CN207006671U - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN207006671U CN207006671U CN201720748150.XU CN201720748150U CN207006671U CN 207006671 U CN207006671 U CN 207006671U CN 201720748150 U CN201720748150 U CN 201720748150U CN 207006671 U CN207006671 U CN 207006671U
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- CN
- China
- Prior art keywords
- cold end
- inner bag
- semiconductor
- heat sink
- refrigeration box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 100
- 238000005057 refrigeration Methods 0.000 claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000004040 coloring Methods 0.000 claims description 4
- 238000005187 foaming Methods 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 238000001816 cooling Methods 0.000 description 12
- 230000005855 radiation Effects 0.000 description 9
- 229910002804 graphite Inorganic materials 0.000 description 7
- 239000010439 graphite Substances 0.000 description 7
- 229910021389 graphene Inorganic materials 0.000 description 6
- 238000005507 spraying Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000009182 swimming Effects 0.000 description 1
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor fridge, include inner bag, semiconductor refrigeration piece and lead cold charge and put, the semiconductor refrigeration piece is worn to establish on the inner bag, the semiconductor refrigeration piece is in the inside one end of inner bag with lead the laminating setting of cold charge and put, lead cold charge and put and be provided with on the surface and lead the temperature material layer. The utility model discloses realize the effect of quick heat transfer to make the heat dissipation of cold junction heat dissipation and hot junction all not have fan unit, realize noiseless refrigeration effect fast, make user experience optimize more, and energy-concerving and environment-protective, reduce the cost of semiconductor fridge.
Description
Technical field
It the utility model is related to semiconductor refrigerating technology field, and in particular to a kind of semiconductor refrigeration box.
Background technology
Semiconductor electronic refrigerating is also known as thermoelectric cooling, or thermoelectric cooling, and it is one kind using " peltier effect "
Refrigerating method, with compression-type refrigeration and absorption refrigeration and referred to as three big refrigeration modes of the world.
The heat sink conception of semiconductor refrigeration box in the market, it is most of to add what fan forced convection radiated using radiator
Mode is radiated, and this heat sink conception has the defects of very big：Because semiconductor cooling hot junction utilizes fan cooling, fan is not only
Noise is very big when can increase the overall power consumption of refrigerating box, and run, and influences the experience effect of user；In addition, set up fan
Also increase the manufacturing cost of semiconductor freezer.
Utility model content
The utility model discloses a kind of semiconductor refrigeration box, solves heat transfer effect in semiconductor refrigeration box in the prior art
Fruit difference problem.
It is described the utility model discloses a kind of semiconductor refrigeration box, including inner bag, semiconductor chilling plate and cold guide apparatus
Semiconductor chilling plate is located on the inner bag, one end that the semiconductor chilling plate is in inside the inner bag and the conduction cooling
Device fitting is set, and is provided with the surface of the cold guide apparatus and is led adiabator layer.
Further, the cold guide apparatus is cold end heat sink, and the cold end heat sink is removably mounted on inner bag,
And the subregion of the cold end heat sink and the cold end of the semiconductor chilling plate fit.
Further, installing port is provided with the inner bag, the semiconductor chilling plate is arranged at the installing port, institute
The cold end of semiconductor chilling plate is stated towards setting inside the inner bag, the hot junction of the semiconductor chilling plate is away from the inner bag
Direction is set.
Further, the semiconductor refrigeration box also includes hot-side heat dissipation device, and the hot-side heat dissipation device includes being fitted in institute
The reservoir in semiconductor chilling plate hot junction and the heat pipe being inserted on the reservoir are stated, the heat pipe is arranged at the inner bag
It is outside.
Further, the hot-side heat dissipation device also includes the more fiber tube heat exchangers for being used to increase heat exchange area, the silk
Heat exchange of heat pipe is connected on the heat pipe.
Further, the heat pipe is multiple that multiple heat pipes are arranged at intervals.
Further, the heat pipe connects after the bending of one end of the reservoir with the reservoir.
