CN203775405U - Microphone improved structure - Google Patents
Microphone improved structure Download PDFInfo
- Publication number
- CN203775405U CN203775405U CN201420125421.2U CN201420125421U CN203775405U CN 203775405 U CN203775405 U CN 203775405U CN 201420125421 U CN201420125421 U CN 201420125421U CN 203775405 U CN203775405 U CN 203775405U
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- CN
- China
- Prior art keywords
- housing
- microphone
- substrate
- transmission aperture
- sound transmission
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Abstract
The utility model relates to a microphone improved structure, comprising a housing, a substrate, circuit elements, and a microphone chip. The housing is an outer housing of the microphone formed by cooperation of a sunken part structure and the substrate. The circuit elements are disposed on the inner surface of the substrate. The inner side wall of the housing is provided with a circuit board layer. The inner surface of the circuit board layer is provided with microphone chips. The circuit board layer is connected with the microphone chip and the external circuit by a wire. The microphone is provided with sound holes. At least one of the sound holes is disposed on the bottom surface of the housing or the substrate. The junction position of the bottom surface of the housing and the side wall is provided with at least a sound hole.
Description
Technical field
The utility model belongs to microphone field, specifically refers to that a kind of microphone with shock-absorbing capacity improves structure.
Background technology
The MEMS microphone that now utilizes MEMS (micro electro mechanical sys tems) technology to manufacture, its basic structure is to form encapsulation by substrate and housing, at the upper surface of substrate, microphone chip and circuit element are set, and on housing, are provided with the sound hole of transmitting sound.
In order to overcome the problem of microphone miniaturization, existing had technology to propose, and by three-dimensional to microphone chip and circuit element layout, is arranged at respectively the structure of the upper and lower surface of circuit substrate by microphone chip and circuit element.And now actual production and use of the technological improvement of this class.Such technical scheme is accompanied by the sheet of electronic component, by the microphone construction size reduction of existing use many, but the ultrathin of such structure and existing electronic product still or some weak point, but now the difficulty of the miniaturization again of microphone is very large.
On the other hand, what the sound transmission aperture on existing microphone case and the sound hole on microphone chip adopted substantially is by the directly structure to sound hole just of sound transmission aperture, or employing sound transmission aperture and the two-way bending mode in sound hole transaudient, either voice is excessive, either voice is too small, can not realize flexible acoustic.
Utility model content
The purpose of this utility model is by existing mike technique being proposed to improve technical scheme, by the technical program, can realizing the miniaturization again of microphone, and can ensure the performance of microphone, and can improve transaudient flexibility.
The utility model is achieved through the following technical solutions:
A kind of microphone improves structure, includes housing, substrate, circuit element and microphone chip; Described housing is the shell body of a depressed part structure and substrate mix proportion microphone; Described circuit element is arranged at substrate inner surface; The madial wall of described housing is provided with board layer, and described board layer inner surface is provided with microphone chip, and the sound hole of described microphone chip is perpendicular to the center line of housing and substrate; Described board layer is connected by wire with microphone chip and external circuit; On described microphone, be provided with sound transmission aperture; Described sound transmission aperture has at least on a bottom surface or substrate that is arranged at housing; Be provided with at least one sound transmission aperture in the bottom surface of described housing and the junction of sidewall.
Described microphone chip is at least three, is evenly arranged along the madial wall of housing.
Sound transmission aperture on described microphone is arranged on housing or on substrate.
The center line of the sound transmission aperture on described housing bottom surface or substrate is vertical with the center line in sound hole; The center of sound transmission aperture that the bottom surface of described housing and the junction of sidewall arrange and the angle of the bottom surface of housing and sidewall are all greater than 0 degree.
Described housing is box-shaped or cylindrical structural, and described substrate matches with the opening shape of housing.
The beneficial effects of the utility model are:
By the technical program, thoroughly improve the technology that circuit element and microphone chip is arranged to two faces of substrate, microphone chip is arranged to the sidewall of the housing of microphone.The technical program has reduced thickness for holding circuit element and substrate not to be needed blocked uply, and the thickness of whole like this microphone reduces a lot, substantially can be adapted to the ultrathin needs of electronic product.Meanwhile, the wind entering from sound transmission aperture can not be directly passed to sound hole, but passes to sound hole after by break-in.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the A-A sectional view of Fig. 1.
Embodiment
Describe by the following examples the technical solution of the utility model in detail, following embodiment is only exemplary, only can be used for explaining and explanation the technical solution of the utility model, and can not to be interpreted as is the restriction to technical solutions of the utility model.
In the technical solution of the utility model, the contour structures of microphone does not require protection in this application, because microphone need to carry out the change of shape as required, does not still affect the reality of the application's technical scheme
As depicted in figs. 1 and 2, a kind of microphone improves structure, includes housing 1, substrate 2, circuit element 6 and microphone chip 5; Described microphone chip 5 is prior art, and described housing 1 is the shell body of a depressed part structure and substrate 2 mix proportion microphones; Described circuit element 6 is arranged at substrate 2 inner surfaces; The madial wall of described housing 1 is provided with board layer 7, and described board layer 7 inner surfaces are provided with microphone chip 5, and described microphone chip is at least three, is evenly arranged, to ensure to receive the effect of sound along the madial wall of housing; Inner surface in this application and outer surface are relative concept, and taking the outer surface of shell body as outer surface, opposite side is inner surface; The surface that board layer contacts with the inner surface of shell body is outer surface, and the surface of opposite side is inner surface.
