CN206998630U - A kind of sapphire wafer edging cooling device - Google Patents
A kind of sapphire wafer edging cooling device Download PDFInfo
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- CN206998630U CN206998630U CN201720738919.XU CN201720738919U CN206998630U CN 206998630 U CN206998630 U CN 206998630U CN 201720738919 U CN201720738919 U CN 201720738919U CN 206998630 U CN206998630 U CN 206998630U
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- circulating pump
- water butt
- water
- filter vat
- valve
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Abstract
A kind of sapphire wafer edging cooling device,Including circulating pump,Water butt and filter vat,The grinding tool in sapphire wafer and edge polisher is cooled down using chemical coolant hydronic mode,Compared with traditional in line type of cooling of RO water,Reduce the consumption of 90% 98%RO water,And the grinding tool in the chemical straight edge polisher of coolant,Reduce the wear extent of grinding tool,Improve the service life of grinding tool,Circulating pump is fixed on water butt using fixing device,Improve the stability of circulating pump,Prevent circulating pump from dropping from water butt can not normal work or even damage,Enhance the security performance of cooling device,The first screen pack is provided with filter vat,The second screen pack is provided with circulating pump,It can effectively prevent sapphire powder from entering by circulating pump in edge polisher,So that sapphire wafer edge damage is excessive,Or sapphire wafer edging effect is bad,Increase sapphire subsequent machining cost,Reduce by 1% 5% sapphire wafers and collapse angle or rupture loss ratio,Cooling device uses circulating cooling method,Chemical coolant is recycled and is not excluded for,Environment will not be polluted,Environment protecting is good.
Description
Technical field
Sapphire eyeglass grinding field is the utility model is related to, is a kind of sapphire wafer edging cooling device.
Background technology
Sapphire wafer hardness is very high, is 9 grades of Mohs' hardness, is only second to diamond, and there is good translucency, heat to pass for it
The property led and electric insulating quality, good mechanical properties, and there is the characteristics of wear-resisting and weather-proof, sapphire wafer fusing point is 2050
DEG C, boiling point is 3500 DEG C, and maximum operating temperature can reach 1900 DEG C, therefore sapphire wafer is frequently used for science and technology, national defence
With civilian industry, electronic technology etc. with multi-field, in existing sapphire wafer process engineering, grinding and polishing processing are all
Waffer edge can be caused to damage, cause Waffer edge to peel off, generation is hidden to split and collapse angle, and the serious angle that collapses can be in following process mistake
Fragmentation is produced in journey, causes heavy losses, influences the wafer quality entirely processed, Sapphire Substrate is usually using at edging in addition
Reason is to reduce the damage of Waffer edge, and but mode has two kinds to edging board traditional cold：One kind is cold as being ground using chemical agent
But liquid, concentration general control is between 5% -10%.Usage amount is larger, and the pollution concentration of discharge is higher；Another kind uses water cooling
But, the cost of water is relatively low but cooling effect is poor, and the mode directly discharged causes substantial amounts of water resource waste, the life-span of grinding tool nor
Normal is short, and as the increase of finishing quantity, the grinding capacity of emery wheel decline comparatively fast, damage caused by Waffer edge is got over
More, the ratio of bad loss progressively increases, and have impact on the effect of sapphire wafer edge stress removal, considerably increases sapphire
The cost of following process.
Utility model content
In view of the above-mentioned problems, the utility model proposes a kind of sapphire wafer edging cooling device, the device not only may be used
To reduce the edge damage of sapphire wafer, and reduce sapphire because the edge stress after cutting discharges problem, reduce blue
The waste collapsed angle and damaged ratio, reduce water resource of jewel chip, improve the service life of edging grinding tool.
