CN206947308U - Wafer carrier - Google Patents
Wafer carrier Download PDFInfo
- Publication number
- CN206947308U CN206947308U CN201720914885.5U CN201720914885U CN206947308U CN 206947308 U CN206947308 U CN 206947308U CN 201720914885 U CN201720914885 U CN 201720914885U CN 206947308 U CN206947308 U CN 206947308U
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- Prior art keywords
- wafer
- ears
- storehouse
- leg
- carrier
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Abstract
The utility model discloses a kind of wafer carrier.With this carrier, enable the wafer that multiple diameter is processed suitable for the equipment of the diameter wafers of work sheet one.Carrier includes wafer storehouse, two pick up the ears those widened sections and the padded portions of leg.Two pick up the ears those widened sections and the padded portions of leg are so that carrier is equivalent to the wafer storehouse with the loading larger diameter wafer of corresponding manipulator matching in width, height.The motor program of modification manipulator is not had to so, with regard to the mobile carrier for loading wafer can be picked and placeed, the padded portion of leg makes the top of the wafer of different-diameter be in same level simultaneously, wafer process fluid is set to flow through processing effect caused by the wafer of different-diameter consistent, improve production efficiency and utilization rate of equipment and installations, the adaptability of equipment is improved, avoids repeating to purchase same category of device, saves cost.
Description
Technical field
A kind of wafer carrier is the utility model is related to, in wafer plated film, removing glue, cleaning, etching and processing.
Background technology
Wafer currently used for producing circuit chip is not of uniform size, and diameter wafer has a variety of, such as 4 inches, 5 inches, 6 English
It is very little, 8 inches, 12 inches, 16 inches, 18 inches etc..When wafer is processed, more wafers are placed in wafer storehouse, and wafer storehouse is put again
Enter in processing groove, the wafer allowed fluid flow in wafer storehouse is processed, and it is pure that fluid includes chemical liquid, gas, deionization
Water.
In the prior art, wafer when wafer processing designs only specifically for a kind of diameter is processed, if processing
The wafer of another diameter makes machinery it is necessary to many parameters of adjustment equipment, such as the robot movement program in adjusting device
Hand moves the wafer that different distances picks and places another size, and this technical difficulty is big, and uncommon staff can grasp, also
Adjustment time is expended, reduces production efficiency, and crudy does not reach requirement sometimes, in order to process the wafer of different-diameter,
Have to separately buy equipment, semiconductor processing equipment is expensive, and investment is very big.
So as in the prior art using the crystalline substance of the process equipment processing small diameter suitable for the diameter wafers of work sheet one
Bowlder has the defects of production efficiency is relatively low, the also underproof defect of processing effect.
Utility model content
The technical problems to be solved in the utility model is straight greatly using work sheet one is applied in the prior art in order to overcome
There is the defects of production efficiency is relatively low during the wafer of the process equipment processing small diameter of footpath wafer, there is provided a kind of wafer carrier.
The utility model is that solve above-mentioned technical problem by following technical proposals：
A kind of wafer carrier, for wafer processing, the wafer processing has manipulator, and its feature is,
The wafer carrier includes：
Wafer storehouse, there are two first be oppositely arranged to be picked up the ears；
Two those widened sections of picking up the ears, connect one to one and picked up the ears in two described first, between those widened sections of being picked up the ears described in two
Distance be used for be adapted with the manipulator；
The padded portion of leg, located at the bottom in the wafer storehouse, for making the top of wafer of different-diameter be in same level
Face, and for making the height residing for two after widening first bottom surfaces picked up the ears be adapted with the manipulator.
