CN207184926U

CN207184926U - The LED of graphene wiring board

Info

Publication number: CN207184926U
Application number: CN201721114204.3U
Authority: CN
Inventors: 王钟民
Original assignee: Shenzhen City New Mstar Technology Ltd
Current assignee: Shenzhen City New Mstar Technology Ltd
Priority date: 2017-09-01
Filing date: 2017-09-01
Publication date: 2018-04-03
Anticipated expiration: 2027-09-01

Abstract

A kind of LED of graphene wiring board, it is characterized in that, the LED includes FPC and LED chip or LED particle, and wherein FPC includes be cascading substrate layer, conductive layer and insulating barrier, and LED chip/LED particle is arranged on insulating barrier；Wherein conductive layer is the circuit network layer of graphene etching, and wherein line alignment corresponds to the layout of LED chip/LED particle.The utility model makes conductive layer using graphene; not only thickness super thin; and it can be mothballed and be protected in a insulating layer; only expose and local very small connect electric connecting points; it can be considered essentially as all packed protections; so structure is highly stable, electric conductivity is superpower, is able to ensure that long-acting using LED made of this material and reliably uses.

Description

The LED of graphene wiring board

【Technical field】

It the utility model is related to new material lighting field, more particularly to brand-new material superconductor illuminator.

【Background technology】

Existing LED, including LED chip and FPC and power supply module are formed, and LED chip typically uses tin Weldering or LED encapsulation particles are bundled on pcb board by the way of die bond, and soldering gold thread is needed on pcb board to LED core Piece or the LED particle of encapsulation provide conducting wire, and gold thread is fragile and is directly exposed to outside wiring board, such wiring board In the presence of being prone to wear out, impact resistance or the situation of impact, gold thread can not be easily broken off causing open circuit, and cause whole wiring board to lose Effect, the problem of LED can not be lighted.

【The content of the invention】

The utility model proposes a kind of wiring board that conductive layer is made using graphene for problem above, and uses Circuit is printed to veneer structure, then passes through outsourcing insulation by the LED of the wiring board, the LED of the graphene wiring board Covering protection is carried out, it is comparatively reliable and stable, it can keep long-acting and reliably use.

The LED described in the utility model for being related to graphene wiring board, it is characterised in that the LED includes flexible circuitry Plate and LED chip or LED particle, wherein FPC include be cascading substrate layer, conductive layer and insulating barrier, And LED chip/LED particle is arranged on insulating barrier；Wherein conductive layer is the circuit network layer of graphene etching, wherein circuit Move towards the layout of corresponding LED chip/LED particle.

Wherein substrate layer is PE material layers, PVE material layers or ABS material layer.

There is raised border, conductive layer and coated insulation layer built in raised border adaptation at substrate layer edge.

Wherein insulating barrier is PI film layers, i.e. polyimide film layer.

The insulating barrier covers whole conductive layer, and correspond to that die bond position has a hollow out on which insulating layer connects electric connecting points position.

Several connect electric connecting points position and correspond to LED chip/LED particle on the insulating barrier.

Conductive layer is made up of graphene, and its thickness is 10 ~ 50 μm.

The utility model makes conductive layer using graphene, not only thickness super thin, and can be mothballed and insulate Protected in layer, only expose it is local it is very small connect electric connecting points, all packed protections are can be considered essentially as, so knot Structure is highly stable, and electric conductivity is superpower, is able to ensure that long-acting using LED made of this material and reliably uses.

【Brief description of the drawings】

Fig. 1 is the LED structure schematic diagram of the utility model graphene wiring board；

Fig. 2 is the conductive coating structure schematic diagram of the utility model graphene wiring board；

Fig. 3 is the insulation layer structure schematic diagram of the utility model graphene wiring board；

Wherein：10th, LED chip/LED particle；20th, wiring board；21st, substrate layer；22nd, conductive layer；23rd, insulating barrier；231、 Connect electric connecting points position.

【Embodiment】

The utility model is described in detail below in conjunction with drawings and Examples.The example of the embodiment is in accompanying drawing In show, wherein same or similar label represents same or similar element or with same or like function from beginning to end Element.The embodiments described below with reference to the accompanying drawings are exemplary, be only used for explain the utility model, and it is not intended that To limitation of the present utility model.

