CN206976394U - A kind of graphene film and semiconductor devices - Google Patents

A kind of graphene film and semiconductor devices Download PDF

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CN206976394U
CN206976394U CN201720799002.0U CN201720799002U CN206976394U CN 206976394 U CN206976394 U CN 206976394U CN 201720799002 U CN201720799002 U CN 201720799002U CN 206976394 U CN206976394 U CN 206976394U
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汪际军
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Quanpu Semiconductor Technology (Shenzhen) Co., Ltd.
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Abstract

本实用新型提供了一种石墨烯薄膜及半导体器件,该石墨烯薄膜具有多个一面具有开口的微空腔结构,微空腔结构是由石墨烯薄膜表面的凸起结构和/或凹陷结构构成;微空腔结构的开口形成于凸起结构的底部和/或凹陷结构的顶部。本实用新型利用具有微空腔结构的石墨烯薄膜能够增加石墨烯薄膜的变形量以及比表面积,使用石墨烯薄膜应用于压电、光伏、光催化、压力探测等领域应用时,提高器件的发电效率、探测灵敏度和精度等。

The utility model provides a graphene film and a semiconductor device. The graphene film has a plurality of micro-cavity structures with openings on one side, and the micro-cavity structure is composed of a convex structure and/or a concave structure on the surface of the graphene film. ; The opening of the micro-cavity structure is formed at the bottom of the protruding structure and/or the top of the concave structure. The utility model utilizes the graphene film with a microcavity structure to increase the deformation and specific surface area of the graphene film, and when the graphene film is used in fields such as piezoelectricity, photovoltaics, photocatalysis, and pressure detection, the power generation of the device is improved. efficiency, detection sensitivity, and accuracy.

Description

一种石墨烯薄膜及半导体器件A kind of graphene film and semiconductor device

技术领域technical field

本实用新型涉及半导体技术领域,具体涉及一种石墨烯薄膜以及具有该石墨烯薄膜的半导体器件。The utility model relates to the technical field of semiconductors, in particular to a graphene film and a semiconductor device with the graphene film.

背景技术Background technique

随着半导体技术的发展和技术节点的不断降低,传统的硅材料已经表现出诸多限制和缺陷,由于石墨烯是目前世界上最薄、强度最高、导电导热性能最强的一种新型纳米材料,所以石墨烯成为理想的硅的替代品。With the development of semiconductor technology and the continuous reduction of technology nodes, traditional silicon materials have shown many limitations and defects. Since graphene is a new type of nanomaterial with the thinnest, highest strength, and strongest electrical and thermal conductivity in the world, So graphene becomes an ideal substitute for silicon.

然而,传统的石墨烯薄膜无论从宏观还是微观均采用平坦表面,包括单原子层石墨烯是微观意上的平坦表面。例如,应用于压电领域中,平坦的石墨烯薄膜在受到外界施加的力作用时产生的变形量很小,而且,在制备时,需要额外在衬底中制备出足够尺寸的空腔,这严重制约了石墨烯薄膜的应用便捷性和广泛性。同时,平坦的石墨烯薄膜的比表面积不是很理想,特别是作为电池的电极、传感器以及光催化器件等更希望具有较大的比表面积和载流子捕获能力。However, traditional graphene films use flat surfaces both macroscopically and microscopically, including monoatomic layer graphene, which is a flat surface in the microscopic sense. For example, when applied in the field of piezoelectricity, the deformation of flat graphene film is very small when it is subjected to external forces, and when it is prepared, it is necessary to additionally prepare a cavity of sufficient size in the substrate. Seriously restricting the convenience and extensiveness of the application of graphene films. At the same time, the specific surface area of the flat graphene film is not very ideal, especially as a battery electrode, sensor, and photocatalytic device, it is more desirable to have a larger specific surface area and carrier capture capacity.

实用新型内容Utility model content

为了克服以上问题,本实用新型旨在提供一种石墨烯薄膜,能够产生较多的形变以及具有更好的比表面积。In order to overcome the above problems, the utility model aims to provide a graphene film, which can produce more deformation and has better specific surface area.

为了达到上述目的,本实用新型提供了一种石墨烯薄膜,所述石墨烯薄膜具有多个一面具有开口的微空腔结构,微空腔结构是由石墨烯薄膜表面的凸起结构和/或凹陷结构构成;微空腔结构的开口形成于凸起结构的底部和/或凹陷结构的顶部。In order to achieve the above object, the utility model provides a graphene film, the graphene film has a plurality of micro-cavity structures with openings on one side, the micro-cavity structure is formed by a raised structure on the surface of the graphene film and/or The concave structure is formed; the opening of the micro-cavity structure is formed at the bottom of the protruding structure and/or the top of the concave structure.

优选地,所述石墨烯薄膜具有主平面,所述凸起结构的开口所在平面和/或所述凹陷结构的开口所在平面位于所述石墨烯薄膜的主平面所在平面;或者所述石墨烯薄膜具有主平面,所述凸起结构的开口所在平面和/或所述凹陷结构的开口所在平面与所述石墨烯薄膜的主平面所在平面不相同。Preferably, the graphene film has a main plane, the plane where the opening of the raised structure and/or the plane where the opening of the concave structure is located is located at the plane where the main plane of the graphene film is located; or the graphene film It has a main plane, and the plane where the opening of the raised structure and/or the plane where the opening of the concave structure is located is different from the plane where the main plane of the graphene film is located.

优选地,所述微空腔结构呈阵列排布,相邻行的微空腔结构相间设置。Preferably, the micro-cavity structures are arranged in an array, and the micro-cavity structures in adjacent rows are arranged alternately.

优选地,每行中凸起结构和凹陷结构相间设置,且相邻行的凸起结构之间相间设置,相邻行的凹陷结构之间相间设置。Preferably, the convex structures and the concave structures in each row are arranged alternately, and the convex structures of adjacent rows are arranged alternately, and the concave structures of adjacent rows are arranged alternately.

优选地,每行中,凸起结构在所述主平面的投影轮廓与所述凹陷结构在所述主平面的投影轮廓相切。Preferably, in each row, the projection profile of the protruding structure on the main plane is tangent to the projection profile of the concave structure on the main plane.

优选地,所述凸起结构与所述凹陷结构为全等图形关系。Preferably, the convex structure and the concave structure are in a congruent figure relationship.

优选地,所述微空腔结构的开口在所述主平面的投影轮廓被所述微空腔结构的其它区域在所述主平面的投影轮廓中的最大轮廓所包围。Preferably, the projected contour of the opening of the micro-cavity structure on the main plane is surrounded by the largest contour of the projected contours of other regions of the micro-cavity structure on the main plane.

优选地,所述开口在主平面的投影轮廓的尺寸和所述最大轮廓的尺寸为纳米级,所述开口的投影轮廓的尺寸为所述最大轮廓的尺寸的1/5~1。Preferably, the size of the projected profile of the opening on the main plane and the size of the largest profile are nanoscale, and the size of the projected profile of the opening is 1/5-1 of the size of the largest profile.

优选地,所述微空腔结构的高度为纳米级,所述微空腔结构的高度为所述开口的尺寸的1/4~1。Preferably, the height of the micro-cavity structure is nanoscale, and the height of the micro-cavity structure is 1/4˜1 of the size of the opening.

优选地,所述微空腔结构的开口在所述主平面的投影轮廓包围所述微空腔结构的其它区域在所述主平面的投影轮廓。Preferably, the projection outline of the opening of the micro-cavity structure on the main plane surrounds the projection outline of other regions of the micro-cavity structure on the main plane.

优选地,所述开口的尺寸为纳米级,所述微空腔结构的高度为纳米级,所述微空腔结构的高度为所述开口的尺寸的1/4~1。Preferably, the size of the opening is on the order of nanometers, the height of the micro-cavity structure is on the order of nanometers, and the height of the micro-cavity structure is 1/4˜1 of the size of the opening.

优选地,所述凸起结构和/或所述凹陷结构在所述主平面的投影轮廓为圆形或矩形,所述开口在所述主平面的投影轮廓为圆形或矩形。Preferably, the projected outline of the protruding structure and/or the recessed structure on the main plane is circular or rectangular, and the projected outline of the opening on the main plane is circular or rectangular.

优选地,所述微空腔结构为被开口所截的球体。Preferably, the micro-cavity structure is a sphere intercepted by an opening.

优选地,所述凸起结构包括上层结构和与之相连的下层结构,所述上层结构具有平坦表面或弧形表面,所述下层结构为倾斜侧壁,倾斜侧壁由下向上逐渐向外或向内倾斜;凹陷结构为所述凸起结构的倒置。Preferably, the protruding structure includes an upper structure and a lower structure connected thereto, the upper structure has a flat surface or an arc-shaped surface, the lower structure is an inclined side wall, and the inclined side wall gradually outwards or upwards from bottom to top. Inclined inwardly; the concave structure is the inverse of the convex structure.

优选地,仅在所述微空腔结构内壁和/或整个石墨烯薄膜表面形成有金属化合物半导体纳米薄膜。Preferably, the metal compound semiconductor nano-film is only formed on the inner wall of the micro-cavity structure and/or the entire surface of the graphene film.

优选地,所述半导体纳米薄膜为钛合金纳米薄膜和/或锌合金纳米薄膜。Preferably, the semiconductor nano-film is titanium alloy nano-film and/or zinc alloy nano-film.

优选地,所述钛合金纳米薄膜的材料为TiOx,x为正数;所述锌合金纳米薄膜为ZnO纳米薄膜。Preferably, the material of the titanium alloy nano film is TiOx, x is a positive number; the zinc alloy nano film is ZnO nano film.

优选地,所述半导体纳米薄膜由金属化合物的纳米线阵列构成。Preferably, the semiconductor nanofilm is composed of nanowire arrays of metal compounds.