In this programme, the top of the wafer of different-diameter is in same level by the padded portion of leg, ensured with this
It is consistent to the wafer processing effect of different-diameter.Those widened sections of picking up the ears are equivalent to the width for adding wafer storehouse so that are connected with side
The wafer storehouse of ear those widened sections is equivalent to the larger-diameter wafer to match on width with the manipulator of corresponding process equipment
Storehouse.The padded portion of leg is equivalent to the height for adding wafer storehouse so that the wafer storehouse for being connected with the padded portion of leg is equivalent in height
The larger-diameter wafer storehouse to match with the manipulator of corresponding process equipment.This carrier is applied to wafer processing
When, without changing the motor program of manipulator, process equipment loads the carrier of wafer with regard to that can pick and place movement, while makes different straight
The top of the wafer in footpath is in same level, wafer process fluid is flowed through processing effect caused by the wafer of different-diameter
Unanimously.The carrier enables the equipment suitable for the diameter wafers of work sheet one to process the wafer of multiple diameter, improves production
Efficiency, utilization rate of equipment and installations is improved, improve the adaptability of equipment.
It is preferred that picking up the ears those widened sections described in two and the padded portion of the leg is integral structure.
In this programme, it is easy to assemble the wafer carrier, improves operating efficiency.
It is preferred that the wafer carrier includes support, the support has：
Body is supported, the support body surrounds support accommodating cavity；
Spaced multiple supporting legs, it is connected to the bottom of the support body；
Two second be oppositely arranged pick up the ears, and described second picks up the ears from the top of the support body towards away from the branch
The direction extension of frame accommodating cavity；
Wherein, the wafer storehouse is set up in the support accommodating cavity, picks up the ears for two described first to correspond fitting simultaneously
Pressure is picked up the ears located at two described second, and described second picks up the ears to extend described first along the direction away from the support accommodating cavity
Pick up the ears, described second, which picks up the ears, is used to form the those widened sections of picking up the ears；
Formed with gap between the bottom in the wafer storehouse and the bottom of the supporting leg, and the bottom position in the wafer storehouse
In the top of the bottom of the support body, the supporting leg is used to form the padded portion of the leg.
In this programme, described to pick up the ears those widened sections and the padded portion of the leg is realized by support, the wafer storehouse is set up
In the support, the second of the support, which picks up the ears, is used to serve as the those widened sections of picking up the ears, and picks up the ears for two described second to stretch out two
First part picked up the ears is equivalent to the increased width in wafer storehouse.The sizableness in the gap increases in the wafer storehouse
The height added.
It is preferred that described second pick up the ears on be arranged at intervals with multiple through holes.
In this programme, on the one hand, through hole can play a part of loss of weight；On the other hand, when by the wafer carrier
When being put into processing groove to process wafer, fluid can flow out from through hole, prevent fluid from being splashed and shadow on being picked up the ears second
Ring the quality of wafer.
It is preferred that it is described pick up the ears those widened sections and first pick up the ears between be welded to connect, the padded portion of leg with it is described carrying this
It is welded to connect between the bottom of body.
In this programme, according to pick up the ears those widened sections and the size in the padded portion of leg being actually needed, picked up the ears first away from crystalline substance
Weld those widened sections of picking up the ears, carry the bottom padded portion of welding leg of body in one end of circle storehouse accommodating cavity.The program is simple to operate, cost
It is relatively low.
It is preferred that the wafer storehouse, described picking up the ears those widened sections and the padded portion of the leg is integral structure.
It is preferred that the wafer storehouse, those widened sections and the padded portion of the leg of picking up the ears are integrally formed by injection or compression moulding.
In this programme, on the basis of the mould in the wafer storehouse, those widened sections are picked up the ears by increase and the padded portion of leg changes
Enter first and pick up the ears and carry body part, the wafer carrier is then processed by injection or compression moulding.
On the basis of common sense in the field is met, above-mentioned each optimum condition, can be combined, produce the utility model respectively compared with
Good example.
Positive effect of the present utility model is：
Those widened sections of picking up the ears and the padded portion of leg are so that carrier is equivalent to the dress with the matching of corresponding manipulator in width, height
Carry the wafer storehouse of larger diameter wafer.Do not have to the motor program of modification manipulator so, wafer is loaded with regard to movement can be picked and placeed
Carrier, while the padded portion of leg makes the top of the wafer of different-diameter be in same level, wafer process fluid is flowed through difference
Processing effect caused by the wafer of diameter is consistent, improves production efficiency and utilization rate of equipment and installations, improves the adaptability of equipment,
Avoid repeating to purchase same category of device, save cost.The preparation method of wafer carrier is simple.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of the wafer carrier of the utility model embodiment 1.
