CN206879211U - A kind of thick film circuit board - Google Patents
A kind of thick film circuit board Download PDFInfo
- Publication number
- CN206879211U CN206879211U CN201720648861.XU CN201720648861U CN206879211U CN 206879211 U CN206879211 U CN 206879211U CN 201720648861 U CN201720648861 U CN 201720648861U CN 206879211 U CN206879211 U CN 206879211U
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- sputtering layer
- circuit board
- thick film
- film circuit
- conductive material
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model provides a kind of thick film circuit board, including：Substrate, conductive material, the first sputtering layer and the second sputtering layer；Via is provided with the substrate, the conductive material is embedded in the via, and first sputtering layer is covered in the conductive material surface, and second sputtering layer is covered in the first sputtering layer surface.Thick film circuit board provided by the utility model, by covering the first sputtering layer in the conductive material surface cleaned up, again the second sputtering layer is covered in the described first sputtering layer surface, then unnecessary sputtering layer is etched away by etching laser machining, so as to play the anti-oxidation effect to the conductive material, it makes simply, and sputtering layer thickness is uniform, zone of protection may be selected, and improves the reliability of circuit welding；Meanwhile to operating personnel's fanout free region, it is environmentally safe.
Description
Technical field
It the utility model is related to circuit board production techniques field, more particularly to a kind of thick film circuit board.
Background technology
Thick film circuit has a wide range of applications as a kind of high reliability circuit in Aeronautics and Astronautics field.In thick film circuit
Pad majority when be sealed in metal-back, the problem of and having air-tightness requirement, therefore be generally not present pad oxide.It is but right
For portioned product, such as HCE46XX type DC/DC converters, the substrate with pad are incited somebody to action as the drain pan of product, pad
It is exposed to outside.Exposure will necessarily aoxidize pad in atmosphere for a long time, cause follow-up soldering reliability to reduce, seriously
When weld failure problem occurs.
In the prior art, in order to prevent pad oxide generally bond pad surface electroplate one layer of anti-oxidation materials.
But the plating area of electro-plating method can not select, as long as that is, to be all plated layer of metal anti-oxidation for the circuit of connection
Material, then unnecessary metal anti-oxidation materials is removed by craft or machine, it is necessary to take considerable time, while electrodeposited coating
It is in uneven thickness, the reliability of welding is not high, and electroplate liquid is not handled rationally and also ecological environment is polluted.
Utility model content
(1) technical problems to be solved
The purpose of this utility model is to provide a kind of thick film circuit board, when solving conductor in the prior art or long pad
Between exposure produce oxidation in atmosphere, the problem of causing follow-up soldering reliability to reduce.
(2) technical scheme
In order to solve the above-mentioned technical problem, the utility model provides a kind of thick film circuit board, including：
Substrate, conductive material, the first sputtering layer and the second sputtering layer；Via, the conductive material are provided with the substrate
In the via, first sputtering layer is covered in the conductive material surface, and second sputtering layer is covered in described
First sputtering layer surface.
Further, first sputtering layer is nickel.
Further, second sputtering layer is gold.
Further, the thickness of first sputtering layer is 0.5-1 microns.
Further, the thickness of second sputtering layer is 0.2-0.5 microns.
Further, the substrate is ceramic substrate.
Further, the conductive material is silver, platinum is silver-colored or palladium-silver.
Further, the via is through hole or blind hole.
Further, the cross section of the via is square or circular.
Further, the quantity of the via is at least one, and the arrangement mode of the via is square array or circle
Array.
(3) beneficial effect
Thick film circuit board provided by the utility model, by the sputtering of conductive material surface covering first cleaned up
Layer, then the second sputtering layer is covered in the described first sputtering layer surface, then unnecessary sputtering layer is etched by etching laser machining
Fall, so as to play the anti-oxidation effect to the conductive material, it makes simply, and sputtering layer thickness is uniform, zone of protection is optional
Select, improve the reliability of circuit welding；Meanwhile to operating personnel's fanout free region, it is environmentally safe.
Brief description of the drawings
Fig. 1 is the structural representation of the thick film circuit board according to the utility model embodiment.
Embodiment
In order that the purpose, technical scheme and advantage of the utility model embodiment are clearer, below in conjunction with this practicality
Accompanying drawing in new embodiment, the technical scheme in the embodiment of the utility model is clearly and completely described, it is clear that institute
The embodiment of description is the utility model part of the embodiment, rather than whole embodiments.Based on implementation of the present utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, is belonged to
The scope of the utility model protection.