Further, it is provided with foaming layer between the heat pipe and the inner bag.
Further, the cold end heat sink is arranged on the surface inside the inner bag, described to lead the setting of adiabator layer
Between the inner bag and the cold end heat sink.
Further, it is described lead adiabator layer be arranged on the cold end heat sink and the semiconductor chilling plate cold end it
Between.
Further, the cold end radiating plate surface is carried out any one in anodic oxidation, electrolytic coloring and electrophoretic coating
Kind PROCESS FOR TREATMENT.
Further, the cold end heat sink is any one in the ceramic wafer of aluminium sheet, copper coin and high thermal conductivity coefficient.
Further, the area of the cold end heat sink is not more than the inner bag inner wall area of cold end heat sink installation side.
The utility model leads adiabator layer by being coated with the cold end heat sink in semiconductor refrigeration box inner bag, improves
The heatsink transverse speed of cold end heat sink and longitudinal radiating rate, while the heat loss through radiation ability of cold end heat sink is added, carry
The high integral heat sink ability and radiating rate of cold end heat sink, while the uniformity of radiating is ensure that, it can be obtained in inner bag
Uniform temperature；Meanwhile be used for storing the working medium in heat pipe by reservoir, it can effectively help thermalization to realize quick heat exchange,
By setting fiber tube heat exchanger, heat exchange area greatly increases, so that the heat in semiconductor chilling plate hot junction passes through heat pipe and silk
Heat exchange of heat pipe being scattered in air rapidly and efficiently, the effect quickly to exchange heat is realized, so that cold end radiating and the radiating in hot junction
Calm fan device, quickly realizes noiseless refrigeration, Consumer's Experience is more optimized, and energy-conserving and environment-protective, reduces semiconductor
The cost of refrigerating box.
Brief description of the drawings
Fig. 1 is the structural representation of the semiconductor refrigeration box of the utility model embodiment；
Fig. 2 is the partial enlarged drawing of A in Fig. 1；
Fig. 3 is the cold end radiating direction of transfer schematic diagram of the semiconductor refrigeration box of the utility model embodiment；
Fig. 4 is the cold end heat sink scheme of installation of the semiconductor refrigeration box of the utility model embodiment；
Fig. 5 is the hot-side heat dissipation device scheme of installation of the semiconductor refrigeration box of the utility model embodiment.
Legend：1st, inner bag；11st, installing port；2nd, cold end heat sink；3rd, semiconductor chilling plate；4th, hot-side heat dissipation device；41st, store up
Liquid device；42nd, heat pipe；43rd, fiber tube heat exchanger；5th, adiabator layer is led.
Embodiment
The utility model is described further with reference to embodiment, but is not limited to the content on specification.
As depicted in figs. 1 and 2, the utility model discloses a kind of semiconductor refrigeration box, including：Casing, inner bag 1, partly lead
Body cooling piece 3, cold guide apparatus and control panel；Accommodating chamber is provided with the casing, the inner bag 1 is arranged in accommodating chamber, institute
State semiconductor chilling plate 3 to wear the inner bag 1 and be fixedly installed on the inner bag 1, and be connected with control panel, the semiconductor
One end that cooling piece 3 is in inside the inner bag 1 is bonded setting with the cold guide apparatus, is set on the side of the cold guide apparatus
Lead adiabator layer 5.
In the present embodiment, semiconductor refrigeration box controls semiconductor chilling plate 3 to realize thermoelectric cooling by control panel, partly leads
After body cooling piece passes to direct current, the cold of the cold end of semiconductor chilling plate 3 is realized internally cold guide apparatus in a manner of radiating
The refrigeration of courage 1.It is coated with side by the cold guide apparatus in semiconductor refrigeration box inner bag 1 and leads adiabator layer 5, it is described to lead temperature
Material is graphene, improve cold end heat sink heatsink transverse speed and longitudinal radiating rate (as shown in figure 3, arrow represent
The direction of heat lateral transport radiating, the heat transfer radiating of cold guide apparatus thickness direction are referred to as longitudinal heat dissipation direction, circle ten
Cabinet frame represents heat radiation)；The heat loss through radiation ability of cold guide apparatus is added simultaneously, improves the integral heat sink energy of cold guide apparatus
Power and radiating rate, while the uniformity of radiating is ensure that, uniform temperature can be obtained in inner bag 1, so that cold end radiates
Without being radiated by the way of adding fan forced convection to radiate using radiator, noiseless refrigeration is quickly realized, optimization is used
The experience effect at family, while reduce the cost of semiconductor freezer, more energy-conserving and environment-protective.
