CN207148347U - 一种高硬度软膜结构 - Google Patents

一种高硬度软膜结构 Download PDF

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CN207148347U
CN207148347U CN201720678486.3U CN201720678486U CN207148347U CN 207148347 U CN207148347 U CN 207148347U CN 201720678486 U CN201720678486 U CN 201720678486U CN 207148347 U CN207148347 U CN 207148347U
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high rigidity
layer
film structure
precoated shet
soft film
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吕政锜
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G2f Tech Co ltd
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Abstract

本实用新型提供一种高硬度软膜结构,其包括一中间基材层、一上预涂层、至少一上硬涂层或至少一上抗污层、一第一下预涂层以及至少一下硬涂层或一第二下预涂层及至少一导电金属网格层;本实用新型是将高透光性的中间基材层的上下两侧面涂布预涂层及多个硬涂层的高硬度材料,以提升整体外力刮磨抵抗能力,或再在最外上硬涂层的一侧涂布上抗污层低表面能材料及第二下预涂层及导电金属网格层导电材料,据以达成光学用高硬度、抗污及导电的软膜结构。

Description

一种高硬度软膜结构
技术领域
本实用新型涉及一种可挠性薄膜,尤指一种光学用高硬度、抗污及导电的高硬度软膜结构。
背景技术
软膜(塑料基板)取代玻璃基板成为次世代显示器材料是未来的趋势。因为软膜拥有较玻璃基板的轻、薄、耐冲击、可卷曲等优势,可应用于许多可携式及穿戴式显示设备,以提高使用寿命并增加使用范围。然而,软膜的硬度不及玻璃基板,常常需要在软膜表面做硬膜处理(Hard Coating)。目前软膜在光电产业的应用有:(一)透明导电薄膜(TransparentCon- ductive Film):利用软膜的特性,镀上透明导电膜作为电极,应用于触控式面板屏幕、液晶显示面板(LCD panel)、有机发光二极管(OLED)、电子书(e-book)等,可增加产品的竞争力。除了更轻更薄外,可挠曲的基板优点更是未来被光电产业应用所吸引的主因。(二)抗反射防静电薄膜(Anti-reflection/Anti-static):抗反射膜能增加对比、降低反射并增加穿透率,同时通过膜层的设计,还能有抗静电、耐污、防紫外线照射破坏的功能。以往将抗反射膜镀于玻璃上的需求已明显降低,取而代之的是镀于光学膜,如偏光板、增亮膜等,以增加产品的功能性。(三)表面硬膜(Hard Coating):对于表面硬度不足的软膜而言,镀上硬涂层,如亚克力树脂(PMMA)等,能大幅增加软膜表面的硬度,增加产品的使用寿命。产品的应用如:触控面板、偏光板、各式塑料型显示器等。(四)光储存:如CD-R、DVD-R等在Polycarbonate (PC)基板上制镀反射层。(五)其他:其他软膜表面处理的产品应用方面还有如,在PI (Polyimide)膜上镀上Cu薄膜以作为制镀铜箔的导电电极,此为FPC(FlexiblePrint Circuit) 工艺的基板材料。另外如智能窗、隔热纸以及降低水氧气渗透所制镀的阻绝层等,均是能利用软膜表面处理方式增加其功能性所发展出来的用途。