The sound hole 4 of described microphone chip 5 is perpendicular to the center line of housing 1 and substrate 2; Described board layer 7 is connected by wire 8 with microphone chip 5 and external circuit; On described microphone, be provided with sound transmission aperture 3; In described sound transmission aperture, have at least a sound transmission aperture 3 to be arranged on the bottom surface or substrate 2 of housing 1; Be provided with at least one sound transmission aperture (91,92) in the bottom surface of described housing and the junction of sidewall.Sound transmission aperture 3 on described microphone is arranged on housing 1 or on substrate 2.The center line of the sound transmission aperture 3 on described housing bottom surface or substrate is vertical with the center line in sound hole 4; The center of the sound transmission aperture (91,92) that the bottom surface of described housing and the junction of sidewall arrange and the bottom surface of housing and the angle of sidewall are all greater than 0 degree.
Described housing is box-shaped or cylindrical structural, and described substrate matches with the opening shape of housing.In this application, described housing is box-shaped or cylindrical structural, and described substrate matches with the opening shape of housing.The profile of housing can also be carried out the change of various shapes as required.
In this application, the thickness of substrate is corresponding reducing also, because in this application, do not need to have the substrate of multilayer circuit board, on substrate, as long as meet, circuit element and corresponding binding post is set.
In the application's technical scheme, housing with on substrate, be provided with conductive layer and coordinates formation electromagnetic shielding.Described board layer is arranged on the inner surface of the sidewall of housing, and described board layer can be one or the Split type structure composition identical with the shape of housing.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that not departing from principle of the present utility model and spirit and can carry out multiple variation, amendment, replacement and modification to these embodiment, scope of the present utility model is by claims and be equal to and limit.
Claims (5)
1. microphone improves a structure, it is characterized in that: include housing, substrate, circuit element and microphone chip; Described housing is the shell body of a depressed part structure and substrate mix proportion microphone; Described circuit element is arranged at substrate inner surface; The madial wall of described housing is provided with board layer, and described board layer inner surface is provided with microphone chip, and the sound hole of described microphone chip is perpendicular to the center line of housing and substrate; Described board layer is connected by wire with microphone chip and external circuit; On described microphone, be provided with sound transmission aperture; Described sound transmission aperture has at least on a bottom surface or substrate that is arranged at housing; Be provided with at least one sound transmission aperture in the bottom surface of described housing and the junction of sidewall.
2. microphone according to claim 1 improves structure, it is characterized in that: described microphone chip is at least three, is evenly arranged along the madial wall of housing.
3. microphone according to claim 1 improves structure, it is characterized in that: the sound transmission aperture on described microphone is arranged on housing or on substrate.
4. microphone according to claim 1 improves structure, it is characterized in that: the center line of the sound transmission aperture on described housing bottom surface or substrate is vertical with the center line in sound hole; The center of sound transmission aperture that the bottom surface of described housing and the junction of sidewall arrange and the angle of the bottom surface of housing and sidewall are all greater than 0 degree.
5. microphone according to claim 1 improves structure, it is characterized in that: described housing is box-shaped or cylindrical structural, and described substrate matches with the opening shape of housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125421.2U CN203775405U (en) | 2014-03-19 | 2014-03-19 | Microphone improved structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125421.2U CN203775405U (en) | 2014-03-19 | 2014-03-19 | Microphone improved structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203775405U true CN203775405U (en) | 2014-08-13 |
Family
ID=51292545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420125421.2U Expired - Fee Related CN203775405U (en) | 2014-03-19 | 2014-03-19 | Microphone improved structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203775405U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108616627A (en) * | 2018-07-09 | 2018-10-02 | 北京小米移动软件有限公司 | Terminal |
| CN111866681A (en) * | 2019-09-19 | 2020-10-30 | 甬矽电子(宁波)股份有限公司 | Preparation method of MEMS microphone |
| CN111918187A (en) * | 2020-07-08 | 2020-11-10 | 瑞声科技（南京）有限公司 | MEMS loudspeaker |
-
2014
- 2014-03-19 CN CN201420125421.2U patent/CN203775405U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108616627A (en) * | 2018-07-09 | 2018-10-02 | 北京小米移动软件有限公司 | Terminal |
| CN111866681A (en) * | 2019-09-19 | 2020-10-30 | 甬矽电子(宁波)股份有限公司 | Preparation method of MEMS microphone |
| CN111866681B (en) * | 2019-09-19 | 2021-04-27 | 甬矽电子(宁波)股份有限公司 | Preparation method of MEMS microphone |
| CN111918187A (en) * | 2020-07-08 | 2020-11-10 | 瑞声科技（南京）有限公司 | MEMS loudspeaker |
| CN111918187B (en) * | 2020-07-08 | 2021-10-29 | 瑞声科技（南京）有限公司 | MEMS loudspeaker |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20160319 |