CN207250512U - The semiconductor device of two different component Series Packages - Google Patents
The semiconductor device of two different component Series Packages Download PDFInfo
- Publication number
- CN207250512U CN207250512U CN201721280684.0U CN201721280684U CN207250512U CN 207250512 U CN207250512 U CN 207250512U CN 201721280684 U CN201721280684 U CN 201721280684U CN 207250512 U CN207250512 U CN 207250512U
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- CN
- China
- Prior art keywords
- chip
- island
- semiconductor device
- diode
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
It the utility model is related to the semiconductor device of a kind of two different component Series Packages, including lead frame, the lead frame includes being used for the chip island for setting chip, the chip island includes the first island and the second island isolated with the first island, first island and the second island are respectively used to set a chip, two chips are the chip of different components, second island includes lead bonding pad, for being connected to the chip set on first island by lead, formed and be connected in series with the chip set with second island, the lead frame further includes second pin and the first pin being electrically connected with first island；One in first pin and second pin as the input terminal after series connection, another is as the output terminal after connecting.Two electronic components are integrated into single encapsulation by the utility model, can be saved space, save semiconductor packages and be assembled processing charges.
Description
Technical field
Semiconductor device is the utility model is related to, more particularly to the semiconductor of a kind of two different component Series Packages
Device.
Background technology
Different electronic components, in actual circuit with upper, typically forms single envelope using single component
Fill the building form of individual.So, when needing to use multiple component built-up circuits, the volume of occupancy is big, and can make
Into the waste of encapsulation material and cost.
Utility model content
Based on this, it is necessary to provide the semiconductor device of a kind of two different component Series Packages.
The semiconductor device of a kind of two different component Series Packages, including lead frame, arranged on the lead frame
On the first chip, the second chip, and the insulation protection outer layer of covering first chip and the second chip, the lead frame
Frame includes being used for the chip island for setting chip, and first chip and the second chip are arranged on the chip island, and two chips are
The chip of different components；The chip island includes the first island and the second island isolated with the first island, and first chip is set
In on first island, second chip is arranged on second island；The lead frame include second pin and with it is described
The first pin that first island is electrically connected, one side of second chip away from second island are electrically connected to institute by lead
Second pin is stated, second island includes lead bonding pad, and one side of first chip away from first island passes through lead
It is electrically connected to the lead bonding pad；One in first pin and second pin is used as the input terminal after series connection, another
One as the output terminal after series connection.
In one of the embodiments, first chip is rectifier diode, current regulator diode, light emitting diode, electricity
One kind in device, capacitor, varistor is hindered, second chip is another.
In one of the embodiments, first island extends outward the insulation away from described first pin one end and protects
Shield outer layer, second island are extended outward away from described second pin one end forms exposed heat dissipation outside the insulation protection outer layer
Portion, the both sides of the exposed radiating part are respectively formed with the depression extended to middle part.
In one of the embodiments, the lead frame further includes the 3rd pin for being electrically connected second island, institute
The 3rd pin is stated to be arranged between first pin and second pin.
In one of the embodiments, one in described two chips be rectifier diode, another be two pole of constant current
Pipe；Opposite polarity of the front of two chips with the back side, and contacted by identical face with the chip island.
In one of the embodiments, first chip and the second chip are connect by cathode and the chip island
Touch, second chip is that anode is electrically connected to the second pin by lead, and first chip is anode by drawing
Line is electrically connected to second island.
The utility model also provides a kind of rectification circuit.
A kind of rectification circuit, including the first diode and the second diode, further include the first semiconductor device and the second half
Conductor device, first semiconductor device and the second semiconductor device are partly led for both of the aforesaid difference component Series Package
The first direct current that body device, the anode of first diode and the anode of the second diode are connected to the rectification circuit is defeated
The respectively exchange input as the rectification circuit of outlet, the cathode of first diode and the cathode of the second diode
End, the input terminal after the series connection of cathode connection first semiconductor device of first diode, the described 2nd 2
The cathode of pole pipe connects the input terminal after the series connection of second semiconductor device, first semiconductor device it is described
Output terminal after series connection and the output terminal after the series connection of second semiconductor device as the rectification circuit second
DC output end.
The utility model also provides a kind of LED drive circuit.
A kind of LED drive circuit, including foregoing rectification circuit, two ac input ends are used for incoming transport electricity
Source, first DC output end are used for the anode for connecting LED component, and second DC output end is used to connect the LED
The cathode of component.
