CN106505152B - Flexible OLED panel production method and flexible OLED panel - Google Patents

Flexible OLED panel production method and flexible OLED panel Download PDF

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CN106505152B
CN106505152B CN201610929395.2A CN201610929395A CN106505152B CN 106505152 B CN106505152 B CN 106505152B CN 201610929395 A CN201610929395 A CN 201610929395A CN 106505152 B CN106505152 B CN 106505152B
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conductive layer
patterned conductive
flexible
layer
base board
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CN106505152A (en
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林书如
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a kind of oled panel production method and oled panel, production method includes: to provide a rigid substrates；A patterned conductive layer is formed on the rigid substrate；A flexible base board is formed on patterned conductive layer；A flexible unit is formed on flexible substrates；It is passed through pulsed power supplies signal in a flash to patterned conductive layer, to separate flexible unit and rigid substrates.By the above-mentioned means, not only equipment cost is low, and can be such that flexible unit separates with rigid substrates by the Joule heat that patterned conductive layer moment generates, flexible component will not be hurt, flexible component electrical property drift will not be caused.In addition, declining to a great extent in the electric energy that the patterned conductive layer that the approximately the same plane inner bending for being parallel to flexible base board is extended consumes equipment cable, work peace risk is effectively reduced.

Description

Flexible OLED panel production method and flexible OLED panel
Technical field
The present invention relates to field of display technology more particularly to a kind of flexible OLED panel production method and the flexibility faces OLED Plate.
Background technique
Flexible OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) panel is replaced with flexible substrate The flexible of panel is realized for traditional glass substrate, thus is with a wide range of applications.Its production method is general are as follows: Sequentially form flexible substrate and OLED device on glass substrate, it is to be produced it is good after flexible substrate is removed from glass substrate again.
Traditional removing mode has mechanical stripping method (Mechanical delamination) and radium-shine stripping method (Laser-lift-off delamination).Wherein, mechanical stripping method is although easy to operate but be easy to cause flexible substrate Warpage, and will lead to electrical drift in stripping process, destroy OLED device；And the equipment cost of radium-shine stripping method is high.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of flexible OLED panel production method and flexible OLED panel, Flexible unit and rigid substrates can be separated, and flexible unit will not be injured, flexible component is caused electrically to drift about.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of flexible OLED panel is provided Manufacturing method.This method comprises: providing a rigid substrates；A patterned conductive layer is formed on the rigid substrate；It is led in patterning A flexible base board is formed in electric layer；A flexible unit is formed on flexible substrates；Pulse in a flash is passed through to patterned conductive layer Formula power signal, to separate flexible unit and rigid substrates.
Wherein, it is metal, electrically conducting transparent oxygen that form a patterned conductive layer on the rigid substrate, which include: patterned conductive layer, Compound, electrically conducting transparent macromolecule, nanometer silver, graphene or carbon nanotubes, and in the approximately the same plane for being parallel to flexible base board Bending is extended, to increase the resistance value of patterned conductive layer.
Wherein, it is passed through pulsed power supplies signal in a flash to patterned conductive layer, to separate flexible unit and rigid substrates It include: that momentary pulse formula power signal is provided by ac/Dc power power supply unit.
Wherein, further comprise: a release layer is set between rigid substrates and patterned conductive layer；In pattern conductive One heat-insulated buffer layer is set between layer and flexible unit.
Wherein, it is passed through pulsed power supplies signal in a flash to patterned conductive layer, to separate flexible unit and rigid substrates Include: the Joule heat thermal cracking release layer that momentary pulse formula power signal generates, and then separates flexible unit and rigid substrates.
Wherein, the joule thermal isolation that heat-insulated buffer layer generates momentary pulse formula power signal, so that patterned conductive layer It is stayed on flexible unit with heat-insulated buffer layer.
Wherein, rigid substrates are glass substrate；Flexible base board is PI flexible base board；Flexible unit include array substrate and OLED element.
Wherein, release layer is class PI or Silica-base release film or tackifier；Heat-insulated buffer layer is SiO2Layer.
In order to solve the above technical problems, another technical solution used in the present invention is: providing a kind of flexible OLED panel. The flexible OLED panel includes: the patterned conductive layer being cascading, heat-insulated buffer layer, PI flexible base board and flexible group Part.