优选地,所述半导体纳米薄膜的厚度与所述开口的轮廓尺寸的比例不大于1:3。Preferably, the ratio of the thickness of the semiconductor nano film to the outline size of the opening is no greater than 1:3.

优选地,所述石墨烯薄膜为单原子层厚度的石墨烯薄膜。Preferably, the graphene film is a graphene film with a monoatomic layer thickness.

为了达到上述目的,本实用新型还提供了一种探测器,具有上述任意一项所述的石墨烯薄膜作为探测部件。In order to achieve the above object, the utility model also provides a detector, which has the graphene film described in any one of the above as a detection component.

为了达到上述目的,本实用新型还提供了一种压力发电器件,其具有上述任意一项所述的石墨烯薄膜作为压电转换部件;当外界向石墨烯薄膜的凸起结构和/或凹陷结构施加作用力时,多个所述微空腔结构发生形变,从而产生电能。In order to achieve the above object, the utility model also provides a piezoelectric power generation device, which has the graphene film described in any one of the above as a piezoelectric conversion component; When force is applied, the multiple micro-cavity structures are deformed, thereby generating electric energy.

为了达到上述目的,本实用新型还提供了一种光催化器件,其具有上述任意一项所述的石墨烯薄膜作为光催化部件。In order to achieve the above purpose, the utility model also provides a photocatalytic device, which has the graphene film described in any one of the above as a photocatalytic component.

为了达到上述目的,本实用新型还提供了一种太阳能电池,具有上述任意一项所述的石墨烯薄膜作为电极或光电转换部件。In order to achieve the above purpose, the utility model also provides a solar cell, which has the graphene film described in any one of the above as an electrode or a photoelectric conversion component.

为了达到上述目的,本实用新型还提供了一种LED器件,其具有上述任意一项所述的石墨烯薄膜作为电致发光层或电极层。In order to achieve the above purpose, the utility model also provides an LED device, which has the graphene film described in any one of the above as an electroluminescent layer or an electrode layer.

为了达到上述目的,本实用新型还提供了一种储能电池,其具有上述任意一项所述的石墨烯薄膜作为电极层。In order to achieve the above object, the utility model also provides an energy storage battery, which has the graphene film described in any one of the above as an electrode layer.

本实用新型的石墨烯薄膜,利用石墨烯薄膜具有多个一面具有开口的微空腔结构,首先,由于每个微空腔结构均可以产生变形,多个微空腔结构的变形输出使得石墨烯薄膜的变形总量增多,当该石墨烯薄膜应用于压力探测器时,可以提高压力探测器的灵敏度和准确度;当该石墨烯薄膜应用于压力发电器件时,可以增加发电总量,提高发电效率;并且,形成微空腔结构的凸起结构、凹陷结构可以实现石墨烯薄膜的任意方位的压力探测能力,也即是从任意方向施加的力例如侧向、纵向或倾斜的力均可以被石墨烯薄膜探测到,从而进一步提高压力探测器件的灵敏度和准确度,并且提高压力发电器件的能量利用率、发电量和发电效率;此外,多个微空腔结构的设置可以实现多点探测,并且精准的探测出每一点的压力;其次,凸起结构和凹陷结构均可以增加石墨烯薄膜的比表面积,有利于应用于需要高比表面积的器件中。进一步的,石墨烯薄膜表面形成有金属化合物半导体纳米薄膜,使得石墨烯薄膜的比表面积进一步提高,并且利用金属化合物半导体纳米薄膜在光物理、光化学、光催化等方面所具有的突出特性,赋予石墨烯薄膜更多的半导体特性,扩宽石墨烯薄膜的应用领域。The graphene thin film of the present utility model utilizes that the graphene thin film has a plurality of microcavity structures with openings on one side. First, since each microcavity structure can be deformed, the deformation output of a plurality of microcavity structures makes the graphene The total amount of deformation of the film increases. When the graphene film is applied to a pressure detector, the sensitivity and accuracy of the pressure detector can be improved; when the graphene film is applied to a pressure power generation device, the total amount of power generation can be increased, and the power generation Efficiency; And, the protruding structure that forms microcavity structure, concave structure can realize the pressure detection ability of the arbitrary orientation of graphene film, that is to say the force such as sideways, vertical or inclined force that is applied from any direction can all be detected Graphene film is detected, thereby further improving the sensitivity and accuracy of the pressure detection device, and improving the energy utilization rate, power generation capacity and power generation efficiency of the pressure power generation device; in addition, the setting of multiple micro-cavity structures can realize multi-point detection, And the pressure at each point can be accurately detected; secondly, both the convex structure and the concave structure can increase the specific surface area of the graphene film, which is beneficial to be used in devices that require a high specific surface area. Further, a metal compound semiconductor nano-film is formed on the surface of the graphene film, which further increases the specific surface area of the graphene film, and utilizes the outstanding properties of the metal compound semiconductor nano-film in photophysics, photochemistry, photocatalysis, etc., to endow graphite More semiconducting properties of graphene films can broaden the application fields of graphene films.

并且,石墨烯薄膜由于高硬度特点,对石墨烯薄膜的微加工具有一定的难度。本实用新型利用牺牲材料和化学气相沉积技术来实现对石墨烯薄膜的成型,并通过释放工艺实现对牺牲材料的去除;进一步的,本实用新型利用石墨烯薄膜在受到外界刺激时产生形变,使得石墨烯薄膜的任意形状结构均可以与其所依附的材料层产生剥离,比如,本实用新型的一个实施例中的开口较窄的微空腔结构,当对石墨烯薄膜施加外界刺激时,使得微空腔结构产生变形,从而使微空腔结构内壁或表面的材料层与之相剥离开来。因此,本实用新型的石墨烯方法改变了现有石墨烯薄膜的加工成型思路,使得石墨烯薄膜具有多种形状结构成为可能,以及实现了石墨烯薄膜成型的灵活性。Moreover, due to the high hardness of the graphene film, it is difficult to micro-process the graphene film. The utility model utilizes sacrificial materials and chemical vapor deposition technology to realize the shaping of the graphene film, and realizes the removal of the sacrificial material through the release process; further, the utility model utilizes the deformation of the graphene film when it is subjected to external stimuli, so that Any shape and structure of the graphene film can be peeled off from the material layer to which it is attached. For example, the micro-cavity structure with narrower openings in one embodiment of the present invention, when the external stimulus is applied to the graphene film, the micro-cavity The cavity structure is deformed, so that the material layer on the inner wall or surface of the micro-cavity structure is separated from it. Therefore, the graphene method of the utility model has changed the processing and forming idea of the existing graphene film, which makes it possible for the graphene film to have various shapes and structures, and realizes the flexibility of forming the graphene film.

附图说明Description of drawings

图1为本实用新型的实施例一的石墨烯薄膜的俯视结构示意图Fig. 1 is the top view structural representation of the graphene thin film of embodiment one of the utility model

图2为本实用新型的实施例一的一种微空腔结构的截面结构示意图Fig. 2 is a schematic cross-sectional structure diagram of a micro-cavity structure in Embodiment 1 of the present utility model

图3为本实用新型的实施例一的另一种微空腔结构的截面结构示意图Fig. 3 is a schematic cross-sectional structure diagram of another microcavity structure according to Embodiment 1 of the present utility model

图4为本实用新型的实施例一的又一种微空腔结构的截面结构示意图Fig. 4 is a schematic cross-sectional structure diagram of yet another microcavity structure in Embodiment 1 of the present invention

图5为本实用新型的实施例一的一种微空腔结构的截面结构示意图Fig. 5 is a schematic cross-sectional structure diagram of a micro-cavity structure according to Embodiment 1 of the present utility model

图6为本实用新型的实施例一的另一种微空腔结构的截面结构示意图Fig. 6 is a schematic cross-sectional structure diagram of another microcavity structure according to Embodiment 1 of the present utility model

图7为本实用新型的实施例一的又一种微空腔结构的截面结构示意图Fig. 7 is a schematic cross-sectional structure diagram of yet another microcavity structure according to Embodiment 1 of the present utility model

图8为本实用新型的实施例一的一种微空腔结构的截面结构示意图Fig. 8 is a schematic cross-sectional structure diagram of a micro-cavity structure according to Embodiment 1 of the present utility model

图9为本实用新型的实施例一的另一种微空腔结构的截面结构示意图Fig. 9 is a schematic cross-sectional structure diagram of another microcavity structure according to Embodiment 1 of the present utility model

图10为本实用新型的实施例一的又一种微空腔结构的截面结构示意图Fig. 10 is a schematic cross-sectional structure diagram of yet another microcavity structure according to Embodiment 1 of the present utility model

图11为本实用新型的实施例一的石墨烯薄膜的制备方法的流程示意图Fig. 11 is the schematic flow sheet of the preparation method of the graphene thin film of embodiment one of the present utility model

图12~23为本实用新型的实施例一的石墨烯薄膜的制备方法的各步骤示意图Fig. 12~23 is the schematic diagram of each step of the preparation method of the graphene thin film of embodiment one of the present utility model

图24为本实用新型的实施例二的石墨烯薄膜的俯视结构示意图Fig. 24 is a top view structure schematic diagram of the graphene film of the second embodiment of the utility model

图25为本实用新型的实施例二的一种微空腔结构的截面结构示意图Fig. 25 is a schematic cross-sectional structure diagram of a micro-cavity structure in Embodiment 2 of the present utility model

图26为本实用新型的实施例二的另一种微空腔结构的截面结构示意图Fig. 26 is a schematic cross-sectional structure diagram of another microcavity structure according to Embodiment 2 of the present utility model

图27为本实用新型的实施例二的又一种微空腔结构的截面结构示意图Fig. 27 is a schematic cross-sectional structure diagram of yet another microcavity structure according to Embodiment 2 of the present utility model

具体实施方式Detailed ways

为使本实用新型的内容更加清楚易懂,以下结合说明书附图,对本实用新型的内容作进一步说明。当然本实用新型并不局限于该具体实施例,本领域内的技术人员所熟知的一般替换也涵盖在本实用新型的保护范围内。In order to make the content of the utility model clearer and easier to understand, the content of the utility model will be further described below in conjunction with the accompanying drawings of the description. Of course, the utility model is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the utility model.