In the above-described embodiments, as shown in figure 4, the cold guide apparatus is cold end heat sink 2, the cold end heat sink 2 is logical
Cross bolt to be removably mounted on inner bag 1, installing port 11 is provided with the inner bag 1, the semiconductor chilling plate 3 is arranged at
At the installing port 11, the cold end of the semiconductor chilling plate 3 is set towards the inside of inner bag 1, the semiconductor chilling plate
3 hot junction is set away from the direction of the inner bag 1, and the cold end heat sink 2 is bonded with the cold end of the semiconductor chilling plate 3.
Bigger using the heat exchange area of cold end heat sink 2, heat exchange efficiency is higher, and cold end heat sink 2 and half can be not only made using screw
The cold end face of conductor cooling piece 3 is brought into close contact, and avoiding passing through gluing mode influences heat exchange effect, so as to reduce contact heat
Resistance, can effectively increase radiating efficiency；But also facilitate follow-up after-sales service, facilitate repair demolition inspection.
In the above-described embodiments, as shown in Figure 2 and Figure 5, the semiconductor refrigeration box also includes：Hot-side heat dissipation device 4, it is described
Hot-side heat dissipation device 4 includes being fitted in the reservoir 41 in the hot junction of semiconductor chilling plate 3 and is inserted on the reservoir 41
Heat pipe 42, the heat pipe 42 is arranged at outside the inner bag 1, and the hot-side heat dissipation device 4 also includes more and is used to increase heat exchange
The fiber tube heat exchanger 43 of area, the fiber tube heat exchanger 43 perpendicular to the direction of the heat pipe 42 to be set in parallel in the heat
On pipe 42, the heat pipe 42 is multiple, and the heat pipe 42 mutually be arranged in parallel, and is bent close to one end of the reservoir 41
Connected afterwards with the reservoir 41, each fiber tube heat exchanger 43 is at least in contact with a heat pipe 42.
It is used for storing the working medium in heat pipe 42 by reservoir 41, can effectively helps thermalization to realize quick heat exchange, pass through
Fiber tube heat exchanger 43 is set, and heat exchange area greatly increases, so that the heat in the hot junction of semiconductor chilling plate 3 passes through heat pipe 42 and silk
Being scattered in air rapidly and efficiently of heat exchange of heat pipe 43, the effect quickly to exchange heat is realized, dissipated so as to avoid use and must use
Hot equipment, the problem of causing noise very, Consumer's Experience is more optimized, and energy-conserving and environment-protective, reduce the cost of semiconductor refrigeration box.
In the above-described embodiments, foaming layer is provided between the heat pipe 42 and the inner bag 1, by the heat pipe 42
The foaming layer for thermal insulation is provided between the inner bag 1, realizes isolation, is not in the mutual transmission of heat, so as to carry
High refrigerating efficiency.
The adiabator layer 5 of leading is arranged between the inner bag 1 and the cold end heat sink 2.
