CN207299711U - For water dispenser electronic refrigerating container and there is its water dispenser - Google Patents

For water dispenser electronic refrigerating container and there is its water dispenser Download PDF

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Publication number
CN207299711U
CN207299711U CN201721346736.XU CN201721346736U CN207299711U CN 207299711 U CN207299711 U CN 207299711U CN 201721346736 U CN201721346736 U CN 201721346736U CN 207299711 U CN207299711 U CN 207299711U
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China
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ice courage
courage body
water
semiconductor refrigeration
conduction cooling
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CN201721346736.XU
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Chinese (zh)
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杨玉恒
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Foshan Shunde Midea Water Dispenser Manufacturing Co Ltd
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Foshan Shunde Midea Water Dispenser Manufacturing Co Ltd
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Abstract

The utility model discloses a kind of electronic refrigerating container for water dispenser and there is its water dispenser, the electronic refrigerating container for water dispenser includes:Ice courage body, is provided with conduction cooling part on the bottom wall of ice courage body;Semiconductor refrigeration chip, is located on ice courage body, and the cold end of semiconductor refrigeration chip is connected with heat transfer with conduction cooling part;Radiating piece, installed in the bottom of ice courage body, the hot junction of semiconductor refrigeration chip is connected with heat transfer with radiating piece.Electronic refrigerating container according to the present utility model for water dispenser, by being provided with conduction cooling part on the bottom wall of ice courage body, the cold end of semiconductor refrigeration chip is connected with conduction cooling part to be connected with heat transfer with heat transfer, the hot junction of semiconductor refrigeration chip with radiating piece.So that the injection intrinsic liquid of ice courage can carry out heat transfer with conduction cooling part and semiconductor refrigeration chip respectively such as water, heat can be exported by the hot junction of semiconductor refrigeration chip, so not only contribute to simplify the structure of electronic refrigerating container, can also improve heat exchange efficiency.

Description

For water dispenser electronic refrigerating container and there is its water dispenser
Technical field
Household electrical appliance technical field is the utility model is related to, more particularly to a kind of electronic refrigerating container and tool for water dispenser There is its water dispenser.
Background technology
In correlation technique, the building block in electronic refrigerating container is such as water tank, semiconductor refrigeration chip, radiation aluminium, fan Arrangement it is unreasonable and complicated, heat exchange efficiency is low, it is impossible to meets the needs of users well.
Utility model content
The utility model is intended at least solve one of technical problem existing in the prior art.For this reason, the utility model carries Go out a kind of electronic refrigerating container for water dispenser, the structure of the electronic refrigerating container for water dispenser is simple, and heat exchange efficiency improves.
The utility model also proposes a kind of water dispenser, and the water dispenser includes the above-mentioned electronic refrigerating container for water dispenser.
According to the electronic refrigerating container for water dispenser of the utility model first aspect embodiment, including:Ice courage body, it is described Conduction cooling part is installed on the bottom wall of ice courage body;Semiconductor refrigeration chip, the semiconductor refrigeration chip are located at the ice courage sheet On body, the cold end of the semiconductor refrigeration chip is connected with heat transfer with the conduction cooling part;Radiating piece, the radiating piece are installed on The bottom of the ice courage body, the hot junction of the semiconductor refrigeration chip are connected with heat transfer with the radiating piece.
According to the electronic refrigerating container for water dispenser of the utility model embodiment, by being installed on the bottom wall of ice courage body Have conduction cooling part, and make the cold end of semiconductor refrigeration chip and conduction cooling part is connected with heat transfer, the hot junction of semiconductor refrigeration chip with Radiating piece is connected with heat transfer.As a result, injection the intrinsic liquid of ice courage such as water can respectively with conduction cooling part and Semiconductor refrigeration chip carries out heat transfer, and heat can further be exported by the hot junction of semiconductor refrigeration chip, so not only Be conducive to simplify the structure of electronic refrigerating container, heat exchange efficiency can also be improved.