本实用新型的石墨烯薄膜具有多个一面具有开口的微空腔结构,微空腔结构是由石墨烯薄膜表面的凸起结构和/或凹陷结构构成;微空腔结构的开口形成于凸起结构的底部和/或凹陷结构的顶部。The graphene film of the present utility model has a plurality of microcavity structures with openings on one side, and the microcavity structure is composed of a convex structure and/or a concave structure on the surface of the graphene film; the opening of the microcavity structure is formed on the protrusion the bottom of the structure and/or the top of the recessed structure.

以下结合附图1-27和具体实施例对本实用新型作进一步详细说明。需说明的是,附图均采用非常简化的形式、使用非精准的比例,且仅用以方便、清晰地达到辅助说明本实施例的目的。Below in conjunction with accompanying drawing 1-27 and specific embodiment the utility model is described in further detail. It should be noted that the drawings are all in a very simplified form, using imprecise scales, and are only used to facilitate and clearly achieve the purpose of assisting in describing the present embodiment.

实施例一Embodiment one

本实施例中,请参阅图1~图10,石墨烯薄膜G具有多个一面具有开口的微空腔结构,微空腔结构是由石墨烯薄膜G表面的凸起结构T和凹陷结构A构成;微空腔结构的开口形成于凸起结构T的底部和凹陷结构A的顶部。In this embodiment, please refer to FIGS. 1 to 10. The graphene film G has a plurality of microcavity structures with openings on one side. The microcavity structure is composed of a raised structure T and a concave structure A on the surface of the graphene film G. ; The opening of the micro-cavity structure is formed at the bottom of the protruding structure T and the top of the concave structure A.

图1中,凹陷结构A的开口AK从俯视图上显示出来,而凸起结构T的开口不能从俯视图显示出来。这里的微空腔结构呈阵列排布,相邻行的微空腔结构相间设置。较佳的,多个凸起结构T为全等图形,多个凹陷结构A为全等图形;每行的微空腔结构为凸起结构T和凹陷结构A相间设置,且相邻行的凸起结构T之间相间设置,相邻行的凹陷结构A之间相间设置;凸起结构T与凹陷结构A为全等图形关系。In FIG. 1 , the opening AK of the recessed structure A is shown from the top view, while the opening of the raised structure T cannot be shown from the top view. The micro-cavity structures here are arranged in an array, and the micro-cavity structures in adjacent rows are arranged alternately. Preferably, a plurality of protruding structures T are congruent figures, and a plurality of recessed structures A are congruent figures; the micro-cavity structures of each row are alternately arranged with protruding structures T and recessed structures A, and the protruding structures A of adjacent rows The raised structures T are arranged alternately, and the recessed structures A in adjacent rows are arranged alternately; the raised structures T and the recessed structures A are in a congruent figure relationship.

本实施例中,石墨烯薄膜G具有主平面,主平面为凸起结构和/或凹陷结构区域之外的大面积的石墨烯薄膜所在平面,或者说,整个石墨烯薄膜G边缘区域所在平面。如图2~10中箭头所指。这里,凸起结构T和凹陷结构A在石墨烯薄膜G的主平面的投影为圆形,如图1所示;而开口在石墨烯薄膜G的主平面的投影也为圆形。当然,本实用新型的其它实施例中,凸起结构和凹陷结构在石墨烯薄膜的主平面的投影为矩形,开口在石墨烯薄膜的主平面的投影也为矩形,例如长方形或正方形等;或者,在本实用新型的其它实施例中,开口在石墨烯薄膜的主平面的投影的形状与凸起结构和凹陷结构在石墨烯薄膜的主平面的投影的形状不相同,例如,开口的投影形状为圆形,而凹陷结构和凸起结构的投影形状为正方形等。In this embodiment, the graphene film G has a main plane, and the main plane is the plane where the large-area graphene film outside the convex structure and/or the concave structure area is located, or in other words, the plane where the edge region of the entire graphene film G is located. As indicated by the arrows in Figure 2-10. Here, the projections of the raised structures T and the depressed structures A on the main plane of the graphene film G are circular, as shown in FIG. 1 ; and the projections of the openings on the main plane of the graphene film G are also circular. Of course, in other embodiments of the present utility model, the projection of the convex structure and the concave structure on the main plane of the graphene film is a rectangle, and the projection of the opening on the main plane of the graphene film is also a rectangle, such as a rectangle or a square; or , in other embodiments of the present utility model, the shape of the projection of the opening on the main plane of the graphene film is different from the shape of the projection of the convex structure and the concave structure on the main plane of the graphene film, for example, the projected shape of the opening is circular, while the projected shapes of the concave structure and the convex structure are square, etc.

再次参阅图1,每行中,凸起结构T在主平面的投影轮廓与凹陷结构A在主平面的投影轮廓相切。当然,在本实用新型的其它实施例中,每行中,凸起结构T在主平面的投影轮廓与凹陷结构A在主平面的投影轮廓之间也可以具有一定的间隔,例如呈等间距排布。Referring to FIG. 1 again, in each row, the projected profile of the protruding structure T on the main plane is tangent to the projected profile of the recessed structure A on the main plane. Of course, in other embodiments of the present utility model, in each row, there may also be a certain interval between the projected contours of the protruding structures T on the main plane and the projected contours of the recessed structures A on the main plane, for example, in an equidistant row cloth.

本实施例的微空腔结构的开口在主平面的投影轮廓被微空腔结构的其它区域在主平面的投影轮廓中的最大轮廓所包围,简言之,凸起结构为"上宽下窄"型,凹陷结构为"下宽上窄"型。The projected contour of the opening of the microcavity structure in this embodiment on the main plane is surrounded by the largest contours of other areas of the microcavity structure in the projected contours of the main plane. In short, the raised structure is "wide at the top and narrow at the bottom". "type, the concave structure is "wide at the bottom and narrow at the top".

本实施例中,微空腔结构可以为被开口所截的球体,或者形成微空腔结构的凸起结构包括上层结构和与之相连的下层结构,上层结构具有平坦表面(如图4所示)或弧形表面(如图3所示),下层结构为倾斜侧壁,倾斜侧壁由下向上逐渐向外倾斜;并且,凹陷结构为凸起结构的倒置。In this embodiment, the microcavity structure can be a sphere cut by the opening, or the protruding structure forming the microcavity structure includes an upper structure and a lower structure connected thereto, and the upper structure has a flat surface (as shown in Figure 4 ) or a curved surface (as shown in Figure 3), the underlying structure is an inclined side wall, and the inclined side wall gradually slopes outward from bottom to top; and the concave structure is the inversion of the convex structure.

请参阅图2,凸起结构T1和凹陷结构A1均为分别被开口T1K和A1K所截的球体;凸起结构T1形成了微空腔结构Q11,凹陷结构A1形成了微空腔结构Q12。例如,该石墨烯薄膜中的被开口所截球体的凸起结构和凹陷结构的制备可以但不限于包括:首先,将制备好的石墨烯薄膜转移至一基底上,然后采用冲压等机械制造工艺制备出具有凹陷结构A1的石墨烯薄膜;同时,可以采用倒模、浇注、脱模等现有材料成型工艺来制备出具有凸起结构T1的基底,例如,首先在基底中采用倒模制备出凸起结构的倒置沟槽,再在倒置沟槽中浇注材料,然后将基底倒置过来与具有凹陷结构A1的石墨烯薄膜相键合,使凸起结构A1设置于石墨烯薄膜相应位置;再经脱模工艺去除基底,使凸起结构T1暴露出来,从而形成于石墨烯薄膜上。Please refer to FIG. 2 , the protruding structure T1 and the concave structure A1 are spheres cut by the openings T1K and A1K respectively; the protruding structure T1 forms the microcavity structure Q11 , and the concave structure A1 forms the microcavity structure Q12 . For example, the preparation of the convex structure and the concave structure of the truncated sphere in the graphene film may include but not limited to: first, transfer the prepared graphene film to a substrate, and then use mechanical manufacturing processes such as stamping Prepare a graphene film with a concave structure A1; at the same time, the substrate with a raised structure T1 can be prepared by using existing material molding processes such as inversion, pouring, and demoulding. The inverted groove of the convex structure, and then pouring material in the inverted groove, and then the substrate is turned upside down and bonded with the graphene film with the concave structure A1, so that the convex structure A1 is arranged at the corresponding position of the graphene film; The demoulding process removes the substrate, exposing the protruding structures T1 to be formed on the graphene film.

请参阅图3,形成微空腔结构Q21的凸起结构T2包括上层结构和与之相连的下层结构,上层结构具有弧形表面,下层结构为倾斜侧壁,倾斜侧壁由下向上逐渐向外倾斜;凸起结构T2的底部具有开口T2K;而凹陷结构A2为凸起结构T2的倒置,凹陷结构A2具有微空腔结构Q22,凹陷结构A2的底部具有开口A2K。例如,该石墨烯薄膜中的凸起结构T2和凹陷结构A2的制备可以但不限于包括:首先,将制备好的石墨烯薄膜转移至一基底上,然后采用冲压等机械制造工艺制备出具有凹陷结构A2的石墨烯薄膜;同时,可以采用倒模、浇注、脱模等现有材料成型工艺来制备出具有凸起结构T2的基底,例如,首先在基底中采用倒模制备出凸起结构的倒置沟槽,再在倒置沟槽中浇注材料,然后将基底倒置过来与具有凹陷结构A2的石墨烯薄膜相键合,使凸起结构A2设置于石墨烯薄膜相应位置;再经脱模工艺去除基底,使凸起结构T2暴露出来,从而形成于石墨烯薄膜上。Please refer to Fig. 3, the protruding structure T2 forming the microcavity structure Q21 includes an upper structure and a lower structure connected thereto. The upper structure has a curved surface, and the lower structure is an inclined side wall, and the inclined side wall gradually outwards from bottom to top. Inclined; the bottom of the protruding structure T2 has an opening T2K; and the recessed structure A2 is the inversion of the protruding structure T2, the recessed structure A2 has a micro-cavity structure Q22, and the bottom of the recessed structure A2 has an opening A2K. For example, the preparation of the raised structure T2 and the depressed structure A2 in the graphene film may include, but is not limited to: first, transfer the prepared graphene film to a substrate, and then use a mechanical manufacturing process such as punching to prepare a structure with a concave structure. The graphene film of structure A2; At the same time, existing material molding processes such as pouring, pouring, and demoulding can be used to prepare a substrate with a raised structure T2. Invert the groove, then pour the material in the inverted groove, and then turn the substrate upside down and bond it with the graphene film with the concave structure A2, so that the raised structure A2 is set at the corresponding position of the graphene film; and then removed by the demoulding process The substrate exposes the raised structure T2, thereby forming on the graphene film.

