CN207219040U

CN207219040U - Mems microphone

Info

Publication number: CN207219040U
Application number: CN201721057897.7U
Authority: CN
Inventors: 王凯; 陈虎; 刘国俊
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd
Priority date: 2017-08-22
Filing date: 2017-08-22
Publication date: 2018-04-10
Anticipated expiration: 2027-08-22

Abstract

The utility model provides a kind of MEMS microphone; MEMS microphone includes the protection structure with accommodation space and the MEMS chip and asic chip that are contained in accommodation space; protection structure is provided with the acoustic aperture passed through for sound wave; MEMS microphone also includes the waterproof case of covering acoustic aperture; protection structure includes shell and the PCB substrate of accommodation space is formed with shell; waterproof case is included towards the roof of acoustic aperture, the bottom wall relative with roof and the side wall of connection roof and bottom wall, and roof on bottom wall with being equipped with some micropores.The MEMS microphone enhances the effect of waterproof and dustproof, particularly under High Voltage hydraulic pressure or high concentration dust environment, can still keep the effect of splendid waterproof and dustproof.

Description

MEMS microphone

【Technical field】

Microphone techniques field is the utility model is related to, more particularly to a kind of water proof and dust proof MEMS microphone.

【Background technology】

In recent years, as the volume of various electronic products constantly reduces, performance requirement improves constantly, with various electronic products The volume of the electronic component to match is also also improving constantly in continuous reduction, performance requirement.Accordingly, for as important electronics The microphone of part, improved space be present.

With society progress and technology development, in recent years, with the electronic product such as mobile phone, notebook computer volume not Disconnected to reduce, people are to the performance requirement of these portable electronic products also more and more higher, so as to also require matched electronics zero The volume of part constantly reduces, performance and uniformity improve constantly.Under this background, the strength member as portable electronic products One of microphone products field be also proposed many novel products, wherein to utilize semiconductor fabrication process technology and batch The MEMS microphone of realization is representative products.

A kind of known MEMS microphone related to the utility model, the microphone is attached to using single layer silicon substrate and acoustic aperture Corresponding position is to reach the effect of water proof and dust proof.However, the silicon substrate is single layer structure, in High Voltage hydraulic pressure or high concentration In the environment of dust, the effect of water proof and dust proof can drastically be deteriorated.

【Utility model content】

The purpose of this utility model is to provide a kind of functions of waterproof and dustproof stronger MEMS microphone.

In order to solve the above problems, the utility model provides a kind of MEMS microphone, and the MEMS microphone includes having The protection structure of accommodation space and the MEMS chip and asic chip being contained in the accommodation space, set in the protection structure There is the acoustic aperture passed through for sound wave, the MEMS microphone also includes the waterproof case for covering the acoustic aperture, and the protection structure includes Shell and the PCB substrate that the accommodation space is formed with the shell, the waterproof case include towards acoustic aperture roof, with it is described The side wall of the relative bottom wall of roof and the connection roof and the bottom wall, the roof are some micro- with being equipped with the bottom wall Hole.

As an improvement the acoustic aperture is arranged on the shell, the waterproof case is fixed on the direction of the shell The surface of accommodation space.

As an improvement the MEMS chip is fixed on the shell, the waterproof case is arranged at the MEMS cores Between piece and shell, and the waterproof case is bonded to the surface of the MEMS chip.

As an improvement the acoustic aperture is arranged in the PCB substrate, the waterproof case is fixed on the PCB substrate The surface towards accommodation space.

As an improvement the MEMS chip is fixed in the PCB substrate, the waterproof case is arranged at the MEMS Between chip and PCB substrate, and the waterproof case is bonded to the surface of the MEMS chip.

As an improvement the end of the side wall of the waterproof case and the planes align where the bottom wall.

As an improvement the side wall of the waterproof case includes connecting main part and the extension of the roof and the bottom wall Beyond the extension of the main part, depression, the extension and the protection are formed between the extension and the bottom wall Structure is fixedly connected.

As an improvement the waterproof case is made up of silicon nitride material.

As an improvement the aperture of the micropore is in the range of 1 micron -10 microns.

As an improvement being shaped as the micropore is circular, square or other irregular shapes.

The beneficial effects of the utility model are：On the one hand, MEMS microphone of the present utility model enhances waterproof and dustproof Effect, particularly under High Voltage hydraulic pressure or high concentration dust environment, can still keep the effect of splendid waterproof and dustproof Fruit；On the other hand, the waterproof case of MEMS microphone of the present utility model uses the double-deck silicon chip that bonding semiconductor technique is formed, Manufacture craft is simple, can in high volume make, cost performance is high.