In addition, skill additional as follows is also had according to the electronic refrigerating container for water dispenser of the utility model above-described embodiment Art feature:
Some embodiments according to the present utility model, the bottom of the ice courage body have through hole, and the conduction cooling part includes: Conduction cooling plate, the conduction cooling plate close the through hole;Fin, the fin are connected with the conduction cooling plate and stretch into the ice courage body It is interior, wherein, the cold end of the semiconductor refrigeration chip is connected with heat transfer with the outer surface of the conduction cooling plate.
Further, the fin extends along perpendicular to the direction of the conduction cooling plate.
In some embodiments of the utility model, it is empty that the fin covers the ice courage body interior in the height direction Between height at least 50%.
Alternatively, the cold end of the semiconductor refrigeration chip is bonded with the conduction cooling part, the semiconductor refrigeration chip Hot junction is bonded with the radiating piece.
Some embodiments according to the present utility model, a side surface of the semiconductor refrigeration chip and the conduction cooling part it Between, between another side surface of the semiconductor refrigeration chip and the radiating piece at least one at scribble heat-conducting silicone grease.
Alternatively, be equipped with thermal insulation barriers between the radiating piece and the conduction cooling part, the thermal insulation barriers in the conduction cooling part and Heat-insulation chamber is limited between the radiating piece, the semiconductor refrigeration chip is located in the heat-insulation chamber.
Further, the thermal insulation barriers in a ring and are sleeved on the semiconductor refrigeration chip side face, and the thermal insulation barriers are Flexible thermal insulation barriers, and the thickness of the thermal insulation barriers is not less than the thickness of the semiconductor refrigeration chip.
Alternatively, water fender is installed in the ice courage body, the water fender is located at the intrinsic top of ice courage, And there is passage between the water fender and/or the water fender and the ice courage body internal surface, wherein, the ice courage body Water inlet pipe be connected to the upper space of the water fender and the port of export and the water fender of the water inlet pipe of the ice courage body Face, the outlet pipe of the ice courage body are connected to the lower space of the water fender.
Alternatively, it is enclosed with heat preservation member on the outside of the ice courage body;It is equipped with the ice courage body described for detecting The temperature sensor of water temperature in ice courage body;The bottom of the ice courage body is connected with wastewater discharge pipe.
According to the water dispenser of the utility model second aspect embodiment, including:Water tank;Electronic refrigerating container, the electronic refrigerating container The lower section of the water tank is located at, the electronic refrigerating container is the electronic refrigerating container for water dispenser described above.
The additional aspect and advantage of the utility model will be set forth in part in the description, partly by from following description In become obvious, or recognized by the practice of the utility model.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the utility model will in the description from combination accompanying drawings below to embodiment Become obvious and be readily appreciated that, wherein:
Fig. 1 is a schematic diagram according to the electronic refrigerating container for water dispenser of the utility model embodiment.
Reference numeral:Electronic refrigerating container 100, ice courage body 1, water fender 11, the water inlet pipe 12 of ice courage body 1, water inlet pipe 12 The port of export 121, the outlet pipe 13 of ice courage body 1, heat preservation member 14, temperature sensor 15, wastewater discharge pipe 16, conduction cooling part 2, leads Cold plate 21, fin 22, semiconductor refrigeration chip 3, radiating piece 4, thermal insulation barriers 5, radiator fan 6.
Embodiment
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning Same or similar element is represented to same or similar label eventually or there is same or like element.Below by ginseng The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and it is not intended that to the utility model Limitation.
In the description of the utility model, it is to be understood that term " " center ", " height ", " thickness ", " on ", " under ", The orientation or position relationship of the instruction such as " top ", " bottom " " interior ", " outer " be based on orientation shown in the drawings or position relationship, be only for Described easy to description the utility model and simplifying, rather than instruction or imply signified device or element must have it is specific Orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.
