CN207038513U - A kind of strong cooling triode of modified - Google Patents

A kind of strong cooling triode of modified Download PDF

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Publication number
CN207038513U
CN207038513U CN201720528392.8U CN201720528392U CN207038513U CN 207038513 U CN207038513 U CN 207038513U CN 201720528392 U CN201720528392 U CN 201720528392U CN 207038513 U CN207038513 U CN 207038513U
Authority
CN
China
Prior art keywords
bottom plate
insulating heat
conductive piece
semiconductor chip
strong cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720528392.8U
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Chinese (zh)
Inventor
徐亚维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Lianzhou Intellectual Property Operation and Management Co Ltd
Original Assignee
Dongguan Lianzhou Intellectual Property Operation and Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Lianzhou Intellectual Property Operation and Management Co Ltd filed Critical Dongguan Lianzhou Intellectual Property Operation and Management Co Ltd
Priority to CN201720528392.8U priority Critical patent/CN207038513U/en
Application granted granted Critical
Publication of CN207038513U publication Critical patent/CN207038513U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a kind of strong cooling triode of modified, including semiconductor chip, insulating heat-conductive piece and bottom plate, the semiconductor chip is provided with three pins, three pins are connected with the collecting zone, base, launch site of semiconductor chip respectively, the insulating heat-conductive piece is fixed on the bottom surface of semiconductor chip, the bottom surface of the insulating heat-conductive piece forms multiple strip bulges, the bottom surface of insulating heat-conductive piece is fixed on bottom plate, the top surface of bottom plate has multiple connecting grooves, strip bulge sleeve and holding is in connecting groove.Multiple strip bulge sleeves that the utility model is formed by the bottom surface of insulating heat-conductive piece and holding is in connecting groove, so as to increase the contact area with bottom plate, radiated by bottom plate, and the bottom surface for the groove that the bottom surface of the bottom plate of the underface of insulating heat-conductive piece has forms multiple radiating salient points, so as to increase area of dissipation simultaneously, radiating effect can be greatly improved by air flow, improve its service life.

Description

A kind of strong cooling triode of modified
Technical field:
Technical field of elevator equipment is the utility model is related to, more specifically to a kind of strong cooling triode of modified.
Background technology:
Triode is a kind of semiconductor devices of current control electric current, and it is that small-signal is zoomed into spoke value is larger that it, which is acted on, Electric signal.Triode is the PN junction that two close proximities are made on a block semiconductor substrate, and two PN junctions partly lead monoblock Body is divided into three parts, and center section is base, and two side portions are launch site and collecting zone, and arrangement mode has two kinds of PNP and NPN.
The Chinese utility model patent of application number 201420590308.1 discloses a kind of triode with radiating surface, its Mainly by setting protuberance to be radiated on bottom plate, but its position is in the side of insulating heat-conductive piece, is not underface, Its radiating effect relative reduction.
Utility model content:
The purpose of this utility model is overcome the deficiencies in the prior art, there is provided a kind of strong cooling triode of modified, it is logical Cross multiple strip bulge sleeves that the bottom surface of insulating heat-conductive piece forms and holding is in connecting groove, so as to increase and bottom plate Contact area, radiated by bottom plate, and the bottom surface for the groove that the bottom surface of the bottom plate of the underface of insulating heat-conductive piece has into Type has multiple radiating salient points, so as to increase area of dissipation simultaneously, can greatly improve radiating effect by air flow, improves Its service life.
The utility model solve the technical problem scheme be:
A kind of strong cooling triode of modified, including semiconductor chip, insulating heat-conductive piece and bottom plate, the semiconductor chip Three pins are provided with, three pins are connected with the collecting zone, base, launch site of semiconductor chip respectively, the insulation Thermally conductive sheet is fixed on the bottom surface of semiconductor chip, and the bottom surface of the insulating heat-conductive piece forms multiple strip bulges, and insulation is led The bottom surface of backing is fixed on bottom plate, and the top surface of bottom plate has multiple connecting grooves, strip bulge sleeve and holding recessed in connection In groove.
The left side of the bottom plate is provided with the through hole that is connected.
The semiconductor chip, insulating heat-conductive piece and part pin plastic packaging are in thermosetting plastics.
The bottom plate is provided with four through holes, and two through holes are in the side of insulating heat-conductive piece, and another two through hole is in exhausted The opposite side of edge thermally conductive sheet.
The through hole is the small truncated cone-shaped of the big end diameter of upper end diameter.
The bottom surface that the bottom plate is in the underface of insulating heat-conductive piece has groove, and the bottom surface of groove forms multiple radiatings Salient point, the bottom surface for the salient point that radiates are equal with the bottom surface of bottom plate.
Prominent effect of the present utility model is:Compared with prior art, it is formed by the bottom surface of insulating heat-conductive piece Multiple strip bulge sleeves simultaneously in connecting groove, so as to increase the contact area with bottom plate, by bottom plate radiated by holding, It is scattered so as to increase and the bottom surface for the groove that the bottom surface of the bottom plate of the underface of insulating heat-conductive piece has forms multiple radiating salient points Hot area simultaneously, can greatly improve radiating effect by air flow, improve its service life.
Brief description of the drawings:
Fig. 1 is partial top view of the present utility model;
Fig. 2 is partial sectional view of the present utility model.
Embodiment:
Embodiment, see as shown in Figure 1 to Figure 2, a kind of strong cooling triode of modified, including semiconductor chip 10, insulation Thermally conductive sheet 20 and bottom plate 30, the semiconductor chip 10 are provided with three pins 11, three pins 11 respectively with semiconductor The collecting zone of chip 10, base, launch site connection, the insulating heat-conductive piece 20 are fixed on the bottom surface of semiconductor chip 10, institute The bottom surface for stating insulating heat-conductive piece 20 forms multiple strip bulges 21, and the bottom surface of insulating heat-conductive piece 20 is fixed on bottom plate 30, bottom The top surface of plate 30 has multiple connecting grooves 31, the sleeve of strip bulge 21 and holding is in connecting groove 31.
Further, the left side of the bottom plate 30 is provided with the through hole 32 that is connected.
Further, the semiconductor chip 10, insulating heat-conductive piece 20 and the plastic packaging of part pin 11 are in thermosetting plastics In 40.
Further, the bottom plate 30 is provided with four through holes 33, and two through holes 33 are in the one of insulating heat-conductive piece 20 Side, another two through hole 33 are in the opposite side of insulating heat-conductive piece 20.
Further, the through hole 33 is the small truncated cone-shaped of the big end diameter of upper end diameter.
Further, the bottom surface that the bottom plate 30 is in the underface of insulating heat-conductive piece 20 has groove 34, groove 34 Bottom surface form it is multiple radiating salient points 35, radiate salient point 35 bottom surface it is equal with the bottom surface of bottom plate 30.
In the present embodiment, its insulating heat-conductive piece 20 can be white graphite, and white graphite has the layer structure of similar graphite, had Good lubricity, electrical insulating property thermal conductivity and chemical resistance, have neutron absorption capability, and white graphite has good electricity Insulating properties, it is the good conductor of heat.
And bottom plate 30 can be the material such as copper or aluminium, its good heat dissipation effect.
And through hole 33 can enter thermosetting plastics in through hole 33 when plastic packaging is carried out, fixed encapsulation effect is improved Fruit.
Finally, embodiment of above is merely to illustrate the utility model, and is not limitation of the utility model, relevant skill The those of ordinary skill in art field, in the case where not departing from spirit and scope of the present utility model, various changes can also be made Change and modification, therefore all equivalent technical schemes fall within category of the present utility model, patent protection model of the present utility model Enclosing to be defined by the claims.

