CN207148049U - A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector - Google Patents
A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector Download PDFInfo
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- CN207148049U CN207148049U CN201720995983.6U CN201720995983U CN207148049U CN 207148049 U CN207148049 U CN 207148049U CN 201720995983 U CN201720995983 U CN 201720995983U CN 207148049 U CN207148049 U CN 207148049U
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Abstract
The utility model discloses a kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector, and for accessing ultrasonic equipment and sending ultrasonic wave so as to be detected a flaw to workpiece weld seam, including probe voussoir, the probe voussoir can be coupled in workpiece surface by couplant；Several piezoelectric chips, several piezoelectric chips are arranged on the probe voussoir, wherein, each piezoelectric chip differs in the angle of inclination on probe voussoir；When piezoelectric chip is stimulated, incident angle of the ultrasonic wave acoustic beam in workpiece caused by piezoelectric chip is 0 °~90 ° so as to realize comprehensive covering to workpiece weld seam.It can realize that probe placement can be in checked object or throat depth side upwardly close to comprehensive covering scanning in fixed position by above-mentioned scheme.
Description
Technical field
A kind of ultrasonic examination field is the utility model is related to, more specifically, it relates to which a kind of multi-wafer multi-angle surpasses
Sound transverse wave double-bevel detector.
Background technology
In various industrial nondestructive testing technical methods, ultrasonic wave is a kind of very effective detection method, and it, which has, wears
Saturating ability is strong, accurate positioning and the advantages that high sensitivity, and ultrasonic wave can be realized to metal, particularly weld seam internal flaw size
With the accurate measurement of depth location, especially to weld seam underbead crack, incomplete fusion, lack of penetration, slag inclusion and stomata the defects of it is quicker
Sense, thus this mode has obtained very extensive application in field of non destructive testing.
The Application elements of ultrasound detection mainly include professional and technical personnel, detection device and equipment, detection technique method and
Working space environment etc., detection device plays conclusive effect with equipment in these key elements, mainly including ultrasound examination
Instrument, super shear wave probe, reference block and mechanical scanning device etc., particularly ultrasonic probe（Ultrasonic transducer）, it is by electricity
The mechanical oscillation of high frequency can be converted into, transmitting ultrasonic wave, which enters, to be detected in workpiece.Therefore, the structure and performance of ultrasonic probe
It is the basis of ultrasound examination, vital effect is played to Ultrasonic Nondestructive technology.
Ultrasonic probe is divided into numerous species according to different purposes, has compressional wave normal probe, longitudinal wave oblique probe, shear wave tiltedly to visit
Head, surface wave probe, climbing probe etc..Wherein compressional wave normal probe and transverse wave double-bevel detector are most commonly seen in operation detection.
The mechanism of Ultrasonic wave angle probe is typically by sound-absorbing material, damping block, shell, plug, cable and for producing
The original paper composition such as piezoelectric chip of raw ultrasonic wave.The basic functional principle of ultrasonic probe is electric caused by ultrasonic instrument circuit
Impulse wave is applied on the piezoelectric chip with piezo-electric effect so that piezoelectric chip produces inverse piezoelectricity and imitated, and axle occurs for piezoelectric chip
Line direction and the radial vibration in vertical axis direction.Piezoelectric chip radial vibration produces clutter and absorbed by sound-absorbing material, and axially
Ultrasonic velocity caused by vibration is only useful acoustic beam and is only useful acoustic beam.Piezoelectric chip direction of vibration is ultrasonic wave matter
Point direction of vibration, particle vibration direction is identical with ultrasonic wave acoustic beam transmission direction, then it can be inferred that piezoelectric chip axial vibration is produced
Raw useful acoustic beam is compressional wave acoustic beam, and the ultrasonic velocity of tapered wedges is the compressional wave acoustic beam of lucite.When wafer receipt to one
Individual electric pulse completes an inverse piezoelectric effect, and the damping block being fixed on chip is prevented into aftershock, reduces ultrasonic wave repercussions.
The existing Chinese utility model file for referring to authorize public number to be CN201653984U, it discloses one kind certainly
Dynamic continuous angle changing ultrasonic probe, including micro motor and variable angle probe, micro motor are fixed on variable angle probe top；It is micro-
Type motor is provided with crank, is fixed with swing rod at the rotatable chip of variable angle probe, is connected between crank and swing rod by connecting rod.