The electronic refrigerating container for water dispenser according to the utility model first aspect embodiment is described below in conjunction with the accompanying drawings 100。
As shown in Figure 1, according to the electronic refrigerating container 100 for water dispenser of the utility model embodiment, including:Ice courage body 1st, semiconductor refrigeration chip 3 and radiating piece 4.
Specifically, conduction cooling part 2 is installed on the bottom wall of ice courage body 1.Conduction cooling part 2 can be conduction cooling aluminium etc..For example, In Fig. 1, conduction cooling part 2 may be mounted on the bottom wall of ice courage body 1, be so conducive to by conduction cooling part 2 preferably with ice courage sheet Liquid in body 1 exchanges heat such as water, achievees the purpose that refrigeration.
Semiconductor refrigeration chip 3 is located on ice courage body 1, and the cold end of semiconductor refrigeration chip 3 is (with reference to semiconductor in Fig. 1 The upper end or upper surface of refrigerating chip 3) it is connected with conduction cooling part 2 with heat transfer.Thus, the cold end of semiconductor refrigeration chip 3 is passed through And conduction cooling part 2 can preferably carry out heat transfer, ensure heat exchange efficiency.
Radiating piece 4 is installed on the bottom (with reference to the bottom outside of ice courage body 1 in Fig. 1) of ice courage body 1, semiconductor refrigerating The hot junction of chip 3 is connected with heat transfer (with reference to the lower end or lower surface of semiconductor refrigeration chip 3 in Fig. 1) with radiating piece 4.Heat dissipation Part 4 can be radiation aluminium etc..Thus, inject water in ice courage body 1 etc. can respectively with conduction cooling part 2 and semiconductor refrigerating core Piece 3 carries out heat transfer, and heat can further be exported by the hot junction of semiconductor refrigeration chip 3.
According to the electronic refrigerating container 100 for water dispenser of the utility model embodiment, by the bottom wall of ice courage body 1 Conduction cooling part 2 is installed, and the cold end of semiconductor refrigeration chip 3 and conduction cooling part 2 is connected with heat transfer, semiconductor refrigeration chip 3 Hot junction be connected with radiating piece 4 with heat transfer.As a result, the liquid in injection ice courage body 1 such as water can respectively with Conduction cooling part 2 and semiconductor refrigeration chip 3 carry out heat transfer, and heat can be further by the hot junction of semiconductor refrigeration chip 3 Export, so not only contributes to simplify the structure of electronic refrigerating container 100, can also improve heat exchange efficiency.
There is through hole with reference to Fig. 1, some embodiments according to the present utility model, the bottom of ice courage body 1, through hole can be with shape The middle part of the bottom wall of Cheng Bing courages body 1.So it is easy to the installation of conduction cooling part 2, is conducive to force balance, ensures electronic refrigerating container 100 use stationarity.
Conduction cooling part 2 includes:Conduction cooling plate 21 and fin 22.Wherein, conduction cooling plate 21 can close above-mentioned through hole.Namely Say, the conduction cooling plate 21 of conduction cooling part 2 may be mounted in above-mentioned through hole, and conduction cooling plate 21 can close above-mentioned through hole, so have Beneficial to the sealing performance for ensureing electronic refrigerating container 100, heat exchange efficiency is preferably improved.
Fin 22 is connected with conduction cooling plate 21 and stretches into ice courage body 1, wherein, the cold end of semiconductor refrigeration chip 3 is with leading The outer surface of cold plate 21 is connected with heat transfer.In other words, fin 22 is connected with conduction cooling plate 21, and fin 22 can stretch into ice courage In body 1.For example, fin 22 can upwardly extend and stretch into the inside of ice courage body 1 in Fig. 1.Wherein, semiconductor refrigerating core The cold end of piece 3 is connected (with reference to the upper end or upper surface of semiconductor refrigeration chip in Fig. 1 3) with the outer surface of conduction cooling plate 21 to be passed with heat Pass.As a result, can more fully it exchange heat into the liquid in ice courage body 1 such as water with conduction cooling part 2, favorably In raising heat exchange efficiency.
