U CN207338305 U CN 207338305U
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China
Prior art keywords
special
chip
glass cement
sucker
silica gel
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CN201721515385.0U
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Inventor
徐明星
吴兴旺
夏冬生
史国顺
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Shandong Core Electronic Polytron Technologies Inc
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Shandong Core Electronic Polytron Technologies Inc
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Priority to CN201721515385.0U priority Critical patent/CN207338305U/en
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Abstract

The utility model discloses a kind of glassivation chip glass cement coating unit, including special motor, special sucker, special motor is connected with hollow motor shaft, and hollow motor shaft connects special sucker, chip is fixed with special sucker, the hollow motor shaft is connected with vacuum system.Chip at the uniform velocity rotates on special sucker, glass cement is coated in center wafer position by silica gel spoon, then the silica gel spoon that moves linearly is passed through, by glass cement by center wafer position outwards until edge carries out pushing away painting, glass cement can be uniformly adhered to wafer surface during afer rotates by the pushing of silica gel spoon.

Description

A kind of glassivation chip glass cement coating unit
Technical field
The utility model relates to semiconductor electronic component manufacturing technology field, more particularly, to a kind of glassivation Chip glass cement coating unit.
Background technology
With the development of semiconductor technology, the requirement to semiconductor surface passivation is higher and higher, blunt as diode one kind Change material, should undoubtedly possess:First, good electric property and reliability.Including resistivity, dielectric strength, ionic mobility Deng.The introducing of material should not bring side effect to device;Second, good chemical stability.In recent years, used in the market The cry of a kind of higher glassivation of reliability (GPP) silicon diode is higher and higher, and obtains the general of personage in electronics industry All over accreditation.This GPP chip is that (glass passivation process temperature allow also can after) uses light before the metallization of silicon diffusion sheet Photoresist mask and etching V-groove or the mechanical table top for drawing V-groove.Then, glass dust is applied on knot surface to carry out table top Passivation Treatment.The suspension that glass powder is made of some adhesives and the mixing of the fine glass dust of high-purity.By glass dust Suspension is by certain process coated in V-groove, adhesive is burned off at high temperature, and glass melting is simultaneously entirely being tied Seal protection layer is formed on surface.
Coating glass mainly has three kinds of methods:Electrophoresis, photoetching process and knife coating, at present knife coating use polytetrafluoroethylene (PTFE) Plate makes angle scraper, by least act 5 steps is applied to wafer surface by glass cement by hand, and because of manual operations, each step Gap and scraper dynamics difference cause wafer surface glass cement thickness to differ, and seriously affect subsequent wafer processing, and special to chip Property easily cause it is bad, therefore study it is a kind of glass cement can be coated uniformly on to wafer surface method it is very necessary.
Utility model content
Applied the purpose of this utility model is that overcoming the deficiencies of the prior art and provide a kind of glassivation chip glass cement The method covered, while quality problems caused by manual operations are reduced, and improve production efficiency by associated machines.
The utility model adopts the following technical solution:
A kind of glassivation chip glass cement coating unit, including special motor, special sucker, silica gel spoon, special motor Hollow motor shaft is connected with, the hollow motor shaft is connected with vacuum system, and hollow motor shaft connects special sucker, special Chip is fixed with sucker processed, silica gel spoon is suspended in above chip;Special suction cup interior has vacuum groove, and center drilling is vacuum Hole, communicates to form vacuum line with machine shaft;Chip is put into special chuck surface, connects vacuum system, and chip is adsorbed in spy Chuck surface processed, opens special motor, and chip is rotated with special sucker and hollow motor shaft, discharged after end of run Vacuum system, removes chip.
The special motor is connected with motor speed control box, and motor speed control box is equipped with motor rotary switch;Electricity Machine rotating speed control box sets multistage rotating speed, realizes that the slow-speed of revolution is changed to high rotating speed, and can set rotational time.
The vacuum system is connected with solenoid valve, and solenoid valve is connected with vacuum switch.
The special sucker is Teflon material, and surface processing is fluted, and is connected to the true of special sucker center At emptying aperture, i.e., chip is positioned over special chuck surface, is opened by vacuum switch, and chip is firmly adsorbed in special sucker Surface, and as special sucker is rotated.
The silica gel spoon is polytetrafluoroethylene (PTFE) material, has acid-alkali-corrosive-resisting high-temperature stability, and pollution-free to glass cement.
The capacity that the silica gel spoon accommodates glass cement is 2-4g.
Use the advantageous effects that as above scheme obtains for:
Chip at the uniform velocity rotates on special sucker, and glass cement is coated in center wafer position by silica gel spoon, is then passed through Move linearly silica gel spoon, and by glass cement by center wafer position outwards until edge carries out pushing away painting, glass cement is in afer rotates mistake Wafer surface can be uniformly adhered to by the pushing of silica gel spoon in journey.
Brief description of the drawings
Fig. 1 is the utility model glassivation chip glass cement coating unit structure diagram.
In figure, 1, motor speed control box, 2, motor rotary switch, 3, special motor, 4, special sucker, 5, chip, 6, Hollow motor shaft, 7, solenoid valve, 8, vacuum switch.
Embodiment
The specific embodiment of the utility model is described further with reference to attached drawing 1:
A kind of glassivation chip glass cement coating unit, including special motor 3, special sucker, silica gel spoon, special motor 3 are connected with hollow motor shaft 6, and hollow motor shaft 6 connects special sucker, and chip 5 is fixed with special sucker, described hollow Machine shaft is connected with vacuum system, and silica gel spoon is suspended in above chip;Special suction cup interior has vacuum groove, and center drilling is Vacuum hole, communicates to form vacuum line with machine shaft;Chip is put into special chuck surface, connects vacuum system, chip absorption In special chuck surface, special motor is opened, chip is rotated with special sucker and hollow motor shaft, after end of run Vacuum system is discharged, removes chip.
The special motor is connected with motor speed control box 1, and motor speed control box 1 is equipped with motor rotary switch 2; Motor speed control box 1 sets multistage rotating speed, realizes that the slow-speed of revolution is changed to high rotating speed, and can set rotational time.
The vacuum system is connected with solenoid valve 7, and solenoid valve 7 is connected with vacuum switch 8.
The special sucker is Teflon material, and surface processing is fluted, and is connected to the true of special sucker center At emptying aperture, i.e., chip is positioned over special chuck surface, is opened by vacuum switch 8, and chip is firmly adsorbed in special suction Panel surface, and as special sucker is rotated.
The chip of glass cement to be coated is put in special sucker, and is in concentric position, vacuum switch is opened, by crystalline substance Piece is adsorbed in special chuck surface;With a certain amount of glass cement of silica gel bale-out, drip in center wafer position, while press motor rotation Pass is turned on, chip is rotated with special sucker;Silica gel spoon bottom and center wafer glass cement surface gentle touchdown, and by silicon Glue spoon is at the uniform velocity moved along straight line to Waffer edge, and traveling time is identical with sucker rotational time;Glass cement passes through silica gel spoon bottom Pushing away painting, special sucker centrifugal force is uniformly coated on wafer surface in addition, and by adjusting special sucker rotating speed and rotational time control Combinations piece watch crystal glue thickness, reaches wafer surface glass cement consistency of thickness.The amount of glass cement is true according to the capacity of silica gel spoon Fixed, glass cement amount is 2-4g.Special 500-800 revs/min of sucker rotating speed.Traveling time about 5- identical with sucker rotational time 8 seconds.Wafer surface glass cement thickness is about 50-70um.
Silica gel spoon is suspended in above chip, can be operated by the spoon of holding of operating personnel, can also be set dedicated silica gel spoon and fix And mobile device, drive silica gel spoon contact chip and at the uniform velocity move.
Chip at the uniform velocity rotates on special sucker, and glass cement is coated in center wafer position by silica gel spoon, is then passed through Move linearly silica gel spoon, and by glass cement by center wafer position outwards until edge carries out pushing away painting, glass cement is in afer rotates mistake Wafer surface can be uniformly adhered to by the pushing of silica gel spoon in journey.
Glassivation chip glass cement coating unit reduces quality problems caused by manual operations, and is set by associated mechanical It is standby to improve production efficiency.
Certainly, the preferred embodiment of only the utility model described above, the utility model is not limited to enumerate above-mentioned Embodiment, it should be noted that for any those skilled in the art under the guidance of this specification, that is made is all etc. With replacement, obvious variant, all fall within the essential scope of this specification, ought to be protected be subject to the utility model.

