CN207068800U - A kind of delivery air air lock - Google Patents
A kind of delivery air air lock Download PDFInfo
- Publication number
- CN207068800U CN207068800U CN201720494183.6U CN201720494183U CN207068800U CN 207068800 U CN207068800 U CN 207068800U CN 201720494183 U CN201720494183 U CN 201720494183U CN 207068800 U CN207068800 U CN 207068800U
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- CN
- China
- Prior art keywords
- air
- delivery
- air lock
- lock
- wafer
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 29
- 238000001312 dry etching Methods 0.000 claims abstract description 10
- 239000007789 gas Substances 0.000 claims description 49
- 239000011800 void material Substances 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 2
- 230000004044 response Effects 0.000 claims description 2
- 230000003628 erosive effect Effects 0.000 claims 1
- 229920000642 polymer Polymers 0.000 abstract description 16
- 230000007547 defect Effects 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008676 import Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
The utility model provides a kind of delivery air air lock, applied in the board that dry etching is carried out to wafer, board includes reaction cavity, conveyer, input air air lock, the delivery air air lock of dry etching, wherein, delivery air air lock includes：Mounting structures, it is arranged in delivery air air lock, to the placement wafer of level；Intake valve, the top of delivery air air lock is arranged at, to be passed through by intake valve in extraneous gas to delivery air air lock；Heater, it is fixedly installed on the inwall of delivery air air lock, and is connected positioned at the top of mounting structures, and in intake valve；Air outlet valve, is arranged at the bottom of delivery air air lock, and air outlet valve is connected with a gas pump, and the gas pump is extracting the air in the delivery air air lock.The beneficial effect of its technical scheme is, overcoming existing wafer, polymer poly combines in crystal column surface and causes wafer defect after completion of the reaction, influences wafer yield.
Description
Technical field
It the utility model is related to the output in field of semiconductor devices, more particularly to a kind of board applied to dry etching
Air barrier room.
Background technology
Wafer is sent to air barrier by existing board when performing dry etch process typically by conveyer
Room, and then enter in the reaction cavity of board and carry out dry etch process, pass through another air after the completion of dry etch process
Air lock sends out wafer, after wafer carries out the technique of dry etching in the reaction cavity of board, often in the table of wafer
Some polymer are remained on face, if the polymer of generation can not be removed in time, can be assembled on current wafer, with wafer table
Face film and steam reaction, cause wafer defect, influence the yield of wafer.
The content of the invention
For in the prior art in wafer after dry etching is performed existing above mentioned problem, now provide one kind can to reaction
The surface polymer of the wafer of completion is removed, and improves the delivery air air lock of wafer yield.
Concrete technical scheme is as follows：
A kind of delivery air air lock, applied in the board that dry etching is carried out to wafer, the board includes dry method
The reaction cavity of etching, conveyer, input air air lock, one end of input air air lock described in delivery air air lock
Be connected with the reaction cavity, the other end is connected with the conveyer, one end of the delivery air air lock with it is described anti-
Cavity is answered to connect, the other end is connected with the conveyer, wherein, the output channel air barrier room includes：
Mounting structures, it is arranged in the delivery air air lock, to the placement wafer of level；Intake valve, if
The top of the delivery air air lock is placed in, is obstructed to be passed through extraneous gas to the delivery air by the intake valve
It is indoor；
Heater, it is fixedly installed on the inwall of the delivery air air lock, and positioned at the upper of the mounting structures
Side, and connected in the intake valve；
Air outlet valve, it is arranged at the bottom of the delivery air air lock；
The air outlet valve is connected with a gas pump, and the gas pump is unnecessary in the delivery air air lock to extract
Gas.
Preferably, the heater is provided with multiple gas outlets, the multiple gas outlet putting toward the wafer
Seated position.
Preferably, the interval between the gas outlet is identical.
Preferably, the mounting structures include at least one pair of supporting part, and the pair of supporting part is relatively arranged on institute respectively
On the inwall for stating delivery air air lock, to the edge of wafer described in the support of level.