请参阅图4,形成微空腔结构Q31的凸起结构T3包括上层结构和与之相连的下层结构,上层结构具有平坦表面,下层结构为倾斜侧壁,倾斜侧壁由下向上逐渐向外倾斜;凸起结构T3的底部具有开口T3K;而凹陷结构A3为凸起结构T3的倒置,凹陷结构A3具有微空腔结构Q32,凹陷结构A3的底部具有开口A3K。例如,该石墨烯薄膜中的被开口所截球体的凸起结构T3和凹陷结构A3的制备可以但不限于包括:首先,将制备好的石墨烯薄膜转移至一基底上,然后采用冲压等机械制造工艺制备出具有凹陷结构A3的石墨烯薄膜;同时,可以采用倒模、浇注、脱模等现有材料成型工艺来制备出具有凸起结构T3的基底,例如,首先在基底中采用倒模制备出凸起结构的倒置沟槽,再在倒置沟槽中浇注材料,然后将基底倒置过来与具有凹陷结构A3的石墨烯薄膜相键合,使凸起结构A3设置于石墨烯薄膜相应位置;再经脱模工艺去除基底,使凸起结构T3暴露出来,从而形成于石墨烯薄膜上。Please refer to FIG. 4, the protruding structure T3 forming the microcavity structure Q31 includes an upper structure and a lower structure connected thereto. The upper structure has a flat surface, and the lower structure is an inclined side wall, and the inclined side wall gradually slopes outward from bottom to top. The bottom of the protruding structure T3 has an opening T3K; and the recessed structure A3 is an inversion of the protruding structure T3, the recessed structure A3 has a micro-cavity structure Q32, and the bottom of the recessed structure A3 has an opening A3K. For example, the preparation of the convex structure T3 and the concave structure A3 in the graphene film, which are truncated by openings, may include, but is not limited to: first, transfer the prepared graphene film to a substrate, and then use machinery such as stamping to The manufacturing process prepares a graphene film with a concave structure A3; at the same time, existing material molding processes such as inversion, casting, and demoulding can be used to prepare a substrate with a convex structure T3. Prepare an inverted groove with a raised structure, pour materials into the inverted groove, and then turn the substrate upside down and bond it to the graphene film with the concave structure A3, so that the raised structure A3 is arranged at the corresponding position of the graphene film; Then, the substrate is removed through a demoulding process, exposing the raised structure T3 to be formed on the graphene film.

此外,本实施例中,凸起结构T的开口所在平面和/或凹陷结构A的开口所在平面与石墨烯薄膜G的主平面所在平面可以相同,也可以不相同。In addition, in this embodiment, the plane where the opening of the protruding structure T and/or the plane where the opening of the recessed structure A is located and the plane where the main plane of the graphene film G is located may or may not be the same.

凸起结构T的开口所在平面和/或凹陷结构A的开口所在平面与石墨烯薄膜G的主平面所在平面可以相同的情况请再次参阅图2~4,图中箭头所指为石墨烯薄膜G的主平面所在平面;图2中,凸起结构T1的开口T1K所在平面和凹陷结构A1的开口A1K所在平面相同,也均位于石墨烯薄膜G的主平面所在平面。图3中,凸起结构T2的开口T2K所在平面和凹陷结构A2的开口A2K所在平面相同,也均位于石墨烯薄膜G的主平面所在平面。图4中,凸起结构T3的开口T3K所在平面和凹陷结构A3的开口A3K所在平面相同,也均位于石墨烯薄膜G的主平面所在平面。The plane where the opening of the raised structure T and/or the plane where the opening of the recessed structure A is located can be the same as the plane where the main plane of the graphene film G is located. Please refer to Figures 2-4 again. The arrows in the figure refer to the graphene film G The plane where the main plane of the graphene film G is located; in Figure 2, the plane where the opening T1K of the raised structure T1 is located is the same as the plane where the opening A1K of the recessed structure A1 is located, and is also located on the plane where the main plane of the graphene film G is located. In FIG. 3 , the plane where the opening T2K of the protruding structure T2 is located is the same as the plane where the opening A2K of the concave structure A2 is located, and both are located on the plane where the main plane of the graphene film G is located. In FIG. 4 , the plane where the opening T3K of the raised structure T3 is located is the same as the plane where the opening A3K of the recessed structure A3 is located, and both are located on the plane where the main plane of the graphene film G is located.

凸起结构T的开口所在平面和/或凹陷结构A的开口所在平面与石墨烯薄膜G的主平面所在平面可以不相同的情况请参阅图5~图10,其中图5~7为石墨烯薄膜的主平面高于凸起结构的开口和凹陷结构的开口的示例,此时石墨烯薄膜G的主平面与凸起结构顶部相齐平;图8~10为石墨烯薄膜的主平面低于凸起结构的开口和凹陷结构的开口的示例,此时石墨烯薄膜G的主平面与凹陷结构的底部相齐平。The plane of the opening of the raised structure T and/or the plane of the opening of the recessed structure A and the plane of the main plane of the graphene film G may be different, please refer to Figures 5 to 10, where Figures 5 to 7 are graphene films The main plane of the graphene film G is higher than the opening of the convex structure and the example of the opening of the concave structure. At this time, the main plane of the graphene film G is flush with the top of the convex structure; An example of the opening of the structure and the opening of the recessed structure, at this time, the main plane of the graphene film G is flush with the bottom of the recessed structure.

本实用新型中,开口在主平面的投影轮廓的尺寸和上述的最大轮廓的尺寸均为纳米级,较佳的,开口的轮廓的尺寸为上述最大轮廓的尺寸的1/5~1。这里所说的尺寸包含直径、长、宽等尺寸数据。本实施例中,凸起结构和凹陷结构在主平面的投影轮廓均为圆形,开口在主平面的投影轮廓的直径和上述的最大轮廓的直径均为纳米级,较佳的,本实用新型的微空腔结构的各类尺寸为纳米级,开口的轮廓的直径可以为1~100nm,最大轮廓的直径可以大于1nm且小于200nm;这里,开口的投影轮廓的直径可以为最大轮廓的直径的4/5。In the present invention, the size of the projected profile of the opening on the main plane and the size of the above-mentioned maximum profile are both nanoscale. Preferably, the size of the profile of the opening is 1/5-1 of the size of the above-mentioned maximum profile. The size mentioned here includes dimensional data such as diameter, length, and width. In this embodiment, the projected contours of the convex structure and the concave structure on the main plane are both circular, and the diameters of the projected contours of the openings on the main plane and the diameter of the above-mentioned largest contour are both nanoscale. Preferably, the utility model The various sizes of the microcavity structure are nanoscale, the diameter of the contour of the opening can be 1-100nm, and the diameter of the largest contour can be greater than 1nm and less than 200nm; here, the diameter of the projected contour of the opening can be the diameter of the largest contour 4/5.

本实用新型中,微空腔结构的高度为纳米级,微空腔结构的高度为开口的尺寸的1/4~1,这里所说的尺寸包含直径、长、宽等尺寸数据。这样,微空腔结构的开口窄且微空腔结构的其它区域宽,微空腔结构整体为扁型,一则小的深宽比在制备时具有大工艺窗口而易于制备,二则形状较扁的微空腔结构能够提高横向受力接触面积,而且在微空腔结构顶部受力时,微空腔结构侧壁能够给予更加良好的固定和支撑;三则降低整个石墨烯薄膜的高度。In the present invention, the height of the micro-cavity structure is nanoscale, and the height of the micro-cavity structure is 1/4 to 1 of the size of the opening. The size mentioned here includes dimensional data such as diameter, length, and width. In this way, the opening of the microcavity structure is narrow and other regions of the microcavity structure are wide. The flat micro-cavity structure can increase the lateral force contact area, and when the top of the micro-cavity structure is stressed, the side walls of the micro-cavity structure can provide better fixation and support; thirdly, the height of the entire graphene film can be reduced.

本实施例中,在微空腔结构内壁形成有金属化合物半导体纳米薄膜。半导体纳米薄膜可以由金属化合物的纳米线阵列构成,半导体纳米薄膜可以为钛合金纳米薄膜和/或锌合金纳米薄膜,较佳的,钛合金纳米薄膜的材料为TiOx,x为正数;锌合金纳米薄膜为ZnO纳米薄膜。本实施例中,半导体纳米薄膜的厚度与开口的轮廓尺寸的比例不大于1:3,从而使得半导体纳米薄膜不会破坏微空腔结构。较佳的,石墨烯薄膜可以为单原子层厚度的石墨烯薄膜,单原子层石墨烯薄膜具有更高强度和透明性,能够得到更加广泛的应用。需要说明的是,本实用新型的其它实施例中,在石墨烯薄膜的上表面和/或下表面都可以形成金属化合物半导体纳米薄膜。In this embodiment, a metal compound semiconductor nano film is formed on the inner wall of the micro-cavity structure. The semiconductor nanofilm can be composed of a nanowire array of a metal compound. The semiconductor nanofilm can be a titanium alloy nanofilm and/or a zinc alloy nanofilm. Preferably, the material of the titanium alloy nanofilm is TiOx, and x is a positive number; The nano film is a ZnO nano film. In this embodiment, the ratio of the thickness of the semiconductor nano-film to the outline size of the opening is not greater than 1:3, so that the semiconductor nano-film will not damage the microcavity structure. Preferably, the graphene film can be a graphene film with a single atomic layer thickness, and the single atomic layer graphene film has higher strength and transparency, and can be used more widely. It should be noted that, in other embodiments of the present invention, the metal compound semiconductor nano-film can be formed on the upper surface and/or the lower surface of the graphene film.

