CN207011081U - A kind of high-density multi-layered copper circuit board - Google Patents
A kind of high-density multi-layered copper circuit board Download PDFInfo
- Publication number
- CN207011081U CN207011081U CN201720929868.9U CN201720929868U CN207011081U CN 207011081 U CN207011081 U CN 207011081U CN 201720929868 U CN201720929868 U CN 201720929868U CN 207011081 U CN207011081 U CN 207011081U
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- CN
- China
- Prior art keywords
- circuit board
- layer
- conductive traces
- copper
- board unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of high-density multi-layered copper circuit board, including device body, described device body is formed by being arranged on the circuit board unit of the device body side and being arranged on the circuit board of the device body bottom, this kind of high-density multi-layered copper circuit board, in the bottom of copper circuit board only with one layer of substrate, superposition of the circuit layer on substrate in layer, so as to greatly save material, and the thickness of circuit layer is more thin compared to other techniques, so as to high degree meet copper circuit board for make line width it is smaller, the demand of the smaller circuit of line-spacing, deep gouge is provided with the top of the circuit board, slide rail and elastic component, it can be very good copper circuit board being fixed by the mutual cooperation of element, greatly facilitate subsequent operation, so as to improve efficiency, also save cost.
Description
Technical field
Copper circuit board technical field is the utility model is related to, specially a kind of high-density multi-layered copper circuit board.
Background technology
Existing wiring board preparation technology, when forming figure, the main method taken be cover the rigidity of copper or
Photo-conductive film in flexible parent metal overlying, dry film is commonly called as, afterwards by exposure imaging, the figure on film namely mask plate is turned
Move on on dry film.The copper of its lower floor of dry film pattern etching is utilized afterwards, forms conducting wire.
But existing copper circuit board, which makes, has the problem of many, existing technique can only make some line widths, line-spacing compared with
Big wiring board, the copper circuit board finer to some requirements is difficult to reach making requirement, and also exists in process of production
The problem of waste of materials, in the operating process of copper circuit board, it is a very big problem that wiring board, which is fixed, is often relied on artificial
Fixed, not only efficiency is low, and cost is higher, can't be supported the use with machine.
So how to design a kind of high-density multi-layered copper circuit board, turning into us will currently solve the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of high-density multi-layered copper circuit board, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, the utility model provides following technical scheme：A kind of high-density multi-layered copper circuit board, including
Device body, described device body is by being arranged on the circuit board unit of the device body side and being arranged on the device body bottom
Circuit board form, the side of the circuit board unit is provided with deep gouge, and the deep gouge is embedded in and is arranged in circuit board unit, institute
The top for stating circuit board is provided with elastic component, and fixation is brought into close contact between the elastic component and circuit board, the top of the circuit board
Portion is provided with grab, and the grab is partially submerged into setting in the circuit board, and the side of the circuit board is provided with circuit board unit groove,
And the circuit board unit groove insertion is set in the circuit board, the circuit board unit inner bottom wall is provided with substrate, and the substrate
Fixation is brought into close contact between circuit board unit, the top of the substrate is provided with first layer copper conductive traces, and the first layer
Fixation is brought into close contact between copper conductive traces and substrate, the top of the first layer copper conductive traces is provided with second layer conductive copper wire
Road, and fixation is brought into close contact between the second layer copper conductive traces and first layer copper conductive traces, the second layer copper is conductive
The inside of circuit is provided with through hole, and through hole insertion is arranged in second layer copper conductive traces, and the inside of the through hole is provided with
Hole filler.
Further, the circuit board unit side is provided with hanging hole, and the hanging hole is through being arranged in circuit board unit.
Further, the top of the circuit board is provided with slide rail, and is brought into close contact fixation between the slide rail and circuit board.
Further, the top of the first layer copper conductive traces is provided with insulating barrier, and the insulating barrier and first layer copper
Fixation is brought into close contact between conducting wire.
Further, the top of the second layer copper conductive traces is provided with coat of metal, and the coat of metal covers
Lid is arranged on second layer conductive copper wire road surfaces.
