CN207320076U - Cleaning device before chip potential barrier - Google Patents
Cleaning device before chip potential barrier Download PDFInfo
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- CN207320076U CN207320076U CN201721521216.8U CN201721521216U CN207320076U CN 207320076 U CN207320076 U CN 207320076U CN 201721521216 U CN201721521216 U CN 201721521216U CN 207320076 U CN207320076 U CN 207320076U
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- potential barrier
- cleaning device
- case lid
- jet pipe
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Abstract
Cleaning device before chip potential barrier.The cleaning device being related to before IC manufacturing field, more particularly to chip potential barrier.A kind of convenient processing is provided, moisture removal is effectively removed, improves the cleaning device before the chip potential barrier of product quality.Including babinet, the centre of the babinet is equipped with the supporting table driven by driver, the supporting table is equipped with some frames, some frames are uniformly arranged in a ring, the frame is used to place some wafers, the top opening of the babinet is hingedly equipped with case lid, and the center of the case lid is equipped with jet pipe, and the jet pipe is located at the top connecting pipe one of case lid and pipeline two, positioned at the lower part of case lid is equipped with some spouts.The utility model operation is reliable, ensure that the quality of product.
Description
Technical field
It the utility model is related to the cleaning device before IC manufacturing field, more particularly to chip potential barrier.
Background technology
Si after chip potential barrier cleaning process inside tube core is combined with metal, but si surfaces occur after cleaning
Water stain residual, find that abnormal dot size size occurs in tube core after potential barrier corrosion<, there is this abnormal pipe in 15um etc.
IR occurs in core causes chip rejection extremely, and can not do over again；
Water stain residual reason：When potential barrier is cleaned, the silicon atom of suspension can and water occur that combination reaction generation is non-typical can
Deliquescent silica gel, silica gel and SIO can be left after remaining water droplet evaporation in silicon face2。
HF endings technique in the prior art, water its surface contact angle between 60 ~ 80, contact angle is bigger, surface
Power is stronger, it is necessary to which enough centrifugal force removes, and inertia mass is small（The size of water droplet）, required centrifugal force is bigger, rotating speed
Higher, the drying effect of droplet is better, but the limitation of FSI boards in itself, maximum speed 500RPM/MIN, by centrifugal force deficiency
Surface water drops are thrown away chip completely.
Utility model content
The utility model is conveniently processed in view of the above problems, providing one kind, is effectively removed moisture removal, is improved product quality
Cleaning device before chip potential barrier.
The technical solution of the utility model is：Including babinet, the centre of the babinet is equipped with the branch driven by driver
Platform is supportted, the supporting table is equipped with some frames, and some frames are uniformly arranged in a ring, and the frame is used to place some crystalline substances
Circle, the top opening of the babinet are hingedly equipped with case lid, and the center of the case lid is equipped with jet pipe, and the top that the jet pipe is located at case lid connects
Thread a pipe and one and pipeline two, positioned at the lower part of case lid be equipped with some spouts.
The pipeline two is used to connect atomising mechanism, and the atomising mechanism includes atomizer, hydrogen is equipped with the atomizer
Fluoric acid, the interior connection nitrogen of the atomizer.
The bottom of the babinet is equipped with discharge outlet, and case lid is equipped with exhaust outlet, check valve is equipped with the exhaust outlet.
Some spouts are located at the side of jet pipe and are set along the center line of jet pipe.
The lower part that the jet pipe is located at case lid is laid with humidity sensor, and the humidity sensor is located at the another of jet pipe
Side.
Partition component detachably is equipped with the babinet, the partition component includes some partition plates being arranged in parallel and a frame
Body, the partition plate, which has, to be used to place the mesoporous of jet pipe, and strut connects between some partition plates, and the partition plate be located at adjacent humidity and passes
Between sensor,
The partition plate is equipped with perforation, and the framework is located in the perforation of some partition plates, is detachably equipped with the framework
Towards the baffle of spout.
The baffle is equipped with adsorption layer.
At work, wafer is placed on frame for the utility model, driver drives supporting table spinning movement, pipeline
First, solution is passed through in two and is sprayed respectively from jet pipe and is used for cleaning wafer, removes the organic matter and particle of remained on surface；Take away and get rid of again
It is water stain on dry wafer.Humidity sensor is set on jet pipe, easy to measure humidity, so as to by being passed through hydrofluoric acid mist, by crystalline substance
The remaining water stain quality taken away, improve processing on circle；Partition component is detachably arranged in babinet, can be according to diverse location
The data of humidity sensor measurement, and then corresponding catch is set in framework, the dosage of respective regions hydrofluoric acid mist is reduced, is kept away
Exempt from the excessive corrosion to wafer.The utility model operation is reliable, ensure that the quality of product.