The utility model also provides a kind of LED lamp.
A kind of LED lamp, including LED component, further include the rectification circuit according to right wants 7, two exchanges
Input terminal is used for incoming transport power supply, the anode of the first DC output end connection LED component, second DC output end
Connect the cathode of the LED component.
Two electronic components are integrated into single envelope by the semiconductor device of above-mentioned two difference component Series Package
Dress, can save space, saves semiconductor packages and assemble processing charges.Lead frame has a gelled effect, thus this two
The semiconductor device of a difference component Series Package has the characteristics that thermal diffusivity is good, and can avoid diode, resistance and electricity
The axial product such as appearance needs to damage the potential physical stress of pin bending forming.
Brief description of the drawings
Fig. 1 is the structure diagram of the semiconductor device of Series Package in an embodiment；
Fig. 2 is the structure diagram of the semiconductor device of Series Package in another embodiment；
Fig. 3 is the structure diagram of lead frame in an embodiment；
Fig. 4 a~4f are respectively in the embodiment that a kind of two chips are different components；
Fig. 5 is the circuit diagram of LED lamp in an embodiment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in fact in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is the public affairs made to the utility model
Open content more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood implication of technical staff in domain is identical.It is simply in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more relevant Listed Items.
The semiconductor device of two different component Series Packages includes the lead frame of conductive material (such as copper).Fig. 1,
Fig. 2 is respectively the structure diagram of the semiconductor device of two different component Series Packages in an embodiment.
The structure of semiconductor device is introduced below in conjunction with Fig. 1 and Fig. 2.Semiconductor device is further included arranged on lead frame
The first chip 102, the second chip 104 on frame, and the insulation protection outer layer of the first chip 102 of covering and the second chip 104
40.It should be understood that since the first chip 102 and the second chip 104 are covered by insulation protection outer layer 40, Fig. 1 and Fig. 2 divide
Do not show a case that insulation protection outer layer 40 covers the first chip 102 and the second chip 104 and to insulation protection outer layer 40
Do the situation of perspective processing.Lead frame includes being used for the chip island for setting chip, and the first chip 102 and the second chip 104 are set
In on chip island.Two chips are the chip of different components, such as the first chip 102 is that rectifier diode is (i.e. common
Diode), current regulator diode (CRD), light emitting diode (LED), resistor, capacitor, one kind in varistor, the second core
Piece 104 is the another kind in rectifier diode, current regulator diode, light emitting diode, resistor, capacitor, varistor.Fig. 4 a
~4f shows a case that two chips are different components in several different embodiments, and wherein Fig. 4 a are rectifier diodes
With resistor in series, Fig. 4 b are that rectifier diode is connected with current regulator diode, and Fig. 4 c are rectifier diode and light emitting diode
(LED) connect, Fig. 4 d are that rectifier diode is connected with capacitor, and Fig. 4 e are that resistor is connected with capacitor, and Fig. 4 f are rectifications two
Pole pipe is connected with varistor.
In the embodiment depicted in figure 2, chip island includes the first island 10 and the second island 20 isolated with the first island 10.First core
Piece 102 is arranged on the first island 10, and the second chip 104 is arranged on the second island 20.Lead frame includes second pin 34 and with first
The first pin 32 that island 10 is electrically connected.Second chip 104 away from the second island 20 one side (be in the present embodiment chip just
Face) second pin 34 is electrically connected to by lead.First chip 102 (is in the present embodiment away from the one side on the first island 10
Chip front side) lead bonding pad (not indicated in Fig. 2) is electrically connected to by lead.In first pin 32 and second pin 34
One as the input terminal of semiconductor device after two chip-in series, another is as the output terminal after series connection.
Two electronic components are integrated into single envelope by the semiconductor device of above-mentioned two difference component Series Package
Dress, can save space, saves semiconductor packages and assemble processing charges.Lead frame has a gelled effect, thus this two
The semiconductor device of a difference component Series Package has the advantages that thermal diffusivity is good, and can avoid diode, resistance and electricity
The axial product such as appearance needs to damage the potential physical stress of pin bending forming.
In the embodiment depicted in figure 2, lead frame further includes the 3rd pin 36 for being electrically connected the second island 20, the 3rd pin
36 are arranged between the first pin 32 and second pin 34.
