CN207232789U - Cryo tissue embeds adapter - Google Patents
Cryo tissue embeds adapter Download PDFInfo
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- CN207232789U CN207232789U CN201721094626.9U CN201721094626U CN207232789U CN 207232789 U CN207232789 U CN 207232789U CN 201721094626 U CN201721094626 U CN 201721094626U CN 207232789 U CN207232789 U CN 207232789U
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- semiconductor element
- mouth
- embedded block
- element limiting
- limiting plate
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Abstract
Cryo tissue embedding adapter belongs to biological specimen cryo tissue embedding techniques field, more particularly to a kind of cryo tissue embedding adapter.The utility model provides the cryo tissue embedding adapter that a kind of work efficiency is high, using effect is good.The utility model includes housing, semiconductor element limiting slot is provided with housing base, heating refrigeration semiconductor element is provided with semiconductor element limiting slot, semiconductor element limiting slot upper end is provided with embedded block limited mouth covered with embedded block limiting plate on embedded block limiting plate corresponding to semiconductor element limiting slot；The control circuit being provided with the housing base, the control signal output mouth of control circuit is connected with heating the control signal input mouth of refrigeration semiconductor element, and the detection signal input port of control circuit is connected with the detection signal output port of the temperature sensor of detection heating refrigeration semiconductor component temperature.
Description
Technical field
The utility model belongs to biological specimen cryo tissue embedding techniques field, more particularly to a kind of embedding of cryo tissue is fitted
Orchestration.
Background technology
China Patent No. proposes a set of for the patented technology of 201610159556 .4 in terms of low-temperature biological sample storage
Embedded embedding solution so that low-temperature biological sample embedding techniques saves the plenty of time, improves work efficiency, saves greatly
Memory space is measured, and realizes batch-automated scanning storage.
Although above-mentioned technology solves the batch storage problem of sample, but, it is necessary to embedded during follow-up use
Label implements the operation thawed and frozen again, and researcher is generally melted using body temperature in the past operating process and the cold environment of refrigerator is cold
Freeze, the process time and effort consuming, and be unfavorable for batch operation, if melted or to freeze process again lasting, it is also possible to influence whether to be wrapped
Bury the nucleic acid or Protein Information of biological specimen.
The content of the invention
The utility model is aiming at the above problem, there is provided the cryo tissue bag that a kind of work efficiency is high, using effect is good
Bury adapter.
To achieve the above object, the utility model adopts the following technical solution, and the utility model includes housing, housing base
On be provided with semiconductor element limiting slot, be provided with semiconductor element limiting slot heating refrigeration semiconductor element, semiconductor element
Part limiting slot upper end is provided with embedding covered with embedded block limiting plate on embedded block limiting plate corresponding to semiconductor element limiting slot
Block limited mouth；The control circuit being provided with the housing base, control signal output mouth and the heating of control circuit are freezed
The control signal input mouth of semiconductor element is connected, and detection signal input port and the detection heating refrigeration of control circuit are partly led
The detection signal output port of the temperature sensor of body component temperature is connected.
As a preferred embodiment, heating refrigeration semiconductor element described in the utility model is partly led using two level heating refrigeration
Volume elements part.
As another preferred solution, it is spacing that semiconductor element limiting slot described in the utility model is arranged on semiconductor element
On plate, semiconductor element limiting plate and the dismantled and assembled connection of housing base；Semiconductor element limiting slot includes being limited by semiconductor element
Position edges of boards slide mouth along the strip extended to middle part, and sliding mouth both ends top is the first raised, semiconductor of sliding mouth the inner to middle part
The lower end of element limiting plate is provided with limited block, and sliding mouth inside lower end is provided with lower loading plate, and lower loading plate both sides are with partly leading
Volume elements part limiting plate lower end is connected；First raised inside upper part is the second protrusion to middle part；Semiconductor is installed on housing base
The edge of opening of element limiting plate is corresponding at the beginning of the first order heating refrigeration semiconductor element of two level heating refrigeration semiconductor element
Beginning is put into position and is provided with carrying guide plate.
As another preferred solution, four semiconductor elements are provided with semiconductor element limiting plate described in the utility model
Part limiting slot, the line at the center of four semiconductor element limiting slots are square；Embedded block limiting plate is provided with four and half
The corresponding embedded block limited mouth of conductor element limiting slot.
