CN207181759U - A kind of more transverse mode light emission components of plug type - Google Patents
A kind of more transverse mode light emission components of plug type Download PDFInfo
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- CN207181759U CN207181759U CN201721197515.0U CN201721197515U CN207181759U CN 207181759 U CN207181759 U CN 207181759U CN 201721197515 U CN201721197515 U CN 201721197515U CN 207181759 U CN207181759 U CN 207181759U
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- monitoring
- laser
- photoelectric diode
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Abstract
It the utility model is related to optical communication technique field,A kind of more particularly to more transverse mode light emission components of plug type,Including adapter assembly and luminescence component,Adapter assembly includes connector and is arranged at the adapter of connector left end,Luminescence component is arranged at the right-hand member of connector,Luminescence component includes base,The pipe cap of base left end,Connector is provided with storage tank,Lens are provided with storage tank,The pipe cap is placed in storage tank,A cavity is formed after pipe cap and base assembling,Laser and monitoring photoelectric diode are provided with the cavity,Pipe cap is provided with tilting mirrors,Adapter,Lens and luminescence component are located on same axis,The encapsulation of light emission component is designed to coaxial type by the utility model,Reduce packaging cost,Simplify packaging technology,The light-receiving component enable with being assembled using the hardware compatibility of coaxial packaging technique,And monitoring photoelectric diode is reflexed to by transmitting light of the oblique mirror to laser,Realize the monitoring to laser.
Description
Technical field
It the utility model is related to optical communication technique field, more particularly to a kind of more transverse mode light emission components of plug type.
Background technology
Today's society informatization fast development, demand day of the people for multimedia communications such as data, voice, images
Benefit is vigorous, and this greatly accelerates the development of fiber optic communication, optical device transmission rate from 10Gbps, 16Gbps be promoted to 25Gbps,
28Gbps, it is increasing to the demand of the optical device of high transfer rate.
Existing 25G multimodes light emission component uses the packaged type that chip is attached to circuit board, and this just gives birth to circuit board
The product packaging cost that production. art requires high, relative is high, complex process；In addition, product can not do that air-tight packaging causes can
It is poor by property, and the monitoring relatively difficult to achieve to laser, and can not compatible assembling with the equipment using coaxial packaging technique.
The content of the invention
The purpose of this utility model is to provide a kind of plug type more transverse mode light transmitting groups in view of the shortcomings of the prior art
The encapsulation of light emission component is designed to coaxial type by part, the utility model, reduces packaging cost, simplifies packaging technology so that should
Light-receiving component can be with being assembled using the hardware compatibility of coaxial packaging technique, and the light launched by oblique mirror laser is believed
Number monitoring photoelectric diode is reflexed to, realize the monitoring to laser.
The utility model is achieved through the following technical solutions, a kind of more transverse mode light emission components of plug type, bag
Adapter assembly and luminescence component are included, the adapter assembly includes connector and is arranged at the adapter of connector left end, institute
The right-hand member that luminescence component is arranged at connector is stated, the luminescence component includes the base being connected with connector, the base left end
Pipe cap, the connector is provided with storage tank, lens is provided with the storage tank, and the pipe cap is placed in storage tank, institute
A cavity is formed after stating pipe cap and base assembling, laser and monitoring photoelectric diode, the pipe cap are provided with the cavity
The tilting mirrors of a half-transmitting and half-reflecting is provided with, the adapter, lens and luminescence component are located on same axis.
Preferably, the laser is arranged at the upper end of monitoring photoelectric diode, the laser and monitoring photoelectricity two
Conductive silver glue paster is provided between level pipe, the laser is connected by conductive silver glue paster with monitoring photoelectric diode.
Preferably, it is provided with conductive silver glue paster, the monitoring photoelectricity between the monitoring photoelectric diode and base
Diode is fixedly connected by conductive silver glue paster with base.
Preferably, the upper end of the monitoring photoelectric diode is additionally provided with one side gold plated ceramic pad, the one side is gold-plated
Non-conductive adhesive paster is provided between ceramic gasket and monitoring photoelectric diode, the one side gold plated ceramic pad passes through non-conductive
Sticker piece is connected with monitoring photoelectric diode.