When above-mentioned utility model is used for steel plate butt weld flaw detection, continuous under micro motor driving it can change Probe Ultrasonic Searching
Ripple incidence angle, make probe motionless in one suitable position of joint edge, just can complete to sweep section of weld joint corresponding to the position
Look into, the position being then adapted to along the weld seam, which moves linearly, pops one's head in, and can complete the scanning to all sections of whole piece weld seam.
The utility model realizes the continuous rotation of piezoelectric chip by the connecting rod connection between crank and swing rod, still,
The rotational angle moment in actual use due to chip is changing, and wherein includes more invalid angle, and its straight line of popping one's head in moves
Occur that portion is exactly in ineffective angle when dynamic, produce the phenomenon of missing inspection.
In addition, the ultrasonic shear waves angle probe detection angles of conventional single-chip K values fixation are single, detection range is smaller, it is
Effectively defect can be detected, testing staff needs hand hold transducer to be done according to the rules along toe in probe moving area
Zigzagging at the uniform velocity, such zigzag scan Z mode make it that probe wear extent is quite big, and in detection process, due to
Probe abrasion causes angle to change, it is also necessary to often verifies sensitivity, to prevent defect missing inspection, is carried out using conventional transducer
Inspection is visited, flaw detection is second-rate and flaw detection is less efficient.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of multi-wafer Multi-angle ultrasound horizontal stroke
Ripple angle probe, realize that probe placement can be swept in fixed position in checked object or throat depth side upwardly close to comprehensive covering
Look into.
To achieve the above object, the utility model provides following technical scheme：
A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector, for accessing ultrasonic equipment and sending ultrasonic wave so as to work
Part weld seam is detected a flaw, including probe voussoir, and the probe voussoir may couple to workpiece surface；Several piezoelectric chips, the number
Individual piezoelectric chip is arranged on the probe voussoir, wherein, each piezoelectric chip is in the angle of inclination not phase on probe voussoir
Together；When piezoelectric chip is stimulated, shear refraction angle of the ultrasonic wave acoustic beam caused by piezoelectric chip in workpiece is 0 °~90 °
So as to realize comprehensive covering to workpiece weld seam.
By using above-mentioned technical proposal, by the way that multiple piezoelectric chips are arranged in into probe voussoir according to respective mode
On, and the angle of inclination of each piezoelectric chip and ultrasonic wave incident angle differ, so, each piezoelectric chip
The generation ultrasonic wave acoustic beam that is stimulated simultaneously is detected a flaw to workpiece or weld seam, can be realized multi-wafer Multi-angle ultrasound shear wave
Angle probe is placed in a relatively fixed position and either can be achieved in the region of moving range very little to workpiece or weld seam thickness
Spend comprehensive covering in direction, it is not necessary to use traditional zigzag scan Z mode, operate relatively simple, flaw detection efficiency and flaw detection effect
Fruit is higher.
Preferably, the probe voussoir has one 1/4 arc surfaces, several piezoelectric chips along 1/4 arc surface successively
Spread configuration.
It is in 1/4 circular arc voussoir by probe voussoir design, piezoelectric chip can be according to 1/ by using above-mentioned technical proposal
4 circular arcs natural spread configuration successively, the convenient fixed installation to piezoelectric chip.
Preferably, the probe voussoir offers along 1/4 arc surface and some corresponds to each piezoelectric chip inclination angle
The step cutting of degree, the piezoelectric chip are fixed in the step cutting.
By using above-mentioned technical proposal, step cutting is opened up on 1/4 arc surface on probe voussoir, conveniently install,
Fixed piezoelectric chip.
Preferably, the piezoelectric chip is provided with seven, the ultrasonic wave acoustic beam of the piezoelectric chip transmitting is in workpiece
Shear refraction angle is respectively 0 °, 35 °, 45 °, 60 °, 70 °, the 80 ° and 90 ° angle of inclination for corresponding to piezoelectric chip in probe voussoir
Respectively 0 °, 29 °, 36.7 °, 47.1 °, 52.6 °, 56.4 ° and 90 °, when the piezoelectric chip angle of inclination is 0 °, piezoelectric chip
In horizontal positioned on probe voussoir, the piezoelectric chip transmitting compressional wave；When angle of inclination is 90 °, piezoelectric chip is in probe voussoir
Upper vertical placement, the piezoelectric chip emitting surface ripple.