As another preferred solution, the middle part of embedded block limiting plate described in the utility model is cross hollow-out parts, often
Inside recess is both provided with the middle part of side.
As another preferred solution, the utility model is additionally provided with for compressing embedded block limited mouth inner tissue sample bag
The cover board of block is buried, housing upper end is provided with upper cover, and upper cover one end connects with housing axis, the upper cover other end and housing card and is connected.
As another preferred solution, set in housing base described in the utility model corresponding to heating refrigeration semiconductor element
It is equipped with heat sink and radiator fan, the control signal input mouth of radiator fan and the control signal output mouth phase of control circuit
Even.
Secondly, the embedded label of the utility model（Referring to 201610159556 .4 of patent）On histotomy after, by group
Knit and be placed in label cover（Referring to 201610159556 .4 of patent）Interior, embedded label is inserted into embedded block limited mouth downward, and control adds
Refrigeration heat semiconductor element heats, and embedded label is pressed into tissue and turns positive and negative anodes again, and cooling keeps embedded label
It is pressed into and organizes the formation of one, lift on embedded block limiting plate is separated with semiconductor element limiting slot, label cover is taken out to be put into and is deposited
Storage box.
In addition, when the utility model control heating refrigeration semiconductor element thaws：It is heated to 40 degree to maintain 1 second, electricity
Umpolung, it is 5 degree to freeze to temperature, maintains 5 seconds, removes embedded block rapidly, it is spare to open label-side；
When resetting and freezing again：Semiconductor element is set as -20 degree, and 1 cubic centimeter of tissue block is heated to 60 degree, pauses 8 seconds,
Electrode inverts, and radiator fan starts, and refrigeration to -30 degree maintains 10 seconds, pauses 5 seconds, and electrode reversion, is heated to temperature as 5 degree, stops
Only work, remove sample rapidly.
The utility model beneficial effect.
The utility model is the adapter of the frozen-thaw process during the tissue use of cooperation low temperature embedding.
The utility model is fast, efficient using heating refrigeration semiconductor element, heating and the speed to cool down.
The utility model sets embedded block limited mouth, can effectively prevent embedding box lid from sliding offset.
Using the utility model, process standard can be made, it is poor caused by sample and experiment process to reduce human factor
Alienation is disturbed.
The utility model plays a very good protection sample biological information, and destruction when avoiding conventional treatment is made
With.
The utility model control circuit can built-in several programs or pattern through practice examining, it is easy to use.
Special shape of the utility model for " cryogenic storage system mark carries element ", there is provided grope the temperature of maturation
Intervention group set is spent, can realize -20, -40, -80 degrees Celsius of feelings respectively in the case where fully maintaining biological specimen storage temperature
Element dissociation and composition operation under condition.
Brief description of the drawings
The utility model is described further with reference to the accompanying drawings and detailed description.Scope of protection of the utility model
It is not only limited to the statement of herein below.
Fig. 1 is the utility model structure diagram.
Fig. 2 is the utility model semiconductor element limiting plate bottom view.
Fig. 3 is the spacing plate structure schematic diagram of the utility model semiconductor element.
Fig. 4 is the spacing plate structure schematic diagram of the utility model embedded block.
Fig. 5 is that the utility model carrying guide plate sets position view.
Fig. 6 is the utility model covering plate structure schematic diagram.
Fig. 7 is the utility model CPU part circuit diagram.
Fig. 8 is the utility model power supply conversion portion circuit diagram.
Fig. 9,10,11 are Tthe utility model system control section schematic diagrams.
Figure 12 is the utility model memory portion circuit diagram.
Figure 13,14 are Tthe utility model system feedback fraction circuit diagrams.
Figure 15 is the utility model display portion circuit diagram.
Figure 16 is the utility model Bluetooth portion circuit diagram.
Figure 17 is the utility model radiating control partial circuit schematic diagram.