Embodiment 1：
Fig. 1 is the structural representation of the thick film circuit board according to the utility model embodiment, as shown in figure 1, this practicality is new
Type embodiment provides a kind of thick film circuit board, including：
Substrate 2, conductive material 1, the first sputtering layer 3 and the second sputtering layer 4；Wherein, via 5, institute are provided with the substrate 2
Conductive material 1 is stated in the via 5, first sputtering layer 3 is covered in the surface of conductive material 1, and described second splashes
Penetrate layer 4 and be covered in the surface of the first sputtering layer 3.
Specifically, it is provided with via 5 on the substrate 2.The conductive material 1 is embedded in the via 5, the conduction exposed
The surface of material 1 and the flush of the substrate 2, form contact point during welding, i.e. pad.First sputtering layer 3 covers
On the surface of conductive material 1, all covered exposed on the surface of the conductive material 1 of the outside of substrate 2, described second
Sputtering layer 4 is covered in the surface of the first sputtering layer 3.
The technical scheme of the present embodiment is further illustrated below by the preparation method of thick film circuit board.
First, the surface of the initial thick film circuit board substrate to making is cleaned.Pad is wiped with rubber, removes table
The oxide and greasy dirt in face, until pad is shinny, then the thick film circuit board is placed in plasma cleaner and cleaned 5 minutes,
The oxide and greasy dirt of the thick film circuit board substrate surface are further removed, makes the chemical energy of bond pad surface reduce, to improve
Bond pad surface activity.
Then, the first sputtering layer is sputtered in the thick film circuit board substrate surface using magnetron sputter, then sputtered again
Second sputtering layer.
Finally, sputtering layer unnecessary on the thick film circuit board substrate surface is etched away using etching laser machining, it is remaining
Sputtering layer be covered in the bond pad surface.
Further, first sputtering layer is nickel.
Specifically, in the preparation method of above-mentioned thick film circuit board, using magnetron sputter in the thick film circuit board base
Plate surface sputters the first sputtering layer, and first sputtering layer is nickel, then sputters the second sputtering layer again.
It should be noted that making the first sputtering layer in above-mentioned example method and the second sputtering layer uses magnetron sputtering
Machine, power are 500-1000 watts, and preferred power is 800 watts when first sputtering layer is nickel, and target can select copper, nickel, gold
Or cadmium, using DC sputtering, sputter 20-40 minutes, and not limited to this in actual applications, thin film evaporation can also be selected to splash
Machine or other sputters are penetrated, which kind of specifically used sputter can depend on the circumstances.
Further, second sputtering layer is gold.
Specifically, in the preparation method of above-mentioned thick film circuit board, using magnetron sputter in the thick film circuit board base
Plate surface sputters the first sputtering layer, then sputters the second sputtering layer again, and second sputtering layer is gold, second sputtering
The preferred power of magnetron sputter is 600 watts when layer is golden.
Further, the thickness of first sputtering layer is 0.5-1 microns.
Specifically, in the preparation method of above-mentioned thick film circuit board, using magnetron sputter in the thick film circuit board base
Plate surface sputters the first sputtering layer, and the thickness of first sputtering layer is 0.5-1 microns, then sputters the second sputtering again
Layer.
Further, the thickness of second sputtering layer is 0.2-0.5 microns.
Specifically, in the preparation method of above-mentioned thick film circuit board, using magnetron sputter in the thick film circuit board base
Plate surface sputters the first sputtering layer, then sputters the second sputtering layer again, and the thickness of second sputtering layer is micro- for 0.2-0.5
Rice.
Further, the substrate is ceramic substrate.
Specifically, the thick film circuit board is produced on ceramic substrate.
Further, the conductive material is silver, platinum is silver-colored or palladium-silver.
Specifically, the thick film circuit board is produced on substrate, it is silver to make the conductive material that circuit board uses.
It should be noted that it is silver that the conductive material that circuit board uses is made in above-mentioned example method, and actually should
With middle not limited to this, can need to select platinum silver or palladium-silver according to circuit design, which kind of specifically used material can optionally and
It is fixed.
Further, the via is through hole or blind hole.
Specifically, the thick film circuit board is produced on substrate, through hole is provided with the substrate, the conductive material is embedded in
In the through hole.