By using above-mentioned technical proposal, piezoelectric chip is preferably provided with 7, and according to ultrasonic wave acoustic beam in workpiece or
Shear refraction angle in weld seam is come piezoelectric chip angle corresponding to designing so that the super shear wave acoustic beam in workpiece or weld seam can
Coating workpieces or throat depth direction, so as to realize effective to defect, comprehensive detection.
Preferably, the probe voussoir is encapsulated by shell, its complementary space is filled with backing sound-absorbing material in shell.
By using above-mentioned technical proposal, the piezoelectric chip back side, probe can be absorbed by the backing sound-absorbing material of setting
The ultrasonic hash of voussoir surrounding diverging, probe voussoir are encapsulated by shell, inner member can be played fixed, protection and
Electromagnetic shielding action.
Preferably, each piezoelectric chip accesses to the probe plug of shell one end by cable and opened by control
Close the working condition of control piezoelectric chip.
Preferably, the probe voussoir is made of lucite.
By using above-mentioned technical proposal, probe voussoir, which uses, to be had and glass is made, and can be realized to ultrasonic wave acoustic beam
Waveform is changed, and ultrasonic wave acoustic beam can be entered into workpiece with given refraction angle and workpiece or throat depth direction are carried out
Comprehensive sound wave covering with reach it is effective, close to comprehensive defect detection.
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of defect detection on ultrasonic basis, it is real
Existing probe placement can be in checked object or throat depth side upwardly close to comprehensive covering scanning in fixed position.
In summary, the utility model has the advantages that：
1st, by the way that multi-wafer Multi-angle ultrasound transverse wave double-bevel detector need not be carried out into zigzag scan Z, it is only necessary to carry out straight line
Scanning mode can realize comprehensive covering to workpiece or workpiece weld seam in a thickness direction, reduce the abrasion of probe,
Flaw detection effect is preferable；
2nd, probe voussoir uses 1/4 circular arc voussoir, convenient that multiple piezoelectric chips are laid out, and can make each pressure
Ultrasonic wave acoustic beam caused by electric chip can approach and workpiece and workpiece throat depth direction is completely covered；
3rd, the structure types such as Steel Structure Weld can be answered by using multi-wafer Multi-angle ultrasound transverse wave double-bevel detector
Workpiece miscellaneous, that detection zone is limited has preferable effect, has come because this workpiece weld seam does not have enough detection zones
The scanning carried out into conventional transducer to it；
4th, TOFD can be combined using the multi-wafer Multi-angle ultrasound transverse wave double-bevel detector or other ultrasonic techniques realizes butt welding
Stitch the scanning of high sensitivity, high coverage rate.
Brief description of the drawings
Fig. 1 is a kind of overall structure diagram of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector；
Fig. 2 is a kind of A-A of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector to cross section view；
Fig. 3 A are a kind of left views of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector；
Fig. 3 B are a kind of top views of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector；
Fig. 4 is a kind of schematic diagram of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector scanning workpiece weld seam；
Fig. 5 is a kind of schematic diagram of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector straight line scanning whole piece workpiece weld seam；
Fig. 6 is a kind of defect detection on ultrasonic basis schematic flow sheet using multi-wafer Multi-angle ultrasound transverse wave double-bevel detector.
Reference：1st, probe voussoir；11st, 1/4 arc surface；12nd, step cutting；2nd, piezoelectric chip；3rd, shell；4th, backing
Sound-absorbing material；5th, plug；6th, cable；7th, damping block；71st, dampening shell；8th, multi-wafer Multi-angle ultrasound transverse wave double-bevel detector；
9th, workpiece；10th, workpiece weld seam.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.Wherein same or similar label represents phase
With either similar element or the element with same or like function.The embodiment described below in conjunction with the accompanying drawings is exemplary
, it is only used for explaining the utility model, and it is not intended that to limitation of the present utility model.