【Brief description of the drawings】

Fig. 1 is the overlooking the structure diagram of waterproof case of the present utility model.

Fig. 2 is the structural representation of MEMS microphone of the present utility model, wherein, Fig. 2 (a) is reality of the present utility model The structural representation of the MEMS microphone of example 1 is applied, and Fig. 2 (b) is the knot of the MEMS microphone of embodiment 2 of the present utility model Structure schematic diagram.

Fig. 3 is the structural representation of MEMS microphone of the present utility model, wherein, Fig. 3 (a) is reality of the present utility model The structural representation of the MEMS microphone of example 3 is applied, and Fig. 3 (b) is the knot of the MEMS microphone of embodiment 4 of the present utility model Structure schematic diagram.

Fig. 4 is the structural representation of the waterproof case of MEMS microphone in the utility model embodiment 1,2.

Fig. 5 is the structural representation of the waterproof case of MEMS microphone in the utility model embodiment 3,4.

【Embodiment】

The utility model is described in detail below in conjunction with the accompanying drawings.

Embodiment

The utility model proposes a kind of new MEMS microphone.With reference to 1 to Fig. 5, MEMS microphone 100, which includes having, to be received Receive the protection structure 1 in space 10 and the MEMS chip 2 and asic chip 3 that are contained in accommodation space 10, protection structure 1 are provided with The acoustic aperture 4 passed through for sound wave, the protection structure 1 include shell 5 and the PCB of the accommodation space 10 are formed with the shell 5 Substrate 6, the MEMS microphone 100 also include being arranged at the waterproof case 7 at acoustic aperture 4；

Specifically, in the present embodiment 1, as shown in Fig. 2 (a), acoustic aperture 4 is arranged on shell 5, is provided with acoustic aperture 4 anti- Water part 7, the MEMS chip 2 may be contained within the PCB substrate 6 with asic chip 3, and the waterproof case 7 is fixed on described outer The surface towards accommodation space 10 of shell 5.

In the present embodiment 2, as shown in Fig. 2 (b), acoustic aperture 4 is arranged in PCB substrate 6, and waterproof case is provided with acoustic aperture 4 7, the MEMS chip 2 may be contained within the PCB substrate 6 with asic chip 3, and the waterproof case 7 is arranged at the MEMS cores Between piece 2 and PCB substrate 6, and the waterproof case 7 is bonded to the surface of the MEMS chip 2.Certainly, in other embodiments, The waterproof case 7, MEMS chip 2 and asic chip 3 may be contained within shell 5, and now, waterproof case 7 is arranged at the MEMS cores Between piece 2 and shell 5, and waterproof case 7 is bonded to the surface of the MEMS chip 2；Or waterproof case 7 is arranged at PCB substrate 6 On, MEMS chip 2 may be contained within shell 5 with asic chip 3, and now, the waterproof case 7 is fixed on the court of the PCB substrate 6 To the surface of accommodation space 10.

The structure of waterproof case 7 in the present embodiment 1,2 is identical, reference picture 1, Fig. 2, Fig. 4, and waterproof case 7 is included towards acoustic aperture Roof 71, the bottom wall 72 relative with roof 71 and the side wall 73 for being connected roof 71 and bottom wall 72, on roof 71 and bottom wall 72 Provided with some micropores 74.The waterproof case 7 is made up of silicon nitride material.Model of the aperture of the micropore 74 at 1 micron -10 microns In enclosing, the micropore 74 is shaped as circular, square or other irregular shapes.The micropore 74 in the aperture disclosure satisfy that sound Propagation, the effective waterproof and dustproof of and can.In the present embodiment 1,2, end and the bottom wall of the side wall 73 of the waterproof case 7 Planes align where 72.

In the present embodiment 3, as shown in Fig. 3 (a), acoustic aperture 4 is arranged on shell 5, and waterproof case 7, institute are provided with acoustic aperture 4 State MEMS chip 2 to may be contained within the PCB substrate 6 with asic chip 3, the waterproof case 7 is fixed on the direction of the shell 5 The surface of accommodation space 10.

In the present embodiment 4, as shown in Fig. 3 (b), acoustic aperture 4 is arranged in PCB substrate 6, and waterproof case is provided with acoustic aperture 4 7, the MEMS chip 2 may be contained within the PCB substrate 6 with asic chip 3, and the waterproof case 7 is arranged at the MEMS cores Between piece 2 and PCB substrate 6, and the waterproof case 7 is bonded to the surface of the MEMS chip 2.Certainly, in other embodiments, The waterproof case 7, MEMS chip 2 and asic chip 3 may be contained within shell 5, and now, waterproof case 7 is arranged at the MEMS cores Between piece 2 and shell 5, and waterproof case 7 is bonded to the surface of the MEMS chip 2；Or waterproof case 7 is arranged at PCB substrate 6 On, MEMS chip 2 may be contained within shell 5 with asic chip 3, and now, the waterproof case 7 is fixed on the court of the PCB substrate 6 To the surface of accommodation space 10.