Fig. 2 is the dimensional structure diagram of the wafer carrier for being mounted with wafer of the utility model embodiment 1.
Fig. 3 is the structural representation of the wafer of the utility model embodiment 1.
Fig. 4 be the utility model embodiment 1 wafer carrier in wafer storehouse dimensional structure diagram.
Fig. 5 is the dimensional structure diagram of the wafer carrier medium-height trestle of the utility model embodiment 1.
Fig. 6 is the utility model embodiment 2 and the dimensional structure diagram of the wafer carrier of embodiment 3.
Description of reference numerals：
10：Wafer storehouse
101：Wafer storehouse accommodating cavity
102：Carry body
103：Storage tank
104：First picks up the ears
20：Wafer
30：Support
301：Support body
302：Supporting leg
303：Second picks up the ears
304：Support accommodating cavity
305：Through hole
Embodiment
Name 3 preferred embodiments, and become apparent from intactly illustrating the utility model with reference to accompanying drawing.
Embodiment 1
Wafer processing includes two manipulators, and wafer processing to wafer when being processed, it is necessary to manipulator
The carrier for being mounted with wafer is put into processing groove.As Figure 1-5, wafer carrier includes 10, two, wafer storehouse and picks up the ears to add
Wide portion and the padded portion of leg.
Wafer is thin discs, and as shown in Figures 2 and 3, wafer 20 is loaded in wafer storehouse 10, can load more wafers,
For sake of simplicity, diagram only encloses wafer, when processing, two manipulators are controlled by motor program, ask support 30 left
Right two second pick up the ears 303 bottom surface, lift movement, be put into processing groove, manipulator departs from wafer storehouse 10 and support 30 afterwards,
Equipment starts to allow fluid flow wafer 20, and fluid is had an effect with wafer 20, produces processing effect, after machining, two machines
Tool hand move past again hold up 30 or so two second, support pick up the ears 303 bottom surface, wafer storehouse 10 and the wafer 20 in it are removed.
Wherein, wafer top influences processing effect, so to there is setting relative to the height and position of groove top in processing groove
Proper height, the assembly in wafer storehouse and its support in the carrier is equivalent to larger-diameter wafer storehouse, small diameter
Wafer loads in the assembly of wafer storehouse and its support, is equivalent to larger diameter wafer and loads in wafer storehouse, small diameter wafer
Top in processing groove relative to the height and position of groove top, with the top of larger diameter wafer in processing groove relative to groove top
Height and position it is the same, it is consistent with the effect for flowing through larger diameter wafer that the fluid in equipment flows through small diameter wafer, processing
Effect is consistent, and same equipment just can equivalent processing reducing wafer.That is it is applied to one larger-diameter wafer of work sheet
Equipment just can process the wafer of multiple diameter.
So as to, make support two second pick up the ears between width and between two of larger wafer storehouse pick up the ears in the prior art
Width it is the same, the height for bottom surface of respectively picking up the ears is the same, so as to, in the case where not changing motor program, the machinery of process equipment
Hand can similarly pick and place, move them.
Specifically, as Figure 1-5, the two carrying bodies that wafer storehouse 10 has wafer storehouse accommodating cavity 101 and is oppositely arranged
102, two carrying bodies 102 are used to surround wafer storehouse accommodating cavity 101, and each carrying body 102 is provided with multiple storage tanks 103,
Multiple storage tanks 103 on two carrying bodies 102, which correspond, to be set, for carrying wafer 20；Carry the top tool of body 102
There is first to pick up the ears 104, first picks up the ears 104 prolongs from the tops of carrying body 102 towards away from the direction of wafer storehouse accommodating cavity 101
Stretch.The those widened sections of picking up the ears pick up the ears 104 along being connected to two first one by one away from the direction of wafer storehouse accommodating cavity 101, two institutes
The distance between the one end of those widened sections away from wafer storehouse accommodating cavity 101 of picking up the ears is stated to be adapted with two manipulators.The leg
Padded portion is located at the bottom of carrying body 102.