Claims (6)

1. a kind of strong cooling triode of modified, including semiconductor chip (10), insulating heat-conductive piece (20) and bottom plate (30), described Semiconductor chip (10) is provided with three pins (11), three pins (11) current collection with semiconductor chip (10) respectively Area, base, launch site connection, it is characterised in that:The insulating heat-conductive piece (20) is fixed on the bottom surface of semiconductor chip (10), The bottom surface of the insulating heat-conductive piece (20) forms multiple strip bulges (21), and the bottom surface of insulating heat-conductive piece (20) is fixed on bottom plate (30) on, the top surface of bottom plate (30) has multiple connecting grooves (31), strip bulge (21) sleeve and holding is in connecting groove (31) in.
A kind of 2. strong cooling triode of modified according to claim 1, it is characterised in that:The left side of the bottom plate (30) Provided with the through hole that is connected (32).
A kind of 3. strong cooling triode of modified according to claim 1, it is characterised in that:The semiconductor chip (10), insulating heat-conductive piece (20) and part pin (11) plastic packaging are in thermosetting plastics (40).
A kind of 4. strong cooling triode of modified according to claim 1, it is characterised in that:The bottom plate (30) is provided with Four through holes (33), two through holes (33) are in the side of insulating heat-conductive piece (20), and another two through hole (33) is in insulating heat-conductive The opposite side of piece (20).
A kind of 5. strong cooling triode of modified according to claim 4, it is characterised in that:The through hole (33) is upper end The small truncated cone-shaped of diameter end diameter.
A kind of 6. strong cooling triode of modified according to claim 1, it is characterised in that:The bottom plate (30) is in exhausted The bottom surface of the underface of edge thermally conductive sheet (20) has groove (34), and the bottom surface of groove (34) forms multiple radiating salient points (35), The bottom surface of radiating salient point (35) is equal with the bottom surface of bottom plate (30).
CN201720528392.8U 2017-05-12 2017-05-12 A kind of strong cooling triode of modified Expired - Fee Related CN207038513U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720528392.8U CN207038513U (en) 2017-05-12 2017-05-12 A kind of strong cooling triode of modified

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720528392.8U CN207038513U (en) 2017-05-12 2017-05-12 A kind of strong cooling triode of modified

Publications (1)

Publication Number Publication Date
CN207038513U true CN207038513U (en) 2018-02-23

Family

ID=61479621

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720528392.8U Expired - Fee Related CN207038513U (en) 2017-05-12 2017-05-12 A kind of strong cooling triode of modified

Country Status (1)

Country Link
CN (1) CN207038513U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180223

Termination date: 20180512