薄膜表面处理方法,可分为干式处理工艺及湿式处理工艺,其中,干式处理工艺可使用氧化铝、氧化硅、氧化镁等的无机物或无机氧化物,利用真空蒸镀法、溅镀法、离子镀法等的物理气相成长法(PVD法),或电浆化学气相成长法、热化学气相成长法、光化学气相成长法等的化学气相成长法(CVD法)等,形成该无机物的蒸镀膜而成的表面处理薄膜。其借由电浆CVD法形成以硅氧化物为主成分的表面处理方法中,由于基材表面受到电浆的发光热或离子、自由基的冲撞等的影响。干式处理工艺仍有披覆时温度较高易影响塑料基材质量及成品易弯折龟裂等物性不安定的问题。另外,湿式处理工艺可使用光硬化或热硬化树脂树脂涂布方式,将有机无机混成材料涂布于基材上,先前技术针对湿式表面硬膜处理方式研究,如中国台湾专利公告号420636所公开,一种具低反射色的反反射涂覆层的挠性塑料基质包括折射率范围由1.55至1.71的表面及第二表面,一有机硬膜淀积于该基质的第一表面上且在该第一表面上载有一反反射涂覆层的光学对象,并层叠于该有机硬膜上,该反反射涂覆层由高折射率材料与低折射率材料所组成,该反反射涂覆层提供一低于1%的反射量。另外也有,针对表面硬涂研究,如中国台湾专利公告号201606591所公开,一种积层薄膜及使用其的触控面板,其中,该积层薄膜铅笔硬度为H以上的树脂层。粒子为选自包括氧化硅粒子、硫酸钡粒子、氧化铝粒子及碳酸钙粒子的群组中的至少1种粒子。以及如中国台湾专利证书号I546198所公开,一种高阻气性且阻气性的重复再现性优异的阻气性薄膜。其在高分子基材的至少一面上依顺序积层有以下的[A]层与[B]层,[A]层:铅笔硬度为H~3H且表面自由能为45mN/m以下的交联树脂层,[B]层:厚度为10~1000nm的含硅无机层,其是以下的[B1]层或[B2]层中的任一个,[B1]层:包括氧化锌、二氧化硅与氧化铝的共存相的层,[B2] 层:包括硫化锌与二氧化硅的共存相的层。
另外,针对湿式表面硬膜处理式的透明导电膜研究,如中国台湾专利证书号I480164 所公开,一种于积层2片透明导电膜,其中,硅氧化物构成的薄膜层借由化学气相蒸镀法 (CVD法)成形,于透明塑料膜的单面或两面,形成由树脂构成的透明硬涂层。借由将硬涂层形成于透明塑料膜表面,可隐藏原先存在于透明塑料膜的划痕,并且形成有硬涂层的透明膜基材表面的滑动性或表面强度提高,故于后加工时,可防止于透明膜基材产生划痕。尤其是,在将硬涂层形成于透明导电层侧的透明塑料膜表面时,除上述方面外,进而也可使本发明的透明导电膜的导电性稳定。用于硬涂层的树脂较佳为使该硬涂层为铅笔硬度2H以上,可使用三聚氰胺系树脂、紫外线硬化型丙烯酸系树脂、胺酯系树脂等透明树脂,且厚度较佳为1~7μm。并且,在形成硬涂层时,会有产生干涉条纹的情形,但在该情形时,较佳为在上述透明塑料膜与硬涂层之间,设置由树脂与高折射率微粒子等构成的干涉防止层(厚度为 10~50nm左右,较佳为20~30nm左右)。作为上述树脂,可使用例如丙烯酸系树脂、聚酯系树脂等,作为上述高折射率微粒子,可使用由例如氧化钛、氧化锆等构成的微粒子,上述透明导电层较佳为由ITO构成的薄膜层。
多层堆栈结构膜的研究,如中国台湾专利证书号I510365所公开,是一种多层塑料基板,其中,第一有机或有机-无机混合层、一气体阻隔层以及第二有机或有机-无机混合层层叠于相连的两塑料膜层的两表面;第一或第二有机或有机-无机混合层的至少一个以组成物形成。以及如中国台湾专利证书号I477637所公开,是一种具有硬质涂层的被覆件,包括硬质基体、形成于该基体上的结合层及形成于该结合层上的纳米硬质涂层,该纳米硬质涂层包括多层TiAlN层及多层SiN层,所述TiAlN层与SiN层交替堆栈,该纳米硬质涂层经交替沉积所述TiAlN层及SiN层后进行氮化热处理制得。利用磁控溅射设备的制备方法,制备该被覆件具有较高硬度、耐磨损及优良的高温抗氧化性能。以上的先前技术仍未有具高硬度、抗污及导电软膜整合的高柔性薄型化结构的实用新型,若具整合后,实为食品、医药品的包装或太阳能电池、电子纸、有机电致发光(EL)显示器等产业一大进展,为促进于产业进入次世代产品发展的重要基石。