In the above-described embodiments, the cold end heat sink 2 is removably mounted on the table inside the inner bag 1 by bolt
On face, graphite ene coatings are positioned only at the side away from semiconductor chilling plate 3, can not only improve the horizontal stroke of cold end heat sink 2
To radiating rate and longitudinal radiating rate, cold end heat sink 2 can also be made faster to carry out heat exchange with the inside of inner bag 1, from
And the heat inside inner bag 1 is quickly reduced, improve the refrigerating efficiency of semiconductor refrigeration box；In addition to this it is possible to by the stone
Black ene coatings are arranged between the inner bag 1 and the cold end heat sink 2, i.e., the homonymy of described semiconductor chilling plate 3, equally
The heatsink transverse speed of cold end heat sink 2 and longitudinal radiating rate can be improved, improves cold end heat sink 2 with entering inside inner bag 1
The efficiency of row heat exchange, graphite ene coatings are particularly arranged on the cold end heat sink 2 and the cold end of semiconductor chilling plate 3
Between, i.e., a layer graphene material is coated with the cold end binding face of semiconductor chilling plate 3 on cold end heat sink 2, fills cold end heat sink 2
Divide and be bonded with the cold end of semiconductor chilling plate 3, increase the biography of semiconductor chilling plate cold end heat by applying a layer graphene material
Lead, while greatly reduce the thermal resistance between cold end heat sink 2 and the contact of the cold end of semiconductor chilling plate 3, fill the heat of semiconductor
Divide and be rapidly dispersed through on cold end heat sink 2, improve the refrigerating efficiency of semiconductor refrigeration box, energy-conserving and environment-protective.
It should be noted that in the present embodiment, so that cold end heat sink 2 is aluminium sheet as an example, when being not coated with grapheme material, heat
Amount transmits especially slow, the heat transfer coefficient 200W/m.K, it is impossible in time scatter away heat that radiates；It is no more than when coating a layer thickness
After 5mm graphene, its heatsink transverse speed is significantly lifted, and longitudinal velocity is also slowly lifted, and heat transfer coefficient is up to 600-
1200W/m.K, therefore, while greatly reduce the thermal resistance between cold end heat sink and semiconductor chilling plate contact, make semiconductor
Heat is sufficiently and quickly distributed on cold end heat sink, improves refrigerating efficiency, and refrigerating box inner bag can be made quickly to realize refrigeration, and
Ensure that temperature is uniform in inner bag, reduces the fluctuation range of temperature, improves the experience effect of client.
In the above-described embodiments, if graphite ene coatings to be arranged on to the homonymy of the semiconductor chilling plate 3, semiconductor refrigerating
The opposite side of piece 3 can carry out spraying black processing, and it is to semiconductor chilling plate surface " anodic oxidation, electrolytic coloring or electricity to spray black processing
Swimming japanning " PROCESS FOR TREATMENT, by carrying out spraying black processing in the opposite side of semiconductor chilling plate 3, i.e., to 2 surfaces of cold end heat sink
" anodic oxidation, electrolytic coloring or electrophoretic coating " PROCESS FOR TREATMENT (similarly hereinafter), can greatly improve heat loss through radiation ability, allow cold end to dissipate
The slin emissivity of hot plate 2 is up to 0.98, higher than common metal plate tens times, and radianting capacity is high, can quickly realize the system in inner bag 1
It is cold.Temperature in inner bag 1 mainly realizes refrigeration by the heat radiation of cold end heat sink 2, sprayed on cold end heat sink 2 it is black can be with
Increase blackness, so as to increase Boltzmann constant σ values, and radiations heat energy Q and σ is proportional, and relation is Q=ε σ T4, it is known that σ
More large radiation heat exchange amount Q is bigger.The mode radiated using cold end heat sink, can make refrigerating box inner bag quickly realize refrigeration, without
Increase the convection devices such as fan, not only reduce noise, energy-conserving and environment-protective, but also ensure that temperature is uniform in inner bag 1, reduces temperature
Fluctuation range, improve the experience effect of client.