Compared with prior art, the beneficial effects of the utility model are：This kind of high-density multi-layered copper circuit board, in copper wire
The bottom of plate is only with one layer of substrate, superposition of the circuit layer on substrate in layer, so as to greatly save material, and
The thickness of circuit layer is more thin compared to other techniques, and copper circuit board is met for making line width more so as to high degree
Small, the smaller circuit of line-spacing demand, deep gouge, slide rail and elastic component are provided with the top of the circuit board, passes through the phase interworking of element
Conjunction can be very good copper circuit board being fixed, and greatly facilitate subsequent operation, so as to improve efficiency, also save
Cost.
Brief description of the drawings
Fig. 1 is overall structure diagram of the present utility model；
Fig. 2 is the partial structural diagram of the utility model circuit board；
Fig. 3 is the partial structural diagram of the utility model circuit board unit；
In figure：1- device bodies；2- hanging holes；3- circuit board units；4- deep gouges；5- grabs；6- slide rails；7- elastic components；8-
Circuit board；9- substrates；10- first layer copper conductive traces；11- insulating barriers；12- second layer copper conductive traces；13- through holes；14- gold
Belong to protective layer；15- holes filler；16- circuit board unit grooves.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：A kind of high-density multi-layered copper circuit board, including dress
Body 1 is put, described device body 1 is by being arranged on the circuit board unit 3 of the side of device body 1 and being arranged on the device body 1
The circuit board 8 of bottom is formed, and the side of the circuit board unit 3 is provided with deep gouge 4, and the insertion of the deep gouge 4 is arranged on circuit board
In unit 3, the top of the circuit board 8 is provided with elastic component 7, and is brought into close contact fixation between the elastic component 7 and circuit board 8,
The top of the circuit board 8 is provided with grab 5, and the grab 5 is partially submerged into and is arranged in circuit board 8, and the one of the circuit board 8
Side is provided with circuit board unit groove 16, and the circuit board unit groove 16 insertion is arranged in circuit board 8, the circuit board unit 3
Inner bottom wall is provided with substrate 9, and fixation is brought into close contact between the substrate 9 and circuit board unit 3, and the top of the substrate 9 is provided with
First layer copper conductive traces 10, and fixation, the first layer are brought into close contact between the first layer copper conductive traces 10 and substrate 9
The top of copper conductive traces 10 is provided with second layer copper conductive traces 12, and the second layer copper conductive traces 12 are led with first layer copper
Fixation is brought into close contact between electric line 10, the inside of the second layer copper conductive traces 12 is provided with through hole 13, and the through hole 13
Insertion is arranged in second layer copper conductive traces 12, and the inside of the through hole 13 is provided with hole filler 15.
Further, the side of circuit board unit 3 is provided with hanging hole 2, and the hanging hole 2 is through being arranged on circuit board unit
In 3, by the hanging hole 2 of setting, very easily circuit board unit 3 can be hung up, so as to which it be arranged well.
Further, the top of the circuit board 8 is provided with slide rail 6, and is brought into close contact between the slide rail 6 and circuit board 8
It is fixed, by the slide rail 6 of setting, can be very good circuit board 8 being fixed, to facilitate subsequent operation.
Further, the top of the first layer copper conductive traces 10 is provided with insulating barrier 11, and the insulating barrier 11 and
Fixation is brought into close contact between one layer of copper conductive traces 10, passes through the insulating barrier 11 of setting, it is ensured that between conducting wire mutually not
Interference, so as to ensure the normal operation of circuit.
Further, the top of the second layer copper conductive traces 12 is provided with coat of metal 14, and the metal coating
The covering of layer 14 is arranged on the surface of second layer copper conductive traces 12, can be to this kind of copper wire by the coat of metal 14 of setting
Plate is protected well.