实用新型内容
本实用新型的发明人从事显示器材料产业工作多年,深知其薄型化高硬度光学可挠性软膜仍有不足之处,须解决卷取时易脆问题,乃致力于发展高硬度软膜结构开发。本实用新型提供一种高硬度软膜结构,其包括:
一中间基材层,设置于上预涂层及第一下预涂层之间;
一上预涂层,设置于中间基材层及上硬涂层之间;
至少一上硬涂层,相邻于上预涂层一侧;
一第一下预涂层,设置于中间基材层及下硬涂层之间;及
至少一下硬涂层,相邻于第一下预涂层一侧;各涂层之间相对构成。
本实用新型还提供一种高硬度软膜结构,其包括:
一中间基材层,设置于上预涂层及第一下预涂层之间;
一上预涂层,设置于中间基材层及上硬涂层之间;
至少一上硬涂层,相邻于上预涂层一侧;
一第一下预涂层,设置于中间基材层及下硬涂层之间;
至少一下硬涂层,相邻于第一下预涂层一侧;
一第二下预涂层,设置于下硬涂层及导电金属网格层之间;及
至少一导电金属网格层,相邻于第二下预涂层一侧;各涂层之间相对构成。
其中,导电金属网格层具备图纹构造的方向性导电功能,该导电金属网格层的厚度介于1~10μm之间,并且,该导电金属网格层的表面覆盖至少一保护层。
其中,在最外上硬涂层的表面一侧相邻设置至少一上抗污层,或至少一上抗污层取代上硬涂层覆盖于上预涂层一侧,据以达成光学用高硬度、抗污及导电的软膜结构。
其中,上抗污层选用低表面能氟素或非氟素热反应性的高硬度涂料制成;该上抗污层的厚度介于1~30μm之间。
其中,中间基材层选用聚对苯二甲酸乙二酯、聚碳酸酯、聚甲基丙烯酸甲酯、聚氨酯、热塑性聚氨酯、聚酰胺、三醋酸纤维素、PC/ABS、PC/PMMA、聚醚砜、聚萘二甲酸乙二酯或聚酰亚胺其中的一种或复合透光材料;该中间基材层的厚度介于7~188μm之间。
其中,各预涂层提供其相邻层的界面间亲和性官能基团,达到异质界面偶合效果;各预涂层的厚度介于50nm~10μm之间。
其中,各硬涂层的料材选用热反应型树脂,各硬涂层的厚度介于1~30μm之间。
其中,该热反应型树脂包含硅酮、二氧化硅和硅酸盐的单一或复合有机无机材料。
其中,该高硬度软膜结构的整体厚度介于20~250μm之间。
其中,该高硬度软膜结构的整体厚度≤120μm。
其中,该高硬度软膜结构的整体透光度>85%,曲率半径<10cm。
其中,该高硬度软膜结构的硬度随硬涂层厚度调整为3-9H。
本实用新型的有益效果为:本实用新型是将高透光性中间基材层的上下两侧面涂布预涂层及多个硬涂层的高硬度材料,以提升整体外力刮磨抵抗能力,或再在最外上硬涂层的一侧涂布抗污层低表面能材料及第二下预涂层及导电金属网格层导电材,据以达成光学用高硬度、抗污及导电的软膜结构。
附图说明
图1显示现有高硬度软膜结构剖面图;
图2显示本实用新型高硬度软膜结构剖面图;
图3显示本实用新型具抗污的高硬度软膜结构剖面图;
图4显示本实用新型具硬涂层及抗污层结构图;
图5显示现有导电玻璃基板结构剖面图;
图6显示本实用新型具导电的高硬度软膜结构剖面图;
图7显示本实用新型具抗污及导电的高硬度软膜结构剖面图。
附图标记说明
(现有技术)
1 现有高硬度软膜结构
101 中间基材层
102 上预涂层
103 下预涂层
104 上硬涂层
105 下硬涂层
5 现有导电玻璃基板结构
501 玻璃层
502 塑料基材层
503 导电金属网格层
(本实用新型)
2 高硬度软膜结构
201 中间基材层