In one embodiment, the material of insulation protection outer layer 40 is epoxy resins insulation plastics.
In Fig. 1 and embodiment illustrated in fig. 2, the one end of the first island 10 away from the first pin 32 extends outward insulation protection
Outer layer 40, the second island 20 are equally extended outward away from 34 one end of second pin forms exposed radiating part outside insulation protection outer layer 40
31.Fig. 3 is the structure diagram of lead frame in an embodiment, and the both sides of exposed radiating part 31, which are respectively formed with to middle part, to be extended
Depression 11 and depression 21.It will be appreciated by those skilled in the art that, lead frame is multiple to be connected to one when making
One shelf of formation is played, therefore is further included in structure shown in Fig. 3 and multiple lead frames is connected to dowel 33 in a row.
In the embodiment shown in fig. 3, the first pin 32, second pin 34, the 3rd one end of pin 36 away from chip island lead to
Cross connecting portion 35 to connect, location hole 41 is further opened with connecting portion 35.As shown in figure 3, can be on the first island 10 and the second island 20
Upper setting specific region, dedicated for setting chip, the spacing of the two areas outsides is a, and a should be less than exposed radiating part 31
Both sides spacing.
It is rectifier diode with the first chip 102, the second chip 104 is the embodiment of current regulator diode to above-mentioned semiconductor
The application of device is further described.Referring also to Fig. 2, in this embodiment, the positive polarity with the back side of two chips
Conversely.Such as the front of chip is P-type semiconductor, the anode as diode, the back side is N-type semiconductor, as diode
Cathode.The front that can also be in other embodiments chip is cathode, the back side is anode.First chip 102 and the second chip
104 are contacted by identical face (being chip back in the present embodiment) with chip island.In practical application, it can be somebody's turn to do by two
Device and two diodes form a kind of rectification circuit.Referring to Fig. 5, rectification circuit includes the first diode 302 and the two or two pole
Pipe 304, further includes the first semiconductor device 100 and the second semiconductor device 200.Wherein the first semiconductor device 100 and second
Semiconductor device 200 is two differences that foregoing first chip 102 is rectifier diode, the second chip 104 is current regulator diode
The semiconductor device of component Series Package.The anode of the anode of first diode 302 and the second diode 304 is connected to whole
The cathode of first DC output end of current circuit, the cathode of the first diode 302 and the second diode 304 is respectively used as rectification circuit
An ac input end.The cathode of first diode 302 connects the input terminal of the first semiconductor device 100, the second diode
304 cathode connects the input terminal of the second semiconductor device 200.The output terminal and the second semiconductor of first semiconductor device 100
Second DC output end of the output terminal of device 200 as rectification circuit.
Above-mentioned rectification circuit only used 4 devices (the first diode 302, the second diode 304, the first semiconductor dress
Put the 100, second semiconductor device 200) it can form, cost can be reduced, save space and simplifies production procedure.
The utility model provides a kind of LED drive circuit and LED lamp including above-mentioned rectification circuit at the same time, has following
Advantage：
Circuit is simple
Need to can only be connected multiple low-power LEDs by commercial power rectification, filtering access current regulator diode, be adapted to LED daylight
Lamp.Circuit is simple, small, even narrow space can also put in completely.
Stability is high
Equivalent to one dynamic electric resistor of current regulator diode, output current are controlled, flicker free, stable luminescence.
No EMI interference problems and low ripple output
Since current regulator diode employs linear circuit framework, EMI problems are not present in circuit and ultralow ripple exports, so that
The light decay of LED can be mitigated, prolonged the service life.
It is efficient
It is lower than the energy consumption using electronic power supply supply (switching power), so as to improve whole circuit
Efficiency.
Negative temperature characteristic
When detecting that environment temperature raises in lamps and lanterns, CRD can suppress output current automatically, so as to protect LED, mitigate
The light decay of LED, it is ensured that LED long-lives.
High and low pressure is applicable in
The minimum pressure-resistant 50V (actual more than 60V) of current regulator diode, high pressure 100V, high and low pressure is applicable in without adding assisted group
Part.