Wherein, patterned conductive layer is extended in the approximately the same plane inner bending for being parallel to flexible base board, to increase figure The resistance value of case conductive layer.
The beneficial effects of the present invention are: by increasing by a patterned conductive layer between rigid substrates and flexible base plate, wherein Patterned conductive layer is extended in the approximately the same plane inner bending for being parallel to flexible base board, is supplied using ac/Dc power Device is passed through pulsed power supplies signal in a flash to patterned conductive layer, and equipment cost is low, and can be by patterned conductive layer moment The Joule heat of generation makes flexible base board thermal cracking, and then separates flexible unit with rigid substrates, due to being momentary pulse formula electricity Source signal, therefore most of Joule heat is patterned conductive layer and rigid substrates are taken away, and will not hurt flexible component, therefore Flexible component electrical property drift is not will cause.
In addition, can effectively increase in the patterned conductive layer that the approximately the same plane inner bending for being parallel to flexible base board is extended The resistance value of big conductive layer is so that its resistance value is much larger than the resistance value of equipment cable, therefore conductive layer consumes most electricity Can, the electric energy of equipment cable consumption declines to a great extent, so as to which energy loss is effectively reduced；Meanwhile the increasing of resistance conductive layer value Add so that all-in resistance increases in circuit, total current reduces, so that flowing through the current reduction of equipment cable, can effectively reduce work Pacify risk.
Detailed description of the invention
Fig. 1 is the flow diagram of oled panel production method first embodiment of the present invention；
Fig. 2 is the structural schematic diagram of one embodiment of patterned conductive layer of the present invention；
Fig. 3 is the structural schematic diagram of one embodiment of present system circuit；
Fig. 4 is the flow diagram of oled panel production method second embodiment of the present invention；
Fig. 5 is the structural schematic diagram of one embodiment of oled panel of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that the described embodiments are merely a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, Fig. 1 is the flow diagram of oled panel production method first embodiment of the present invention.The present embodiment Oled panel production method include:
S11: a rigid substrates are provided.
Specifically, rigid substrates are carrier substrates, can be glass substrate, but be not limited only to this.
S12: a patterned conductive layer is formed on the rigid substrate.
Specifically, patterned conductive layer is extended in the approximately the same plane inner bending for being parallel to flexible base board, to increase The resistance value of patterned conductive layer makes resistance value of its resistance value much larger than equipment cable.Patterned conductive layer can be using steaming The modes pattern-making such as plating/sputter, pattern are the structure of one embodiment of patterned conductive layer of the present invention referring particularly to Fig. 2, Fig. 2 Schematic diagram, but it is not limited only to this.
It is the structural schematic diagram of one embodiment of present system circuit further referring to Fig. 3, Fig. 3.The circuit system packet It includes: power supply 30, equipment cable 31 and patterned conductive layer 32.For convenience of description, equipment cable 32 is equivalent to one in figure Resistance.
Wherein, the voltage value of power supply 30 is V0, the resistance value of equipment cable 31 is R1, the resistance value of patterned conductive layer 32 For R2, equipment cable 31 connects with patterned conductive layer 32.When patterned conductive layer 32 is being parallel to the same of flexible base board When plane inner bending is extended, the conductive total length L of patterned conductive layer 32 is elongated, and cross-sectional area S reduces, therefore by formula R (ρ is the resistivity of conductor material to=ρ L/S in formula, and L is the length of conductor, and S is the cross-sectional area of conductor.) know, pattern conductive The resistance value R of layer 322Become larger, and is much larger than the resistance value R of equipment cable 311, therefore patterned conductive layer 32 consumes major part Electric energy (W=I2R), the electric energy that equipment cable 31 consumes declines to a great extent, so as to which energy loss is effectively reduced；Meanwhile by It is series circuit in the circuit, the increase of resistance conductive layer value 32 is so that total resistance value (R in circuit1+R2) increase, in power supply electricity Pressure value V0In the case where certain, known by formula I=U/R, total current I reduces in circuit, so that the electric current for flowing through equipment cable subtracts It is small, work peace risk can be effectively reduced.