在本实施例中,石墨烯薄膜上表面和/或下表面还可以具有金属纳米薄膜;则上述的金属化合物半导体纳米薄膜仅在微空腔结构内壁的金属纳米薄膜的表面上形成;和/或整个石墨烯薄膜上表面的金属纳米薄膜和/或整个石墨烯薄膜下表面的金属纳米薄膜上形成有金属化合物半导体纳米薄膜。金属纳米薄膜的材料可以为铜或镍。In this embodiment, the upper surface and/or the lower surface of the graphene film can also have a metal nanofilm; then the above-mentioned metal compound semiconductor nanofilm is only formed on the surface of the metal nanofilm on the inner wall of the microcavity structure; and/or A metal compound semiconductor nanofilm is formed on the metal nanofilm on the upper surface of the entire graphene film and/or on the metal nanofilm on the lower surface of the entire graphene film. The material of the metal nano film can be copper or nickel.

请参阅图11,本实施例的石墨烯薄膜的制备方法,以制备上述图4中的具有凸起结构和凹陷结构的石墨烯薄膜为例进行说明,其包括:Please refer to FIG. 11 , the preparation method of the graphene film of the present embodiment is illustrated by preparing the graphene film with a raised structure and a concave structure in the above-mentioned FIG. 4 as an example, which includes:

步骤01:请参阅图12,采用光刻和刻蚀工艺,制备出具有凸起结构T和/或凹陷结构A的牺牲层衬底101;Step 01: Referring to FIG. 12 , a sacrificial layer substrate 101 having a raised structure T and/or a recessed structure A is prepared by photolithography and etching processes;

具体的,本实施例中,在牺牲层衬底101上形成凸起结构T和凹陷结构A的过程,可以采用逐层具体包括:Specifically, in this embodiment, the process of forming the protruding structure T and the recessed structure A on the sacrificial layer substrate 101 may specifically include:

步骤011:制备光刻版图;Step 011: preparing a photolithography layout;

这里,本实施例中版图图形中,微空腔结构的图形呈阵列排布,相邻行的微空腔结构的图形相间设置,且其中一行的微空腔结构图形的一个边缘与其相间设置的另一行的微空腔结构图形的一个边缘位于同一直线上;本实用新型中,版图图形包括凸起结构图形层和/或凹陷结构图形层,本实施例中,版图图形包括凸起结构图形层和凹陷结构图形层;当凸起结构图形层和凹陷结构图形层叠套时,多个凸起结构图形为全等图形,多个凹陷结构图形为全等图形;每行中凸起结构图形和凹陷结构图形相间设置,且相邻行的凸起结构图形之间相间设置,相邻行的凹陷结构图形之间相间设置。Here, in the layout graphics in this embodiment, the graphics of the microcavity structures are arranged in an array, the graphics of the microcavity structures in adjacent rows are arranged alternately, and one edge of the microcavity structure graphics of one row is arranged alternately with the One edge of another row of micro-cavity structure graphics is located on the same straight line; in the present utility model, the layout graphics include a raised structure graphics layer and/or a concave structure graphics layer, and in this embodiment, the layout graphics include a raised structure graphics layer and the concave structure graphics layer; when the convex structure graphics layer and the concave structure graphics layer are stacked, the multiple convex structure graphics are congruent graphics, and the multiple concave structure graphics are congruent graphics; the convex structure graphics and the depressions in each row The structural graphics are arranged alternately, and the convex structural graphics of adjacent rows are arranged alternately, and the concave structural graphics of adjacent rows are arranged alternately.

步骤012:采用步骤011的光刻版图,通过光刻和干法刻蚀工艺,在牺牲层中刻蚀出凸起结构和/或凹陷结构。Step 012: Using the photolithography layout of step 011, through photolithography and dry etching process, etch the convex structure and/or the concave structure in the sacrificial layer.

这里,由于本实施例中同时具有凸起结构和凹陷结构,所以这里,首先,在牺牲层表面涂覆光刻胶,利用凸起结构图形层的版图,经曝光显影,在光刻胶中形成凸起结构图案;然后,采用可以但不限于等离子体刻蚀工艺来刻蚀牺牲层,从而在牺牲层中形成凸起结构;接着,再次涂覆光刻胶,利用凹陷结构图形层的版图,经曝光显影,在光刻胶中形成凹陷结构图案;再采用可以但不限于等离子体刻蚀工艺来刻蚀牺牲层,从而在牺牲层中形成凹陷结构;凸起结构和凹陷结构最终的位置关系和上述光刻版图的图形的位置关系相同。Here, since this embodiment has both a raised structure and a recessed structure, here, firstly, a photoresist is coated on the surface of the sacrificial layer, and the pattern layer of the raised structure pattern is used to form in the photoresist after exposure and development. The pattern of the raised structure; then, the sacrificial layer is etched using but not limited to a plasma etching process, thereby forming a raised structure in the sacrificial layer; then, the photoresist is coated again, and the layout of the patterned layer of the recessed structure is used, After exposure and development, a recessed structure pattern is formed in the photoresist; the sacrificial layer can be etched by but not limited to a plasma etching process, thereby forming a recessed structure in the sacrificial layer; the final positional relationship between the raised structure and the recessed structure It is the same as the positional relationship of the graphics in the above photolithography layout.

具体的,以制备图4的石墨烯薄膜所采用的牺牲层衬底为例。请参阅图13~16。首先,请参阅图13,提供一牺牲层衬底101,并且在牺牲层衬底101上表面沉积与牺牲层衬底101的材料不同的牺牲材料层102,并且,采用光刻和刻蚀工艺在牺牲材料层102中刻蚀出凸起结构和凹陷结构之间的形状,由于等离子体干法刻蚀工艺的速率可调节,通常所刻蚀的线条是上大下小的沟槽,所以采用常规工艺就可以刻蚀出倾斜侧壁,从图13中看,倾斜侧壁为两层,因此,可以采用"沉积一层牺牲材料层-光刻和刻蚀该牺牲材料层"依此至少两次循环来得到图13中的结构;然后,请参阅图14,在图13中得到的结构的间隔中再次填充与牺牲层衬底101的材料相同牺牲材料103;接着,请参阅图15,针对牺牲材料层102的材料采用相应的释放工艺来去除牺牲材料层102,并且该释放工艺不会对牺牲层衬底101和牺牲材料103产生腐蚀;然后,请参阅图16,涂覆光刻胶,将图15中的牺牲层衬底最右边缘的牺牲材料103暴露出来,并且对暴露出的牺牲材料103进行刻蚀或采用释放工艺去除牺牲层衬底101最右边缘的牺牲材料103,然后,采用光刻工艺将图15中的牺牲层衬底101最左侧的牺牲材料103的左侧边缘暴露出来;接着,在光刻胶表面以及暴露出的牺牲层衬底101表面沉积一层与牺牲层衬底101的材料相同的牺牲材料104,牺牲材料104的厚度小于牺牲材料103的厚度,为了使凸起结构和凹陷结构的开口与石墨烯薄膜的主平面在同一平面,牺牲材料104的顶部与牺牲材料103倾斜侧壁的下层的顶部齐平。然后,再沉积一层光刻胶并且经光刻工艺掩盖住牺牲材料104且将牺牲材料103上方的前层光刻胶暴露出来,然后采用针对牺牲材料104的材料的释放工艺或刻蚀工艺去除前层光刻胶层上的牺牲材料104,最后,去除所有的光刻胶,即可得到图12所示的结构。当然,为了使凸起结构和凹陷结构的开口高于石墨烯薄膜的主平面,还可以使牺牲材料104的顶部高于牺牲材料103倾斜侧壁的下层的顶部;此外,为了使凸起结构和凹陷结构的开口低于石墨烯薄膜的主平面,还可以使牺牲材料104的顶部低于牺牲材料103倾斜侧壁的下层的顶部,或者就不执行沉积牺牲材料104的步骤即可。然则,对于形成图12中的结构还可以采用其它的常规手段组合来实现,这应当理解为均在本实用新型的范围之内。Specifically, take the sacrificial layer substrate used to prepare the graphene thin film in FIG. 4 as an example. Please refer to Figures 13-16. First, referring to FIG. 13 , a sacrificial layer substrate 101 is provided, and a sacrificial material layer 102 different from the material of the sacrificial layer substrate 101 is deposited on the upper surface of the sacrificial layer substrate 101, and photolithography and etching processes are used to The shape between the convex structure and the concave structure is etched in the sacrificial material layer 102. Since the rate of the plasma dry etching process can be adjusted, usually the etched lines are trenches with a large top and a small bottom, so conventional The slanted sidewall can be etched by the process. As seen from FIG. 13, the slanted sidewall has two layers. Therefore, "depositing a sacrificial material layer-photolithography and etching the sacrificial material layer" can be used at least twice Cycle to obtain the structure in FIG. 13; then, please refer to FIG. 14, fill again the same sacrificial material 103 with the material of the sacrificial layer substrate 101 in the gap of the structure obtained in FIG. 13; then, please refer to FIG. The material of the material layer 102 adopts a corresponding release process to remove the sacrificial material layer 102, and the release process will not corrode the sacrificial layer substrate 101 and the sacrificial material 103; then, please refer to FIG. 16, apply photoresist, and The sacrificial material 103 at the rightmost edge of the sacrificial layer substrate in FIG. The photolithography process exposes the left edge of the sacrificial material 103 on the leftmost side of the sacrificial layer substrate 101 in FIG. The same sacrificial material 104 of the material of the substrate 101, the thickness of the sacrificial material 104 is less than the thickness of the sacrificial material 103, in order to make the opening of the raised structure and the recessed structure be on the same plane as the main plane of the graphene film, the top of the sacrificial material 104 and The tops of the lower layers of the sacrificial material 103 sloped sidewalls are flush. Then, deposit a layer of photoresist and cover the sacrificial material 104 through a photolithography process and expose the front layer of photoresist above the sacrificial material 103, and then use a release process or an etching process for the material of the sacrificial material 104 to remove The sacrificial material 104 on the front photoresist layer, and finally, all the photoresist is removed to obtain the structure shown in FIG. 12 . Certainly, in order to make the opening of the raised structure and the recessed structure higher than the main plane of the graphene film, the top of the sacrificial material 104 can also be made higher than the top of the lower layer of the sacrificial material 103 inclined sidewall; The opening of the recessed structure is lower than the main plane of the graphene film, and the top of the sacrificial material 104 may be lower than the top of the lower layer of the sacrificial material 103 with inclined sidewalls, or the step of depositing the sacrificial material 104 may not be performed. However, the structure in FIG. 12 can also be realized by combining other conventional means, which should be understood as being within the scope of the present invention.