In figure, 1 it is display portion, 2 is upper cover, 3 is semiconductor element limiting plate, 4 is embedded block limiting plate, 5 is second
Level heating refrigeration semiconductor element, 6 be first order heating refrigeration semiconductor element, 7 be cover board, 8 be housing, 9 be the first protrusion,
10 for it is second raised, 11 be lower loading plate, 12 be sliding mouth, 13 be rectangular-shaped limited block, 14 be recess, 15 be cross hollow out
Portion, 16 be semiconductor element limiting slot, 17 be carrying guide plate, 18 be handle.
Embodiment
As shown in the figure, the utility model includes housing, semiconductor element limiting slot, semiconductor element are provided with housing base
Heating refrigeration semiconductor element is provided with part limiting slot, semiconductor element limiting slot upper end is covered with embedded block limiting plate, bag
Bury and semiconductor element limiting slot is provided with embedded block limited mouth on block limiting plate；The control being provided with the housing base
Circuit processed, the control signal output mouth of control circuit are connected with heating the control signal input mouth of refrigeration semiconductor element,
The detection signal of the detection signal input port of control circuit and the temperature sensor of detection heating refrigeration semiconductor component temperature
Output port is connected.
The heating refrigeration semiconductor element is using two level heating refrigeration semiconductor element.Partly led using two level heating refrigeration
Volume elements part, can further speed up the speed of heating and cooling, and heating, temperature-fall period can be completed for several seconds.Sample disposal
Time shortens to ultimate attainment, almost can be ignored.
The semiconductor element limiting slot is arranged on semiconductor element limiting plate, semiconductor element limiting plate and housing bottom
The dismantled and assembled connection of seat；The strip that semiconductor element limiting slot includes extending from semiconductor element limiting plate edge to middle part slides mouth,
Sliding mouth both ends top is the first protrusion to middle part, and the lower end of the semiconductor element limiting plate of sliding mouth the inner is provided with limiting block
Block, sliding mouth inside lower end are provided with lower loading plate, and lower loading plate both sides are connected with semiconductor element limiting plate lower end；First is raised
Inside upper part is the second protrusion to middle part；The edge of opening that semiconductor element limiting plate is installed on housing base corresponds to two level
The first order heating refrigeration semiconductor element of heating refrigeration semiconductor element is initially put into position and is provided with carrying guide plate.
Sliding mouth is set easy to which semiconductor element is pushed into, easy to the dismounting of semiconductor element.Second level heating refrigeration is partly led
Volume elements part is arranged in the middle part of first order heating refrigeration semiconductor element and protrusion, first order heating refrigeration semiconductor element are initially put
In on carrying guide plate, sliding mouth is pushed forward into along carrying guide plate, continues first order heating refrigeration semiconductor element forward and enters
First raised lower end, last first order heating refrigeration semiconductor member forward end offset with limited block, first order heating refrigeration
Semiconductor element lower end is placed on lower loading plate, and the first order heats refrigeration semiconductor element and pressed from both sides by the first raised and lower loading plate
Firmly.Refrigeration semiconductor element is heated due to narrower width, between the first protrusion of both sides, second level heating refrigeration half in the second level
Conductor element two is placed on the second raised lower end, and the opening between the second protrusion is contact mouth of the embedded block with semiconductor element.
Semiconductor element limiting plate and the dismantled and assembled connection of housing base；Easy to the dismounting of component.
Four semiconductor element limiting slots, four semiconductor element limiting slots are provided with the semiconductor element limiting plate
Center line it is square；Embedded block limiting plate is provided with four and is limited with the corresponding embedded block of semiconductor element limiting slot
Position mouth.Multiple semiconductor element limiting slots and embedded block limited mouth are set, easy to the batch processing of embedded block.
The middle part of the embedded block limiting plate is cross hollow-out parts, and per side, middle part is both provided with inside recess.Set
Cross hollow-out parts pick and place easy to embedded block limiting plate.
The utility model is additionally provided with the cover board for compressing embedded block limited mouth inner tissue sample embedded block, housing upper end
Upper cover is provided with, upper cover one end connects with housing axis, the upper cover other end and housing card and is connected.