To solve above technical problem, technical scheme provided by the utility model is:
A kind of sapphire wafer edging cooling device, it is characterised in that described including circulating pump, water butt and filter vat
Water butt is vertically arranged, and water butt is in cuboid, and water butt is in hollow structure, and water butt is provided with water inlet pipe, the water inlet pipe
One end is connected with water butt, and the other end is connected with water source, is provided with floating-ball level switch in water butt, the floating-ball level switch is consolidated
Surely it is arranged in the middle part of water butt, water butt is provided with supporting plate, and the supporting plate is in cuboid, and supporting plate is vertically arranged, support
Plate is arranged on water outlet the same side, and is fixedly connected with water butt, and the filter vat is arranged on water butt opposite side, and is arranged on storage
Bucket upper end, filter vat are in cuboid, and filter vat is hollow structure, and filter vat is provided with the first screen pack, first filtering
Net is set in filter vat, and is arranged in the middle part of filter vat, is provided with the 3rd pipeline in filter vat, and the 3rd pipeline has two, the
Three pipelines are symmetrical arranged, and the 3rd pipeline one end is arranged on filter vat, and the 3rd pipeline other end is connected with edge polisher；
The circulating pump is arranged on water butt side, and sets on the supporting plate, and circulating pump is provided with fixing device, and logical
Cross fixing device and be fixed on water butt, the fixing device there are three, and fixing device is arranged on circulating pump bottom, fixed dress
Put including lock handle, fixed plate and shell, the shell is in cuboid, and housing vertical is set, and shell side is provided with groove, institute
State lock handle and be arranged on shell upper end, lock handle one end is arranged in shell, and the fixed plate is in cuboid, fixed plate water
Flat to set, dead plate upper end is fixedly connected with lock handle one end, and circulating pump side is provided with the first valve, the first valve water
Flat to set, first valve one end is connected with circulating pump, and the other end is connected with the first pipeline, and first pipeline is arranged on the first valve
Door side, the first pipeline other end are connected with edge polisher, are provided with the second screen pack in the first valve, second screen pack has six
Individual, the second screen pack freely arranges to the left, and the circulating pump other end is provided with the second valve, and second valve is horizontally disposed with, and second
Valve one end is connected with circulating pump, and the other end is connected with second pipe, and the second pipe is arranged on the second valve side, and second
The pipeline other end is connected with water butt, and is arranged on water storage bottom of the barrel；
Further, the aperture of the first screen pack is 60-70 mesh, and the second screen pack mesh right-to-left is sequentially reduced, point
Wei not 60-70 mesh, 70-80 mesh, 80-100 mesh, 100-120 mesh, 120-140 mesh, 140-170 mesh；
Further, the open and close of floating-ball level switch control water inlet pipe.
The beneficial effects of the utility model are：
A kind of sapphire wafer edging cooling device, including circulating pump, water butt and filter vat, are followed using chemical coolant
The mode of ring cooling cools down to the grinding tool in sapphire wafer and edge polisher, with traditional in line type of cooling phase of RO water
Than reducing the consumption of 90%-98%RO water, and the grinding tool in the straight edge polisher of chemical coolant, reducing the abrasion of grinding tool
Amount, is improved the service life of grinding tool, circulating pump is fixed on water butt using fixing device, improves the stabilization of circulating pump
Property, preventing that circulating pump from dropping from water butt normal work or even can not damage, and enhance the security performance of cooling device, filtering
The first screen pack is provided with bucket, the second screen pack is provided with circulating pump, can effectively prevent sapphire powder from passing through circulating pump
Into in edge polisher, so that sapphire wafer edge damage is excessive, or sapphire wafer edging effect is bad, increases blue precious
Stone subsequent machining cost, reduce 1%-5% sapphire wafers and collapse angle or rupture loss ratio, cooling device uses circulating cooling
Method, chemical coolant are recycled and are not excluded for, environment will not be polluted, environment protecting is good.
Brief description of the drawings
Fig. 1 is cooling device front view.
Fig. 2 is cooling device top view.
Fig. 3 is water storage cylinder sectional view.
Fig. 4 is the second valve sectional view.
Fig. 5 is fixing device right view.