Patterned conductive layer 32 can be the metals such as aluminium, titanium, or ITO (Indium Tin Oxides, indium oxide Tin), the transparent conductive oxides such as IZO (Indium Zinc Oxides, indium zinc oxide), or PEDOT (polyethylene dioxy Thiophene) conductive polymer materials such as/PSS (kayexalate), or carbon nanotube/graphene/nanometer silver/metal The conductive films such as net.But it is not limited only to this.
S13: a flexible base board is formed on patterned conductive layer.
Specifically, flexible base board is PI (Polyimide, polyimides) flexible base board, but is not limited only to this.
S14: a flexible unit is formed on flexible substrates.
Specifically, flexible unit include the array substrate being cascading, OLED element and for encapsulate OLED member The encapsulated layer of part.
S15: it is passed through pulsed power supplies signal in a flash to patterned conductive layer, to separate flexible unit and rigid substrates.
By the above-mentioned means, increasing by a patterned conductive layer between rigid substrates and flexible base plate, wherein pattern conductive Layer is extended in the approximately the same plane inner bending for being parallel to flexible base board, using ac/Dc power power supply unit to patterning Conductive layer is passed through pulsed power supplies signal in a flash, and equipment cost is low, and the joule that can be generated by patterned conductive layer moment Heat makes flexible base board thermal cracking, and then separates flexible unit with rigid substrates, due to being momentary pulse formula power signal, Most of Joule heat is patterned conductive layer and rigid substrates are taken away, and will not hurt flexible component, therefore will not cause soft Property component electrical property drift.
In addition, the patterned conductive layer that the approximately the same plane inner bending for being parallel to flexible base board is extended can effectively increase The resistance value of conductive layer is so that its resistance value is much larger than the resistance value of equipment cable, therefore conductive layer consumes most electric energy, The electric energy of equipment cable consumption declines to a great extent, so as to which energy loss is effectively reduced；Meanwhile the increase of resistance conductive layer value makes It obtains all-in resistance in circuit to increase, total current reduces, so that flowing through the current reduction of equipment cable, can effectively reduce Gong Anfeng Danger.
Referring to Fig. 4, Fig. 4 is the flow diagram of oled panel production method second embodiment of the present invention, the present embodiment Based on oled panel production method first embodiment of the present invention, it is release that one is arranged between rigid substrates and patterned conductive layer Layer；One heat-insulated buffer layer is set between patterned conductive layer and flexible unit.Its specific production method includes:
S41: a rigid substrates are provided.
Specifically, rigid substrates are carrier substrates, can be glass substrate, but be not limited only to this.
S42: a release layer is formed on the rigid substrate.
Specifically, release layer can be class PI release film；It is also possible to Silica-base release film；It is also possible to increasing stick Agent (Adhesion promoter), material can be Couple-agents (coupling agent) or the HDMSO (hexamethyls such as silanes Disiloxane).
S43: a patterned conductive layer is formed on release layer.
Specifically, patterned conductive layer is extended in the approximately the same plane inner bending for being parallel to flexible base board, to increase The resistance value of patterned conductive layer makes resistance value of its resistance value much larger than equipment cable.Patterned conductive layer can be using steaming The modes pattern-making such as plating/sputter, pattern are the structure of one embodiment of patterned conductive layer of the present invention referring particularly to Fig. 2, Fig. 2 Schematic diagram, but it is not limited only to this.
Fig. 3 is further regarded to, Fig. 3 is the structural schematic diagram of one embodiment of present system circuit.The circuit system includes: Power supply 30, equipment cable 31 and patterned conductive layer 32.For convenience of description, equipment cable 32 is equivalent to an electricity in figure Resistance.
Wherein, the voltage value of power supply 30 is V0, the resistance value of equipment cable 31 is R1, the resistance value of patterned conductive layer 32 For R2, equipment cable 31 connects with patterned conductive layer 32.When patterned conductive layer 32 is being parallel to the same of flexible base board When plane inner bending is extended, the conductive total length L of patterned conductive layer 32 is elongated, and cross-sectional area S reduces, therefore by formula R (ρ is the resistivity of conductor material to=ρ L/S in formula, and L is the length of conductor, and S is the cross-sectional area of conductor.) know, pattern conductive The resistance value R of layer 322Become larger, and is much larger than the resistance value R of equipment cable 311, therefore patterned conductive layer 32 consumes major part Electric energy (W=I2R), the electric energy that equipment cable 31 consumes declines to a great extent, so as to which energy loss is effectively reduced；Meanwhile by It is series circuit in the circuit, the increase of resistance conductive layer value 32 is so that total resistance value (R in circuit1+R2) increase, in power supply electricity Pressure value V0In the case where certain, known by formula I=U/R, total current I reduces in circuit, so that the electric current for flowing through equipment cable subtracts It is small, work peace risk can be effectively reduced.