Preferably, the angle of inclination of the tilting mirrors is 15 degree ~ 25 degree.
Preferably, the angle of inclination of the tilting mirrors is 17 degree.
The beneficial effects of the utility model：A kind of more transverse mode light emission components of plug type, including adapter assembly and hair
Optical assembly, the adapter assembly include connector and are arranged at the adapter of connector left end, and the luminescence component is arranged at
The right-hand member of connector, the luminescence component include the base being connected with connector, the pipe cap of the base left end, the connector
Storage tank is provided with, lens are provided with the storage tank, the pipe cap is placed in storage tank, after pipe cap and the base assembling
A cavity is formed, laser and monitoring photoelectric diode are provided with the cavity, it is anti-that the pipe cap is provided with a half transmitting half
The tilting mirrors penetrated, the adapter, lens and luminescence component are located on same axis, and the utility model is by light emission component
Encapsulation is designed to coaxial type, reduces packaging cost, simplifies packaging technology so that the light-receiving component can with using coaxial packaging
The hardware compatibility assembling of technique, and the optical signal launched by oblique mirror laser reflexes to monitoring photoelectric diode, realizes
Monitoring to laser.
Brief description of the drawings
Fig. 1 is dimensional structure diagram of the present utility model.
Fig. 2 is cross-sectional view of the present utility model.
Fig. 3 is the decomposition texture schematic diagram of the utility model luminescence component.
Embodiment
1 the utility model is described further to accompanying drawing 3, and embodiment below in conjunction with the accompanying drawings.
As shown in Figure 1 to Figure 3, the more transverse mode light emission components of a kind of plug type, including adapter assembly 1 and luminescence component
2, the adapter assembly 1 includes connector 3 and is arranged at the adapter 4 of the left end of connector 3, and the luminescence component 2 is arranged at
The right-hand member of connector 3, the luminescence component 2 include the base 21 that is connected with connector 3, the pipe cap 22 of the left end of base 21,
The connector 3 is provided with storage tank 31, and lens 5 are provided with the storage tank 31, and the pipe cap 22 is placed in storage tank 31,
A cavity is formed after pipe cap 22 and base 21 assembling, laser 23 and monitoring photoelectric diode are provided with the cavity
24, the pipe cap 22 is provided with the tilting mirrors 25 of a half-transmitting and half-reflecting, the adapter 4, lens 5 and luminescence component 2
In on same axis.
Adapter 4, lens 5 and luminescence component 2 are located on same axis, by light by the present embodiment on the basis of connector 3
The encapsulation of emitting module is designed to coaxial type, reduces packaging cost, simplifies packaging technology so that the utility model can be with use
The hardware compatibility assembling of coaxial packaging technique, and the optical signal launched by oblique mirror 25 laser 23 reflexes to monitoring photoelectricity
Diode 24, realize the monitoring to laser.
The present embodiment laser 23 launches optical signal and passes through tilting mirrors 25, and tilting mirrors 25 is the mirror of half-transmitting and half-reflecting
Face, a part of optical signal is transmitted through lens 5 by tilting mirrors 25, then is transmitted through adapter 4 by lens 5；Another part light
Signal reflexes to the reception area of monitoring photoelectric diode 24 by oblique mirror 25, and monitoring photoelectric diode 24 monitors whether normal work
Make, the working condition of laser 23 is fed back.
To ensure that the monitored photoelectric diode 24 of the reflected light signal of oblique mirror 25 receives, the angle of inclination of tilting mirrors 25
For 17 degree.
The utility model base 21 is the base 21 for meeting 25G/28G speed.