步骤02:在牺牲层衬底表面生长一层金属催化剂纳米薄膜;Step 02: growing a metal catalyst nano film on the surface of the sacrificial layer substrate;

具体的,金属催化剂纳米薄膜的材料可以为铜或镍;这里可以但不限于采用真空蒸度工艺在形成有凸起结构和凹陷结构的牺牲层衬底表面来沉积一层金属催化剂纳米薄膜;考虑到作为催化剂,而且金属催化剂薄膜不能够过厚,较佳的,金属催化剂纳米薄膜的厚度为1~5nm。这里的金属催化剂纳米薄膜还可作为上述的石墨烯薄膜下表面的金属纳米薄膜,如需该金属催化剂纳米薄膜,则不需要执行步骤05即可。Specifically, the material of the metal catalyst nano film can be copper or nickel; here, but not limited to, a vacuum evaporation process can be used to deposit a layer of metal catalyst nano film on the surface of the sacrificial layer substrate formed with a raised structure and a recessed structure; consider To be used as a catalyst, and the metal catalyst film cannot be too thick, preferably, the thickness of the metal catalyst nano film is 1-5 nm. The metal catalyst nano-film here can also be used as the metal nano-film on the lower surface of the above-mentioned graphene film. If the metal catalyst nano-film is needed, step 05 is not required.

步骤03:请参阅图17,采用化学气相沉积工艺,在金属催化剂纳米薄膜表面包括凸起结构表面和/或凹陷结构内侧壁表面生长出石墨烯薄膜G;石墨烯薄膜G依附于凸起结构和/或凹陷结构生长,从而使得石墨烯薄膜G形成于牺牲层衬底101相同的具有多个凸起结构和/或凹陷结构;Step 03: Please refer to Figure 17, using a chemical vapor deposition process, a graphene film G is grown on the surface of the metal catalyst nano-film including the surface of the raised structure and/or the inner wall surface of the recessed structure; the graphene film G is attached to the raised structure and / or the growth of the recessed structure, so that the graphene film G is formed on the same sacrificial layer substrate 101 with a plurality of raised structures and/or recessed structures;

具体的,化学气相沉积工艺的具体参数可以根据实际需要来调整,这里不作限制。由于石墨烯薄膜依附生长于牺牲层衬底表面,因而,利用保型性原理,石墨烯薄膜中形成凸起结构和凹陷结构,凸起结构和凹陷结构形成了多个一面具有开口的微空腔结构。Specifically, specific parameters of the chemical vapor deposition process can be adjusted according to actual needs, and are not limited here. Since the graphene film grows attached to the surface of the sacrificial layer substrate, using the principle of shape retention, a convex structure and a concave structure are formed in the graphene film, and the convex structure and the concave structure form a plurality of micro cavities with openings on one side structure.

此外,本实施例的上述石墨烯薄膜表面还具有金属化合物半导体纳米薄膜,因此,步骤03之后且在步骤04之前,还包括:可以但不限于采用化学气相沉积法或水溶液法在石墨烯薄膜上表面制备金属化合物半导体纳米薄膜;In addition, the surface of the above-mentioned graphene film of the present embodiment also has a metal compound semiconductor nano-film, therefore, after step 03 and before step 04, it also includes: but not limited to using chemical vapor deposition or aqueous solution method on the graphene film Surface preparation of metal compound semiconductor nano film;

并且,步骤03之后且在步骤04之前,还可以包括:首先,在石墨烯薄膜上表面制备金属纳米薄膜;然后在金属纳米薄膜上制备金属化合物半导体纳米薄膜。Moreover, after step 03 and before step 04, it may also include: firstly, preparing a metal nano-film on the upper surface of the graphene film; then preparing a metal compound semiconductor nano-film on the metal nano-film.

步骤04:请参参阅图18,采用释放工艺,去除牺牲层衬底;Step 04: Referring to Figure 18, remove the sacrificial layer substrate using a release process;

这里,牺牲层的材料可以为有机材料,例如光刻胶、聚酰亚胺等,也可以为无机材料,如非晶硅材料、氧化硅等;关于牺牲层材料和对应的释放工艺可以采用常规工艺,这是本领域技术人员可以知晓的,在此不再赘述。Here, the material of the sacrificial layer can be an organic material, such as photoresist, polyimide, etc., or an inorganic material, such as amorphous silicon material, silicon oxide, etc.; the material of the sacrificial layer and the corresponding release process can be conventional The process is known to those skilled in the art and will not be repeated here.

这里需要说明的是,考虑到牺牲层衬底在释放去除后导致石墨烯薄膜的寻找困难,可以实现在进行释放工艺之前,如图18所示,在牺牲层衬底的底部和侧壁形成支撑层Z,该支撑层Z不会在任何释放工艺中被释放掉,例如采用氮化硅材料作为支撑层的材料。关于支撑层Z的形成可以在步骤04中,且在释放工艺之前,但是这样可能会对石墨烯薄膜造成一些磨损等破坏,所以,较佳的,应当在步骤01中,在光刻和刻蚀之前,形成底部和侧壁被支撑层Z包围的牺牲层衬底。这样,当本步骤04的释放工艺结束,牺牲层衬底被去除后,支撑层支撑在石墨烯薄膜G下方,不仅便于定位石墨烯薄膜G,而且同时还在石墨烯薄膜G下方形成了一个大空腔,该结构可以进一步用于制备半导体器件的相关工艺中。What needs to be explained here is that considering the difficulties in finding the graphene film after the release and removal of the sacrificial layer substrate, it can be realized that before performing the release process, as shown in Figure 18, a support can be formed on the bottom and side walls of the sacrificial layer substrate Layer Z, the support layer Z will not be released in any release process, for example, silicon nitride material is used as the material of the support layer. The formation of the support layer Z can be in step 04, and before the release process, but this may cause some damage such as abrasion to the graphene film, so, preferably, it should be in step 01, after photolithography and etching Before, a sacrificial layer substrate is formed whose bottom and sidewalls are surrounded by the supporting layer Z. In this way, when the releasing process in this step 04 ends and the sacrificial layer substrate is removed, the support layer is supported under the graphene film G, which not only facilitates the positioning of the graphene film G, but also forms a large space under the graphene film G simultaneously. cavity, and this structure can be further used in related processes for preparing semiconductor devices.

此外,步骤01~04还可以用于制备上表面和/或下表面具有金属纳米薄膜的上述的石墨烯薄膜。In addition, steps 01 to 04 can also be used to prepare the above-mentioned graphene film having a metal nano film on the upper surface and/or the lower surface.

步骤05:请参阅图19,采用分离技术,将金属催化剂纳米薄膜与石墨烯薄膜分离开来,得到石墨烯薄膜G。Step 05: Please refer to Fig. 19, using separation technology to separate the metal catalyst nano film from the graphene film to obtain the graphene film G.

这里,当采用图18中的支撑层Z时,可以将支撑层Z去除。然后直接采用机械剥离或静电吸附技术可以将金属催化剂纳米薄膜(未示出)与石墨烯薄膜分裂开来。但是,考虑到本实施例一的微空腔结构的开口处较窄,会导致分离不彻底或分离的难度,本实施例进一步可以采用如下分离技术:首先,请参阅图20,通过施加光照、湿度、温度和/或酸碱度使石墨烯薄膜G发生拉伸变形,得到石墨烯薄膜G'。当然关于石墨烯薄膜G的拉伸变形可能不会像图20中那么均匀,这里只是示意变形的趋势,同时,此时采用静电吸附技术或机械剥离将金属纳米薄膜(未示出)与石墨烯薄膜G分离开来,上述变形使得这种分裂操作会更加容易;然后,请参阅图21,停止施加光照、湿度、温度和/或酸碱度使石墨烯薄膜G发生收缩回复原状,当然,实际中石墨烯薄膜G恢复原状的尺寸可能有些与变形前的尺寸略有变化,但是石墨烯薄膜G的凸起结构和凹陷结构的基本形状和位置关系与变形前一致,可近似为变形前的石墨烯薄膜G。这里,光照可以为红外激光照射;光照、湿度、温度和/或酸碱度的具体参数可以根据实际工艺来确定,这里不做限制。Here, when the support layer Z in FIG. 18 is used, the support layer Z may be removed. Then, the metal catalyst nanofilm (not shown) and the graphene film can be separated directly by mechanical exfoliation or electrostatic adsorption technology. However, considering that the opening of the micro-cavity structure in the first embodiment is narrow, which will lead to incomplete separation or difficulty in separation, the following separation technology can be further adopted in this embodiment: first, please refer to FIG. 20 , by applying light, Humidity, temperature and/or pH make the graphene film G stretch and deform to obtain the graphene film G'. Of course, the tensile deformation of the graphene film G may not be as uniform as in Figure 20, and here is only a schematic deformation trend. The film G is separated, and the above-mentioned deformation makes this splitting operation easier; then, please refer to Figure 21, stop applying light, humidity, temperature and/or pH to make the graphene film G shrink back to its original shape, of course, the actual graphite The size of graphene film G restored to its original shape may be slightly changed from the size before deformation, but the basic shape and position relationship of the convex structure and concave structure of graphene film G are consistent with those before deformation, which can be approximated as the graphene film before deformation g. Here, the illumination can be infrared laser irradiation; the specific parameters of illumination, humidity, temperature and/or pH can be determined according to the actual process, and there is no limitation here.