Patterned conductive layer 32 can be the metals such as aluminium, titanium, or ITO (Indium Tin Oxides, indium oxide Tin), the transparent conductive oxides such as IZO (Indium Zinc Oxides, indium zinc oxide), or PEDOT (polyethylene dioxy Thiophene) conductive polymer materials such as/PSS (kayexalate), or carbon nanotube/graphene/nanometer silver/metal The conductive films such as net.But it is not limited only to this.
S44: a heat-insulated buffer layer is formed on patterned conductive layer.
Specifically, heat-insulated buffer layer is used for thermal insulation, can be SiO2Layer, but it is not limited only to this.
S45: a flexible base board is formed on heat-insulated buffer layer.
Specifically, flexible base board is PI (Polyimide, polyimides) flexible base board, but is not limited only to this.
S46: a flexible unit is formed on flexible substrates.
Specifically, flexible unit include the array substrate being cascading, OLED element and for encapsulate OLED member The encapsulated layer of part.
S45: it is passed through pulsed power supplies signal in a flash to patterned conductive layer, to separate flexible unit and rigid substrates.
By the above-mentioned means, increase by a patterned conductive layer between rigid substrates and flexible base plate, and rigid substrates with One release layer is set between patterned conductive layer, a heat-insulated buffer layer is set between patterned conductive layer and flexible unit, In, patterned conductive layer is extended in the approximately the same plane inner bending for being parallel to flexible base board, is supplied using ac/Dc power Device is answered to be passed through pulsed power supplies signal in a flash to patterned conductive layer, equipment cost is low, and can be by patterned conductive layer wink Between the Joule heat that generates make release layer thermal cracking, and then separate flexible unit with rigid substrates, due to being momentary pulse formula electricity Source signal, therefore most of Joule heat is taken away by rigid substrates, will not hurt flexible component, therefore will not cause soft group Part electrical property drift.And heat-insulated buffer layer can make conductive layer by thermal insulation, so that conductive layer and flexible component substrate be avoided to separate Flexible base board end is stayed in heat-insulated buffer layer, conductive layer and heat-insulated buffer layer can block aqueous vapor and penetrate into from flexible base board side, thus Extend the service life of flexible unit, and conductive layer can provide electromagnetic wave barrier and make flexible unit not by Electromagnetic Interference, and keep away Exempt from electrostatic discharges flexible unit.
In addition, the patterned conductive layer that the approximately the same plane inner bending for being parallel to flexible base board is extended can effectively increase The resistance value of conductive layer is so that its resistance value is much larger than the resistance value of equipment cable, therefore conductive layer consumes most electric energy, The electric energy of equipment cable consumption declines to a great extent, so as to which energy loss is effectively reduced；Meanwhile the increase of resistance conductive layer value makes It obtains all-in resistance in circuit to increase, total current reduces, so that flowing through the current reduction of equipment cable, can effectively reduce Gong Anfeng Danger.
Referring to Fig. 5, Fig. 5 is the structural schematic diagram of one embodiment of oled panel of the present invention.The oled panel of the present embodiment It include: the patterned conductive layer 50 being cascading, heat-insulated buffer layer 51, PI flexible base board 52 and flexible unit 53.
Patterned conductive layer 50 is extended in the approximately the same plane inner bending for being parallel to flexible base board, to increase patterning The resistance value of conductive layer 50 is so that its resistance value is much larger than the resistance value of ac/Dc power power supply unit equipment cable.Patterning Conductive layer 50 can be using modes pattern-makings such as vapor deposition/sputters, and pattern is that present invention patterning is led referring particularly to Fig. 2, Fig. 2 The structural schematic diagram of electric layer first embodiment, but it is not limited only to this.