In the present embodiment, the padded portion of the leg is located at the bottom in wafer storehouse, the top of the wafer for making different-diameter
Portion is in same level, and for making the height residing for two the first bottom surfaces picked up the ears after widening be fitted with the mechanical palmistry
Match somebody with somebody.Wafer is correspondingly arranged in storage tank, and a wafer is typically arranged with a storage tank.If limit the first extension picked up the ears
Direction is the width in wafer storehouse, then those widened sections of picking up the ears are equivalent to the width for adding wafer storehouse so that is connected with and picks up the ears to add
The wafer storehouse in wide portion is equivalent to the larger-diameter wafer storehouse to match on width with the manipulator of corresponding process equipment.And
The padded portion of leg is equivalent to the height for adding wafer storehouse so that be connected with the padded portion of leg wafer storehouse be equivalent in height with it is right
The larger-diameter wafer storehouse that the manipulator for the process equipment answered matches.For example, when the wafer for using corresponding 12 inches of processing
Process equipment (for ease of description, represented below with " target device ") come process 8 inches wafer (for ease of describe, with
It is lower to be represented with " wafer to be processed ") when, according to the distance of two manipulators and the height of processing groove of target device, carrying
Pick up the ears, the carry bottom of body of the first of the wafer storehouse of wafer to be processed correspondingly sets pick up the ears those widened sections and the padded portion of leg, makes
The wafer storehouse that the wafer carrier is equivalent to the wafer of 12 inches of carrying is obtained, so as in the premise for the program for not changing target device
Under can process wafer to be processed.By that analogy, the wafer carrier can be applied to what processing was placed than the wafer carrier
The big wafer processing of the brilliant diameter of a circle, utilization rate are higher.
Wherein, the height in the padded portion of leg be with carry 12 inches wafer wafer storehouse top and processing groove top it
Between distance set for standard.That is, after the carrier for carrying wafer to be processed is put into processing groove, the wafer carrier
Top and processing groove 12 inches of the distance between top and carrying wafer the top in wafer storehouse and the top of processing groove
The distance between it is equal.
When using target device to process wafer to be processed, the action process of manipulator is as follows：Fall before to corresponding positions
Put, the bottom for clasping those widened sections of picking up the ears picks up the carrier for being mounted with wafer, is lifted up being put into processing groove by carrier afterwards.
It should be noted that in fact, between the one end of those widened sections away from wafer storehouse accommodating cavity of being picked up the ears described in two away from
Just enable to process equipment just to pick up carrier without modification program from being adapted with two manipulators.Namely
Say, two sizes for picking up the ears those widened sections need not be essentially equal, and even to be zero (actually only exist one of them those widened sections of picking up the ears
One of those first is picked up the ears upper increase width) it can also realize.
In the present embodiment, those widened sections of being picked up the ears described in two and the padded portion of the leg are integral structure.In fact,
In present embodiment, those widened sections of picking up the ears and the padded portion of leg are realized by support.As shown in Figure 1 and Figure 5, the frame of wafer storehouse 10
Located at support 30.Support 30 has support body 301, spaced multiple supporting legs 302 and be oppositely arranged two second
Pick up the ears 303.Wherein, support body 301 surrounds support accommodating cavity 304；Supporting leg 302 is connected to the bottom of support body 301；The
Two tops for picking up the ears 303 self-supporting bodies 301 extend towards away from the direction of support accommodating cavity 304.