Further, fin 22 extends along perpendicular to the direction of conduction cooling plate 21.For example, referring to Fig. 1, conduction cooling plate 21 can be with water Flat extension, fin 22 can extend along perpendicular to the direction of conduction cooling plate 21 in vertical direction or in above-below direction.So so that leading Cold part 2 is easily fabricated, preferably exchanges heat easy to liquid with fin 22, ensures heat exchange efficiency.
With reference to Fig. 1, in some embodiments of the utility model, fin 22 is covered in ice courage body 1 in the height direction At least the 50% of portion's spatial altitude.That is, fin 22 in vertically extending short transverse, can cover ice courage At least the 50% of 1 inner space height of body.Thus, be conducive to liquid in ice courage body 1 more fully with conduction cooling part 2 Such as fin 22 carries out heat exchange, is conducive to improve heat exchange efficiency.
For example, fin 22 can cover in the height direction 1 inner space height of ice courage body 50%, 60%, 70%, 80%th, 90% or 100% etc..
Certainly, in the other embodiment of the utility model, can also by increase conduction cooling part 2 conduction cooling plate 21 it is transversal Area, improves the modes such as the distribution density of fin 22 and improves heat exchange efficiency.
Alternatively, the cold end of semiconductor refrigeration chip 3 (with reference to the upper end or upper surface of semiconductor refrigeration chip 3 in Fig. 1) Be bonded with conduction cooling part 2, the hot junction of semiconductor refrigeration chip 3 (with reference to the lower end or lower surface of semiconductor refrigeration chip 3 in Fig. 1) with Radiating piece 4 is bonded.Thus, by making the cold end of semiconductor refrigeration chip 3 be bonded with conduction cooling part 2 so that conduction cooling part 2 and partly lead The cold end of body refrigerating chip 3 can exchange heat with the liquid in ice courage body 1 such as water, and the heat of generation can pass through The hot junction of semiconductor refrigeration chip 3 and radiating piece 4 export, easy to ensure the refrigeration performance of electronic refrigerating container 100.
With reference to Fig. 1, electronic refrigerating container 100 further comprises:Radiator fan 6, radiator fan 6 are installed on the bottom of radiating piece 4, And radiator fan 6 can be connected with ice courage body 1.As a result, by the liquid in conduction cooling part 2 and ice courage body 1 for example Water etc. changes thermogenetic heat and can export more quickly, advantageously ensures that the refrigeration performance of electronic refrigerating container 100.
As shown in Figure 1, some embodiments according to the present utility model, a side surface of semiconductor refrigeration chip 3 (for example, The upper surface of semiconductor refrigeration chip 3) between conduction cooling part 2, another side surface of semiconductor refrigeration chip 3 is (for example, semiconductor The lower surface of refrigerating chip 3) between radiating piece 4 at least one at scribble heat-conducting silicone grease.Can be into one by heat-conducting silicone grease Step improves heat exchange efficiency, ensures the stability of 100 performance of electronic refrigerating container.
For example, it may be scribble heat-conducting silicone grease between a side surface of semiconductor refrigeration chip 3 and conduction cooling part 2;Also may be used To be to scribble heat-conducting silicone grease between another side surface of semiconductor refrigeration chip 3 and radiating piece 4;It can also be in semiconductor system Scribbled between one side surface of cold core piece 3 and conduction cooling part 2, between another side surface of semiconductor refrigeration chip 3 and radiating piece 4 Heat-conducting silicone grease.
Heat-conducting silicone grease is commonly called as thermal grease, and heat-conducting silicone grease adds heat-resisting, excellent thermal conductivity using organic silicone as primary raw material Material, manufactured heat-conducting type organosilicon smectic compound is former for electronics such as power amplifier, transistor, electron tube, CPU The heat conduction and heat dissipation of device, so as to ensure the stabilization of the electric property of electronic instrument and meter etc..