In use, first embedded block limiting plate is placed on semiconductor element limiting plate, then by embedded box（Referring to patent
201610159556 .4）It is put into embedded block limited mouth, buckles upper cover, embedded box bottom end cover is closely connect with semiconductor element
Touch.Semiconductor element positive and negative anodes are turned controllable semiconductor element low temperature face and are turned, one face low temperature of semiconductor element（Less than another
20 degree or so of face, also can paste semiconductor element, i.e. two level heating refrigeration semiconductor element, the rear patch semiconductor element again in chill surface
Part high temperature face temperature is identical with base semiconductor components low temperature face temperature, temperature is further reduced）, another side and environment temperature
Unanimously.
Heating refrigeration semiconductor element is provided with heat sink and radiator fan, radiator fan in the housing base
Control signal input mouth be connected with the control signal output mouth of control circuit.
Embedded label（Referring to 201610159556 .4 of patent）On histotomy after, tissue is placed in label cover（Ginseng
See 201610159556 .4 of patent）Interior, embedded label is inserted into embedded block limited mouth, control heating refrigeration semiconductor member downward
Part heats, and embedded label is pressed into tissue and turns positive and negative anodes again, and cooling makes embedded label keep being pressed into organizing the formation of one
Body, lift on embedded block limiting plate is separated with semiconductor element limiting slot, label cover is taken out and is put into the storage box.
Before histotomy, embedded box is first taken out into heating, is uncapped, is sticked on slicing device and cuts into slices after dispensing.
When the utility model control heating refrigeration semiconductor element thaws：It is heated to 40 degree to maintain 1 second, electrode is anti-
Turn, it is 5 degree to freeze to temperature, maintains 5 seconds, removes embedded block rapidly, it is spare to open label-side.
When resetting and freezing again：Semiconductor element is set as -20 degree, and 1 cubic centimeter of tissue block is heated to 60 degree, pauses 8 seconds,
Electrode inverts, and radiator fan starts, and refrigeration to -30 degree maintains 10 seconds, pauses 5 seconds, and electrode reversion, is heated to temperature as 5 degree, stops
Only work, remove sample rapidly.
Above-mentioned technical parameter, is that inventor tests by long-term system and parameter gropes to obtain repeatedly.The working method
It can make several embedded blocks in running order rapidly in 30 seconds, the embedding finished can be used by several with batch in 1 minute
Block label is resetted and frozen firmly.
The control circuit includes CPU, power supply conversion portion, systems control division point, memory, system feedback part, aobvious
Show part, Bluetooth portion and radiating control part, the control that the control signal output mouth of CPU divides with systems control division respectively is believed
Number input port, the control signal input mouth of radiating control part are connected, the detection signal input port and system feedback of CPU
Partial detection signal output port is connected, the signal transmission port of the CPU signal transmission port with memory, display unit respectively
Sub-signal transmission port, the signal transmission port of Bluetooth portion are connected；Display portion is arranged on the housing forward end.
The power supply output port of the power supply conversion portion power port that the power port with CPU, systems control division divide respectively,
The power port of memory, the power port of system feedback part, the power port of display portion, the power end of alarm portion
Mouth, the power port of radiating control part are connected.
According to actual needs, multiple User Defined patterns can be set.
The CPU using STM32F103RBT6 chips U1, U1 5 feet respectively with resistance R1 one end, crystal oscillator X1 one end, electricity
Hold C1 one end to be connected, 6 feet of U1 are connected with the resistance R1 other ends, the crystal oscillator X1 other ends, capacitance C2 one end respectively, and capacitance C1 is another
End be connected respectively with ground wire, the capacitance C2 other ends, capacitance C3 one end, the capacitance C3 other ends respectively with resistance R2 one end, 7 feet of U1
It is connected, another termination 3.3V power supplys of resistance R2；60 feet of U1 are grounded by resistance R3, and 38 feet and light emitting diode DS1 of U1 are cloudy
Extremely it is connected, light emitting diode DS1 anodes connect 3.3V power supplys, 37 feet and the light emitting diode DS0 cathode phases of U1 by resistance RD1
Even, light emitting diode DS0 anodes connect 3.3V power supplys by resistance RD2.