202 上预涂层
203 第一下预涂层
204 第一上硬涂层
205 第二上硬涂层
206 第三上硬涂层
207 第一下硬涂层
208 第二下硬涂层
209 第三下硬涂层
210 上硬涂层
211 下硬涂层
3 具抗污的高硬度软膜结构
301 上抗污层
4a 具单层硬涂层结构
4b 具双层硬涂层结构
4c 具三层硬涂层结构
4d 具单层抗污层结构
4e 具单层硬涂层及单层抗污层结构
4f 具双层硬涂层及单层抗污层结构
6 具导电的高硬度软膜结构
601 第二下预涂层
602 导电金属网格层
7 具抗污及导电的高硬度软膜结构。
具体实施方式
以下借由特定的具体实施例说明本实用新型的实施方式,本领域技术人员可由本说明书所揭示的内容轻易地了解本实用新型的其他优点与功效。本实用新型也可借由其他不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不悖离本实用新型的精神下进行各种修饰与变更。
首先,敬请参阅图1所示,图1显示现有高硬度软膜结构剖面图,现有高硬度软膜结构1在中间基材层101的两侧面覆盖一上预涂层102及一下预涂层103,该预涂层的作用在于提供中间基材层101及硬涂层的界面间亲和性官能基团,达到异质界面偶合效果;该厚度>10μm,一般介于10~20μm之间。上预涂层102在接邻中间基材层101的另一侧面覆盖一上硬涂层104;并且,下预涂层103在接邻中间基材层101的另一侧面覆盖一下硬涂层 105,该硬涂层为了达到表面铅笔硬度达到H以上的要求,工艺上一般使用亚克力材料涂布,该厚度>30μm,一般介于30~40μm之间。中间基材层101的厚度一般介于100~188 μm之间,往往硬膜处理后的整体厚度大于200μm,且考虑表面硬度及固着力的要求,硬涂层及预涂层厚度均无法相对有效降低。即使整体厚度达到135μm,但光学透光度、固着力及卷取性效果仍然没有很好。
因此,请比较图1的现有高硬度软膜结构1,再参阅图2,图2显示本实用新型高硬度软膜结构剖面图,本实用新型的高硬度软膜结构2的中间基材层201设置于上预涂层202 及第一下预涂层203之间,在中间基材层201的两侧面覆盖一上预涂层202及一第一下预涂层203。上预涂层202设置于中间基材层201及第一上硬涂层204之间;第一下预涂层203 设置于中间基材层201及下硬涂层211之间;其预涂层的作用在于提供中间基材层201及硬涂层的界面间亲和性官能基团,达到异质界面偶合效果;该厚度≤10μm,介于50nm~10μ m之间。上预涂层202在接邻中间基材层201的另一侧面,上硬涂层210相邻于上预涂层 202一侧,依序覆盖一第一上硬涂层204、第二上硬涂层205及第三上硬涂层206。并且,第一下预涂层203在接邻中间基材层201的另一侧面,下硬涂层211相邻于第一下预涂层 203一侧,依序覆盖一第一下硬涂层207、第二下硬涂层208及第三下硬涂层209。该硬涂层为了达到表面铅笔硬度达到6~9H的要求,工艺上选用热反应型树脂;该热反应型树脂可包含硅酮(silicone)、二氧化硅(silica)和硅酸盐(silicate)的单一或复合有机无机材料。该树脂涂布于相邻该预涂层上之后,再以堆栈方式将其他硬涂层依序涂布覆盖上,各硬涂层厚度≤10 μm,介于1~10μm之间。中间基材层201选用聚对苯二甲酸乙二酯(poly(ethylene terephthalate),PET)、聚碳酸酯(polycarbonate,PC)、聚甲基丙烯酸甲酯poly(methyl methacrylate),PMMA)、聚氨酯(poly urethance,PU)、热塑性聚氨酯(thermoplastic poly urethance,TPU)、聚酰胺(polyamide,PA)、三醋酸纤维素(triacetyl cellulose,TAC)、 PC/ABS、PC/PMMA、聚醚砜(poly(ether sulfones),PES)、聚萘二甲酸乙二酯(poly(ethylene 2,6-naphthalate),PEN)或聚酰亚胺(polyimide,PI)其中的一种或复合透光材料,该厚度介于7~188μm之间,可控制硬膜处理后的整体厚度介于20~250μm之间,该整体厚度以≤120 μm为最佳。