Embodiment
A kind of sapphire wafer edging cooling device, it is characterised in that including circulating pump 1, water butt 2 and filter vat 3, institute
State water butt 2 to be vertically arranged, water butt 2 is in cuboid, and water butt 2 is in hollow structure, and water butt 2 is provided with water inlet pipe 4, described
The one end of water inlet pipe 4 is connected with water butt 2, and the other end is connected with water source, and floating-ball level switch 5, the ball float are provided with water butt 2
Liquid-level switch 5 is fixedly installed on the middle part of water butt 2, and water butt 2 is provided with supporting plate 6, and the supporting plate 6 is in cuboid, support
Plate 6 is vertically arranged, and supporting plate 6 is arranged on water outlet the same side, and is fixedly connected with water butt 2, and the filter vat 3 is arranged on water storage
2 opposite sides of bucket, and the upper end of water butt 2 is arranged on, filter vat 3 is in cuboid, and filter vat 3 is hollow structure, and filter vat 3 is provided with
First screen pack 7, first screen pack 7 are set in filter vat 3, and are arranged on the middle part of filter vat 3, and the is provided with filter vat 3
Three pipelines 8, the 3rd pipeline 8 have two, and the 3rd pipeline 8 is symmetrical arranged, and the one end of the 3rd pipeline 8 is arranged on filter vat 3,
The other end of 3rd pipeline 8 is connected with edge polisher；
The circulating pump 1 is arranged on the side of water butt 2, and is arranged in supporting plate 6, and circulating pump 1 is provided with fixing device
9, and by fixing device 9 and be fixed on water butt 2, the fixing device 9 has three, and fixing device 9 is arranged on circulating pump 1
Bottom, fixing device 9 include lock handle 10, fixed plate 11 and shell 12, and the shell 12 is in cuboid, and shell 12 is set vertically
Put, the side of shell 12 is provided with groove 13, and the lock handle 10 is arranged on the upper end of shell 12, and the one end of lock handle 10 is arranged on outer
In shell 12, the fixed plate 11 is in cuboid, and fixed plate 11 is horizontally disposed, and the upper end of fixed plate 11 is fixed with the one end of lock handle 10
Connection, the side of circulating pump 1 are provided with the first valve 14, and first valve 14 is horizontally disposed, the one end of the first valve 14 and circulating pump 1
Connection, the other end are connected with the first pipeline 15, and first pipeline 15 is arranged on the side of the first valve 14, and the first pipeline 15 is another
End is connected with edge polisher, is provided with the second screen pack 16 in the first valve 14, second screen pack 16 has six, the second screen pack
16 freely arrange to the left, and the other end of circulating pump 1 is provided with the second valve 17, and second valve 17 is horizontally disposed, the second valve 17
One end is connected with circulating pump 1, and the other end is connected with second pipe 18, and the second pipe 18 is arranged on the side of the second valve 17,
The other end of second pipe 18 is connected with water butt 2, and is arranged on the bottom of water butt 2；
Further, the aperture of the first screen pack 7 is 60-70 mesh, and the mesh right-to-left of the second screen pack 16 is sequentially reduced,
Respectively 60-70 mesh, 70-80 mesh, 80-100 mesh, 100-120 mesh, 120-140 mesh, 140-170 mesh；
Further, floating-ball level switch 5 controls the open and close of water inlet pipe 4；
Further, above-mentioned be fixedly connected is fixed using conventional fixed forms such as welding, screw and nuts.
It is described above, the only preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art can readily occur in the technical scope that the utility model discloses
Change or replacement, should all cover in the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be with
The protection domain of claims is defined.