1 foot that the power supply conversion portion includes LM2596S-5.0 chip U2 and RT9167A-3.3 chips U3, U2 is distinguished
It is connected with diode D1 cathodes, capacitance C8 cathodes, diode D1 anodes are connected with 15V power supplys, capacitance C12 cathodes respectively, capacitance
C12 anode are connected with capacitance C8 anode, ground wire respectively；2 feet of U2 are connected with diode D2 cathodes, inductance L1 one end respectively, and two
Pole pipe D2 plus earths, the inductance L1 other ends respectively with capacitance C9 cathodes, 4 feet of U2, capacitance C10 cathodes, capacitance C11 cathodes,
Power supply VCC is connected, 3, the 5 feet ground connection of U2.
1,3 feet of U3 connect the 2 feet ground connection of power supply VCC, U3, and 4 feet of U3 are grounded by capacitance C17,5 feet of U3 respectively with electricity
Appearance C18 one end, capacitance C19 cathodes, capacitance C20 cathodes, 3.3V power supplys are connected, and the capacitance C18 other ends are born with capacitance C19 respectively
Pole, capacitance C20 anode, ground wire are connected.
The systems control division point include IRF740 chip MOS2, IRF740 chip MOS1, IRF740 chips MOS3,
IRF740 chips MOS4, relay SRD1, relay SRD2, relay SRD3, relay SRD4 and ULN2003 chip U4, after
5 feet of electric appliance SRD1 meet GND_P1, and 4 feet of relay SRD1 meet 15V_P1, and 1 foot of relay SRD1 connects power supply VCC, relay
3 feet of SRD1 connect 14 feet of U4, and 2 feet of relay SRD1 connect the first order heating refrigeration half of two level heating refrigeration semiconductor element
One pin of conductor element.
5 feet of relay SRD2 meet GND_P1, and 4 feet of relay SRD2 meet 15V_P1, and 1 foot of relay SRD2 connects power supply
3 feet of VCC, relay SRD2 connect 13 feet of U4, and 2 feet of relay SRD2 connect the first order of two level heating refrigeration semiconductor element
Heat another pin of refrigeration semiconductor element.
5 feet of relay SRD3 meet GND_P2, and 4 feet of relay SRD3 meet 15V_P2, and 1 foot of relay SRD3 connects power supply
3 feet of VCC, relay SRD3 connect 16 feet of U4, and 2 feet of relay SRD3 connect the second level of two level heating refrigeration semiconductor element
Heat one pin of refrigeration semiconductor element.
5 feet of relay SRD4 meet GND_P2, and 4 feet of relay SRD4 meet 15V_P2, and 1 foot of relay SRD4 connects power supply
3 feet of VCC, relay SRD4 connect 15 feet of U4, and 2 feet of relay SRD4 connect the second level of two level heating refrigeration semiconductor element
Heat another pin of refrigeration semiconductor element.
15V power supplys are connected by heat portective switch PROTECT1 with 15V_P1, and 15V power supplys pass through heat portective switch
PROTECT2 is connected with 15V_P2.
2 feet of MOS2 are connected with 2 feet of GND_P1, MOS1 respectively, 1 foot of MOS2 respectively 9 feet with U1, MOS1 1 foot,
Resistance R7 one end is connected, another termination 15V power supplys of resistance R7,3 feet of MOS1 and the 3 feet ground connection of MOS2.
2 feet of MOS3 are connected with 2 feet of GND_P2, MOS4 respectively, 1 foot of MOS3 respectively 8 feet with U1, MOS4 1 foot,
Resistance R6 one end is connected, another termination 15V power supplys of resistance R6,3 feet of MOS4 and the 3 feet ground connection of MOS3.
54,53,52,51,50 feet of 1,2,3,4,5 feet of U4 respectively with U1 are corresponding to be connected, 12 feet and the buzzer BUZ of U4
It is connected.
As shown in Fig. 9,10,11, G1 and G2 are MOS1, MOS2 and MOS3, the grid control signal of MOS4, and G1 voltages are
MOS1, MOS2 are in the conduction state during 15V, and MOS1, MOS2 are cut-off state when G1 is 0V.When relay closes, G1 leads to
Cross pulsewidth modulation（PWM）The power of load can be adjusted.When G1 is in low level（I.e. MOS1, MOS2 are in cut-off state）To control
The switch of relay processed, turns on for 15V after the completion of relay switch, then by G1 controls, so can close relay
Or disconnection moment contact will not produce spark, greatly prolong relay service life.