其高硬度的软膜结构整体透光度>85%,曲率半径<10cm,且其软膜硬度可随涂层厚度调整为6-9H。
另一实施例,请再阅图3,图3显示本实用新型具抗污的高硬度软膜结构剖面图,本实用新型具抗污的高硬度软膜结构3的中间基材层201设置于上预涂层202及第一下预涂层203之间,在中间基材层201的两侧面覆盖一上预涂层202及一第一下预涂层203。上预涂层202设置于中间基材层201及第一上硬涂层204之间;第一下预涂层203设置于中间基材层201及下硬涂层211之间;其预涂层作用在于提供中间基材层201及硬涂层的界面间亲和性官能基团,达到异质界面偶合效果;该厚度≤10μm,介于50nm~10μm之间。上预涂层 202在接邻中间基材层201的另一侧面,上硬涂层210相邻于上预涂层202一侧,依序覆盖一第一上硬涂层204、第二上硬涂层205以及最外层的上抗污层301;该抗污层选用氟素或非氟素热反应性高硬度涂料制成;该厚度介于1~10μm之间。并且,第一下预涂层203在接邻中间基材层201的另一侧面,下硬涂层211相邻于第一下预涂层203一侧,依序覆盖一第一下硬涂层207、第二下硬涂层208及第三下硬涂层209。该硬涂层为了达到表面铅笔硬度达到6~9H的要求,工艺上选用热反应型树脂;该热反应型树脂可包含硅酮(silicone)、二氧化硅(silica)和硅酸盐(silicate)的单一或复合有机无机材料。该树脂涂布于相邻该预涂层上之后,再以堆栈方式将其他硬涂层依序涂布覆盖上,各硬涂层厚度≤10μm,介于1~10μm 之间。中间基材层201选用聚对苯二甲酸乙二酯(poly(ethylene terephthalate),PET)、聚碳酸酯(polycarbonate,PC)、聚甲基丙烯酸甲酯poly(methyl methacrylate),PMMA)、聚氨酯(poly urethance,PU)、热塑性聚氨酯(thermoplastic poly urethance,TPU)、聚酰胺(polyamide, PA)、三醋酸纤维素(triacetyl cellulose,TAC)、PC/ABS、PC/PMMA、聚醚砜(poly(ether sulfones),PES)、聚萘二甲酸乙二酯(poly(ethylene 2,6-naphthalate),PEN)或聚酰亚胺 (polyimide,PI)其中的一种或复合透光材料,该厚度介于7~188μm之间,可控制硬膜处理后的整体厚度介于20~250μm之间,该高硬度软膜结构3的整体厚度以≤120μm为最佳。其高硬度的软膜结构整体透光度>85%,曲率半径<10cm,且其软膜硬度可随涂层厚度调整为6-9H。
图4显示本实用新型具硬涂层及抗污层结构图,本实用新型的具单层硬涂层结构4a 的第一上硬涂层204的厚度介于1~30μm之间,由于硬度与厚度呈正比关系,随厚度增加,其结构的铅笔硬度约达3H~9H。再参阅本实用新型的具双层硬涂层结构4b,其以双层硬涂层结构:第一上硬涂层204及第二上硬涂层205堆栈而成,其各层厚度约介于1~15μm 之间,同样随厚度增加,其结构的铅笔硬度约达6H~9H。再进一步,本实用新型的具三层硬涂层结构4c使用三层硬涂层结构:第一上硬涂层204、第二上硬涂层205及第三上硬涂层206堆栈而成,其各层厚度约介于1~10μm之间,同样随厚度增加,其结构的铅笔硬度约达6H~9H。