For the wafer carrier, as shown in Figure 1-2, wafer storehouse 10 is set up in support accommodating cavity 304, two the first sides
Ear 104 correspond be bonded and press picked up the ears located at two second 303, and second pick up the ears 303 along deviate from support accommodating cavity 304 side
104 are picked up the ears to extending first, and second, which picks up the ears, 303 is used to form the those widened sections of picking up the ears.Carry bottom and the support of body 102
Formed with gap between the bottom of leg 302, and the bottom of body 102 is carried positioned at the top of the bottom of support body 301, support
Leg 302 is used to form the padded portion of the leg.
In the present embodiment, it is described to pick up the ears those widened sections and the padded portion of the leg is realized by support, the wafer storehouse
The support is set up in, the second of the support, which picks up the ears, is used to serve as the those widened sections of picking up the ears, and two described second are picked up the ears to stretch out
Two first parts picked up the ears are equivalent to the increased width in wafer storehouse.The sizableness in the gap is in the wafer
The increased height in storehouse.
As shown in Figure 1, Figure 2 with shown in Fig. 5, second picks up the ears is arranged at intervals with multiple through holes 305 on 303.On the one hand, through hole
Loss of weight can be played a part of；On the other hand, when the wafer carrier is put into processing groove to process wafer, fluid can
Flowed out from through hole, prevent fluid from splashing on being picked up the ears second and influenceing the quality of wafer.
In the present embodiment, the preparation method of carrier includes：Make support as described above；Wafer storehouse is set up in institute
State support.
Two pick up the ears those widened sections and the padded portions of leg are so that carrier is equivalent in width, height and the matching of corresponding manipulator
The larger-diameter wafer storehouse of loading.Do not have to the motor program of modification manipulator so, wafer is loaded with regard to movement can be picked and placeed
Carrier, while the padded portion of leg makes to be in same level at the top of the wafer of different-diameter, flows through wafer process fluid different straight
Processing effect caused by the wafer in footpath is consistent.So as to improve production efficiency and utilization rate of equipment and installations.It should be noted that Fig. 2
It can be replaced with the wafer in Fig. 3 with other carriers, and the shape of carrier is unlimited, corresponding storage tank 103 makes adaptation carrier
Shape.
Embodiment 2
The structure of carrier and the structure of carrier in embodiment 1 are essentially identical in present embodiment, the difference is that only side
The set-up mode in the padded portion of ear those widened sections and leg is different.Specifically, in embodiment 1, those widened sections of picking up the ears and the padded portion of leg are logical
Support realization is crossed, wafer storehouse is set up in support afterwards.However, it is by being picked up the ears first away from crystalline substance in the present embodiment
One end welded blank of circle storehouse accommodating cavity is used as those widened sections of picking up the ears, and padded as leg in the bottom welded blank of carrying body
Portion, some through holes can be beaten on the sheet material of welding or groove mitigates weight.
Carrier in present embodiment is the small brilliant storehouse of one for being equivalent to big wafer storehouse, and the left and right in small wafer storehouse is widened in welding
Two pick up the ears, and the width being widened between ear at left and right sides of big wafer storehouse is consistent, and weld and increase the small leg of brilliant storehouse two, increase two
Make the height and highly consistent, the polishing light after welding in eardrum face at left and right sides of big wafer storehouse in its left and right sides eardrum face after leg
It is sliding, just it is manufactured that the small brilliant storehouse of the one for being equivalent to big wafer storehouse as shown in Figure 6.
Embodiment 3
The structure of carrier and the structure of carrier in embodiment 1 are essentially identical in present embodiment, the difference is that only side
The set-up mode in the padded portion of ear those widened sections and leg is different.Specifically, in embodiment 1, those widened sections of picking up the ears and the padded portion of leg are logical
Support realization is crossed, wafer storehouse is set up in support afterwards.However, in the present embodiment, as shown in fig. 6, being in wafer storehouse
On the basis of mould, those widened sections are picked up the ears by increase and the padded portion of leg improves first and picks up the ears and carry body part, are then passed through
Injection molding goes out the wafer carrier.