Claims (3)
- A kind of 1. sapphire wafer edging cooling device, it is characterised in that including circulating pump, water butt and filter vat, the storage Bucket is vertically arranged, and water butt is in cuboid, and water butt is in hollow structure, and water butt is provided with water inlet pipe, the water inlet pipe one End is connected with water butt, and the other end is connected with water source, is provided with floating-ball level switch in water butt, the floating-ball level switch is fixed It is arranged in the middle part of water butt, water butt is provided with supporting plate, and the supporting plate is in cuboid, and supporting plate is vertically arranged, supporting plate Water outlet the same side is arranged on, and is fixedly connected with water butt, the filter vat is arranged on water butt opposite side, and is arranged on water storage Bucket upper end, filter vat is in cuboid, and filter vat is hollow structure, and filter vat is provided with the first screen pack, first screen pack Setting in filter vat, and be arranged in the middle part of filter vat, be provided with the 3rd pipeline in filter vat, the 3rd pipeline has two, and the 3rd Pipeline is symmetrical arranged, and the 3rd pipeline one end is arranged on filter vat, and the 3rd pipeline other end is connected with edge polisher；The circulating pump is arranged on water butt side, and sets on the supporting plate, and circulating pump is provided with fixing device, and by solid Determine device and be fixed on water butt, the fixing device there are three, and fixing device is arranged on circulating pump bottom, fixing device bag Lock handle, fixed plate and shell are included, the shell is in cuboid, and housing vertical is set, and shell side is provided with groove, the lock Tight handle is arranged on shell upper end, and lock handle one end is arranged in shell, and the fixed plate is in cuboid, and fixed plate level is set Put, dead plate upper end is fixedly connected with lock handle one end, and circulating pump side is provided with the first valve, and the first valve level is set Put, first valve one end is connected with circulating pump, and the other end is connected with the first pipeline, and first pipeline is arranged on the first valve one Side, the first pipeline other end are connected with edge polisher, and the second screen pack is provided with the first valve, and second screen pack has six, Second screen pack freely arranges to the left, and the circulating pump other end is provided with the second valve, and second valve is horizontally disposed with, the second valve One end is connected with circulating pump, and the other end is connected with second pipe, and the second pipe is arranged on the second valve side, second pipe The other end is connected with water butt, and is arranged on water storage bottom of the barrel.
- A kind of 2. sapphire wafer edging cooling device as claimed in claim 1, it is characterised in that the aperture of the first screen pack For 60-70 mesh, the second screen pack mesh right-to-left is sequentially reduced, respectively 60-70 mesh, 70-80 mesh, 80-100 mesh, 100- 120 mesh, 120-140 mesh, 140-170 mesh.
- 3. a kind of sapphire wafer edging cooling device as claimed in claim 1, it is characterised in that floating-ball level switch controls The open and close of water inlet pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720738919.XU CN206998630U (en) | 2017-06-23 | 2017-06-23 | A kind of sapphire wafer edging cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720738919.XU CN206998630U (en) | 2017-06-23 | 2017-06-23 | A kind of sapphire wafer edging cooling device |
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| Publication Number | Publication Date |
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| CN206998630U true CN206998630U (en) | 2018-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201720738919.XU Active CN206998630U (en) | 2017-06-23 | 2017-06-23 | A kind of sapphire wafer edging cooling device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107053009A (en) * | 2017-06-23 | 2017-08-18 | 江苏吉星新材料有限公司 | A kind of sapphire wafer edging cooling device |
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2017
- 2017-06-23 CN CN201720738919.XU patent/CN206998630U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107053009A (en) * | 2017-06-23 | 2017-08-18 | 江苏吉星新材料有限公司 | A kind of sapphire wafer edging cooling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhejiang Zhaojing New Material Technology Co.,Ltd. Assignor: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. Contract record no.: X2022980008188 Denomination of utility model: A sapphire wafer edge grinding cooling device Granted publication date: 20180213 License type: Common License Record date: 20220627 |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221230 Address after: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee after: Youran Walker (Beijing) Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230614 Address after: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee after: TUNGHSU GROUP Co.,Ltd. Address before: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee before: Youran Walker (Beijing) Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230811 Address after: 843000 East side of Jingkai Avenue, Aksu Prefecture Economic Development Zone, Aksu City City, Xinjiang Patentee after: Xinjiang Lanjing New Material Technology Co.,Ltd. Patentee after: Beijing Zhongqixiang Technology Co.,Ltd. Address before: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee before: TUNGHSU GROUP Co.,Ltd. |