The structure for differing only in waterproof case of embodiment 3,4 and embodiment 1,2, in embodiment 3,4, as shown in figure 5, Waterproof case 7 includes the roof 71, the bottom wall 72 relative with roof 71 and the side wall 73 for being connected roof 71 and bottom wall 72 towards acoustic aperture, Roof 71 on bottom wall 72 with being equipped with some micropores 74.The waterproof case 7 is made up of silicon nitride material.The aperture of the micropore 74 In the range of 1 micron -10 microns, preferably 5 microns, the micropore 74 is shaped as circular, square or other irregular shapes Shape.The micropore 74 in the aperture disclosure satisfy that the propagation of sound, the effective waterproof and dustproof of and can.It is described anti-in the present embodiment 3,4 The side wall 73 of water part 7 includes connecting the main part 731 of the roof 71 and the bottom wall 72 and extends beyond the main part 731 Extension 732, between the extension 732 and the bottom wall 72 formed depression 75, i.e., the side wall 73 of described waterproof case 7 extends More than the plane where the bottom wall 72, the side wall 73 is between the part of the plane where bottom wall 72 and the bottom wall 72 Depression 75 is formed, the extension 732 is fixedly connected with the protection structure.

Unlike the prior art, waterproof case 7 of the present utility model is formed using double layer substrate bonding, such as double-deck silicon substrate Plate, double glazing substrate or one layer of silicon substrate and one layer of glass substrate.If it should be noted that use double glazing substrate, glass The surface of glass needs to carry out hydrophobic treatment.In the present embodiment, using double-deck silicon substrate, on each layer of double-deck silicon substrate all Micropore 74 is provided with, the size of the micropore 74 meets waterproof and dustproof requirement, but without prejudice to sound transmission.Bilayer with micropore 74 The waterproof case 7 that substrate is formed effectively enhances waterproof and dustproof effect, especially, in High Voltage hydraulic pressure or high concentration dust Under environment, the MEMS microphone of the present embodiment can still keep the effect of splendid waterproof and dustproof.It is of the present utility model The waterproof case of MEMS microphone uses bonding semiconductor technique, makes simply, suitable for batch production.

Above-described is only embodiment of the present utility model, it should be noted here that the ordinary skill for this area For personnel, on the premise of not departing from the utility model and creating design, improvement can also be made, but these belong to this practicality New protection domain.

Claims

1. a kind of MEMS microphone, the MEMS microphone includes the protection structure with accommodation space and is contained in the storage MEMS chip and asic chip in space, the protection structure are provided with the acoustic aperture passed through for sound wave, the MEMS microphone Also include the waterproof case for covering the acoustic aperture, the protection structure includes shell and forms the accommodation space with the shell PCB substrate, it is characterised in that：The waterproof case is included towards the roof of acoustic aperture, the bottom wall relative with the roof and connection institute The side wall of roof and the bottom wall is stated, the roof on the bottom wall with being equipped with some micropores.

2. MEMS microphone according to claim 1, it is characterised in that：The acoustic aperture is arranged on the shell, described Waterproof case is fixed on the surface towards accommodation space of the shell.

3. MEMS microphone according to claim 2, it is characterised in that：The MEMS chip is fixed on the PCB substrate On.

4. MEMS microphone according to claim 1, it is characterised in that：The acoustic aperture is arranged in the PCB substrate, institute State the surface towards accommodation space that waterproof case is fixed on the PCB substrate.

5. MEMS microphone according to claim 4, it is characterised in that：The MEMS chip is fixed on the PCB substrate On, the waterproof case is arranged between the MEMS chip and PCB substrate, and the waterproof case is bonded to the MEMS chip Surface.

6. MEMS microphone according to claim 1, it is characterised in that：The end of the side wall of the waterproof case and the bottom Planes align where wall.

7. MEMS microphone according to claim 1, it is characterised in that：The side wall of the waterproof case includes connecting the top The main part of wall and the bottom wall and the extension for extending beyond the main part, are formed between the extension and the bottom wall Depression, the extension are fixedly connected with the protection structure.

8. MEMS microphone according to claim 1, it is characterised in that：The waterproof case is made up of silicon nitride material.

9. MEMS microphone according to claim 1, it is characterised in that：The aperture of the micropore is at 1 micron -10 microns In the range of.

10. MEMS microphone according to claim 1, it is characterised in that：Being shaped as the micropore be circular, it is square or its Its irregular shape.