Brief description of the drawings
Fig. 1 is the structure diagram of the utility model,
Fig. 2 is the structure diagram of partition plate,
Fig. 3 is the structure diagram of framework；
1 is babinet in figure, and 2 be driver, and 3 be supporting table, and 4 be frame, and 5 be case lid, and 6 be jet pipe, and 7 be pipeline one, and 8 are
Pipeline two, 9 be spout, and 10 be atomizer, and 11 be discharge outlet, and 12 be exhaust outlet, and 13 be humidity sensor, and 14 be partition plate, and 140 are
Perforation, 15 be strut, and 16 be framework, and 17 be baffle, and 18 be adsorption layer, and 19 be positioning column.
Embodiment
As shown in Figs. 1-3, including babinet 1, the centre of the babinet is equipped with the branch driven by driver 2 to the utility model
Platform 3 is supportted, the supporting table is equipped with some frames 4, and some frames are uniformly arranged in a ring, and the frame is used to place some crystalline substances
Circle, the top opening of the babinet are hingedly equipped with case lid 5, and the center of the case lid is equipped with jet pipe 6, and the jet pipe is located at the top of case lid
Connecting pipe 1 and pipeline 28, positioned at the lower part of case lid be equipped with some spouts 9.
In work, wafer is placed on frame, driver（That is motor）Drive supporting table spinning movement, pipeline one, two
Inside it is passed through solution and is sprayed respectively from jet pipe and be used for cleaning wafer, removes the organic matter and particle of remained on surface.
The pipeline two is used to connect atomising mechanism, and the atomising mechanism includes atomizer 10, is equipped with the atomizer
Hydrofluoric acid（That is HF）, the interior connection nitrogen of the atomizer.
Be atomized to form hydrofluoric acid mist by nitrogen hydrofluoric acid, hydrofluoric acid mist be dissolved on wafer it is remaining it is water stain in, so
Afterwards with the SIO on surface2React, produce SIF4It is water stain that gas takes away surface.
The bottom of the babinet is equipped with discharge outlet 11, and case lid is equipped with exhaust outlet 12, check valve is equipped with the exhaust outlet.
Discharge outlet is reliable easy to exhaust, operation easy to the cleaning solution after discharge cleaning, exhaust outlet.
Some spouts 9 are located at the side of jet pipe and are set along the center line of jet pipe；It is easy to process, adapt to cleaning action.
The lower part that the jet pipe is located at case lid is laid with humidity sensor 13, and the humidity sensor is located at the another of jet pipe
Side.Humidity sensor is set, easy to measure humidity, so as to take away moisture by hydrofluoric acid mist, avoids water stain residual.
Partition component detachably is equipped with the babinet, the partition component includes some partition plates 14 and one being arranged in parallel
Framework 16, the partition plate, which has, to be used to place the mesoporous of jet pipe, and strut 15 connects between some partition plates, and the partition plate is positioned at adjacent
Between humidity sensor,
The partition plate is equipped with perforation 140, and the framework 16 is located in the perforation of some partition plates, detachable in the framework
It is provided with the baffle of spout.
Partition component is set, the wafer on babinet inner frame is subjected to subregion, is measured by some humidity sensors
Different humidity, in this way, the hydrofluoric acid mist of respective amount can be targetedly passed through, so as to by removing moisture removal；Basis in framework
The humidity of measurement, baffle is put into corresponding region, so as to reduce the hydrofluoric acid mist dosage of respective regions, avoids hydrofluoric acid mist pair
Wafer causes excessive corrosion.
The baffle is equipped with adsorption layer 18；Adsorption layer is set, hydrofluoric acid mist can be directly adsorbed, reduce the hydrogen of respective regions
The dosage of fluoric acid mist.
The bottom surface of the case lid is equipped with positioning column 19, and the partition plate that the top is located in partition component is equipped with location hole, described
Positioning column is located in location hole, the positioning for partition component.In this way, at work, partition component and jet pipe keep relatively solid
It is fixed so that the baffle in framework reliably corresponds to spout.