BUZ is buzzer, in system operation irregularity（Including temperature sensor fault, fan failure, cpu fault, liquid crystal display
Communication failure）Buzzer intermittence sends sound, system stalls.
PROTECT interfaces are heat portective switch interface.Wherein the normally closed type of 100 DEG C/10A can be used to protect for heat portective switch
Switch, it is connected in loaded work piece electric power loop, and it is when system is out of control that it, which is acted on, and load gives off heat in work always,
When temperature is more than 100 DEG C, heat portective switch disconnects, and cuts off the power, and prevents since overheat produces disaster.
The memory is connected using 1 foot of W25X16 chips U5, U5 with 20 feet of U1,2 feet of U5 and the 22 foot phases of U1
Even, 6 feet of U5 are connected with 21 feet of U1, and 5 feet of U5 are connected with 23 feet of U1.
The system feedback part includes resistance R10, resistance R11 and resistance R13, resistance R10 one end respectively with resistance R11
One end, resistance R13 one end are connected, and the resistance R10 other ends heat the temperature of refrigeration semiconductor component temperature with the detection first order respectively
Degree sensor, 14 feet of U1, capacitance C13 one end are connected, capacitance C13 other ends ground connection.
The resistance R11 other ends respectively with the detection second level heating temperature sensor of refrigeration semiconductor component temperature, U1
15 feet, capacitance C14 one end are connected, capacitance C4 other ends ground connection.
The resistance R13 other ends are respectively with detecting the temperature sensor of heatsink temperature, 24 feet of U1, capacitance C15 one end phase
Even, capacitance C15 other ends ground connection.
Resistance R10, resistance R11 and resistance R13 change detection temperature for divider resistance by branch pressure voltage value.
As shown in Figure 13,14, P5-P8 is jointing temp sensor, and wherein P5 P6 P7 connect the temperature of two groups of cooling pieces respectively
Sensor, the temperature sensor of heat sink, P8 are spare interface.
The temperature feedback that P5, P6 measure two groups of cooling pieces adjusts the work of cooling piece by feedback temperature to CPU, CPU
State.P7 measures heatsink temperature, and CPU adjusts the working status of radiator fan by feedback temperature.
1 foot that the display portion includes MAX232 chips U6, U6 is connected with 3 feet by capacitance C4,4 feet and 5 feet of U6
It is connected by capacitance C5,11 feet of U6 are connected with 42 feet of U1, and 12 feet of U6 are connected with 43 feet of U1,13 feet of U6 and LCD's
RS232RXD feet are connected, and 14 feet of U6 are connected with the RS232TXD feet of LCD.
LCD shows interpersonal interactive interface.Display content may include the operating status control of whole system（Including cooling piece temperature
Degree and the control of duration）, realtime curve（Including cooling piece temperature and duration）, model selection（Including refrigeration
Piece temperature and duration selection）, help（Including explanation, Introduction of enterprises etc.）.
The Bluetooth portion is 17,16 correspondings connected using 1,2 feet and the U1's of HC-08 bluetooth modules U7, U7.Phase can be set
APP is answered, carries out wireless communication.
1 foot of the radiating control part including AO3401 chips MOS5, MOS5 respectively with resistance R8 one end, 15V power supplys
It is connected, 2 feet of the resistance R8 other ends respectively with resistance R9 one end, MOS5 are connected, and 3 feet of MOS5 connect radiator fan, and resistance R9 is another
The control signal output mouth of one termination CPU.
FPK2-15828NC types heating refrigeration semiconductor element can be used by heating refrigeration semiconductor element.
The semiconductor element limiting plate corner is provided with rectangular-shaped limited block, rectangular-shaped limited block and embedded block limiting plate
Corner is corresponding；It is accurately positioned easy to embedded block limiting plate.
The cover board upper end is provided with handle；Easy to hand-held.
It is understood that above with respect to the specific descriptions of the utility model, it is merely to illustrate the utility model and is not
The described technical solution of the utility model embodiment is limited to, it will be understood by those of ordinary skill in the art that, still can be with
Modify to the utility model or equivalent substitution, to reach identical technique effect；As long as satisfaction uses needs, all in this reality
Within new protection domain.