In description of the present utility model, it is to be understood that term " " center ", " on ", " under ", it is "left", "right", " perpendicular
Directly ", the orientation of the instruction such as " level ", " top ", " bottom ", " interior ", " outer " or position relationship be based on orientation shown in the drawings or
Person's position relationship, it is for only for ease of and describes simplified description of the present utility model, rather than the device of instruction or hint meaning,
Component or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this practicality
New limitation.In addition, be only used for describing purpose for term " first ", " second ", and it is not intended that instruction or hint
The quantity of relative importance or the implicit technical characteristic for indicating instruction.Thus, define " first ", the feature of " second " can be with
Express or what is implied includes one or more this feature.In description of the present utility model, unless otherwise indicated, " multiple "
Implication refer to two or more.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model
Dress ", " connected ", " connection " should be interpreted broadly, such as can be fixedly connected or be detachably connected or integral
Connection, can be mechanically connect, can also be joined directly together, can also be indirectly connected by intermediary, can be two
The connection of element internal.For those of ordinary skills, above-mentioned term can be understood in this reality as the case may be
With the concrete meaning in new.
A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector, referring to figs. 1 to Fig. 6, including probe voussoir 1, pop one's head on voussoir 1
It is arranged with the incidence angle of several piezoelectric chips 2, the angle of inclination of each piezoelectric chip 2 and the caused ultrasonic wave acoustic beam that is stimulated
Degree differs, and the refracted shear wave acoustic beam in workpiece 9 can be on workpiece 9 or the thickness direction of workpiece weld seam 10 close to covering comprehensively
Lid.
Specifically, with reference to figure 1 and Fig. 2, probe voussoir 1 is one 1/4 circular arc voussoirs, and it uses lucite to be made, and is visited
Head voussoir 1 can arrange 7 along its 1/4 arc surface 11（Greater number can be arranged according to being actually needed）Angle of inclination is different
Piezoelectric chip 2, the numbering of piezoelectric chip 2 is 1~7.
Shear refraction angle of the ultrasonic wave acoustic beam in workpiece 9 is ultrasonic wave acoustic beam caused by the piezoelectric chip 2 of numbering 1~7
Incident angle in workpiece 9 is respectively 0 °（Launch compressional wave）, 35 °, 45 °, 60 °, 70 °, 80 ° and 90 °（Emitting surface ripple）, phase
Angle of inclination of the corresponding piezoelectric chip 2 on 1/4 arc surface 11 of probe voussoir 1 is respectively 0 °（It is horizontal positioned）、29°、
36.7 °, 47.1 °, 52.6 °, 56.4 ° and 90 °（It is vertical to place）.
Piezoelectric chip 2 is the element for the most critical that probe produces ultrasonic wave as " heart " entirely popped one's head in, in this example
Piezoelectric chip 2 material with piezo-electric effect such as quartz, piezoelectric ceramics can be used to be made.
In order to stable placement piezoelectric chip 2, processed respectively on 1/4 arc surface 11 of probe voussoir 1 with milling cutter
The good corresponding angle of inclination of piezoelectric chip 2（0°、29°、36.7°、47.1°、52.6°、56.4°90°）Step cutting 12, it is each
Piezoelectric chip 2 is fixed in each step cutting 12 by chimeric mode, bonding way.
In the above-described example, with reference to figure 3A, the length of probe voussoir 1 is 40mm, width 30mm, with reference to figure 3B probe wedges
The width of 7 piezoelectric chips 2 on block 1 is 3mm, length 30mm.
Referring back to Fig. 2, overall voussoir 1 of popping one's head in is encapsulated by shell 3, and the support that shell 3 serves to inner member is consolidated
The effect such as fixed, protection and electromagnetic shielding, its its internal complementary space are filled using backing sound-absorbing material 4, backing sound absorption
The effect of material 4 is to absorb the back side of piezoelectric chip 2, the ultrasonic hash of probe voussoir 1 surrounding diverging；The end installation of shell 3
There is plug 5, the back of each piezoelectric chip 2, which is drawn, is connected to a cable 6, for exciting piezoelectric chip 2 to work, receiving letter
Number, each bar cable 6 is converged at plug 5, and the interface installation controlling switch of probe voussoir 1 is used to control each piezo crystals
The working condition of piece 2.