Preferably, in addition to a void apparatus, the void apparatus are connected with the reaction cavity, described defeated
Enter air barrier room one end to be connected with the void apparatus, the other end is connected with the conveyer；
Described delivery air air lock one end is connected with the void apparatus, and the other end connects with the conveyer
Connect.
Preferably, the internal diameter of the input air air lock and the delivery air air lock is all higher than the wafer
Diameter.
Preferably, it is provided with gas control in the input air air lock and the delivery air air lock
Valve.
Preferably, the reaction cavity is additionally provided with an extraction valve, and the extraction valve is connecting an air-extractor.
Preferably, the board also includes a wafer holder, and the wafer holder is connected with the conveyer, institute
State the wafer that conveyer is completed to placing response.
Preferably, the extraneous gas that the intake valve is passed through is nitrogen.
Above-mentioned technical proposal has the following advantages that or beneficial effect：It is outer by the intake valve input in delivery air air lock
Portion's gas, and export to the surface of wafer, air outlet valve after being heated by heater to extraneous gas and then obstruct delivery air
Excessive gas in room is extracted out, to form gas circulation and then remove the polymer of crystal column surface, overcomes existing wafer
Polymer poly combines in crystal column surface and causes wafer defect after completion of the reaction, influences wafer yield.
Brief description of the drawings
Fig. 1 is a kind of overall structure diagram of the embodiment of delivery air air lock of the utility model；Fig. 2 is this reality
With in a kind of new embodiment of delivery air air lock, the front section view on delivery air air lock；
Fig. 3 is in a kind of embodiment of delivery air air lock of the utility model, is not included on delivery air air lock
The structural representation of mounting structures；
Fig. 4 is a kind of overall structure diagram of another embodiment of delivery air air lock of the utility model
Reference represents：
1st, board；11st, reaction cavity；12nd, conveyer；13rd, input air air lock；14th, delivery air air lock；
15th, wafer holder；16th, extraction valve；141st, holding element；142nd, heater；143rd, intake valve；144th, air outlet valve；1421、
Gas outlet；A1, wafer.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the premise of creative work
Lower obtained every other embodiment, belong to the scope of the utility model protection.
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the utility model can
To be mutually combined.
The utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings, but not as of the present utility model
Limit.
Such as Fig. 1 to Fig. 3, a kind of embodiment of delivery air air lock, applied in the board 1 of dry etching, board 1
Reaction cavity 11, conveyer 12, input air air lock 13, delivery air air lock 14 including dry etching, input are empty
One end of vapour lock compartment 13 is connected with reaction cavity 11, and the other end is connected with conveyer 12, and the one of delivery air air lock 14
End is connected with reaction cavity 11, and the other end is connected with conveyer 12, wherein, delivery air air lock 14 includes：
Mounting structures, it is arranged in delivery air air lock 14, to the placement wafer a1 of level；Intake valve 143, set
In the top of delivery air air lock 14, to be passed through by intake valve 143 in extraneous gas to delivery air air lock 14；
Heater 142, it is fixedly installed on the inwall of delivery air air lock 14, and is located at the top of mounting structures,
And connected in intake valve 143；
Air outlet valve 144, it is arranged at the bottom of delivery air air lock 14；
Air outlet valve 144 is connected with a gas pump (not shown in figure), and gas pump is extracting in delivery air air lock
Unnecessary gas in 14.
In above-mentioned technical proposal, when the wafer a1 in reaction cavity 11 is after dry etching use, output is empty to exporting
On mounting structures in vapour lock compartment 14, now intake valve 143 is by being passed through extraneous gas into heater 142, heating dress
Put and exported after 142 pairs of extraneous gas heat to wafer a1 surface, wafer a1 tables are removed to pass through the gas after heating
The polymer in face, the air outlet valve 144 for being arranged at the bottom of delivery air air lock 14 discharges gas unnecessary in pipeline, and then shape
Into the circulation of internal gas, by air-flow output can be driven to be discharged to air outlet valve 144 in the polymer on wafer a1 surfaces, overcome
Polymer poly combines in wafer a1 surfaces and causes wafer a1 defects existing wafer a1 after completion of the reaction, influences wafer a1 yields.