It should be noted that being provided with through hole described in above-mentioned example method on circuit board substrate, the conductive material is embedding
In the via.And not limited to this in actual applications, it can need to select through hole or blind hole according to circuit design, specifically make
It can be depended on the circumstances with through hole or blind hole.
Further, the cross section of the via is square or circular.
Specifically, the thick film circuit board is produced on substrate, it is square via that cross section is provided with the substrate, institute
Conductive material is stated in the via.
It should be noted that it is square via to be provided with cross section described in above-mentioned example method on circuit board substrate,
The conductive material is embedded in the via.And not limited to this in actual applications, it can be selected according to the needs of circuit design horizontal
Section is square or circular via, specifically used square or circular can depend on the circumstances.
Further, the quantity of the via is at least one, and the arrangement mode of the via is square array or circle
Array.
Specifically, the thick film circuit board is produced on substrate, at least one via, the via are provided with the substrate
Arranged by square array, the conductive material is embedded in the via.
It should be noted that at least one via is provided with described in above-mentioned example method on circuit board substrate, the mistake
Hole is arranged by square array, and the conductive material is embedded in the via.And not limited to this in actual applications, the via
Arrangement mode can need to select square array or circular array according to circuit design, specifically used square or circular can regard
Depending on situation.
Verified by microelectronic component Test Methods And Procedures national standard GJB548B-2003 weldability tests, product quilt
Detect surface to be exposed in vapor after 85h ± 0.5h, passed through the test requirements document of weld groove method, that is, be verified bond pad surface and be more than
95% area covering has continuous solder layer, fully meets GJB548B-2003 and electronic component pad solderability is wanted
Ask.
The thick film circuit board that the utility model embodiment provides, by the conductive material surface covering first cleaned up
Sputtering layer, then the second sputtering layer is covered in the described first sputtering layer surface, then by etching laser machining by unnecessary sputtering layer
Etch away, so as to play the anti-oxidation effect to the conductive material, it makes simply, and sputtering layer thickness is uniform, zone of protection
It may be selected, improve the reliability of circuit welding；Meanwhile to operating personnel's fanout free region, it is environmentally safe.
Finally it should be noted that：Above example is only to illustrate the technical solution of the utility model, rather than its limitations；
Although the utility model is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that：
It can still modify to the technical scheme described in foregoing embodiments, or which part technical characteristic is carried out etc.
With replacement；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the utility model technology
The spirit and scope of scheme.
Claims (10)
- A kind of 1. thick film circuit board, it is characterised in that including：Substrate, conductive material, the first sputtering layer and the second sputtering layer；Via is provided with the substrate, the conductive material is embedded in In the via, first sputtering layer is covered in the conductive material surface, and second sputtering layer is covered in described first Sputter layer surface.
- 2. thick film circuit board according to claim 1, it is characterised in that first sputtering layer is nickel.
- 3. thick film circuit board according to claim 1, it is characterised in that second sputtering layer is gold.
- 4. thick film circuit board according to claim 1, it is characterised in that the thickness of first sputtering layer is that 0.5-1 is micro- Rice.
- 5. thick film circuit board according to claim 1, it is characterised in that the thickness of second sputtering layer is 0.2-0.5 Micron.
- 6. thick film circuit board according to claim 1, it is characterised in that the substrate is ceramic substrate.
- 7. thick film circuit board according to claim 1, it is characterised in that the conductive material is silver, platinum is silver-colored or palladium-silver.
- 8. according to the thick film circuit board any one of claim 1-7, it is characterised in that the via is through hole or blind Hole.
- 9. according to the thick film circuit board any one of claim 1-7, it is characterised in that the cross section of the via is side Shape or circle.
- 10. according to the thick film circuit board any one of claim 1-7, it is characterised in that the quantity of the via is at least For one, the arrangement mode of the via is square array or circular array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720648861.XU CN206879211U (en) | 2017-06-06 | 2017-06-06 | A kind of thick film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720648861.XU CN206879211U (en) | 2017-06-06 | 2017-06-06 | A kind of thick film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206879211U true CN206879211U (en) | 2018-01-12 |
Family
ID=61337953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720648861.XU Active CN206879211U (en) | 2017-06-06 | 2017-06-06 | A kind of thick film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206879211U (en) |
-
2017
- 2017-06-06 CN CN201720648861.XU patent/CN206879211U/en active Active
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