Operation principle：First, circuit board unit 3 is placed in circuit board unit groove 16, the side of circuit board unit 3 is set
There is deep gouge 4, slide rail 6 is provided with the top of circuit board 8, symmetrical elastic component 7 is provided with the both ends of slide rail 6, in slide rail 6
Side is provided with grab 5, and the elasticity of elastic component 7 makes grab 5 to be moved on slide rail 6, to adapt to various sizes of copper wire
Plate, by slide rail 6, elastic component 7, deep gouge 4 and grab 5, circuit board unit 3 can be fixed well, in circuit board
The bottom of unit 3 is provided with substrate 9, and the making of circuit board is carried out in substrate 9, and it is conductive to form first layer copper at the top of substrate 9
Circuit 10, a layer insulating 11 is covered on the surface of first layer copper conductive traces 10, through hole 13, through hole are formed in insulating barrier 11
13 reveal the first layer copper conductive traces 10 of bottom, and hole filler 15 is provided with through hole 13, and hole filler 15 uses
The polymeric material of buffer action is played, silica can be used, second layer copper conductive traces 12 are provided with the top of insulating barrier 11,
So as to form multilayer copper conductive traces, coat of metal 14 is provided with the top of second layer copper conductive traces 12, to protect copper
Conducting wire is without prejudice, ensures the normal work of copper circuit board.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of high-density multi-layered copper circuit board, including device body（1）, it is characterised in that：Described device body（1）By setting
In the device body（1）The circuit board unit of side（3）And it is arranged on the device body（1）The circuit board of bottom（8）Form, institute
State circuit board unit（3）Side be provided with deep gouge（4）, and the deep gouge（4）Insertion is arranged on circuit board unit（3）In, it is described
Circuit board（8）Top be provided with elastic component（7）, and the elastic component（7）With circuit board（8）Between be brought into close contact fixation, it is described
Circuit board（8）Top be provided with grab（5）, and the grab（5）It is partially submerged into and is arranged on circuit board（8）In, the circuit board
（8）Side be provided with circuit board unit groove（16）, and the circuit board unit groove（16）Insertion is arranged on circuit board（8）In, institute
State circuit board unit（3）Inner bottom wall is provided with substrate（9）, and the substrate（9）With circuit board unit（3）Between be brought into close contact it is solid
It is fixed, the substrate（9）Top be provided with first layer copper conductive traces（10）, and the first layer copper conductive traces（10）With substrate
（9）Between be brought into close contact fixation, the first layer copper conductive traces（10）Top be provided with second layer copper conductive traces（12）, and
The second layer copper conductive traces（12）With first layer copper conductive traces（10）Between be brought into close contact fixation, the second layer copper is led
Electric line（12）Inside be provided with through hole（13）, and the through hole（13）Insertion is arranged on second layer copper conductive traces（12）In,
The through hole（13）Inside be provided with hole filler（15）.
A kind of 2. high-density multi-layered copper circuit board according to claim 1, it is characterised in that：The circuit board unit（3）
Side is provided with hanging hole（2）, and the hanging hole（2）Through being arranged on circuit board unit（3）In.
A kind of 3. high-density multi-layered copper circuit board according to claim 1, it is characterised in that：The circuit board（8）Top
Portion is provided with slide rail（6）, and the slide rail（6）With circuit board（8）Between be brought into close contact fixation.
A kind of 4. high-density multi-layered copper circuit board according to claim 1, it is characterised in that：The first layer conductive copper wire
Road（10）Top be provided with insulating barrier（11）, and the insulating barrier（11）With first layer copper conductive traces（10）Between be brought into close contact
It is fixed.
A kind of 5. high-density multi-layered copper circuit board according to claim 1, it is characterised in that：The second layer conductive copper wire
Road（12）Top be provided with coat of metal（14）, and the coat of metal（14）Covering is arranged on second layer copper conductive traces
（12）Surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720929868.9U CN207011081U (en) | 2017-07-28 | 2017-07-28 | A kind of high-density multi-layered copper circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720929868.9U CN207011081U (en) | 2017-07-28 | 2017-07-28 | A kind of high-density multi-layered copper circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207011081U true CN207011081U (en) | 2018-02-13 |
Family
ID=61456165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720929868.9U Expired - Fee Related CN207011081U (en) | 2017-07-28 | 2017-07-28 | A kind of high-density multi-layered copper circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207011081U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113782492A (en) * | 2021-09-10 | 2021-12-10 | 京东方科技集团股份有限公司 | Substrate and preparation method thereof, electrical device and integrated circuit board |
-
2017
- 2017-07-28 CN CN201720929868.9U patent/CN207011081U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113782492A (en) * | 2021-09-10 | 2021-12-10 | 京东方科技集团股份有限公司 | Substrate and preparation method thereof, electrical device and integrated circuit board |
| CN113782492B (en) * | 2021-09-10 | 2024-05-07 | 京东方科技集团股份有限公司 | Substrate, preparation method thereof, electric device and integrated circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180213 Termination date: 20180728 |