Patterned conductive layer 50 can be the metals such as aluminium, titanium, or ITO (Indium Tin Oxides, indium oxide Tin), the transparent conductive oxides such as IZO (Indium Zinc Oxides, indium zinc oxide), but be not limited only to this.
Heat-insulated buffer layer 51 is used for thermal insulation, can be SiO2Layer, but it is not limited only to this.
Flexible base board 52 is PI (Polyimide, polyimides) flexible base board, but is not limited only to this.
Flexible unit 53 includes array substrate, OLED element and the envelope for encapsulating OLED element being cascading Fill layer.
It is penetrated by the above-mentioned means, conductive layer and heat-insulated buffer layer can block aqueous vapor from flexible base board side, to extend soft The service life of property component, and conductive layer can provide electromagnetic wave barrier and make flexible unit not by Electromagnetic Interference, and avoid electrostatic Electric discharge destroys flexible unit.
On this basis, the above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all It is to use made by description of the invention and accompanying drawing content, but be not limited only to this effect mould group transformation, such as skill between each embodiment Art feature be combined with each other, and being applied directly or indirectly in other relevant technical fields, similarly includes of the invention special In sharp protection scope.

Claims (8)

1. a kind of manufacturing method of flexible OLED panel characterized by comprising
One rigid substrates are provided；
A release layer is formed on the rigid substrates；
A patterned conductive layer is formed on the release layer；
A heat-insulated buffer layer is formed on the patterned conductive layer；
A flexible base board is formed on the heat-insulated buffer layer；
A flexible unit is formed on the flexible base board；
Wherein, the patterned conductive layer is connected with an equipment cable, and is passed through pulsed electricity in a flash by the equipment cable Source signal, so that release layer described in the Joule heat thermal cracking that the momentary pulse formula power signal generates, and then separate described soft Property the component and rigid substrates；
Wherein, the patterned conductive layer is extended in the approximately the same plane inner bending for being parallel to the flexible base board, so that The resistance value of the patterned conductive layer is much larger than the resistance value of the equipment cable, and after being passed through the power signal, subtracts The electric current on the equipment cable is flowed through less；The patterned conductive layer also provides for electromagnetic wave barrier, so that the flexibility Component is not by Electromagnetic Interference.
2. the method according to claim 1, wherein described form a pattern conductive on the rigid substrates It is metal, transparent conductive oxide, electrically conducting transparent macromolecule, graphene or carbon nanotubes that layer, which includes: the patterned conductive layer,.
3. according to the method described in claim 2, it is characterized in that, the patterned conductive layer is nano silver.
4. the method according to claim 1, wherein the momentary pulse formula power signal is by DC/AC electricity Source power supply unit provides.
5. the method according to claim 1, wherein the heat-insulated buffer layer interrogates the momentary pulse formula power supply Number joule thermal isolation generated, so that the patterned conductive layer and the heat-insulated buffer layer stay on the flexible unit.
6. the method according to claim 1, wherein
The rigid substrates are glass substrate；
The flexible base board is PI flexible base board；
The flexible unit includes array substrate and OLED element.
7. the method according to claim 1, wherein
The release layer is PI or silicon substrate release film or tackifier；
The heat-insulated buffer layer is SiO2Layer.
8. a kind of flexible OLED panel characterized by comprising
Patterned conductive layer, heat-insulated buffer layer, PI flexible base board and the flexible unit being cascading；
The patterned conductive layer is extended in the approximately the same plane inner bending for being parallel to the PI flexible base board, to increase State the resistance value of patterned conductive layer；
Wherein, during fabrication, the flexible OLED panel is arranged on a rigid substrates flexible OLED panel, the flexibility A release layer is additionally provided between oled panel and the rigid substrates；The patterned conductive layer is connected with an equipment cable, and Pulsed power supplies signal in a flash is passed through by the equipment cable, so that the Joule heat that the momentary pulse formula power signal generates Release layer described in thermal cracking, and then separate the oled panel and the rigid substrates；
Wherein, the patterned conductive layer also provides for electromagnetic wave barrier, so that the flexible unit is not by Electromagnetic Interference.
CN201610929395.2A 2016-10-31 2016-10-31 Flexible OLED panel production method and flexible OLED panel Active CN106505152B (en)

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CN110310922B (en) * 2019-06-20 2022-05-06 信利半导体有限公司 Preparation method of flexible circuit device
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