CN206899654U - A kind of injection mold apparatus of intelligent temperature control - Google Patents
A kind of injection mold apparatus of intelligent temperature control Download PDFInfo
- Publication number
- CN206899654U CN206899654U CN201720773751.6U CN201720773751U CN206899654U CN 206899654 U CN206899654 U CN 206899654U CN 201720773751 U CN201720773751 U CN 201720773751U CN 206899654 U CN206899654 U CN 206899654U
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- China
- Prior art keywords
- dynamic model
- cover half
- liquid storage
- storage cylinder
- injection
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
It the utility model is related to a kind of injection mold apparatus of intelligent temperature control,Including dynamic model and cover half,The dynamic model is fixed with injection (mo(u)lding) machine moving die plate,The upper surface centre position of the dynamic model is provided with hole for injecting glue,Upper glue injection cavities are provided with inside the dynamic model lower end,The lower surface corner of the dynamic model is provided with limited post,The cover half is located at the lower section of dynamic model,And the fixed form of the cover half and injection (mo(u)lding) machine connects,The utility model inside cover half by setting liquid storage cylinder,And the bottom of liquid storage cylinder is provided with semiconductor chilling plate,When PUR injects lower glue injection cavities,Heat in melten gel can be absorbed by the solution in liquid storage cylinder,Semiconductor chilling plate can then cool to solution in liquid storage cylinder,So as to ensure that it persistently can cool to melten gel,Reach the purpose of cooling and shaping,This kind of cooling means,It is simple in construction,Avoid causing the waste of water resource,It is strong to cool down controllability simultaneously.
Description
Technical field
The utility model belongs to injection mold technology, more particularly to a kind of injection mold apparatus of intelligent temperature control.
Background technology
Injection mold (Injection mold) is to produce a kind of processing side used during some complex-shaped parts in batches
Method, it is mainly used in industrial circle.Injection mold process is that the material of heated thawing is injected die cavity by high pressure, through cooling and solidifying
Afterwards, formed products are obtained.After injection moulding process terminates, cooling procedure is also particularly significant, and moulded plastic products only have cooling and solidifying to arrive
Certain rigidity, is just avoided that plastic products are deformed because by external force after the demoulding.Because cool time accounts for whole shaping week
Phase about 70%~80%, greatly occupying the time needed for formed product so that production efficiency declines, and increases production cost,
It is therefore desirable to be designed improvement to it, to meet use demand.
The content of the invention
The utility model provides a kind of cooling effect strong intelligent temperature control for technical problem existing for solution known technology
Injection mold apparatus.
The utility model is adopted the technical scheme that by technical problem existing for solution known technology:A kind of intelligent temperature control
Injection mold apparatus, including dynamic model and cover half, the dynamic model fix with injection (mo(u)lding) machine moving die plate, the upper table of the dynamic model
Face centre position is provided with hole for injecting glue, and upper glue injection cavities are provided with inside the dynamic model lower end, and the lower surface corner of the dynamic model is provided with limit
Position post, the cover half is located at the lower section of dynamic model, and the fixed form of the cover half and injection (mo(u)lding) machine connects, the cover half
Lower glue injection cavities are provided with inside upper end, cover half upper surface corner is provided with the stopper slot to match with limited post, the cover half
The lower section for being internally located at lower glue injection cavities is provided with liquid storage cylinder, and being respectively arranged on the left side and the right side feed pathway and going out liquid for the liquid storage cylinder is led to
Road, and the feed pathway and liquid outlet channel are designed with closure bolt, and the lower section of the liquid storage cylinder is provided with cavity, the cavity
Upside is provided with semiconductor chilling plate, and the lower surface of the semiconductor chilling plate is provided with fin, and the fin is that wing aluminium dissipates
Backing, the upper surface of the fin contact with the lower surface of semiconductor chilling plate, the upper surface of the semiconductor chilling plate with
Liquid storage cylinder bottom surface is contacted, and the downside of the semiconductor chilling plate is fanned provided with heat extraction, and the lower section of the heat extraction fan is provided with heat extraction grid.
Further, the closure bolt is threadedly coupled with feed pathway, and the closure bolt and feed pathway contact position
Provided with rubber blanket.
Further, the hole for injecting glue connects with upper glue injection cavities.
Further, the mesh diameter of the heat extraction grid is 1-5mm.
The utility model has the advantage that as follows with good effect：
1. the utility model is provided with semiconductor refrigerating by setting liquid storage cylinder inside cover half, and in the bottom of liquid storage cylinder
Piece, when PUR injects lower glue injection cavities, the heat in melten gel can be absorbed by the solution in liquid storage cylinder, and semiconductor chilling plate then can
Solution in liquid storage cylinder is cooled, so as to ensure that it persistently can cool to melten gel, reaches the purpose of cooling and shaping, this kind cold
But method, it is simple in construction, avoid causing the waste of water resource, while it is strong to cool down controllability.