本实施例中,在步骤05之后,还可以包括:在石墨烯薄膜下表面或者仅在微空腔结构内壁制备金属化合物半导体纳米薄膜;例如,首先将石墨烯薄膜置于另一衬底上,然后制备金属化合物半导体纳米薄膜,在石墨烯薄膜下表面制备金属化合物半导体纳米薄膜的工艺可以采用现有技术这里不再赘述。In this embodiment, after step 05, it may also include: preparing a metal compound semiconductor nano-film on the lower surface of the graphene film or only on the inner wall of the microcavity structure; for example, first placing the graphene film on another substrate, Then prepare the metal compound semiconductor nano film, and the process of preparing the metal compound semiconductor nano film on the lower surface of the graphene film can adopt the existing technology and will not repeat them here.

仅在微空腔结构内壁制备金属化合物半导体纳米薄膜可以包括:The preparation of metal compound semiconductor nanofilms only on the inner wall of the microcavity structure may include:

首先,制备光刻版;光刻版图形包括石墨烯薄膜的凸起结构光刻版和凹陷结构光刻版;First, prepare a photoresist plate; the photoresist pattern includes a raised structure photoresist and a concave structure photoresist of the graphene film;

然后,在凸起结构的微空腔结构内壁制备金属化合物半导体纳米薄膜,包括:请参阅图22,将石墨烯薄膜倒置转移至一衬底上;在倒置的石墨烯薄膜G上形成一层光刻胶R1;利用凸起结构光刻版刻蚀光刻胶,在光刻胶R1中形成凸起结构图案,从而将倒置的凸起结构TT暴露出来;然后,采用溶液法在倒置的凸起结构TT的微空腔结构内壁生长出金属化合物半导体纳米薄膜(未示出);Then, the metal compound semiconductor nano film is prepared on the inner wall of the microcavity structure of the raised structure, including: referring to FIG. 22, transferring the graphene film to a substrate upside down; Resist R1; using a raised structure photolithography plate to etch the photoresist, forming a raised structure pattern in the photoresist R1, thereby exposing the inverted raised structure TT; then, using a solution method to invert the raised structure A metal compound semiconductor nanofilm (not shown) grows on the inner wall of the microcavity structure of the structure TT;

在凹陷结构的微空腔结构内壁制备金属化合物半导体纳米薄膜,包括:请参阅图23,将石墨烯薄膜转移至一衬底301上;在石墨烯薄膜上形成一层光刻胶R2;利用凹陷结构光刻版刻蚀光刻胶,在光刻胶R2中形成凹陷结构图案,从而将凹陷结构A暴露出来;然后,采用溶液法在凹陷结构A的微空腔结构内壁生长出金属化合物半导体纳米薄膜。The metal compound semiconductor nano film is prepared on the inner wall of the microcavity structure of the concave structure, including: referring to FIG. 23, transferring the graphene film to a substrate 301; forming a layer of photoresist R2 on the graphene film; The photoresist is etched by the structural lithography plate to form a recessed structure pattern in the photoresist R2, thereby exposing the recessed structure A; then, a metal compound semiconductor nanometer is grown on the inner wall of the microcavity structure of the recessed structure A by a solution method. film.

这里需要说明的是,本实施例中,可以取消步骤03和步骤04的在石墨烯薄膜上表面制备金属化合物半导体纳米薄膜;而是在步骤05之后,在石墨烯薄膜表面包括上表面和下表面来制备出金属化合物半导体纳米薄膜或者仅在微空腔结构内壁制备金属化合物半导体纳米薄膜。It should be noted here that, in this embodiment, step 03 and step 04 can be canceled to prepare a metal compound semiconductor nano-film on the upper surface of the graphene film; but after step 05, the graphene film surface includes the upper surface and the lower surface To prepare the metal compound semiconductor nano film or only prepare the metal compound semiconductor nano film on the inner wall of the micro cavity structure.

还需要说明的是,本实施例中,石墨烯薄膜具有凸起结构和凹陷结构,在本实用新型的其它实施例中,石墨烯薄膜只具有凸起结构,或者只具有凹陷结构,关于只具有凸起结构的石墨烯薄膜的制备同理可以参照本实施例的制备方法,关于只具有凹陷结构的石墨烯薄膜的制备同理可以参照本实施例的制备方法,这里不再赘述。It should also be noted that, in this embodiment, the graphene film has a convex structure and a concave structure. In other embodiments of the present utility model, the graphene film only has a convex structure, or only has a concave structure. Regarding only having The preparation method of the graphene film with the raised structure can be similarly referred to the preparation method of this embodiment, and the preparation method of the graphene film with only the concave structure can be referred to the preparation method of the present embodiment in the same way, and will not be repeated here.

实施例二Embodiment two

本实施例二的石墨烯薄膜与上述实施例一的石墨烯薄膜的区别在于:如图24所示,凸起结构T'和/或凹陷结构A'在主平面的投影轮廓为矩形,开口在主平面的投影轮廓为矩形。矩形可以为长方形或正方形。此外,凸起结构T'和凹陷结构A'相间设置,可以等间距设置,也可以设置凸起结构T'的开口和凹陷结构A'的开口在界面处相接触,凸起结构T'的开口的边缘和凹陷结构A'的开口法边缘重合或相切。The difference between the graphene film of the second embodiment and the graphene film of the above-mentioned embodiment 1 is that, as shown in FIG. The projected profile of the main plane is rectangular. A rectangle can be a rectangle or a square. In addition, the protruding structure T' and the concave structure A' are alternately arranged at equal intervals, and the opening of the protruding structure T' and the opening of the concave structure A' can also be arranged to contact at the interface, and the opening of the protruding structure T' The edge of and the edge of the opening of the recessed structure A' are coincident or tangent.

本实施例二与上述实施例一的区别还在于,微空腔结构的开口在主平面的投影轮廓包围微空腔结构的其它区域在主平面的投影轮廓,即凸起结构的微空腔结构为“上窄下宽”,凹陷结构的微空腔结构为“上宽下窄”。请参阅图25~27,以凸起结构T'和凹陷结构A'等间距设置为例。The difference between this second embodiment and the above-mentioned first embodiment is that the projection contour of the opening of the micro-cavity structure on the main plane surrounds the projection contours of other regions of the micro-cavity structure on the main plane, that is, the micro-cavity structure of the raised structure is "narrow at the top and wide at the bottom", and the micro-cavity structure of the concave structure is "wide at the top and narrow at the bottom". Please refer to FIGS. 25 to 27 , taking the arrangement of the protruding structures T' and the concave structures A' at equal intervals as an example.

请参阅图25,凸起结构T1'和凹陷结构A1'均为分别被开口T1K'和A1K'所截的半球体;凸起结构T1'形成了微空腔结构Q11',凹陷结构A1'形成了微空腔结构Q12'。Please refer to Fig. 25, the protruding structure T1' and the concave structure A1' are hemispheres cut by the openings T1K' and A1K' respectively; the protruding structure T1' forms the microcavity structure Q11', and the concave structure A1' forms A micro-cavity structure Q12' is obtained.

请参阅图26,形成微空腔结构Q21'的凸起结构T2'包括上层结构和与之相连的下层结构,上层结构具有弧形表面,下层结构为倾斜侧壁,倾斜侧壁由下向上逐渐向内倾斜;凸起结构T2'的底部具有开口T2K';而凹陷结构A2'为凸起结构T2'的倒置,凹陷结构A2'具有微空腔结构Q22',凹陷结构A2'的底部具有开口A2K'。Please refer to FIG. 26, the protruding structure T2' forming the microcavity structure Q21' includes an upper structure and a lower structure connected thereto. The upper structure has a curved surface, and the lower structure is an inclined side wall, and the inclined side wall gradually Inclined inward; the bottom of the raised structure T2' has an opening T2K'; and the depressed structure A2' is the inversion of the raised structure T2', the depressed structure A2' has a microcavity structure Q22', and the bottom of the depressed structure A2' has an opening A2K'.

请参阅图27,形成微空腔结构Q31'的凸起结构T3'包括上层结构和与之相连的下层结构,上层结构具有平坦表面,下层结构为倾斜侧壁,倾斜侧壁由下向上逐渐向外倾斜;凸起结构T3'的底部具有开口T3K';而凹陷结构A3'为凸起结构T3'的倒置,凹陷结构A3'具有微空腔结构Q32',凹陷结构A3'的底部具有开口A3K'。Please refer to Fig. 27, the protruding structure T3' forming the microcavity structure Q31' includes an upper structure and a lower structure connected thereto. The upper structure has a flat surface, and the lower structure has inclined side walls, and the inclined side walls gradually Outward slope; the bottom of the raised structure T3' has an opening T3K'; and the recessed structure A3' is the inversion of the raised structure T3', the recessed structure A3' has a microcavity structure Q32', and the bottom of the recessed structure A3' has an opening A3K '.