Claims (7)
1. cryo tissue embeds adapter, including housing, it is characterised in that semiconductor element limiting slot is provided with housing base,
Heating refrigeration semiconductor element is provided with semiconductor element limiting slot, semiconductor element limiting slot upper end is limited covered with embedded block
Position plate, is provided with embedded block limited mouth on embedded block limiting plate corresponding to semiconductor element limiting slot；Set in the housing base
The control circuit being equipped with, the control signal input of the control signal output mouth and heating refrigeration semiconductor element of control circuit
Mouth is connected, and the detection signal input port of control circuit heats the inspection of the temperature sensor of refrigeration semiconductor component temperature with detection
Signal output port is surveyed to be connected.
2. cryo tissue embedding adapter according to claim 1, it is characterised in that the heating refrigeration semiconductor element is adopted
Refrigeration semiconductor element is heated with two level.
3. cryo tissue embedding adapter according to claim 2, it is characterised in that the semiconductor element limiting slot is set
On semiconductor element limiting plate, semiconductor element limiting plate and the dismantled and assembled connection of housing base；Semiconductor element limiting slot bag
Including the strip extended from semiconductor element limiting plate edge to middle part and slide mouth, sliding mouth both ends top is the first protrusion to middle part,
The lower end of the semiconductor element limiting plate of sliding mouth the inner is provided with limited block, and sliding mouth inside lower end is provided with lower loading plate, under
Loading plate both sides are connected with semiconductor element limiting plate lower end；First raised inside upper part is the second protrusion to middle part；Housing
First order heating of the edge of opening corresponding to two level heating refrigeration semiconductor element of semiconductor element limiting plate is installed on base
Refrigeration semiconductor element is initially put into position and is provided with carrying guide plate.
4. cryo tissue embedding adapter according to claim 3, it is characterised in that set on the semiconductor element limiting plate
Four semiconductor element limiting slots are equipped with, the line at the center of four semiconductor element limiting slots is square；Embedded block is spacing
Plate is provided with four and the corresponding embedded block limited mouth of semiconductor element limiting slot.
5. cryo tissue embedding adapter according to claim 1, it is characterised in that the middle part of the embedded block limiting plate is
Cross hollow-out parts, per side, middle part is both provided with inside recess.
6. cryo tissue embedding adapter according to claim 1, it is characterised in that be additionally provided with for compressing embedded block limit
The cover board of Wei Kou inner tissues sample embedded block, housing upper end are provided with upper cover, and upper cover one end connects with housing axis, the upper cover other end with
Housing card and connection.
7. cryo tissue embedding adapter according to claim 1, it is characterised in that corresponding to heating in the housing base
Refrigeration semiconductor element is provided with heat sink and radiator fan, the control signal input mouth of radiator fan and the control of control circuit
Signal output port processed is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721094626.9U CN207232789U (en) | 2017-08-30 | 2017-08-30 | Cryo tissue embeds adapter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721094626.9U CN207232789U (en) | 2017-08-30 | 2017-08-30 | Cryo tissue embeds adapter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207232789U true CN207232789U (en) | 2018-04-13 |
Family
ID=61859670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721094626.9U Active CN207232789U (en) | 2017-08-30 | 2017-08-30 | Cryo tissue embeds adapter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207232789U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107340789A (en) * | 2017-08-30 | 2017-11-10 | 中国医科大学附属第医院 | Cryo tissue embeds adapter |
-
2017
- 2017-08-30 CN CN201721094626.9U patent/CN207232789U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107340789A (en) * | 2017-08-30 | 2017-11-10 | 中国医科大学附属第医院 | Cryo tissue embeds adapter |
| CN107340789B (en) * | 2017-08-30 | 2022-10-21 | 中国医科大学附属第一医院 | Low-temperature tissue embedding adapter |
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Effective date of registration: 20211224 Address after: 215100 Floor 9, Guoyu innovation building, No. 28, Dongwu North Road, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou carbon Card Intelligent Technology Co.,Ltd. Address before: 110001 No. 155 North Nanjing street, Heping District, Liaoning, Shenyang Patentee before: THE FIRST HOSPITAL OF CHINA MEDICIAL University |