Alternatively, with reference to Fig. 1, thermal insulation barriers 5 are equipped between radiating piece 4 and conduction cooling part 2, thermal insulation barriers 5 are in conduction cooling part 2 and heat dissipation Heat-insulation chamber is limited between part 4, semiconductor refrigeration chip 3 is located in heat-insulation chamber.Thus, on the one hand can be by semiconductor refrigerating core Piece 3 is reliably mounted between radiating piece 4 and conduction cooling part 2;On the other hand, by setting thermal insulation barriers 5 so that electronic refrigerating container 100 The heat produced in process of refrigerastion can be exported by semiconductor refrigeration chip 3 and the grade of radiating piece 4, so be conducive to avoid half Conductor refrigerating chip 3 directly carries out heat exchange with the external world, is easy to ensure refrigerating efficiency.
Further, with reference to Fig. 1, thermal insulation barriers 5 can in a ring, and thermal insulation barriers 5 can be set in semiconductor refrigerating core On 3 side face of piece, thermal insulation barriers 5 can be flexible thermal insulation barriers, for example, thermal insulation barriers 5 can be insulation ring etc..And the thickness of thermal insulation barriers 5 Thickness of the degree not less than semiconductor refrigeration chip 3.Partly led for example, the thickness of thermal insulation barriers 5 along the vertical direction can be greater than or equal to The thickness of body refrigerating chip 3 along the vertical direction.So semiconductor refrigeration chip 3 can be reliably mounted on above-mentioned heat-insulation chamber It is interior, it is thermally shielded better by thermal insulation barriers 5.
Alternatively, with reference to Fig. 1, water fender 11 is installed in ice courage body 1, water fender 11 is located at upper in ice courage body 1 Portion, and there is passage between water fender 11 and/or water fender 11 and 1 inner surface of ice courage body.So that liquid can such as water Freezed with entering via above-mentioned passage in ice courage body 1.
Wherein it is possible to it is that water fender 11 has passage;Can also have between 1 inner surface of water fender 11 and ice courage body Passage;It can also be and be respectively provided with passage between 1 inner surface of water fender 11, water fender 11 and ice courage body.
Specifically, water fender 11 is installed on the top of ice courage body 1, for example, water fender 11 can pacify by welding Mounted in the top of ice courage body 1.Water fender 11 has one with the top of ice courage body 1 and the surrounding of water fender 11 and ice courage body 1 Fixed distance, exterior water enter ice courage body 1 by water inlet pipe 12, can only be along 1 surrounding of water fender 11 and ice courage body Gap (such as passage) enters inside ice courage body 1, avoids water from causing the warm water and ice having just enter into directly into ice courage body 1 Original cold water quickly mixes in courage body 1.
Wherein, the water inlet pipe 12 of ice courage body 1 and the outlet pipe 13 of ice courage body 1, ice courage sheet are connected with ice courage body 1 The water inlet pipe 12 of body 1 is connected to the upper space of water fender 1, and the port of export 121 and water blocking of the water inlet pipe 12 of ice courage body 1 11 face of plate (face in the up-down direction), the outlet pipe 13 of ice courage body 1 can be connected to the lower space of water fender 11.By This so that liquid can be above-mentioned logical followed by being flowed through by water inlet pipe 12, via the port of export 121 of water inlet pipe 12 such as water Road, further flows into ice courage body 1 and freezes;When user needs to take cold water, due to the big original of low temperature water density Reason, by the way that the outlet pipe 13 of ice courage body 1 to be connected to the lower space of water fender 11, advantageously ensures that user gets cold water.