以上举例以上硬涂层做说明,下硬涂层也是如此。除此之外,也可使用抗污层作为表面结构,达到具高硬度及抗污功能,本实用新型的具单层抗污层结构4d的上抗污层301的厚度介于1~30μm之间,抗污层选用含氟素或非氟素所组成的高硬度涂料;并且,由于硬度与厚度呈正比关系,随厚度增加,其结构的铅笔硬度约达3H~9H。再参阅本实用新型的具单层硬涂层及单层抗污层结构4e,其以单层硬涂层及单层抗污层结构,即第一上硬涂层204及上抗污层301堆栈而成,其各层厚度约介于1~15μm之间,同样随厚度增加,其该结构的铅笔硬度约达6H~9H。再进一步,本实用新型的具双层硬涂层及单层抗污层结构4f使用双层硬涂层及单层抗污层结构,即第一上硬涂层204、第二上硬涂层205及上抗污层301堆栈而成,其各层厚度约介于1~10μm之间,同样随厚度增加,其结构的铅笔硬度约达6H~9H。
举例为触控面板的应用领域,如图5显示现有导电玻璃基板结构剖面图,显示现有导电玻璃基板结构5,一般状态下,玻璃机板具备触控功能,需在该玻璃层501的其中一侧的下方设置一导电薄膜,该导电薄膜具一塑料基材层502,该塑料基材层的其中一侧承载导电金属网格层503,该金属网格即所谓Metal Mesh,其可具备图纹(pattern)构造的方向性导电功能。本实用新型可取代该现有导电玻璃基板结构5,请再参阅图6,显示本实用新型的具导电的高硬度软膜结构剖面图,显示本实用新型具导电的高硬度软膜结构6,乃在中间基材层201的两侧面覆盖一上预涂层202及一第一下预涂层203,该预涂层的作用在于提供中间基材层201及硬涂层的界面间亲和性官能基团,达到异质界面偶合效果;该厚度≤10μm,介于50nm~10μm之间。上预涂层202在接邻中间基材层201的另一侧面,上硬涂层210相邻于上预涂层202一侧,依序覆盖一第一上硬涂层204、第二上硬涂层205及第三上硬涂层 206。并且,第一下预涂层203在接邻中间基材层201的另一侧面,依序覆盖一第一下硬涂层207、第二下预涂层601及最内层的导电金属网格层602;该第二下预涂层601的作用在于提供硬涂层及导电金属网格层602的界面间亲和性官能基团,达到异质界面偶合效果,该第二下预涂层601的厚度≤10μm,介于50nm~10μm之间;该金属网格即所谓Metal Mesh,其可具备图纹(pattern)构造的方向性导电功能,该导电金属网格层602的厚度≤10μ m,介于1~10μm之间,并在该导电金属网格层602表面覆盖至少一保护层。该硬涂层为了达到表面铅笔硬度6~9H的要求,工艺上选用热反应型树脂;该热反应型树脂可包含硅酮 (silicone)、二氧化硅(silica)和硅酸盐(silicate)的单一或复合有机无机材料。该树脂涂布于相邻该预涂层上之后,再以堆栈方式将其他硬涂层依序涂布覆盖上,各硬涂层厚度≤10μm,介于1~10μm之间。中间基材层201选用聚对苯二甲酸乙二酯(poly(ethylene terephthalate), PET)、聚碳酸酯(polycarbonate,PC)、聚甲基丙烯酸甲酯poly(methyl methacrylate), PMMA)、聚氨酯(poly urethance,PU)、热塑性聚氨酯(thermoplastic poly urethance,TPU)、聚酰胺(polyamide,PA)、三醋酸纤维素(triacetyl cellulose,TAC)、PC/ABS、PC/PMMA、聚醚砜(poly(ether sulfones),PES)、聚萘二甲酸乙二酯(poly(ethylene 2,6-naphthalate),PEN)或聚酰亚胺(polyimide,PI)其中的一种或复合透光材料,该厚度介于7~188μm之间,可控制硬膜处理后的整体厚度介于20~250μm之间,该高硬度软膜结构6的整体厚度以≤120μm 为最佳。其高硬度软膜结构6的整体透光度>85%,曲率半径<10cm,且其软膜硬度可随涂层厚度调整为6-9H。