In the present embodiment, equivalent to mould is redesigned, manufacture is equivalent to the small brilliant storehouse of one in big wafer storehouse, and it is left
Pick up the ears to be widened to, also, its two leg consistent the width at left and right sides of big wafer storehouse between ear than common small wafer storehouse in the right side two
Increase, make the highly consistent of the height in its left and right sides eardrum face and big wafer storehouse left and right sides eardrum face.
Although the foregoing describing specific embodiment of the present utility model, it will be appreciated by those of skill in the art that
This is merely illustrative of, and the scope of protection of the utility model is defined by the appended claims.Those skilled in the art
On the premise of without departing substantially from principle of the present utility model and essence, various changes or modifications can be made to these embodiments,
But these changes and modification each fall within the scope of protection of the utility model.
Claims (7)
1. a kind of wafer carrier, for wafer processing, the wafer processing has manipulator, it is characterised in that institute
Wafer carrier is stated to include：
Wafer storehouse, there are two first be oppositely arranged to be picked up the ears；
Two those widened sections of picking up the ears, connect one to one and picked up the ears in two described first, between those widened sections of being picked up the ears described in two away from
From for being adapted with the manipulator；
The padded portion of leg, located at the bottom in the wafer storehouse, for making the top of wafer of different-diameter be in same level, and
For making the height residing for two after widening first bottom surfaces picked up the ears be adapted with the manipulator.
2. wafer carrier as claimed in claim 1, it is characterised in that those widened sections of being picked up the ears described in two and the padded portion of the leg are
One overall structure.
3. wafer carrier as claimed in claim 2, it is characterised in that the wafer carrier includes support, and the support has：
Body is supported, the support body surrounds support accommodating cavity；
Spaced multiple supporting legs, it is connected to the bottom of the support body；
Two second be oppositely arranged pick up the ears, and described second picks up the ears holds from the top of the support body towards away from the support
Put the direction extension of chamber；
Wherein, the wafer storehouse is set up in the support accommodating cavity, picks up the ears to correspond fitting and press for two described first to set
Picked up the ears in two described second, and described second picks up the ears to extend first side along the direction away from the support accommodating cavity
Ear, described second, which picks up the ears, is used to form the those widened sections of picking up the ears；
Formed with gap between the bottom in the wafer storehouse and the bottom of the supporting leg, and the bottom in the wafer storehouse is located at institute
The top of the bottom of support body is stated, the supporting leg is used to form the padded portion of the leg.
4. wafer carrier as claimed in claim 3, it is characterised in that described second pick up the ears on be arranged at intervals with multiple run through
Hole.
5. wafer carrier as claimed in claim 1, it is characterised in that it is described pick up the ears those widened sections and described first pick up the ears between weld
Connect, be welded to connect between the padded portion of leg and the bottom in the wafer storehouse in succession.
6. wafer carrier as claimed in claim 1, it is characterised in that the wafer storehouse, those widened sections and the leg of picking up the ears
Padded portion is integral structure.
7. wafer carrier as claimed in claim 6, it is characterised in that the wafer storehouse, those widened sections and the leg of picking up the ears
Padded portion is integrally formed by injection or compression moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720914885.5U CN206947308U (en) | 2017-07-26 | 2017-07-26 | Wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720914885.5U CN206947308U (en) | 2017-07-26 | 2017-07-26 | Wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206947308U true CN206947308U (en) | 2018-01-30 |
Family
ID=61370198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720914885.5U Withdrawn - After Issue CN206947308U (en) | 2017-07-26 | 2017-07-26 | Wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206947308U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452660A (en) * | 2017-07-26 | 2017-12-08 | 新阳硅密（上海）半导体技术有限公司 | Wafer carrier and preparation method thereof |
-
2017
- 2017-07-26 CN CN201720914885.5U patent/CN206947308U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452660A (en) * | 2017-07-26 | 2017-12-08 | 新阳硅密（上海）半导体技术有限公司 | Wafer carrier and preparation method thereof |
| CN107452660B (en) * | 2017-07-26 | 2018-07-03 | 新阳硅密（上海）半导体技术有限公司 | Wafer carrier and preparation method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180130 Effective date of abandoning: 20180703 |