Here, the working cell that each piezoelectric chip 2 can be independent as one carries out the internal loopback of signal, separately
Outside, each piezoelectric chip 2 can be all as transmitting chip, while launch ultrasonic wave, by another compressional wave normal probe or horizontal stroke
Ripple angle probe receives transmission signal, by external ultrasound measuring instrument these transmission signals is analyzed.
In order to make piezoelectric chip 2 stop as early as possible after starting of oscillation, the aftershock of piezoelectric chip 2 is reduced, reduces ultrasonic wave
Pulse width, improve ultrasound detection resolving power, each piezoelectric chip 2 back pressing have damping block 7, the surrounding of damping block 7 is led to
Overdamp outer cover 71 is fixed, and damping block 7 can also absorb piezoelectric chip 2 and support or oppose the ultrasonic wave of surface launching, reduce initial pulse clutter.
At probe interface using controlling switch or Electronic Control can realize each piezoelectric chip 2 work independently or
The purpose that person works simultaneously, it is the mode of operation of internal loopback when each piezoelectric chip 2 works independently；Each piezoelectric chip 2 is same
When working, multiple piezoelectric chips 2 can transmission signal simultaneously, the mode of operation of signal is received by another probe.
With reference to figure 4, when carrying out actual ultrasonic examination, it is divided into following steps：
Step 1（S1）：Multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8 is linked on the connection-peg of ultrasound measuring instrument；
Step 2（S2）：Multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8 is placed on to the inspection of workpiece 9 or workpiece weld seam 10
Survey in region surface；
Step 3（S3）：Open ultrasound measuring instrument and the piezoelectric chip 2 into multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8
Excitation signal is provided, piezoelectric chip 2 produces inverse piezoelectricity effect and produces ultrasonic wave, a plurality of ultrasonic acoustic caused by multiple piezoelectric chips 2
Beam is that waveform conversion occurs for the contact interface of workpiece 9 by voussoir 1 of being popped one's head in made of lucite, finally enters workpiece 9
In workpiece 9 or the thickness direction of workpiece weld seam 10 are carried out close to 100% covering flaw detection.
Wherein, in detection process, with reference to figure 4, if carrying out single-point scanning to workpiece 9 or workpiece weld seam 10, only need
Multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8 is positioned over 9 region surface to be measured of workpiece or the top of workpiece weld seam 10 is stood,
Can be to complete the scanning to 10 corresponding section of workpiece weld seam, with reference to figure 5, if necessary to workpiece 9 or workpiece weld seam 10
Whole piece carries out scanning, and multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8 can be positioned over to 9 region surface to be measured of workpiece or workpiece
Moved linearly above weld seam 10 and along 9 region surface to be measured of workpiece or workpiece weld seam 10, can be with completion to whole
Workpiece 9 or whole piece workpiece weld seam 10 carry out scanning.
Step 4（S4）：The transmitting echo inside workpiece 9 or workpiece weld seam 10 received according to ultrasound measuring instrument
Analyzed so as to judge whether there is the serious of defect, the position of defect and defect inside workpiece 9 or workpiece weld seam 10
Degree.
Multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8 in this example need not carry out traditional zigzag scan Z, can
Reduce the abrasion of probe voussoir 1.
Multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8 in the utility model can combine TOFD or other technologies can be with
Realize the scanning to workpiece weld seam 10 high sensitivity, high coverage rate.The abandoning tradition of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8
Zigzag scan Z mode, while workpiece 9 or workpiece weld seam 10 are entered also without different angles is converted by piezoelectric chip 2
Row scanning, it is only necessary to which multi-wafer Multi-angle ultrasound transverse wave double-bevel detector 8 is placed on to a position of workpiece 9 or workpiece weld seam 10
Either carrying out rectilinear movement scanning can be with the close comprehensive covering on workpiece 9 or the thickness direction of workpiece weld seam 10；This is visited
The design of head, the workpiece 9 especially complex to structure types such as such as Steel Structure Welds, detection zone is limited have extraordinary
Effect.
This specific embodiment is only that it is not to limitation of the present utility model, ability to explanation of the present utility model
Field technique personnel can make the modification of no creative contribution to the present embodiment as needed after this specification is read, but
As long as all protected in right of the present utility model by Patent Law.