It should be noted that the heating in heater 142 can be by the heating element heater that is arranged inside heater 142
Realize, heating element heater may be selected resistance wire and be heated by electric current.
A1 is expressed as the wafer inlet and outlet of delivery air air lock 14 in Fig. 3, is set in each delivery air air lock 14
There are two.
In a kind of preferably embodiment, as shown in Fig. 2 heater 142 is provided with multiple gas outlets 1421, it is multiple
Placement location of the gas outlet 1421 toward wafer a1.
In a kind of preferably embodiment, the interval between gas outlet 1421 is identical.
In above-mentioned technical proposal, the outside gas by heating is exported into the gas outlet 1421 being uniformly arranged, uniformly set
The gas outlet 1421 put uniformly exports extraneous air to wafer a1 surface, makes the gas by heating with wafer a1's
Surface sufficiently contacts, to remove the polymer on wafer a1 surfaces.
In a kind of preferably embodiment, in addition to a void apparatus 17, void apparatus 17 and reaction
Cavity 11 is connected, and the one end of input air air lock 13 is connected with void apparatus 17, and the other end is connected with conveyer 12；
Described one end of delivery air air lock 14 is connected with void apparatus 17, and the other end is connected with conveyer 12.
It should be noted that void apparatus 17 can connect multiple reaction cavities 11, void apparatus 17 to
The wafer completed will be reacted.
In a kind of preferably embodiment, mounting structures include at least one pair of supporting part 141, and a pair of supporting parts 141 are divided
It is not relatively arranged on the inwall of delivery air air lock 14, to the support wafer a1 of level edge.
In above-mentioned technical proposal, multipair holding element 141 also can be set in the inwall of delivery air air lock 14, and then can match somebody with somebody
Close and place multiple wafer a1, the polymer on multiple wafer a1 surfaces can be removed simultaneously.
In above-mentioned technical proposal, also by gas pumping output can be taken empty by connecting a gas pump at air outlet valve 144
Gas in vapour lock compartment 14, to accelerate the flow velocity of internal gas, and then the polymer on wafer a1 surfaces is removed.
In a kind of preferably embodiment, the internal diameter of input air air lock 13 and delivery air air lock 14 is equal
More than wafer a1 diameter.
In above-mentioned technical proposal, in order to ensure the flowing of the gas of delivery air air lock 14 and by wafer a1 surfaces
Polymer is removed, and the internal diameter of delivery air air lock 14 is set greater than to wafer a1 diameter, wafer a1 is positioned over support
When on part 141, space is left between wafer a1 outside and the inside of transfer canal, the polymer on wafer a1 surfaces is gone
Except when, as the gas of formation takes away polymer from space and extracts out in delivery air air lock 14.
In a kind of preferably embodiment, it is respectively provided with input air air lock 13 and delivery air air lock 14
There is a gas control valve.
In a kind of preferably embodiment, reaction chamber is additionally provided with an extraction valve 16, and extraction valve 16 is taken out to connect one
Gas equipment (is not shown) in figure.
It is preferred by the He of delivery air air lock 14 when reaction cavity 11 needs to be formed vacuum environment in above-mentioned technical proposal
Gas control valve in delivery air air lock 14 is closed, then makes reaction by the gas in air-extractor abstraction reaction cavity 11
Cavity 11 forms vacuum environment.
In a kind of preferably embodiment, board 1 also includes a wafer a1 holders 15, wafer a1 holders 15 and
Conveyer 12 connects, and conveyer 12 is after reaction and removing the wafer a1 after polymer and be put into wafer a1 and put
Put in box 15.
In a kind of preferably embodiment, the extraneous gas that intake valve 143 is passed through is nitrogen.
In above-mentioned technical proposal, b1 is expressed as the wafer inlet and outlet of delivery air air lock 14, each delivery air in Fig. 4
Two are provided with air lock 14, import and export b1 by a wherein wafer is connected with reaction cavity 11, and another wafer imports and exports b1
It is connected with conveyer 12；
Or b1 is imported and exported by a wherein wafer and is connected with void apparatus 17, another wafer inlet and outlet b1 and transmission
Device 12 connects.