2. the utility model is fanned by being provided with fin and heat extraction in the lower surface of semiconductor chilling plate, fin can be fast
Speed quickly exports heat caused by semiconductor chilling plate, and fans discharge cover half by heat extraction, improves operating efficiency.
Brief description of the drawings
Fig. 1 is the device overall structure diagram that the utility model embodiment provides.
In figure：1st, dynamic model；2nd, limited post；3rd, stopper slot；4th, feed pathway；5th, semiconductor chilling plate；6th, heat extraction is fanned；7th, arrange
Heat grate；8th, cavity；9th, cover half；10th, closure bolt；11st, liquid outlet channel；12nd, lower glue injection cavities；13rd, upper glue injection cavities；14th, hole for injecting glue；
15th, liquid storage cylinder；16th, fin.
Embodiment
For invention, features and effects of the present utility model can be further appreciated that, following examples are hereby enumerated, and coordinate
Accompanying drawing describes in detail as follows.
The structure of the injection mold apparatus of intelligent temperature control of the present utility model is explained in detail with reference to Fig. 1：One
The injection mold apparatus of kind intelligent temperature control, including dynamic model 1 and cover half 9, the dynamic model 1 are fixed with injection (mo(u)lding) machine moving die plate,
The upper surface centre position of the dynamic model 1 is provided with hole for injecting glue 14, and upper glue injection cavities 13 are provided with inside the lower end of dynamic model 1, described dynamic
The lower surface corner of mould 1 is provided with limited post 2, and the cover half 9 is located at the lower section of dynamic model 1, and the cover half 9 and injection (mo(u)lding) machine
Fixed form connection, be provided with lower glue injection cavities 12 inside the upper end of the cover half 9, the upper surface corner of cover half 9 provided with and limit
The stopper slot 3 that matches of position post 2, the lower section of glue injection cavities 12 is provided with liquid storage cylinder 15, the liquid storage under being internally located at of the cover half 9
Chamber 15 is respectively arranged on the left side and the right side feed pathway 4 and liquid outlet channel 11, and the feed pathway 4 and liquid outlet channel 11 are all set
There is closure bolt 10, the lower section of the liquid storage cylinder 15 is provided with cavity 8, and the upside of the cavity 8 is provided with semiconductor chilling plate 5, described
The upper surface of semiconductor chilling plate 5 contacts with the bottom surface of liquid storage cylinder 15, and the downside of the semiconductor chilling plate 5 is provided with heat extraction fan 6, institute
The lower section for stating heat extraction fan 6 is provided with heat extraction grid 7, and the closure bolt 10 is threadedly coupled with feed pathway 4, and the closure bolt 10
Rubber blanket is provided with the contact position of feed pathway 4, the hole for injecting glue 14 connects with upper glue injection cavities 13, the semiconductor chilling plate 5
Lower surface is provided with fin 16, and the fin 16 is wing aluminium radiator fin, the upper surface of the fin 16 and semiconductor system
The lower surface contact of cold 5, the mesh diameter of the heat extraction grid 7 is 1-5mm.
Operation principle：In use, dynamic model 1 and cover half 9 are closed, the limited post 2 on dynamic model 1 and the stopper slot 3 on cover half 9
Mutually agreeing with, injecting glue is carried out to mould by hole for injecting glue 14 after closure, after the completion of footnote, colloidal sol needs cooling and shaping to handle, this
Shi Qidong semiconductor chilling plates, the heat in colloidal sol can be absorbed by the solution in liquid storage cylinder 15, when the temperature of the solution of liquid storage cylinder 15
Then heat is not being absorbed after identical with melt adhesive temperature, now semiconductor chilling plate 5 works, and solution in liquid storage cylinder 15 is carried out cold
But, so as to continue to cool to colloidal sol, heat can then be inhaled by fin 16 caused by the opposite side of semiconductor chilling plate 5
Receive, and by the discharge of heat extraction fan 7, because the controllability of semiconductor chilling plate 5 is strong, be greatly improved product quality.The utility model
By setting liquid storage cylinder 15 inside cover half 9, and the bottom of liquid storage cylinder 15 is provided with semiconductor chilling plate 5, when PUR is noted
12 when entering lower glue injection cavities, the heat in melten gel can be absorbed by the solution in liquid storage cylinder 15, and semiconductor chilling plate 5 then can be to liquid storage cylinder
Solution is cooled in 15, so as to ensure that it persistently can cool to melten gel, reaches the purpose of cooling and shaping, this kind of cooling side
Method, it is simple in construction, avoid causing the waste of water resource, while it is strong to cool down controllability.The utility model by semiconductor refrigerating,
5 lower surface is provided with fin 16 and heat extraction fan 6, and fin 16 can be quickly quick by heat caused by semiconductor chilling plate 5
Export, and by the discharge cover half of heat extraction fan 6, improve operating efficiency.