In embodiment not shown in figure, the graphite ene coatings can also be arranged on the two of the cold end heat sink 2
Side, it is graphite ene coatings by the way that thickness is respectively coated in the both sides of cold end heat sink 2, on the one hand, make cold end heat sink 2 and semiconductor
The cold end of semiconductor chilling plate 3 heat can be increased by applying a layer graphene material with graphene coated coating between the cold end of cooling piece 3
The conduction of amount, while greatly reduce the thermal resistance between cold end heat sink 2 and the contact of the cold end of semiconductor chilling plate 3, make semiconductor
Heat is sufficiently and quickly distributed on cold end heat sink 2, at the same time it can also improve the heatsink transverse speed of cold end heat sink 2 and
Longitudinal radiating rate, cold end heat sink 2 is set faster to carry out heat exchange with the inside of inner bag 1, so as to by semiconductor chilling plate 3
Cold is quickly reached inside inner bag 1, not only further improves the refrigerating efficiency of semiconductor refrigeration box, and need not increase fan
Etc. convection device, noise, energy-conserving and environment-protective are not only reduced, but also ensure that temperature is uniform in inner bag 1, reduce the fluctuation model of temperature
Enclose, improve the experience effect of client.
In the above-described embodiments, the both sides of cold end heat sink 2 can also carry out spraying black processing, and cold end heat sink 2 exists
On the basis of graphite ene coatings, further carry out spraying black processing, led in increase the horizontal and vertical of cold end heat sink 2
While hot coefficient (improving radiating rate), heat loss through radiation ability can also be greatly improved, makes cold end heat sink 2 by semiconductor
The cold of cooling piece 3 is more quickly reached in inner bag 1, the refrigerating efficiency of semiconductor refrigeration box is further improved, Er Qiewu
The convection devices such as fan need to be increased, not only reduce noise, energy-conserving and environment-protective, but also ensure that temperature is uniform in inner bag 1, reduce temperature
Fluctuation range, improve the experience effect of client.
In the above-described embodiments, the cold end heat sink 2 can not only use aluminium sheet it, copper coin or height can also be used to lead
The ceramic wafer of hot coefficient, and the area of the cold end heat sink 2 is not more than the inner wall area of inner bag 1 of the installation side of cold end heat sink 2.
The utility model is improved by being coated with graphite ene coatings on the cold end heat sink 2 in semiconductor refrigeration box inner bag 1
The heatsink transverse speed of cold end heat sink 2 and longitudinal radiating rate, while add the heat loss through radiation energy of cold end heat sink 2
Power, improves the integral heat sink ability and radiating rate of cold end heat sink 2, while ensure that the uniformity of radiating, energy in inner bag 1
Access uniform temperature；Meanwhile be used for storing the working medium in heat pipe 42 by reservoir 41, effectively thermalization can be helped to realize
Quick heat exchange, by setting fiber tube heat exchanger 43, heat exchange area greatly increases, so that the heat in the hot junction of semiconductor chilling plate 3
By heat pipe and fiber tube heat exchanger being scattered in air rapidly and efficiently, the effect quickly to exchange heat is realized, so that cold end radiates
The calm fan device of radiating with hot junction, quickly realizes noiseless refrigeration, Consumer's Experience is more optimized, and energy-saving ring
Protect, reduce the cost of semiconductor refrigeration box.
Obviously, above-mentioned embodiment of the present utility model is only intended to clearly illustrate the utility model example,
And it is not the restriction to embodiment of the present utility model.For those of ordinary skill in the field, stated upper
It can also be made other changes in different forms on the basis of bright.Here all embodiments can not be given thoroughly
Lift.It is every to belong to obvious changes or variations that the technical solution of the utility model is extended out still in the utility model
Protection domain row.
Claims (13)
1. a kind of semiconductor refrigeration box, it is characterised in that described including inner bag (1), semiconductor chilling plate (3) and cold guide apparatus
Semiconductor chilling plate (3) is located on the inner bag (1), and the semiconductor chilling plate (3) is in internal one of the inner bag (1)
End is bonded setting with the cold guide apparatus, is provided with the surface of the cold guide apparatus and leads adiabator layer (5).
2. semiconductor refrigeration box according to claim 1, it is characterised in that the cold guide apparatus is cold end heat sink (2),
The cold end heat sink (2) is removably mounted on inner bag (1), and the subregion of the cold end heat sink (2) with it is described
The cold end of semiconductor chilling plate (3) fits.