The foregoing is only the utility model preferred embodiment, not thereby limit embodiment of the present utility model and
Protection domain, to those skilled in the art, it should can appreciate that all with the utility model specification and diagram
Hold the scheme obtained by made equivalent substitution and obvious change, should be included in protection model of the present utility model
In enclosing.
Claims (10)
1. a kind of delivery air air lock, applied in the board that dry etching is carried out to wafer, the board is carved including dry method
Reaction cavity, conveyer, input air air lock, the delivery air air lock of erosion, one end of the input air air lock
Be connected with the reaction cavity, the other end is connected with the conveyer, one end of the delivery air air lock with it is described anti-
Cavity is answered to connect, the other end is connected with the conveyer, it is characterised in that the delivery air air lock includes：
Mounting structures, it is arranged in the delivery air air lock, to the placement wafer of level；
Intake valve, the top of the delivery air air lock is arranged at, to be passed through extraneous gas to institute by the intake valve
State in delivery air air lock；
Heater, it is fixedly installed on the inwall of the delivery air air lock, and positioned at the top of the mounting structures, and
Connected in the intake valve；
Air outlet valve, it is arranged at the bottom of the delivery air air lock；
The air outlet valve is connected with a gas pump, and the gas pump is extracting gas unnecessary in the delivery air air lock
Body.
2. delivery air air lock according to claim 1, it is characterised in that the heater is provided with multiple outlets
Mouthful, placement location of multiple gas outlets toward the wafer.
3. delivery air air lock according to claim 2, it is characterised in that the interval between the gas outlet is identical.
4. delivery air air lock according to claim 1, it is characterised in that the mounting structures are held including at least one pair of
Support portion, the pair of supporting part are relatively arranged on the inwall of the delivery air air lock respectively, to the support institute of level
State the edge of wafer.
5. delivery air air lock according to claim 1, it is characterised in that
Also include a void apparatus, the void apparatus is connected with the reaction cavity, the input air barrier
Room one end is connected with the void apparatus, and the other end is connected with the conveyer；
Described delivery air air lock one end is connected with the void apparatus, and the other end is connected with the conveyer.
6. delivery air air lock according to claim 1, it is characterised in that the input air air lock and described
The internal diameter of delivery air air lock is all higher than the brilliant diameter of a circle.
7. delivery air air lock according to claim 1, it is characterised in that the input air air lock and described
A gas control valve is provided with delivery air air lock.
8. delivery air air lock according to claim 1, it is characterised in that the reaction cavity is additionally provided with a pumping
Valve, the extraction valve is connecting an air-extractor.
9. delivery air air lock according to claim 1, it is characterised in that the board also includes a wafer and placed
Box, the wafer holder are connected with the conveyer, the wafer that the conveyer is completed to placing response.
10. delivery air air lock according to claim 1, it is characterised in that the extraneous gas that the intake valve is passed through
For nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720494183.6U CN207068800U (en) | 2017-05-05 | 2017-05-05 | A kind of delivery air air lock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720494183.6U CN207068800U (en) | 2017-05-05 | 2017-05-05 | A kind of delivery air air lock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207068800U true CN207068800U (en) | 2018-03-02 |
Family
ID=61504488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720494183.6U Active CN207068800U (en) | 2017-05-05 | 2017-05-05 | A kind of delivery air air lock |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207068800U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112086384A (en) * | 2020-09-28 | 2020-12-15 | 广州粤芯半导体技术有限公司 | Dry etching machine table and manufacturing method of semiconductor device |
-
2017
- 2017-05-05 CN CN201720494183.6U patent/CN207068800U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112086384A (en) * | 2020-09-28 | 2020-12-15 | 广州粤芯半导体技术有限公司 | Dry etching machine table and manufacturing method of semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Xinxin Integrated Circuit Co.,Ltd. Country or region after: China Address before: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Xinxin Semiconductor Manufacturing Co.,Ltd. Country or region before: China |