Embodiment described above only expresses the several embodiments of the utility model, its description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this area
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (9)
1. the semiconductor device of a kind of two different component Series Packages, including lead frame, on the lead frame
The first chip, the second chip, and the insulation protection outer layer of covering first chip and the second chip, the lead frame
Including the chip island for setting chip, first chip and the second chip are arranged on the chip island, it is characterised in that
Two chips are the chip of different components；The chip island includes the first island and the second island isolated with the first island,
First chip is arranged on first island, and second chip is arranged on second island；The lead frame includes the
Two pins and the first pin being electrically connected with first island, second chip deviate from the one side on second island by drawing
Line is electrically connected to the second pin, and second island includes lead bonding pad, and first chip deviates from first island
One side the lead bonding pad is electrically connected to by lead；One in first pin and second pin is used as series connection
Rear input terminal, another is as the output terminal after series connection.
2. the semiconductor device of two different component Series Packages according to claim 1, it is characterised in that described the
One chip is one kind in rectifier diode, current regulator diode, light emitting diode, resistor, capacitor, varistor, described
Second chip is another.
3. the semiconductor device of two different component Series Packages according to claim 1, it is characterised in that described the
One island extends outward the insulation protection outer layer, second island away from the second pin away from described first pin one end
One end extends outward and forms exposed radiating part outside the insulation protection outer layer, and the both sides of the exposed radiating part are respectively formed with
The depression extended to middle part.
4. the semiconductor device of two according to claim 1 different component Series Packages, it is characterised in that described to draw
Wire frame further includes the 3rd pin for being electrically connected second island, and the 3rd pin draws arranged on first pin and second
Between foot.
5. the semiconductor device of two according to claim 1 different component Series Packages, it is characterised in that described two
One in a chip be rectifier diode, another be current regulator diode；Polarity phase of the front of two chips with the back side
Instead, and by identical face with the chip island contact.
6. the semiconductor device of two different component Series Packages according to claim 5, it is characterised in that described the
One chip and the second chip are to be contacted by cathode with the chip island, and second chip is that anode is electrically connected by lead
The second pin is connected to, first chip is that anode is electrically connected to second island by lead.
7. a kind of rectification circuit, including the first diode and the second diode, it is characterised in that further include the first semiconductor device
With the second semiconductor device, first semiconductor device and the second semiconductor device are two according to claim 6
The semiconductor device of different component Series Packages, the anode of first diode and the anode of the second diode are connected to
Described in first DC output end of the rectification circuit, the cathode of first diode and the cathode of the second diode are respectively used as
One ac input end of rectification circuit, the cathode of first diode connect the series connection of first semiconductor device
Input terminal afterwards, the cathode of second diode connect the input terminal after the series connection of second semiconductor device, institute
State the output terminal after the series connection of the output terminal after the series connection of the first semiconductor device and second semiconductor device
The second DC output end as the rectification circuit.
A kind of 8. LED drive circuit, it is characterised in that including rectification circuit according to claim 7, two exchanges
Input terminal is used for incoming transport power supply, and first DC output end is used for the anode for connecting LED component, and second direct current is defeated
Outlet is used for the cathode for connecting the LED component.
9. a kind of LED lamp, including LED component, it is characterised in that further include rectification circuit according to claim 7, two
A ac input end is used for incoming transport power supply, the anode of the first DC output end connection LED component, and described second
DC output end connects the cathode of the LED component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721280684.0U CN207250512U (en) | 2017-09-30 | 2017-09-30 | The semiconductor device of two different component Series Packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721280684.0U CN207250512U (en) | 2017-09-30 | 2017-09-30 | The semiconductor device of two different component Series Packages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207250512U true CN207250512U (en) | 2018-04-17 |
Family
ID=61889711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721280684.0U Withdrawn - After Issue CN207250512U (en) | 2017-09-30 | 2017-09-30 | The semiconductor device of two different component Series Packages |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207250512U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768365A (en) * | 2017-09-30 | 2018-03-06 | 深圳市矽莱克半导体有限公司 | The semiconductor device of two different component Series Packages |
-
2017
- 2017-09-30 CN CN201721280684.0U patent/CN207250512U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768365A (en) * | 2017-09-30 | 2018-03-06 | 深圳市矽莱克半导体有限公司 | The semiconductor device of two different component Series Packages |
| CN107768365B (en) * | 2017-09-30 | 2019-06-11 | 深圳市矽莱克半导体有限公司 | The semiconductor device of two different component Series Packages |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180417 Effective date of abandoning: 20190611 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20180417 Effective date of abandoning: 20190611 |