触控领域的另一实施例,请再参阅图7,图7显示本实用新型具抗污及导电的高硬度软膜结构剖面图,显示本实用新型具抗污及导电的高硬度软膜结构7,乃在中间基材层201 的两侧面覆盖一上预涂层202及一第一下预涂层203,该预涂层的作用在于提供中间基材层 201及硬涂层的界面间亲和性官能基团,达到异质界面偶合效果;各预涂层的厚度≤10μ m,介于50nm~10μm之间。上预涂层202在接邻中间基材层201的另一侧面,上硬涂层210相邻于上预涂层202一侧,依序覆盖一第一上硬涂层204、第二上硬涂层205以及最外层的上抗污层301;该抗污层选用低表面能氟素或非氟素热反应性高硬度涂料制成;该厚度介于1~10μm之间。并且,第一下预涂层203在接邻中间基材层201的另一侧面,依序覆盖一第一下硬涂层207、第二下预涂层601及最内层的导电金属网格层602;该第二下预涂层601的作用在于提供硬涂层及导电金属网格层602的界面间亲和性官能基团,达到异质界面偶合效果,该第二下预涂层601的厚度≤10μm,介于50nm~10μm之间;该金属网格即所谓MetalMesh,其可具备图纹(pattern)构造的方向性导电功能,该导电金属网格层602的厚度≤10μm,介于1~10μm之间,并在该导电金属网格层602表面覆盖至少一保护层。该硬涂层为了达到表面铅笔硬度6~9H的要求,工艺上选用热反应型树脂;该热反应型树脂选用包含硅酮(silicone)、二氧化硅(silica)和硅酸盐(silicate)的单一或复合有机无机材料。该树脂涂布于相邻该预涂层上之后,再以堆栈方式将其他硬涂层依序涂布覆盖上,各硬涂层的厚度≤10μm,介于1~10μm之间。中间基材层201选用聚对苯二甲酸乙二酯(poly(ethyleneterephthalate),PET)、聚碳酸酯(polycarbonate,PC)、聚甲基丙烯酸甲酯poly(methylmethacrylate),PMMA)、聚氨酯(poly urethance,PU)、热塑性聚氨酯(thermoplastic polyurethance,TPU)、聚酰胺(polyamide,PA)、三醋酸纤维素(triacetyl cellulose,TAC)、PC/ABS、PC/PMMA、聚醚砜(poly(ether sulfones),PES)、聚萘二甲酸乙二酯(poly(ethylene 2,6-naphthalate),PEN)或聚酰亚胺(polyimide,PI)其中的一种或复合透光材料,该中间基材层201的厚度介于7~188μm之间,可控制硬膜处理后的整体厚度达到20~250μm之间,该整体厚度以≤120μm为最佳。其高硬度软膜结构7整体透光度大>85%,曲率半径< 10cm,且其软膜硬度可随涂层厚度调整为6-9H。
本实用新型乃是一种具高硬度、抗污及导电的软膜结构,其包括至少一中间基材层 201、一上预涂层202、多个上硬涂层210、至少一上抗污层301、一第一下预涂层203、多个下硬涂层211、一第二下预涂层601及至少一导电金属网格层602,各涂层相对构成;本实用新型是将高透光性中间基材层的上下两侧面涂布预涂层及多个硬涂层的高硬度材料,以提升整体外力刮磨抵抗能力,再在最外上硬涂层210的一侧涂布上抗污层301低表面能材料,以及第二下预涂层601及导电金属网格层602导电材料,据以达成光学用高硬度、抗污及导电的软膜结构。本实用新型可直接取代导电玻璃基板,并且具备薄型化特征,有别于过去现有技艺具有差异化,其具备新颖性、创造性及实用性。故可有效改进现有技术的缺点,使用上有相当大的实用性。