Here it is possible to understand, the outlet pipe 13 of ice courage body 1 can also be located at the top of water fender 11, by Intubation is equipped with the outlet pipe 13 of ice courage body 1, intubation is inserted into 1 bottom of ice courage body by outlet pipe 13, utilizes low temperature watertight Big principle is spent, the water for ensureing to release all is 1 nethermost water of ice courage body.
For example, in the example of fig. 1, the water inlet pipe 12 for the inner cavity for being respectively communicated with ice courage body 1 is installed on ice courage body 1 With outlet pipe 13, water inlet pipe 12 is connected to the top in ice courage body 1, and the intubation being inserted into outlet pipe 13 is connected to ice courage body Bottom in 1.
According to the electronic refrigerating container 100 of the utility model embodiment, by by ice courage body 1, semiconductor refrigeration chip 3, dissipate Warmware 4, radiator fan 6 arrange arrangement in the up-down direction so that size can reduce electronic refrigerating container 100 in the horizontal direction, have Beneficial to space availability ratio is improved, facility is provided for the miniaturization layout of water dispenser.
The bottom of ice courage body 1 is provided with through hole, and conduction cooling part 2 is installed in the through hole, and the huyashi-chuuka (cold chinese-style noodles) of semiconductor refrigeration chip 3 is tight It is attached on conduction cooling part 2, suitable heat-conducting silicone grease is scribbled in order to improve conducting effect, between them;Radiating piece 4 is close to semiconductor The hot face of refrigerating chip 3, similarly scribbles appropriate between two faces (radiating piece 4 is close to the hot face of semiconductor refrigeration chip 3) Heat-conducting silicone grease;Radiator fan 6 is equipped with below radiating piece 4, radiator fan 6 rotates the heat taken away on radiating piece 4, reaches system Cold purpose.
Alternatively, with reference to Fig. 1, the outside of ice courage body 1 is enclosed with heat preservation member 14.Heat preservation member 14 can be such as heat-preservation cotton The outside of ice courage body 1 is wrapped in Deng, heat preservation member 14, plays insulation effect, while the outside of anti-stagnant ice courage body 1 produces condensed water.
The bottom of ice courage body 1 can be connected with wastewater discharge pipe 16.Waste water can be discharged via wastewater discharge pipe 16, just Handled in collection.
The temperature sensor 15 for being used for detecting water temperature in ice courage body 1 is equipped with ice courage body 1.That is, ice courage sheet Temperature sensor 15 is equipped with body 1, temperature sensor 15 can be used for detecting water temperature in ice courage body 1.By detecting ice courage sheet The result detected can be passed to electric-controlled plate, realize water temperature control by the temperature of water in body 1, temperature sensor 15.
Here, temperature sensor 15 can be such as NTC temperature sensors.NTC temperature sensors are by high accuracy, height The NTC thermistor of reliability is packaged into required with insulation, heat conduction, waterproof polymeric material (being popped one's head in sometimes by means of shell) Shape, extends lead, while is combined into a set of be easily installed or the thermistor of observing and controlling temperature at a distance with one group of clamped nipple Sub-assembly.
NTC (Negative Temperature Coefficient), which refers to have exponent relation with temperature rising resistance, to be subtracted Thermistor phenomenon and material small, that there is negative temperature coefficient.The material is to utilize two kinds of manganese, copper, silicon, cobalt, iron, nickel, zinc etc. Or two or more metal oxides such as is sufficiently mixed, be molded, sintered at the semiconductive ceramic that technique forms, can be made into has The thermistor of negative temperature coefficient (NTC).Its resistivity and material constant are with material composition ratio, sintering atmosphere, sintering temperature It is different with configuration state and change.It has also appeared the non-oxidized substance system with carborundum, stannic selenide, tantalum nitride etc. for representative now NTC thermistor material.