A kind of cleaning of cleaning device before chip potential barrier, comprises the following steps：
1）Some wafers are put into babinet；
2）Cleaning, pipeline one are passed through dense H successively2SO4And H2O2Crystal column surface is cleaned, remove remained on surface has
Machine thing and particle；
3）One-shot measurement humidity, passes through the humidity in the humidity sensor measurement babinet of center；
4）Once dry, hydrofluoric acid is carried out pressurizing atomizing forms hydrofluoric acid mist, and crystal column surface is dried；
5）Double measurement humidity, some humidity sensors measure the humidity of different zones in babinet at the same time；
6）Baffle first is put in the corresponding site of framework, then the partition plate in partition component is put into babinet, finally, framework
It is put into the perforation of partition plate；
7）Secondary drying, carries out pressurizing atomizing by hydrofluoric acid and forms hydrofluoric acid mist, crystal column surface is dried；
8）Complete, take out.
The utility model after cleaning, by measuring humidity twice, thus respectively control hydrofluoric acid mist dosage；Once survey
It is water stain by uniformly being removed to the wafer in whole babinet after amount；After double measurement, pointedly corresponding region can be carried out
Water stain removal, improves the reliability of Product processing.
The utility model is based on FSI cleaning machines（That is MERCURY MP Surface Condition Division
System）On the basis of, by increasing pipeline two, hydrofluoric acid carried out atomization by nitrogen form hydrofluoric acid mist being dissolved on wafer
It is remaining it is water stain in, then with the SIO on surface2React, produce SIF4It is water stain that gas takes away surface.
During cleaning, also need that acid solution equably is sprayed to silicon chip surface, so that the natural oxidizing layer of silicon chip surface is eroded,
A clean potential barrier interface is obtained, but the water stain residual of silicon chip surface can influence potential barrier and be formed.Then, then hydrofluoric acid mist is passed through
Formation, so as to dry water stain（I.e. reaction becomes gas discharge）.
Claims (7)
1. the cleaning device before chip potential barrier, it is characterised in that including babinet, the centre of the babinet is equipped with is driven by driver
Dynamic supporting table, the supporting table are equipped with some frames, and some frames are uniformly arranged in a ring, if the frame is used to place
Dry wafer, the top opening of the babinet are hingedly equipped with case lid, and the center of the case lid is equipped with jet pipe, and the jet pipe is located at the upper of case lid
Portion's connecting pipe one and pipeline two, positioned at the lower part of case lid be equipped with some spouts.
2. the cleaning device before chip potential barrier according to claim 1, it is characterised in that the pipeline two is used to connect mist
Change mechanism, the atomising mechanism includes atomizer, and hydrofluoric acid is equipped with the atomizer, nitrogen is connected in the atomizer.
3. the cleaning device before chip potential barrier according to claim 1, it is characterised in that the bottom of the babinet is equipped with row
The mouth of a river, case lid are equipped with exhaust outlet, check valve are equipped with the exhaust outlet.
4. the cleaning device before chip potential barrier according to claim 1, it is characterised in that some spouts are located at the one of jet pipe
Side and along jet pipe center line set.
5. the cleaning device before chip potential barrier according to claim 4, it is characterised in that the jet pipe is located under case lid
Portion is laid with humidity sensor, and the humidity sensor is located at the opposite side of jet pipe.
6. the cleaning device before chip potential barrier according to claim 5, it is characterised in that be detachably equipped with the babinet
Partition component, the partition component include some partition plates being arranged in parallel and a framework, and the partition plate, which has, to be used to place jet pipe
Mesoporous, strut connects between some partition plates, the partition plate between adjacent humidity sensor,
The partition plate is equipped with perforation, and the framework is located in the perforation of some partition plates, is detachably provided with the framework
The baffle of spout.
7. the cleaning device before chip potential barrier according to claim 6, it is characterised in that the baffle is equipped with absorption
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721521216.8U CN207320076U (en) | 2017-11-14 | 2017-11-14 | Cleaning device before chip potential barrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721521216.8U CN207320076U (en) | 2017-11-14 | 2017-11-14 | Cleaning device before chip potential barrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207320076U true CN207320076U (en) | 2018-05-04 |
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ID=62401256
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721521216.8U Active CN207320076U (en) | 2017-11-14 | 2017-11-14 | Cleaning device before chip potential barrier |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108636908A (en) * | 2018-05-31 | 2018-10-12 | 芜湖英特杰智能科技有限公司 | A kind of chip cleaning plant |
-
2017
- 2017-11-14 CN CN201721521216.8U patent/CN207320076U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108636908A (en) * | 2018-05-31 | 2018-10-12 | 芜湖英特杰智能科技有限公司 | A kind of chip cleaning plant |
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