Claims (7)
- A kind of 1. multi-wafer Multi-angle ultrasound transverse wave double-bevel detector, for accessing ultrasonic equipment and sending ultrasonic wave so as to workpiece （9）With workpiece weld seam（10）Detected a flaw, it is characterized in that, includingProbe voussoir（1）, the probe voussoir（1）It may couple to workpiece（9）Surface；Several piezoelectric chips（2）, several piezoelectric chips（2）It is arranged at the probe voussoir（1）On, wherein, each piezoelectricity Chip（2）In probe voussoir（1）On angle of inclination differ；Work as piezoelectric chip（2）When being stimulated, piezoelectric chip（2）Caused ultrasonic wave acoustic beam is in workpiece（9）In shear refraction angle Spend for 0 °~90 ° so as to realizing to workpiece weld seam（10）Comprehensive covering.
- 2. multi-wafer Multi-angle ultrasound transverse wave double-bevel detector according to claim 1, it is characterized in that,The probe voussoir（1）With one 1/4 arc surfaces（11）, several piezoelectric chips（2）Along 1/4 arc surface（11）According to Secondary spread configuration.
- 3. multi-wafer Multi-angle ultrasound transverse wave double-bevel detector according to claim 2, it is characterized in that,The probe voussoir（1）Along 1/4 arc surface（11）Offer and some correspond to each piezoelectric chip（2）Angle of inclination Step cutting（12）, the piezoelectric chip（2）It is fixed on the step cutting（12）On.
- 4. the multi-wafer Multi-angle ultrasound transverse wave double-bevel detector according to claims 1 to 3 any one, it is characterized in that,The piezoelectric chip（2）Seven are provided with, the piezoelectric chip（2）The ultrasonic wave acoustic beam of transmitting is in workpiece（9）In horizontal stroke Setback firing angle is respectively 0 °, 35 °, 45 °, 60 °, 70 °, 80 ° and 90 ° and corresponds to probe voussoir（1）Middle piezoelectric chip（2）Inclination Angle is respectively 0 °, 29 °, 36.7 °, 47.1 °, 52.6 °, 56.4 ° and 90 °, the piezoelectric chip（2）When angle of inclination is 0 °, Piezoelectric chip（2）In probe voussoir（1）Upper horizontal positioned, the piezoelectric chip（2）Launch compressional wave；When angle of inclination is 90 °, pressure Electric chip（2）In probe voussoir（1）Upper vertical placement, the piezoelectric chip（2）Emitting surface ripple.
- 5. multi-wafer Multi-angle ultrasound transverse wave double-bevel detector according to claim 1, it is characterized in that,The probe voussoir（1）Pass through shell（3）Encapsulation, shell（3）Its interior complementary space is filled with backing sound-absorbing material（4）.
- 6. multi-wafer Multi-angle ultrasound transverse wave double-bevel detector according to claim 5, it is characterized in that,Each piezoelectric chip（2）Pass through cable（6）Access to shell（3）The probe plug of one end（5）And pass through control Switch control piezoelectric chip（2）Working condition.
- 7. the multi-wafer Multi-angle ultrasound transverse wave double-bevel detector according to claim 1 or 2 or 3 or 5 or 6, it is characterized in that,The probe voussoir（1）It is made of lucite.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201720995983.6U CN207148049U (en) | 2017-08-09 | 2017-08-09 | A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector |
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| CN201720995983.6U CN207148049U (en) | 2017-08-09 | 2017-08-09 | A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109387571A (en) * | 2017-08-09 | 2019-02-26 | 北京环安工程检测有限责任公司 | A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector and its defect detection on ultrasonic basis |
| CN109470771A (en) * | 2018-12-21 | 2019-03-15 | 北京环安工程检测有限责任公司 | A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector detection data acquisition analysis system |
-
2017
- 2017-08-09 CN CN201720995983.6U patent/CN207148049U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109387571A (en) * | 2017-08-09 | 2019-02-26 | 北京环安工程检测有限责任公司 | A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector and its defect detection on ultrasonic basis |
| CN109470771A (en) * | 2018-12-21 | 2019-03-15 | 北京环安工程检测有限责任公司 | A kind of multi-wafer Multi-angle ultrasound transverse wave double-bevel detector detection data acquisition analysis system |
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