Described above is only to preferred embodiment of the present utility model, not the utility model is made any formal
Limitation, it is every according to the technical essence of the utility model to any simple modification made for any of the above embodiments, equivalent variations with
Modification, is belonged in the range of technical solutions of the utility model.
Claims (4)
1. a kind of injection mold apparatus of intelligent temperature control, including dynamic model（1）And cover half（9）, it is characterised in that the dynamic model（1）
Fixed with injection (mo(u)lding) machine moving die plate, the dynamic model（1）Upper surface centre position be provided with hole for injecting glue（14）, the dynamic model
（1）Upper glue injection cavities are provided with inside lower end（13）, the dynamic model（1）Lower surface corner be provided with limited post（2）, the cover half（9）
Located at dynamic model（1）Lower section, and the cover half（9）It is connected with the fixed form of injection (mo(u)lding) machine, the cover half（9）Upper end
Inside is provided with lower glue injection cavities（12）, the cover half（9）Upper surface corner is provided with and limited post（2）The stopper slot to match（3）, institute
State cover half（9）Being internally located under glue injection cavities（12）Lower section be provided with liquid storage cylinder（15）, the liquid storage cylinder（15）The left and right sides
It is respectively equipped with feed pathway（4）And liquid outlet channel（11）, and the feed pathway（4）And liquid outlet channel（11）It is designed with closing
Bolt（10）, the liquid storage cylinder（15）Lower section be provided with cavity（8）, the cavity（8）Upside be provided with semiconductor chilling plate（5）,
The semiconductor chilling plate（5）Upper surface and liquid storage cylinder（15）Bottom surface contacts, the semiconductor chilling plate（5）Lower surface set
There is fin（16）, the fin（16）For wing aluminium radiator fin, the fin（16）Upper surface and semiconductor refrigerating
Piece（5）Lower surface contact, the semiconductor chilling plate（5）Downside provided with heat extraction fan（6）, the heat extraction fan（6）Lower section
Provided with heat extraction grid（7）.
A kind of 2. injection mold apparatus of intelligent temperature control according to claim 1, it is characterised in that the closure bolt（10）
With feed pathway（4）Threaded connection, and the closure bolt（10）With feed pathway（4）Contact position is provided with rubber blanket.
A kind of 3. injection mold apparatus of intelligent temperature control according to claim 1, it is characterised in that the hole for injecting glue（14）
With upper glue injection cavities（13）Connection.
4. according to a kind of injection mold apparatus of intelligent temperature control described in claim 1, it is characterised in that the heat extraction grid（7）
Mesh diameter be 1-5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720773751.6U CN206899654U (en) | 2017-06-29 | 2017-06-29 | A kind of injection mold apparatus of intelligent temperature control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720773751.6U CN206899654U (en) | 2017-06-29 | 2017-06-29 | A kind of injection mold apparatus of intelligent temperature control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206899654U true CN206899654U (en) | 2018-01-19 |
Family
ID=61292481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720773751.6U Expired - Fee Related CN206899654U (en) | 2017-06-29 | 2017-06-29 | A kind of injection mold apparatus of intelligent temperature control |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206899654U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108656399A (en) * | 2018-04-28 | 2018-10-16 | 昆明云仁轮胎制造有限公司 | A kind of can effectively improve wraps up in the tire of the glue uniformity and covers adhesive dispenser with steel wire |
| CN116572472A (en) * | 2023-05-31 | 2023-08-11 | 河间市鑫华财注塑厂 | Injection molding die for plastic valve handle |
-
2017
- 2017-06-29 CN CN201720773751.6U patent/CN206899654U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108656399A (en) * | 2018-04-28 | 2018-10-16 | 昆明云仁轮胎制造有限公司 | A kind of can effectively improve wraps up in the tire of the glue uniformity and covers adhesive dispenser with steel wire |
| CN108656399B (en) * | 2018-04-28 | 2023-12-29 | 昆明云仁轮胎制造有限公司 | Steel wire glue coating device capable of effectively improving glue coating uniformity for tire |
| CN116572472A (en) * | 2023-05-31 | 2023-08-11 | 河间市鑫华财注塑厂 | Injection molding die for plastic valve handle |
| CN116572472B (en) * | 2023-05-31 | 2024-06-14 | 东莞市恒泽利塑胶模具制品有限公司 | Injection molding die for plastic valve handle |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180119 |