According to the water dispenser (not shown) of the utility model second aspect embodiment, including:Water tank and electronic refrigerating container, electronics Ice courage is located at the lower section of water tank, and water tank can provide water source for electronic refrigerating container, and electronic refrigerating container is the above-mentioned electricity for water dispenser Sub- ice courage 100.Thus, by setting the electronic refrigerating container for water dispenser of above-mentioned first aspect embodiment on the water dispenser 100, it is easily assembled, and be conducive to improve space availability ratio, provide facility for the miniaturization layout of water dispenser.
The course of work with reference to Fig. 1 descriptions according to the water dispenser of the utility model embodiment.
The installation site of electronic refrigerating container 100 can be higher than the position of the tap of water dispenser, cold when user takes cold water Water can extrude under the effect of gravity through outlet pipe 13.Water flows through water inlet pipe 12 and enters in ice courage body 1, utilizes low temperature water density Big principle, intubation is inserted into outlet pipe 13 and stretches into the bottom of ice courage body 1, ensures that the water outlet at outlet pipe 13 is cold Water.
The bottom of ice courage body 1 is provided with through hole, and conduction cooling part 2 is installed in the through hole, and the huyashi-chuuka (cold chinese-style noodles) of semiconductor refrigeration chip 3 is tight It is attached on conduction cooling part 2, suitable heat-conducting silicone grease is scribbled in order to improve conducting effect, between them;Radiating piece 4 is close to semiconductor The hot face of refrigerating chip 3, similarly scribbles appropriate between two faces (radiating piece 4 is close to the hot face of semiconductor refrigeration chip 3) Heat-conducting silicone grease;Radiator fan 6 is equipped with below radiating piece 4, radiator fan 6 rotates the heat taken away on radiating piece 4, reaches system Cold purpose.So far the course of work of the water dispenser according to the utility model embodiment is completed.
According to other compositions of the water dispenser of the utility model embodiment and operate for those of ordinary skill in the art For be all known, be not detailed herein.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means to combine the embodiment or example particular features, structures, materials, or characteristics described It is contained at least one embodiment or example of the utility model.In the present specification, schematic expression of the above terms Necessarily it is directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be Combined in an appropriate manner in any one or more embodiments or example.In addition, without conflicting with each other, this area Technical staff can carry out the different embodiments or example described in this specification and different embodiments or exemplary feature With reference to and combination.
Although the embodiment of the utility model has been shown and described above, it is to be understood that above-described embodiment is Exemplary, it is impossible to the limitation to the utility model is interpreted as, those of ordinary skill in the art are in the scope of the utility model It is interior above-described embodiment to be changed, changed, replaced and modification.

Claims (11)

  1. A kind of 1. electronic refrigerating container for water dispenser, it is characterised in that including:
    Ice courage body, is provided with conduction cooling part on the bottom wall of the ice courage body;
    Semiconductor refrigeration chip, the semiconductor refrigeration chip are located on the ice courage body, the semiconductor refrigeration chip Cold end is connected with heat transfer with the conduction cooling part;
    Radiating piece, the radiating piece be installed on the ice courage body bottom, the hot junction of the semiconductor refrigeration chip with it is described Radiating piece is connected with heat transfer.
  2. 2. the electronic refrigerating container according to claim 1 for water dispenser, it is characterised in that the bottom tool of the ice courage body There is through hole, the conduction cooling part includes:
    Conduction cooling plate, the conduction cooling plate close the through hole;
    Fin, the fin are connected with the conduction cooling plate and stretch into the ice courage body,
    Wherein, the cold end of the semiconductor refrigeration chip is connected with heat transfer with the outer surface of the conduction cooling plate.
  3. 3. the electronic refrigerating container according to claim 2 for water dispenser, it is characterised in that the fin is along perpendicular to described The direction extension of conduction cooling plate.
  4. 4. the electronic refrigerating container according to claim 2 for water dispenser, it is characterised in that the fin is in the height direction Cover at least the 50% of the ice courage body interior space height.
  5. 5. the electronic refrigerating container for water dispenser according to any one of claim 1-4, it is characterised in that the semiconductor The cold end of refrigerating chip is bonded with the conduction cooling part, and the hot junction of the semiconductor refrigeration chip is bonded with the radiating piece.