Claims (6)

  1. A kind of 1. glassivation chip glass cement coating unit, it is characterised in that including special motor (3), special sucker (4), Silica gel spoon, special motor (3) are connected with hollow motor shaft (6), and the hollow motor shaft (6) is connected with vacuum system, in Empty machine shaft (6) connects special sucker (4), and chip (5) is fixed with special sucker (4), and silica gel spoon is suspended in above chip;
    There is vacuum groove inside the special sucker (4), center drilling is vacuum hole, communicates to be formed with hollow motor shaft (6) Vacuum line;
    The chip (5) is put into special sucker (4) surface, connects vacuum system, and chip (5) is adsorbed on special sucker (4) surface, Special motor (3) is opened, chip (5) is rotated with hollow motor shaft (6) with special sucker (4), released after end of run Vacuum system is put, removes chip (5).
  2. A kind of 2. glassivation chip glass cement coating unit according to claim 1, it is characterised in that the special electricity Machine (3) is connected with motor speed control box (1), and motor speed control box (1) is equipped with motor rotary switch (2);
    Motor speed control box (1) sets multistage rotating speed, realizes that the slow-speed of revolution is changed to high rotating speed.
  3. A kind of 3. glassivation chip glass cement coating unit according to claim 1, it is characterised in that the vacuum system System is connected with solenoid valve (7), and solenoid valve (7) is connected with vacuum switch (8).
  4. A kind of 4. glassivation chip glass cement coating unit according to claim 1, it is characterised in that the special suction Disk (4) is Teflon material, and surface processing is fluted, and is connected at the vacuum hole of special sucker (4) center, i.e. chip (5) special sucker (4) surface is positioned over, is opened by vacuum switch (8), chip (5) is firmly adsorbed in special sucker (4) surface, and as special sucker (4) is rotated.
  5. A kind of 5. glassivation chip glass cement coating unit according to claim 1, it is characterised in that the silica gel spoon For polytetrafluoroethylene (PTFE) material, there is acid-alkali-corrosive-resisting high-temperature stability, and it is pollution-free to glass cement.
  6. A kind of 6. glassivation chip glass cement coating unit according to claim 1, it is characterised in that the silica gel spoon The capacity for accommodating glass cement is 2-4g.
CN201721515385.0U 2017-11-14 2017-11-14 A kind of glassivation chip glass cement coating unit Active CN207338305U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721515385.0U CN207338305U (en) 2017-11-14 2017-11-14 A kind of glassivation chip glass cement coating unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721515385.0U CN207338305U (en) 2017-11-14 2017-11-14 A kind of glassivation chip glass cement coating unit

Publications (1)

Publication Number Publication Date
CN207338305U true CN207338305U (en) 2018-05-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112518473A (en) * 2020-11-30 2021-03-19 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) Optical lens excircle chamfer system of processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112518473A (en) * 2020-11-30 2021-03-19 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) Optical lens excircle chamfer system of processing

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