这里的开口的尺寸为纳米级,微空腔结构的高度为纳米级,微空腔结构的高度可以为开口的尺寸的1/4~1。Here, the size of the opening is nanoscale, the height of the micro-cavity structure is nanoscale, and the height of the micro-cavity structure may be 1/4-1 of the size of the opening.

需要说明的是,实施例二除上述区别之外,其它具体尺寸和关系描述与实施例一相同,可以参照上述实施例一的相关描述,这里不再赘述。It should be noted that, except for the above differences, other specific dimensions and relationship descriptions of the second embodiment are the same as those of the first embodiment, and reference may be made to the relevant descriptions of the first embodiment above, which will not be repeated here.

本实施例二的石墨烯薄膜的制备可以参照上述实施例一的制备方法,这里不再赘述。The preparation of the graphene thin film of this embodiment 2 can refer to the preparation method of the above-mentioned embodiment 1, which will not be repeated here.

需要说明的是,本实用新型的上述实施例一和实施例二分别描述了开口被微空腔结构其它区域在主平面的投影轮廓的最大轮廓包围、以及开口包围微空腔结构其它区域在主平面的投影轮廓的情况,然则,本实用新型的其它实施例中,凸起结构和/或凹陷结构还可以为长方体或正方体,那么,开口与微空腔结构其它区域在石墨烯薄膜投影的轮廓重合。It should be noted that the above-mentioned Embodiment 1 and Embodiment 2 of the present invention respectively describe that the opening is surrounded by the maximum contour of the projected contours of other areas of the micro-cavity structure on the main plane, and that the opening surrounds other areas of the micro-cavity structure on the main plane. In the case of the projected profile of the plane, then, in other embodiments of the present utility model, the raised structure and/or the recessed structure can also be a cuboid or a cube, so, the profile of the opening and other regions of the microcavity structure projected on the graphene film coincide.

本实用新型的一个较佳实施例中,还提供了一种压力发电器件,采用上述的实施例一和/或二的石墨烯薄膜作为压电转换部件;当外界向石墨烯薄膜的凸起结构和/或凹陷结构施加作用力时,多个微空腔结构发生形变,从而更多的产生电能。并且,上述实施例的凸起结构和凹陷结构的设置,使得各个方向的力都能够作用到石墨烯薄膜上,从而提高了利用率。In a preferred embodiment of the present utility model, a pressure power generation device is also provided, using the graphene film of the above-mentioned embodiment one and/or two as the piezoelectric conversion component; And/or when the concave structure exerts force, the multiple micro-cavity structures are deformed, thereby generating more electric energy. Moreover, the arrangement of the convex structure and the concave structure in the above embodiment enables forces from all directions to act on the graphene film, thereby improving the utilization rate.

本实用新型的一个较佳实施例中,还提供了一种探测器,采用上述的实施例一和/或二的石墨烯薄膜作为探测部件,实现了多点探测和多方向探测,提高了探测精度和灵敏度。In a preferred embodiment of the present utility model, a detector is also provided, and the graphene film of the above-mentioned embodiment 1 and/or 2 is used as the detection component, which realizes multi-point detection and multi-directional detection, and improves the detection efficiency. precision and sensitivity.

本实用新型的一个较佳实施例中,还提供了一种光催化器件,采用上述的实施例一和/或二的石墨烯薄膜作为光催化部件。In a preferred embodiment of the present invention, a photocatalytic device is also provided, using the graphene thin film of the above-mentioned embodiment 1 and/or 2 as the photocatalytic component.

本实用新型的一个较佳实施例中,还提供了一种太阳能电池,采用上述的实施例一和/或二的石墨烯薄膜作为电极或光电转换部件。In a preferred embodiment of the present invention, a solar cell is also provided, using the graphene film of the above-mentioned embodiment 1 and/or 2 as an electrode or a photoelectric conversion component.

本实用新型的一个较佳实施例中,还提供了一种LED器件,采用上述的实施例一和/或二的石墨烯薄膜作为电致发光层或电极层。In a preferred embodiment of the present invention, an LED device is also provided, using the graphene thin film of the above-mentioned embodiment 1 and/or 2 as the electroluminescent layer or the electrode layer.

本实用新型的一个较佳实施例中,还提供了一种储能电池,采用上述的实施例一和/或二的石墨烯薄膜作为电极层。In a preferred embodiment of the present invention, an energy storage battery is also provided, using the graphene film of the above-mentioned embodiment 1 and/or 2 as the electrode layer.

虽然本实用新型已以较佳实施例揭示如上,然所述实施例仅为了便于说明而举例而已,并非用以限定本实用新型,本领域的技术人员在不脱离本实用新型精神和范围的前提下可作若干的更动与润饰,本实用新型所主张的保护范围应以权利要求书所述为准。Although the utility model has been disclosed above with preferred embodiments, the embodiments are only examples for convenience of description, and are not intended to limit the utility model. Those skilled in the art will not depart from the spirit and scope of the utility model. Some changes and modifications can be made below, and the scope of protection claimed by the utility model should be based on the claims.

Claims (26)

1. a kind of graphene film, it is characterised in that the graphene film is with microdischarge cavities knot of multiple one sides with opening Structure, microdischarge cavities structure are made up of the bulge-structure and/or sunk structure on graphene film surface;The opening shape of microdischarge cavities structure Into in the top of the bottom of bulge-structure and/or sunk structure.
2. graphene film according to claim 1, it is characterised in that the graphene film has principal plane, described The master that plane where plane where the opening of bulge-structure and/or the opening of the sunk structure is located at the graphene film puts down Plane where face;Or the graphene film has a principal plane, plane where the opening of the bulge-structure and/or described recessed Plane where falling into the opening of structure differs with plane where the principal plane of the graphene film.
3. graphene film according to claim 2, it is characterised in that the microdischarge cavities structure is arranged in array, adjacent The capable alternate setting of microdischarge cavities structure.
4. graphene film according to claim 3, it is characterised in that often row relief structure and sunk structure is alternate sets Put, and alternate setting between the bulge-structure of adjacent lines, alternate setting between the sunk structure of adjacent lines.
5. graphene film according to claim 4, it is characterised in that in often going, bulge-structure is in the principal plane Projected outline is tangent in the projected outline of the principal plane with the sunk structure.
6. graphene film according to claim 4, it is characterised in that the bulge-structure and the sunk structure are complete Deng graphics relationship.
7. graphene film according to claim 2, it is characterised in that the opening of the microdischarge cavities structure is put down in the master The projected outline in face is wrapped by largest contours of the other regions of the microdischarge cavities structure in the projected outline of the principal plane Enclose.
8. graphene film according to claim 7, it is characterised in that the chi of projected outline of the opening in principal plane The size of very little and described largest contours is nanoscale, and the size of the projected outline of the opening is the size of the largest contours 1/5~1.
9. graphene film according to claim 8, it is characterised in that the height of the microdischarge cavities structure is nanoscale, The height of the microdischarge cavities structure is the 1/4~1 of the size of the opening.
10. graphene film according to claim 2, it is characterised in that the opening of the microdischarge cavities structure is in the master The projected outline of plane surrounds projected outline of other regions in the principal plane of the microdischarge cavities structure.
11. graphene film according to claim 10, it is characterised in that the size of the opening is nanoscale, described The height of microdischarge cavities structure is nanoscale, and the height of the microdischarge cavities structure is the 1/4~1 of the size of the opening.
12. the graphene film according to claim 7 or 10, it is characterised in that the bulge-structure and/or the depression Structure is circular or rectangle in the projected outline of the principal plane, the opening the projected outline of the principal plane to be circular or Rectangle.
13. the graphene film according to claim 7 or 10, it is characterised in that the microdischarge cavities structure is by opening institute The spheroid cut.
14. the graphene film according to claim 7 or 10, it is characterised in that the bulge-structure includes superstructure With the understructure being attached thereto, the superstructure has flat surfaces or curved surfaces, and the understructure is inclined side Wall, sloped sidewall gradually inwardly or outwardly tilt from bottom to top;Sunk structure is the inversion of the bulge-structure.
15. graphene film according to claim 1, it is characterised in that only in the microdischarge cavities inner structural wall and/or whole Individual graphene film surface is formed with metal semiconductor compound nano thin-film.
16. graphene film according to claim 15, it is characterised in that the semiconductor nanomembrane is received for titanium alloy Rice film and/or kirsite nano thin-film.
17. graphene film according to claim 16, it is characterised in that the material of the titanium alloy nano film is TiOx, x are positive number;The kirsite nano thin-film is ZnO nano film.
18. graphene film according to claim 15, it is characterised in that the semiconductor nanomembrane is by metal compound The nano-wire array of thing is formed.
19. graphene film according to claim 15, it is characterised in that the thickness of the semiconductor nanomembrane and institute The ratio for stating the overall size of opening is not more than 1:3.
20. graphene film according to claim 1, it is characterised in that the graphene film is monoatomic layer thickness Graphene film.
21. a kind of detector, it is characterised in that there is the graphene film described in claim 1-20 any one as detection Part.
22. a kind of pressure electricity-generating device, it is characterised in that there is the graphene film described in claim 1-20 any one to make For piezoelectricity converting member;It is multiple described when the external world applies bulge-structure from active force to graphene film and/or sunk structure Microdischarge cavities structure deforms upon, so as to produce electric energy.
23. a kind of photocatalytic device, it is characterised in that there is the graphene film conduct described in claim 1-20 any one Photocatalysis part.
24. a kind of solar cell, it is characterised in that there is the graphene film conduct described in claim 1-20 any one Electrode or photoelectric conversion part.
25. a kind of LED component, it is characterised in that there is the graphene film described in claim 1-20 any one as electricity Electroluminescent layer or electrode layer.
26. a kind of energy-storage battery, it is characterised in that there is the graphene film described in claim 1-20 any one as electricity Pole layer.
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