In description of the present utility model, it is to be understood that term " " center ", " on ", " under ", "front", "rear", The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " is based on accompanying drawing institutes The orientation or position relationship shown, it is for only for ease of description the utility model and simplifies description, rather than indicates or imply and be signified Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this practicality New limitation.

The LED of graphene wiring board, it is characterised in that the LED includes LED chip 10 and FPC 20, its Middle FPC 20 includes be cascading substrate layer 21, conductive layer 22 and insulating barrier 23, and LED chip 10 is arranged on On insulating barrier 23；Wherein conductive layer 22 be graphene etching circuit network layer, wherein line alignment correspond to LED chip 10 or The layout of person's LED particle.

Wherein substrate layer 21 is PE material layers, PVE material layers or ABS material layer.

There is raised border, conductive layer and coated insulation layer 23 built in raised border adaptation at the edge of substrate layer 21.

Wherein insulating barrier 23 is PI film layers, i.e. polyimide film layer.Kapton（PolyimdeFilm）It is generation In boundary the best film class insulating materials of performance by pyromellitic acid anhydride (PMDA) and diaminodiphenyl ether (DDE) highly polar Formed again through imidization through polycondensation and casting film-forming in solvent.

The insulating barrier 23 covers whole conductive layer 22, and correspond to that die bond position has a hollow out on the insulating barrier 23 connects electric linking Point position 231.Several connect the corresponding LED chip/LED particle 10 in electric connecting points position 231 on the insulating barrier 23.

Conductive layer is made up of graphene, and its thickness is 10 ~ 50 μm.

Graphene (Graphene) is the only one layer of atomic thickness for being stripped out from graphite material, being made up of carbon atom Two dimensional crystal.Graphene is both most thin material, and most tough material, fracture strength are more taller than best steel 200 times.It has good elasticity again simultaneously, and stretch range can reach the 20% of own dimensions.It is that current nature is most thin, strong Spend highest material.Graphene most potential application at present is the substitute as silicon, manufactures ultra micro transistor npn npn, uses next life Produce following supercomputer.On the other hand, it is very fine and close, even minimum gas atom (helium atom) can not also be worn Thoroughly.A kind of novel nano-material most strong as the most thin, maximum intensity, electrical and thermal conductivity performance that have now been found that.

It is described above, only it is the utility model preferred embodiment, not the utility model is made any formal Limitation, although the utility model is disclosed above with preferred embodiment, but is not limited to the utility model, any to be familiar with sheet Technical professional, do not departing from the range of technical solutions of the utility model, made when using the technology contents of the disclosure above A little change or the equivalent embodiment for being modified to equivalent variations, as long as being without departing from the content of the technical scheme of the utility model, foundation The utility model technology refers to any simple modification, equivalent change and modification made to above example, belongs to this practicality In the range of new technique scheme.

Claims

1. a kind of LED of graphene wiring board, it is characterised in that the LED includes FPC and LED chip or LED Particle, wherein FPC include being cascading substrate layer, conductive layer and insulating barrier, and LED chip/LED particle It is arranged on insulating barrier；Wherein conductive layer be graphene etching circuit network layer, wherein line alignment correspond to LED chip/ The layout of LED particle.

2. the LED of graphene wiring board according to claim 1, it is characterised in that wherein substrate layer be PE material layers, PVE material layers or ABS material layer.

3. the LED of graphene wiring board according to claim 2, it is characterised in that there is lug at substrate layer edge Frame, conductive layer and coated insulation layer built in raised border adaptation.

4. the LED of graphene wiring board according to claim 1, it is characterised in that wherein insulating barrier is PI film layers, i.e., poly- Imide membrane layer.

5. the LED of graphene wiring board according to claim 4, it is characterised in that the insulating barrier covers whole conductive layer, Correspond to that die bond position has a hollow out on which insulating layer connects electric connecting points position.

6. the LED of graphene wiring board according to claim 5, it is characterised in that several connect electric rank on the insulating barrier Contact position corresponds to LED chip/LED particle.

7. the LED of graphene wiring board according to claim 1, it is characterised in that conductive layer is made up of graphene, and it is thick Spend for 10 ~ 50 μm.