综观上述,本实用新型的实施例所公开的具体构造,确实能提供食品、医药品的包装或太阳能电池、电子纸、有机电致发光(EL)显示器等的电子构件用途所使用的可挠性薄膜应用,以其整体结构而言,既未曾见诸于同类产品中,申请前也未见公开,诚已符合专利法的法定要素,特依法提出实用新型专利申请。
但以上所述,仅为本实用新型的一较佳实施例而已,当不能以此限定本实用新型的专利保护范围,即大凡依本实用新型权利要求书及实用新型说明书内容所作的等效变化与修饰,都应仍属本实用新型专利涵盖的范围内。

Claims (13)

1.一种高硬度软膜结构,其包括:
一中间基材层,设置于上预涂层及第一下预涂层之间;
一上预涂层,设置于中间基材层及上硬涂层之间;
至少一上硬涂层,相邻于上预涂层一侧;
一第一下预涂层,设置于中间基材层及下硬涂层之间;及
至少一下硬涂层,相邻于第一下预涂层一侧;各涂层之间相对构成;
其特征是:将高透光性的中间基材层的上下两侧面涂布预涂层及硬涂层的高硬度材料,以提升整体外力刮磨抵抗能力,据以达成光学用高硬度的软膜结构。
2.一种高硬度软膜结构,其包括:
一中间基材层,设置于上预涂层及第一下预涂层之间;
一上预涂层,设置于中间基材层及上硬涂层之间;
至少一上硬涂层,相邻于上预涂层一侧;
一第一下预涂层,设置于中间基材层及下硬涂层之间;
至少一下硬涂层,相邻于第一下预涂层一侧;
一第二下预涂层,设置于下硬涂层及导电金属网格层之间;及
至少一导电金属网格层,相邻于第二下预涂层一侧;各涂层之间相对构成;
其特征是:将高透光性中间基材层的上下两个侧面涂布预涂层及多个硬涂层的高硬度材料,以提升整体外力刮磨抵抗能力,以及涂布第二下预涂层及导电金属网格层导电材料,据以达成光学用高硬度及导电的软膜结构。
3.如权利要求2所述的高硬度软膜结构,其特征在于,导电金属网格层具备图纹构造的方向性导电功能,该导电金属网格层的厚度介于1~10μm之间,并且,该导电金属网格层的表面覆盖至少一保护层。
4.如权利要求1或2所述的高硬度软膜结构,其特征在于,在最外上硬涂层的表面一侧相邻设置至少一上抗污层,或至少一上抗污层取代上硬涂层覆盖于上预涂层一侧,据以达成光学用高硬度、抗污及导电的软膜结构。
5.如权利要求4所述的高硬度软膜结构,其特征在于,上抗污层选用低表面能氟素或非氟素热反应性的高硬度涂料制成;该上抗污层的厚度介于1~30μm之间。
6.如权利要求1或2所述的高硬度软膜结构,其特征在于,中间基材层选用聚对苯二甲酸乙二酯、聚碳酸酯、聚甲基丙烯酸甲酯、聚氨酯、热塑性聚氨酯、聚酰胺、三醋酸纤维素、PC/ABS、PC/PMMA、聚醚砜、聚萘二甲酸乙二酯或聚酰亚胺其中的一种或复合透光材料;该中间基材层的厚度介于7~188μm之间。
7.如权利要求1或2所述的高硬度软膜结构,其特征在于,各预涂层提供其相邻层的界面间亲和性官能基团,达到异质界面偶合效果;各预涂层的厚度介于50nm~10μm之间。
8.如权利要求1或2所述的高硬度软膜结构,其特征在于,各硬涂层的料材选用热反应型树脂,各硬涂层的厚度介于1~30μm之间。
9.如权利要求8所述的高硬度软膜结构,其特征在于,该热反应型树脂包含硅酮、二氧化硅和硅酸盐的单一或复合有机无机材料。
10.如权利要求1或2所述的高硬度软膜结构,其特征在于,该高硬度软膜结构的整体厚度介于20~250μm之间。
11.如权利要求10所述的高硬度软膜结构,其特征在于,该高硬度软膜结构的整体厚度≤120μm。
12.如权利要求1或2所述的高硬度软膜结构,其特征在于,该高硬度软膜结构的整体透光度>85%,曲率半径<10cm。
13.如权利要求1或2所述的高硬度软膜结构,其特征在于,该高硬度软膜结构的硬度随硬涂层厚度调整为3-9H。
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