CN203775409U - Small microphone structure - Google Patents
Small microphone structure Download PDFInfo
- Publication number
- CN203775409U CN203775409U CN201420125491.8U CN201420125491U CN203775409U CN 203775409 U CN203775409 U CN 203775409U CN 201420125491 U CN201420125491 U CN 201420125491U CN 203775409 U CN203775409 U CN 203775409U
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- China
- Prior art keywords
- microphone
- substrate
- housing
- board layer
- small
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a small microphone structure, comprising a housing, a substrate, circuit elements, and a microphone chip. The housing is an outer housing of the microphone formed by cooperation of a sunken structure and the substrate. The microphone chip is disposed on the inner surface of the substrate. The inner side wall of the housing is provided with a circuit board layer. The inner surface of the circuit board layer is provided with the circuit elements. The circuit board layer is connected with the microphone chip and an external circuit through wires. The microphone is provided with sound transmitting holes.
Description
Technical field
The utility model belongs to microphone field, specifically refers to a kind of miniaturization microphone construction.
Background technology
The MEMS microphone that now utilizes MEMS (micro electro mechanical sys tems) technology to manufacture, its basic structure is to form encapsulation by substrate and housing, upper surface at substrate arranges microphone chip and circuit element, and on housing, is provided with the sound transmission aperture of transmitting sound.Or at the upper surface of substrate, microphone chip and circuit element are set, the lower surface of microphone chip over against substrate on offer sound hole; Or be laterally arranged side by side microphone chip and circuit element at the upper surface of substrate, on the substrate outside leaving the position of microphone chip, offer sound transmission aperture.
In prior art scheme, be all that microphone chip and circuit element are laterally arranged side by side in the upper surface of substrate and the lower surface of housing, be difficult to, by microphone miniaturization, can not adapt to the miniaturization issues in electronic equipment, particularly portable equipment.
In order to overcome the problem of microphone miniaturization, existing had technology to propose, and by microphone chip and the three-dimensional layout of circuit element, is about to the structure that microphone chip and circuit element are arranged at respectively the upper and lower surface of circuit substrate.And now actual production and use of the technological improvement of this class.Such technical scheme is accompanied by the sheet of electronic component, by the microphone construction size reduction of existing use many, but the ultrathin of such structure and existing electronic product still or some weak point, but now the difficulty of the miniaturization again of microphone is very large.
Utility model content
The purpose of this utility model is by existing mike technique being proposed to improve technical scheme, by the technical program, can realizing the miniaturization again of microphone, and can guarantee the performance of microphone.
The utility model is achieved through the following technical solutions:
A small-sized microphone construction, includes housing, substrate, circuit element and microphone chip; Described housing is the shell body of a depressed part structure and substrate mix proportion microphone; Described microphone chip is arranged at substrate inner surface; The madial wall of described housing is provided with board layer, and described board layer inner surface is provided with circuit element; Described board layer is connected by wire with external circuit with microphone chip; On described microphone, be provided with sound transmission aperture.
Sound hole is set on described microphone chip.
Sound transmission aperture on described microphone is arranged on housing or on substrate.
Described sound transmission aperture and sound hole over against or not relative.
Described housing is box-shaped or cylindrical structural, and described substrate matches with the opening shape of housing.
The beneficial effects of the utility model are:
By the technical program, thoroughly improved the technology that circuit element and microphone chip is arranged to two faces of substrate, circuit element is arranged to the sidewall of microphone case.The technical program has reduced not to be needed blocked uply for holding the thickness of circuit element and substrate, and the thickness of whole like this microphone reduces a lot, substantially can be adapted to the ultrathin needs of electronic product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the A-A sectional view of Fig. 1.
Embodiment
Describe by the following examples the technical solution of the utility model in detail, following embodiment is only exemplary, only can be used for explaining and explanation the technical solution of the utility model, and can not to be interpreted as is the restriction to technical solutions of the utility model.
In the technical solution of the utility model, the contour structures of microphone does not require protection in this application, because microphone need to need to carry out the change of shape according to what use, but does not affect the realization of the application's technical scheme.
As depicted in figs. 1 and 2, a kind of small-sized microphone construction, includes housing 1, substrate 2, circuit element 6 and microphone chip 5; Described housing 1 is the shell body of a depressed part structure and substrate 2 mix proportion microphones; Described microphone chip 5 is arranged at substrate 2 inner surfaces; The madial wall of described housing 1 is provided with board layer 7, and described board layer 7 inner surfaces are provided with circuit element 6; Described board layer 7 is connected by wire 8 with external circuit with microphone chip 5; On described microphone, be provided with sound transmission aperture 3.
Sound hole 4 is set on described microphone chip 5.
Sound transmission aperture on described microphone is arranged on housing or on substrate.
Described sound transmission aperture and sound hole over against or not relative.
In this application, described housing is box-shaped or cylindrical structural, and described substrate matches with the opening shape of housing.The profile of housing can also be carried out the change of various shapes as required.
In this application, the thickness of substrate is corresponding reducing also, because in this application, do not need to have the substrate of multilayer circuit board, on substrate, as long as meet, microphone chip and corresponding binding post is set.
In the application's technical scheme, housing with on substrate, be provided with conductive layer and coordinates formation electromagnetic shielding.Described board layer is arranged on the inner surface of the sidewall of housing, and described board layer can be one or the Split type structure identical with the shape of housing.
Inner surface in this application and outer surface are relative concept, and the outer surface of shell body of take is outer surface, and opposite side is inner surface; The surface that board layer contacts with the inner surface of shell body is outer surface, and the surface of opposite side is inner surface.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that not departing from principle of the present utility model and spirit and can carry out multiple variation, modification, replacement and modification to these embodiment, scope of the present utility model is by claims and be equal to and limit.
Claims (5)
1. a small-sized microphone construction, is characterized in that: include housing, substrate, circuit element and microphone chip; Described housing is the shell body of a depressed part structure and substrate mix proportion microphone; Described microphone chip is arranged at substrate inner surface; The madial wall of described housing is provided with board layer, and described board layer inner surface is provided with circuit element; Described board layer is connected by wire with external circuit with microphone chip; On described microphone, be provided with sound transmission aperture.
2. small-sized microphone construction according to claim 1, is characterized in that: sound hole is set on described microphone chip.
3. small-sized microphone construction according to claim 1, is characterized in that: the sound transmission aperture on described microphone is arranged on housing or on substrate.
4. small-sized microphone construction according to claim 2, is characterized in that: described sound transmission aperture and sound hole over against or not relative.
5. small-sized microphone construction according to claim 1, is characterized in that: described housing is box-shaped or cylindrical structural, and described substrate matches with the opening shape of housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125491.8U CN203775409U (en) | 2014-03-19 | 2014-03-19 | Small microphone structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420125491.8U CN203775409U (en) | 2014-03-19 | 2014-03-19 | Small microphone structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203775409U true CN203775409U (en) | 2014-08-13 |
Family
ID=51292549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420125491.8U Expired - Fee Related CN203775409U (en) | 2014-03-19 | 2014-03-19 | Small microphone structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203775409U (en) |
-
2014
- 2014-03-19 CN CN201420125491.8U patent/CN203775409U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20160319 |