In the present embodiment, the laser 23 is arranged at the upper end of monitoring photoelectric diode 24, the laser 23 and prison
Conductive silver glue paster is provided between control photoelectric diode 24, the laser 23 passes through conductive silver glue paster and monitoring photoelectricity two
Level pipe 24 connects, and a part of optical signal reflexes to the reception area of monitoring photoelectric diode 24 by oblique mirror 25, monitors photoelectricity two
Level pipe 24 monitors whether normal work, and the working condition of laser 23 is fed back；Conductive silver glue paster is H20S conductive silvers
Sticker piece；
In the present embodiment, conductive silver glue paster, the prison are provided between the monitoring photoelectric diode 24 and base 21
Control photoelectric diode 24 is fixedly connected by conductive silver glue paster with base 21, and conductive silver glue paster is H20S conductive silver stickers
Piece.
In the present embodiment, the upper end of the monitoring photoelectric diode 24 is additionally provided with one side gold plated ceramic pad 26, the list
Non-conductive adhesive paster, the one side gold plated ceramic pad are provided between face gold plated ceramic pad 26 and monitoring photoelectric diode 24
26 are connected by non-conductive adhesive paster with monitoring photoelectric diode 24.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality
With new thought, there will be changes, this specification content should not be construed as in specific embodiments and applications
To limitation of the present utility model.
Claims (6)
- A kind of 1. more transverse mode light emission components of plug type, it is characterised in that：It is described suitable including adapter assembly and luminescence component Including connector with device assembly and be arranged at the adapter of connector left end, the luminescence component is arranged at the right-hand member of connector, The luminescence component includes the base being connected with connector, the pipe cap of the base left end, and the connector is provided with storage tank, Lens are provided with the storage tank, the pipe cap is placed in storage tank, and a cavity is formed after pipe cap and the base assembling, Laser and monitoring photoelectric diode are provided with the cavity, the pipe cap is provided with the tilting mirrors of a half-transmitting and half-reflecting, The adapter, lens and luminescence component are located on same axis.
- A kind of 2. more transverse mode light emission components of plug type according to claim 1, it is characterised in that：The laser is set The upper end of monitoring photoelectric diode is placed in, conductive silver glue paster, institute are provided between the laser and monitoring photoelectric diode Laser is stated to be connected with monitoring photoelectric diode by conductive silver glue paster.
- A kind of 3. more transverse mode light emission components of plug type according to claim 2, it is characterised in that：The monitoring photoelectricity Conductive silver glue paster is provided between diode and base, the monitoring photoelectric diode is consolidated by conductive silver glue paster with base Fixed connection.
- A kind of 4. more transverse mode light emission components of plug type according to claim 1, it is characterised in that：The monitoring photoelectricity The upper end of diode is additionally provided with one side gold plated ceramic pad, is set between the one side gold plated ceramic pad and monitoring photoelectric diode Non-conductive adhesive paster is equipped with, the one side gold plated ceramic pad is connected by non-conductive adhesive paster with monitoring photoelectric diode.
- A kind of 5. more transverse mode light emission components of plug type according to claim 1, it is characterised in that：The tilting mirrors Angle of inclination be 15 degree ~ 25 degree.
- A kind of 6. more transverse mode light emission components of plug type according to claim 1, it is characterised in that：The tilting mirrors Angle of inclination be 17 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721197515.0U CN207181759U (en) | 2017-09-19 | 2017-09-19 | A kind of more transverse mode light emission components of plug type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721197515.0U CN207181759U (en) | 2017-09-19 | 2017-09-19 | A kind of more transverse mode light emission components of plug type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207181759U true CN207181759U (en) | 2018-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721197515.0U Active CN207181759U (en) | 2017-09-19 | 2017-09-19 | A kind of more transverse mode light emission components of plug type |
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| Country | Link |
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| CN (1) | CN207181759U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023077725A1 (en) * | 2021-11-04 | 2023-05-11 | 至芯半导体(杭州)有限公司 | Inclined plane detection device packaging structure and manufacturing method therefor |
-
2017
- 2017-09-19 CN CN201721197515.0U patent/CN207181759U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023077725A1 (en) * | 2021-11-04 | 2023-05-11 | 至芯半导体(杭州)有限公司 | Inclined plane detection device packaging structure and manufacturing method therefor |
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