3. semiconductor refrigeration box according to claim 2, it is characterised in that be provided with installing port on the inner bag (1)
(11), the semiconductor chilling plate (3) is arranged at the installing port (11) place, the cold end direction of the semiconductor chilling plate (3)
Set inside the inner bag (1), the hot junction of the semiconductor chilling plate (3) is set away from the direction of the inner bag (1).
4. semiconductor refrigeration box according to claim 1, it is characterised in that the semiconductor refrigeration box also dissipates including hot junction
Hot device (4), the hot-side heat dissipation device (4) include being fitted in reservoir (41) on the semiconductor chilling plate (3) hot junction and
The heat pipe (42) being inserted on the reservoir (41), it is outside that the heat pipe (42) is arranged at the inner bag (1).
5. semiconductor refrigeration box according to claim 4, it is characterised in that the hot-side heat dissipation device (4) also includes more
For increasing the fiber tube heat exchanger (43) of heat exchange area, the fiber tube heat exchanger (43) is connected on the heat pipe (42).
6. semiconductor refrigeration box according to claim 4, it is characterised in that the heat pipe (42) is multiple described to be multiple
Heat pipe (42) is arranged at intervals.
7. semiconductor refrigeration box according to claim 6, it is characterised in that the heat pipe (42) is close to the reservoir
(41) one end connects after bending with the reservoir (41).
8. semiconductor refrigeration box according to claim 5, it is characterised in that the heat pipe (42) and the inner bag (1) it
Between be provided with foaming layer.
9. semiconductor refrigeration box according to claim 2, it is characterised in that the cold end heat sink (2) is arranged at described
On the internal surface of inner bag (1), it is described lead adiabator layer (5) be arranged on the inner bag (1) and the cold end heat sink (2) it
Between.
10. semiconductor refrigeration box according to claim 2, it is characterised in that it is described lead adiabator layer (5) be arranged on it is described
Between the cold end of cold end heat sink (2) and the semiconductor chilling plate (3).
11. semiconductor refrigeration box according to claim 2, it is characterised in that cold end heat sink (2) surface carries out sun
Any one PROCESS FOR TREATMENT in pole oxidation, electrolytic coloring and electrophoretic coating.
12. semiconductor refrigeration box according to claim 2, it is characterised in that the cold end heat sink (2) is aluminium sheet, copper
Any one in the ceramic wafer of plate and high thermal conductivity coefficient.
13. semiconductor refrigeration box according to claim 12, it is characterised in that the area of the cold end heat sink (2) is not
More than inner bag (1) inner wall area of cold end heat sink (2) installation side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720748150.XU CN207006671U (en) | 2017-06-23 | 2017-06-23 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720748150.XU CN207006671U (en) | 2017-06-23 | 2017-06-23 | Semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207006671U true CN207006671U (en) | 2018-02-13 |
Family
ID=61448800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720748150.XU Active CN207006671U (en) | 2017-06-23 | 2017-06-23 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207006671U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107246755A (en) * | 2017-06-23 | 2017-10-13 | 珠海格力电器股份有限公司 | Semiconductor refrigerator |
| CN108482867A (en) * | 2018-03-21 | 2018-09-04 | 广东努谢尔环境科技有限公司 | A kind of Intelligent logistics incubator using super heat-conductive pipe |
| CN111141058A (en) * | 2020-01-19 | 2020-05-12 | 天津商业大学 | Neural network radiation plate based on semiconductor refrigeration and heating principle |
-
2017
- 2017-06-23 CN CN201720748150.XU patent/CN207006671U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107246755A (en) * | 2017-06-23 | 2017-10-13 | 珠海格力电器股份有限公司 | Semiconductor refrigerator |
| CN108482867A (en) * | 2018-03-21 | 2018-09-04 | 广东努谢尔环境科技有限公司 | A kind of Intelligent logistics incubator using super heat-conductive pipe |
| CN111141058A (en) * | 2020-01-19 | 2020-05-12 | 天津商业大学 | Neural network radiation plate based on semiconductor refrigeration and heating principle |
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