  6. 6. the electronic refrigerating container according to claim 1 for water dispenser, it is characterised in that the semiconductor refrigeration chip Between one side surface and the conduction cooling part, between another side surface of the semiconductor refrigeration chip and the radiating piece in extremely Heat-conducting silicone grease is scribbled at few one.
  7. 7. the electronic refrigerating container for water dispenser according to any one of claim 1-4, it is characterised in that the radiating piece Thermal insulation barriers are equipped between the conduction cooling part, the thermal insulation barriers limit heat-insulated between the conduction cooling part and the radiating piece Chamber, the semiconductor refrigeration chip are located in the heat-insulation chamber.
  8. 8. the electronic refrigerating container according to claim 7 for water dispenser, it is characterised in that the thermal insulation barriers in a ring and cover On the semiconductor refrigeration chip side face, the thermal insulation barriers are flexible thermal insulation barriers, and the thickness of the thermal insulation barriers is not less than institute State the thickness of semiconductor refrigeration chip.
  9. 9. the electronic refrigerating container for water dispenser according to any one of claim 1-4, it is characterised in that the ice courage sheet Water fender is installed in vivo, the water fender is located at the intrinsic top of ice courage, and the water fender and/or the water blocking There is passage between plate and the ice courage body internal surface,
    Wherein, the water inlet pipe of the ice courage body is connected to the upper space of the water fender and the water inlet pipe of the ice courage body The port of export and the water fender face, the outlet pipe of the ice courage body is connected to the lower space of the water fender.
  10. 10. the electronic refrigerating container for water dispenser according to any one of claim 1-4, it is characterised in that the ice courage Heat preservation member is enclosed with the outside of body;
    The temperature sensor for being used for detecting water temperature in the ice courage body is equipped with the ice courage body;
    The bottom of the ice courage body is connected with wastewater discharge pipe.
  11. A kind of 11. water dispenser, it is characterised in that including:
    Water tank;
    Electronic refrigerating container, the electronic refrigerating container are located at the lower section of the water tank, and the electronic refrigerating container is according in claim 1-10 Any one of them is used for the electronic refrigerating container of water dispenser.
CN201721346736.XU 2017-10-16 2017-10-16 For water dispenser electronic refrigerating container and there is its water dispenser Active CN207299711U (en)

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CN201721346736.XU CN207299711U (en) 2017-10-16 2017-10-16 For water dispenser electronic refrigerating container and there is its water dispenser

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Application Number Priority Date Filing Date Title
CN201721346736.XU CN207299711U (en) 2017-10-16 2017-10-16 For water dispenser electronic refrigerating container and there is its water dispenser

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108775732A (en) * 2018-08-31 2018-11-09 厦门帕尔帖电子科技有限公司 A kind of semiconductor refrigerating module
CN109668376A (en) * 2017-10-16 2019-04-23 佛山市顺德区美的饮水机制造有限公司 Electronic refrigerating container for water dispenser and the water dispenser with it
CN111820737A (en) * 2019-04-19 2020-10-27 佛山市顺德区美的饮水机制造有限公司 Kitchen cabinet integrated drinking machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109668376A (en) * 2017-10-16 2019-04-23 佛山市顺德区美的饮水机制造有限公司 Electronic refrigerating container for water dispenser and the water dispenser with it
CN108775732A (en) * 2018-08-31 2018-11-09 厦门帕尔帖电子科技有限公司 A kind of semiconductor refrigerating module
CN111820737A (en) * 2019-04-19 2020-10-27 佛山市顺德区美的饮水机制造有限公司 Kitchen cabinet integrated drinking machine
CN111820737B (en) * 2019-04-19 2022-06-10 佛山市顺德区美的饮水机制造有限公司 Kitchen cabinet integrated drinking machine

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